JP2008117875A5 - - Google Patents

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Publication number
JP2008117875A5
JP2008117875A5 JP2006298433A JP2006298433A JP2008117875A5 JP 2008117875 A5 JP2008117875 A5 JP 2008117875A5 JP 2006298433 A JP2006298433 A JP 2006298433A JP 2006298433 A JP2006298433 A JP 2006298433A JP 2008117875 A5 JP2008117875 A5 JP 2008117875A5
Authority
JP
Japan
Prior art keywords
lead
lead frame
chip mounting
manufacturing
mounting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006298433A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008117875A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006298433A priority Critical patent/JP2008117875A/ja
Priority claimed from JP2006298433A external-priority patent/JP2008117875A/ja
Priority to TW096136919A priority patent/TWI446502B/zh
Priority to CN201010263194.6A priority patent/CN101937856B/zh
Priority to CNA2007101653344A priority patent/CN101174603A/zh
Priority to US11/933,144 priority patent/US8193041B2/en
Priority to KR1020070110748A priority patent/KR20080040582A/ko
Publication of JP2008117875A publication Critical patent/JP2008117875A/ja
Publication of JP2008117875A5 publication Critical patent/JP2008117875A5/ja
Pending legal-status Critical Current

Links

JP2006298433A 2006-11-02 2006-11-02 半導体装置および半導体装置の製造方法 Pending JP2008117875A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2006298433A JP2008117875A (ja) 2006-11-02 2006-11-02 半導体装置および半導体装置の製造方法
TW096136919A TWI446502B (zh) 2006-11-02 2007-10-02 Manufacturing method of semiconductor device
CN201010263194.6A CN101937856B (zh) 2006-11-02 2007-10-26 半导体装置及半导体装置的制造方法
CNA2007101653344A CN101174603A (zh) 2006-11-02 2007-10-26 半导体装置及半导体装置的制造方法
US11/933,144 US8193041B2 (en) 2006-11-02 2007-10-31 Semiconductor device and manufacturing method of the same
KR1020070110748A KR20080040582A (ko) 2006-11-02 2007-11-01 반도체 장치 및 반도체 장치의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006298433A JP2008117875A (ja) 2006-11-02 2006-11-02 半導体装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2008117875A JP2008117875A (ja) 2008-05-22
JP2008117875A5 true JP2008117875A5 (enExample) 2010-10-14

Family

ID=39359027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006298433A Pending JP2008117875A (ja) 2006-11-02 2006-11-02 半導体装置および半導体装置の製造方法

Country Status (5)

Country Link
US (1) US8193041B2 (enExample)
JP (1) JP2008117875A (enExample)
KR (1) KR20080040582A (enExample)
CN (2) CN101174603A (enExample)
TW (1) TWI446502B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5334239B2 (ja) * 2008-06-24 2013-11-06 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5380244B2 (ja) * 2009-10-22 2014-01-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN105023905B (zh) * 2015-07-31 2018-01-16 日月光封装测试(上海)有限公司 导线框架和使用该导线框架的功率集成电路封装件
CN109716745B (zh) * 2016-08-01 2020-12-18 宁波舜宇光电信息有限公司 摄像模组及其模塑电路板组件和模塑感光组件和制造方法
JP7043225B2 (ja) * 2017-11-08 2022-03-29 株式会社東芝 半導体装置
US11227810B2 (en) * 2017-11-10 2022-01-18 Shindengen Electric Manufacturing Co., Ltd. Electronic module with a groove and press hole on the surface of a conductor
JP7192688B2 (ja) 2019-07-16 2022-12-20 Tdk株式会社 電子部品パッケージ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1892537B1 (en) * 2002-07-29 2011-05-25 Yamaha Corporation Three-axis magnetic sensor
CN100472833C (zh) * 2002-07-29 2009-03-25 雅马哈株式会社 磁性传感器及传感器器件
JP2006100348A (ja) 2004-09-28 2006-04-13 Yamaha Corp 物理量センサの製造方法
US7791180B2 (en) * 2004-10-01 2010-09-07 Yamaha Corporation Physical quantity sensor and lead frame used for same
JP4314580B2 (ja) * 2004-10-01 2009-08-19 ヤマハ株式会社 物理量センサ、およびこれに使用するリードフレーム
TWI280399B (en) * 2004-10-01 2007-05-01 Yamaha Corp Physical amount sensor and lead frame used therein
JP2006269859A (ja) * 2005-03-25 2006-10-05 Yamaha Corp 物理量センサ、およびこれに使用するリードフレーム
US7595548B2 (en) * 2004-10-08 2009-09-29 Yamaha Corporation Physical quantity sensor and manufacturing method therefor
US20060185452A1 (en) * 2005-02-22 2006-08-24 Yamaha Corporation Lead frame, sensor including lead frame, resin composition to be used for resin mold in the sensor, and sensor including the resin mold
JP4345685B2 (ja) * 2005-02-22 2009-10-14 ヤマハ株式会社 物理量センサ、これに使用するリードフレーム、及び、リードフレームの製造方法
KR100740358B1 (ko) * 2005-02-25 2007-07-16 야마하 가부시키가이샤 센서 및 센서 형성 방법
JP4652281B2 (ja) * 2006-05-29 2011-03-16 パナソニック株式会社 樹脂封止型半導体装置

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