JP2008103514A - 電子部品装置 - Google Patents
電子部品装置 Download PDFInfo
- Publication number
- JP2008103514A JP2008103514A JP2006284477A JP2006284477A JP2008103514A JP 2008103514 A JP2008103514 A JP 2008103514A JP 2006284477 A JP2006284477 A JP 2006284477A JP 2006284477 A JP2006284477 A JP 2006284477A JP 2008103514 A JP2008103514 A JP 2008103514A
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- Prior art keywords
- electronic component
- filling resin
- main body
- lid
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
【解決手段】凹部29を有する本体22と、凹部29に収納される電子部品24と、凹部29の開口を覆うように本体22に取り付く蓋体23と、凹部29内に充填して硬化させる充填樹脂25とを備えて電子部品装置21を構成する。蓋体23には、充填樹脂25を注入するための注入口42と、充填樹脂25の注入の際における凹部29内の気体を排出するための一又は複数の排気口43とを形成する。蓋体23は、排気口43の開口面積を注入口42の開口面積以上に設定してなる。
【選択図】図1
Description
22 本体
23 蓋体
24 電子部品
25 充填樹脂
26 リードフレーム
27 脚部
28 電子部品実装部
29 凹部
30 底壁
31、32 短辺対応壁
33、34 長辺対応壁
35 本体側段部
36 光透過部
37、38 短辺
39、40 長辺
41 蓋体側段部
42 注入口
43 排気口
44 テーパ
Claims (3)
- 凹部を有する本体と、前記凹部に収納される電子部品と、前記凹部の開口を覆うように前記本体に取り付く蓋体と、を備える電子部品装置において、
前記凹部内に充填して硬化させる充填樹脂を更に備え、前記蓋体には前記充填樹脂を注入するための注入口と、前記充填樹脂の注入の際における前記凹部内の気体を排出するための一又は複数の排気口とを形成する
ことを特徴とする電子部品装置。 - 請求項1に記載の電子部品装置において、
前記排気口の開口面積を前記注入口の開口面積以上に設定する
ことを特徴とする電子部品装置。 - 請求項1又は請求項2に記載の電子部品装置において、
前記排気口及び/又は前記凹部の内面にテーパを形成する
ことを特徴とする電子部品装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006284477A JP5358056B2 (ja) | 2006-10-19 | 2006-10-19 | 電子部品装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006284477A JP5358056B2 (ja) | 2006-10-19 | 2006-10-19 | 電子部品装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008103514A true JP2008103514A (ja) | 2008-05-01 |
JP5358056B2 JP5358056B2 (ja) | 2013-12-04 |
Family
ID=39437626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006284477A Expired - Fee Related JP5358056B2 (ja) | 2006-10-19 | 2006-10-19 | 電子部品装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5358056B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140178784A1 (en) * | 2012-12-24 | 2014-06-26 | Hyundai Motor Company | Active thermal management system for fuel cell stack |
DE102020122788A1 (de) | 2020-01-07 | 2021-07-08 | Mitsubishi Electric Corporation | Halbleitermodul |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6138944U (ja) * | 1984-08-10 | 1986-03-11 | イビデン株式会社 | 半導体装置 |
JP2005274390A (ja) * | 2004-03-25 | 2005-10-06 | Yaskawa Electric Corp | 真空用磁気センサおよびその樹脂充填方法 |
-
2006
- 2006-10-19 JP JP2006284477A patent/JP5358056B2/ja not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6138944U (ja) * | 1984-08-10 | 1986-03-11 | イビデン株式会社 | 半導体装置 |
JP2005274390A (ja) * | 2004-03-25 | 2005-10-06 | Yaskawa Electric Corp | 真空用磁気センサおよびその樹脂充填方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140178784A1 (en) * | 2012-12-24 | 2014-06-26 | Hyundai Motor Company | Active thermal management system for fuel cell stack |
US9450256B2 (en) * | 2012-12-24 | 2016-09-20 | Hyundai Motor Company | Active thermal management system for fuel cell stack |
DE102020122788A1 (de) | 2020-01-07 | 2021-07-08 | Mitsubishi Electric Corporation | Halbleitermodul |
US11587841B2 (en) | 2020-01-07 | 2023-02-21 | Mitsubishi Electric Corporation | Semiconductor module |
Also Published As
Publication number | Publication date |
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JP5358056B2 (ja) | 2013-12-04 |
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