CN105493642A - 尤其用于机动车变速器控制器的、具有电路板和可注塑的塑料密封环的电子模块和用于加工它的方法 - Google Patents

尤其用于机动车变速器控制器的、具有电路板和可注塑的塑料密封环的电子模块和用于加工它的方法 Download PDF

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Publication number
CN105493642A
CN105493642A CN201480043495.4A CN201480043495A CN105493642A CN 105493642 A CN105493642 A CN 105493642A CN 201480043495 A CN201480043495 A CN 201480043495A CN 105493642 A CN105493642 A CN 105493642A
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China
Prior art keywords
circuit board
board parts
electronic module
sealing ring
plate member
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Granted
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CN201480043495.4A
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CN105493642B (zh
Inventor
U.里斯科
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Robert Bosch GmbH
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Robert Bosch GmbH
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
    • B29C65/542—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts by injection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0043—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units comprising a frame housing mating with two lids wherein the PCB is flat mounted on the frame housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B29C45/14508—Joining juxtaposed sheet-like articles, e.g. for making trim panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/70—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/022—Mechanical pre-treatments, e.g. reshaping
    • B29C66/0224—Mechanical pre-treatments, e.g. reshaping with removal of material
    • B29C66/02245—Abrading, e.g. grinding, sanding, sandblasting or scraping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/024—Thermal pre-treatments
    • B29C66/0246—Cutting or perforating, e.g. burning away by using a laser or using hot air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
    • B29C66/3032—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined
    • B29C66/30321—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of protrusions belonging to at least one of the parts to be joined
    • B29C66/30322—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of protrusions belonging to at least one of the parts to be joined in the form of rugosity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B29C66/53462—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies joining substantially flat covers and substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7316—Surface properties
    • B29C66/73161—Roughness or rugosity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
    • B29C66/73941—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset characterised by the materials of both parts being thermosets
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
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    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/712—Containers; Packaging elements or accessories, Packages
    • B29L2031/7172—Fuel tanks, jerry cans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
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    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
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    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
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Abstract

本发明描述一种尤其用于机动车变速器控制器的电子模块（1）和一种用于加工这种电子模块的方法。该电子模块（1）具有第一电路板部件（3）、第二电路板部件（5）和一间隔体（7）。它们共同地包围一个中心的空心空间（9），在其中容纳安置在第一电路板部件（3）的电子元件（25）。不仅在第一电路板部件（3）的向外指向的表面（13）上，而且在第二电路板部件（5）的向外指向的表面（19）上与第一电路板部件（3）的外周边（15）相邻地分别设有环形环绕的微结构（17,21），它们例如利用激光毛化技术产生。在这个区域构成密封环（25），它不仅与第一而且与第二电路板部件（3,5）通过其微结构（17,21）处于形状锁合的连接。所述密封环（25）可以由能抵抗的塑料制成，它在液体状态注塑到第一电路板部件（3）的外周边（15）的区域中，同时流入到微结构（17,21）的凹部中，并且在硬化以后形成在两个电路板部件（3,5）与由此形成的密封环（25）之间的形状锁合的且密封的连接。

