JP2008117875A - 半導体装置および半導体装置の製造方法 - Google Patents

半導体装置および半導体装置の製造方法 Download PDF

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Publication number
JP2008117875A
JP2008117875A JP2006298433A JP2006298433A JP2008117875A JP 2008117875 A JP2008117875 A JP 2008117875A JP 2006298433 A JP2006298433 A JP 2006298433A JP 2006298433 A JP2006298433 A JP 2006298433A JP 2008117875 A JP2008117875 A JP 2008117875A
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JP
Japan
Prior art keywords
mounting portion
chip mounting
lead
sealing body
resin sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006298433A
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English (en)
Japanese (ja)
Other versions
JP2008117875A5 (enExample
Inventor
Shigeki Tanaka
茂樹 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2006298433A priority Critical patent/JP2008117875A/ja
Priority to TW096136919A priority patent/TWI446502B/zh
Priority to CNA2007101653344A priority patent/CN101174603A/zh
Priority to CN201010263194.6A priority patent/CN101937856B/zh
Priority to US11/933,144 priority patent/US8193041B2/en
Priority to KR1020070110748A priority patent/KR20080040582A/ko
Publication of JP2008117875A publication Critical patent/JP2008117875A/ja
Publication of JP2008117875A5 publication Critical patent/JP2008117875A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Measuring Magnetic Variables (AREA)
JP2006298433A 2006-11-02 2006-11-02 半導体装置および半導体装置の製造方法 Pending JP2008117875A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2006298433A JP2008117875A (ja) 2006-11-02 2006-11-02 半導体装置および半導体装置の製造方法
TW096136919A TWI446502B (zh) 2006-11-02 2007-10-02 Manufacturing method of semiconductor device
CNA2007101653344A CN101174603A (zh) 2006-11-02 2007-10-26 半导体装置及半导体装置的制造方法
CN201010263194.6A CN101937856B (zh) 2006-11-02 2007-10-26 半导体装置及半导体装置的制造方法
US11/933,144 US8193041B2 (en) 2006-11-02 2007-10-31 Semiconductor device and manufacturing method of the same
KR1020070110748A KR20080040582A (ko) 2006-11-02 2007-11-01 반도체 장치 및 반도체 장치의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006298433A JP2008117875A (ja) 2006-11-02 2006-11-02 半導体装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2008117875A true JP2008117875A (ja) 2008-05-22
JP2008117875A5 JP2008117875A5 (enExample) 2010-10-14

Family

ID=39359027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006298433A Pending JP2008117875A (ja) 2006-11-02 2006-11-02 半導体装置および半導体装置の製造方法

Country Status (5)

Country Link
US (1) US8193041B2 (enExample)
JP (1) JP2008117875A (enExample)
KR (1) KR20080040582A (enExample)
CN (2) CN101937856B (enExample)
TW (1) TWI446502B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12205873B2 (en) 2019-07-16 2025-01-21 Tdk Corporation Electronic component package

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5334239B2 (ja) * 2008-06-24 2013-11-06 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5380244B2 (ja) * 2009-10-22 2014-01-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN105023905B (zh) * 2015-07-31 2018-01-16 日月光封装测试(上海)有限公司 导线框架和使用该导线框架的功率集成电路封装件
WO2018023887A1 (zh) * 2016-08-01 2018-02-08 宁波舜宇光电信息有限公司 摄像模组及其模塑电路板组件和模塑感光组件和制造方法
JP7043225B2 (ja) * 2017-11-08 2022-03-29 株式会社東芝 半導体装置
US11227810B2 (en) * 2017-11-10 2022-01-18 Shindengen Electric Manufacturing Co., Ltd. Electronic module with a groove and press hole on the surface of a conductor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006038564A1 (ja) * 2004-10-01 2006-04-13 Yamaha Corporation 物理量センサ、およびこれに使用するリードフレーム
JP2006108252A (ja) * 2004-10-01 2006-04-20 Yamaha Corp 物理量センサ、およびこれに使用するリードフレーム
JP2006222471A (ja) * 2006-05-29 2006-08-24 Matsushita Electric Ind Co Ltd 樹脂封止型半導体装置

Family Cites Families (9)

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Publication number Priority date Publication date Assignee Title
CN100472833C (zh) * 2002-07-29 2009-03-25 雅马哈株式会社 磁性传感器及传感器器件
US7187063B2 (en) * 2002-07-29 2007-03-06 Yamaha Corporation Manufacturing method for magnetic sensor and lead frame therefor
JP2006100348A (ja) 2004-09-28 2006-04-13 Yamaha Corp 物理量センサの製造方法
US7791180B2 (en) * 2004-10-01 2010-09-07 Yamaha Corporation Physical quantity sensor and lead frame used for same
JP2006269859A (ja) * 2005-03-25 2006-10-05 Yamaha Corp 物理量センサ、およびこれに使用するリードフレーム
US7595548B2 (en) * 2004-10-08 2009-09-29 Yamaha Corporation Physical quantity sensor and manufacturing method therefor
JP4345685B2 (ja) * 2005-02-22 2009-10-14 ヤマハ株式会社 物理量センサ、これに使用するリードフレーム、及び、リードフレームの製造方法
US20060185452A1 (en) * 2005-02-22 2006-08-24 Yamaha Corporation Lead frame, sensor including lead frame, resin composition to be used for resin mold in the sensor, and sensor including the resin mold
KR100740358B1 (ko) * 2005-02-25 2007-07-16 야마하 가부시키가이샤 센서 및 센서 형성 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006038564A1 (ja) * 2004-10-01 2006-04-13 Yamaha Corporation 物理量センサ、およびこれに使用するリードフレーム
JP2006108252A (ja) * 2004-10-01 2006-04-20 Yamaha Corp 物理量センサ、およびこれに使用するリードフレーム
JP2006222471A (ja) * 2006-05-29 2006-08-24 Matsushita Electric Ind Co Ltd 樹脂封止型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12205873B2 (en) 2019-07-16 2025-01-21 Tdk Corporation Electronic component package

Also Published As

Publication number Publication date
CN101937856A (zh) 2011-01-05
CN101937856B (zh) 2014-04-16
TWI446502B (zh) 2014-07-21
TW200834858A (en) 2008-08-16
US8193041B2 (en) 2012-06-05
CN101174603A (zh) 2008-05-07
US20080105959A1 (en) 2008-05-08
KR20080040582A (ko) 2008-05-08

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