Description

尤其用于机动车变速器控制器的、具有电路板和可注塑的塑料密封环的电子模块和用于加工它的方法
技术领域
本发明涉及一种电子模块，如同尤其在机动车中的变速器控制器中可以使用的那样。本发明还涉及一种用于加工这种电子模块的方法。
背景技术
在机动车中的控制器例如变速器控制器（TCU-transmissioncontrolunit）、马达控制器、电池控制器等，它们包括电子元件，一般要气密保护地免受周围的介质。在机动车中应用时这些控制器处于例如侵蚀性介质例如变速器油、发动机油、水、尿素-水溶液、制动液等。此外，控制器尤其在机动车中使用时可能处于其它潜在的有害影响例如剧烈的温度变化、机械的振动负荷等。
为了可以保护机动车控制器的电子元件免受有害影响，尤其受到周围介质的影响，目前大多将它们容纳在费事构成的、气密的外壳中。在此该外壳大多由金属板制成，其中例如穿过外壳壁的电导线必需费事地电绝缘。用于加工外壳以及用于输入导线的电绝缘的费用可能是显著的。
更简单的、成本更有利的解决方案目前已经证实经常不是长时间可靠的。例如已经注意到，弹性体环形式的密封，它们已经用于气密塑料外壳的互补部分，不能长时间地、例如多于10年的抵制在机动车应用时出现的恶劣的环境条件、尤其是侵蚀性环境介质。为了保护容纳在外壳中的电子元件附加地免受可能挤入的介质，经常通过保护的凝胶包围这些电子元件，但是由此产生附加的费用和成本。
在可选择的方案中使所谓的冲压格栅通过塑料变形，它们需要例如昂贵的注塑模具。
DE102004021931A1描述了一种用于电子电路的外壳。
发明内容
通过本发明的实施例描述了一种电子模块以及一种用于加工这种电子模块的方法，利用它们能够使简单且成本有利的加工性与尤其用于机动车结构的电子模块的长时间可靠的保持性相结合。尤其描述了一种有利的电子模块和一种用于加工它的方法，其中容纳在电子模块中的电子元件长时间可靠气密地免受侵蚀性的周围介质。
按照本发明的第一方面建议一种电子模块，它具有第一和第二电路板部件以及间隔体。第一电路板部件配有至少一设置在其上的电子元件例如电子控制电路。第二电路板部件配有至少一设置在其上的电子元件例如插接头、传感器等。第一电路板部件、第二电路板部件和间隔体这样彼此互补地构成，使它们共同地完全包裹中心空心空间，在其中容纳第一电路板部件的电子元件。所述电子模块的特征在于，不仅在第一电路板部件的向外指向的表面上在第一电路板部件的外周边上，而且在第二电路板部件的向外指向的表面上与第一电路板部件的外周边相邻地分别环形环绕地构成微结构。此外沿着第一电路板部件的外周边构成密封环，该密封环不仅与在第一电路板部件上构成的微结构处于形状锁合的连接，而且与在第二电路板部件上构成的微结构处于形状锁合的连接。
按照本发明的第二方面描述一种用于加工电子模块、尤其如本发明上述第一方面所述的电子模块的方法。在此首先制备第一和第二电路板部件以及间隔体。然后不仅在第一电路板部件的向外指向的表面上在第一电路板部件的外周边上、而且在第二电路板部件的向外指向的表面上与第一电路板部件外周边相邻地构成环形环绕的微结构。接着布置至少一电子元件在指向中心空心空间的第一电路板部件的表面上，该空心空间被两个电路板部件和间隔体包围。然后沿着第一电路板部件的外周边这样构成密封环，使密封环不仅与在第一电路板部件上构成的微结构处于形状锁合的连接，而且与在第二电路板部件上构成的微结构处于形状锁合的连接。
本发明实施例的思想尤其可以视为以下面描述的思想和知识为基础。
目前借助于独立设置的外壳气密地封罩电子元件在电子模块中的技术方案已经被视为在加工中是成本昂贵和费事的。利用塑料包封注塑来围注例如配有电子元件的冲压格栅（引线框）由于为此必需的昂贵的注塑模具是成本昂贵的。通过例如由塑料制成的外壳部件和常见的设置在这些外壳部件之间的密封环的技术上简单的解决方案似乎不能长时间可靠地密封，由此必需通过附加的措施例如充入耐化学腐蚀的凝胶到围绕元件的区域中保护电子元件。
现在已经认识到，借助于两个最好相邻地相互平行设置的电路板部件例如印刷电路板（PCB-printedcircuitboard）可以形成电子模块。两个电路板部件相互间通过设置在其间的间隔体间隔。两个电路板部件与间隔体一起包围中心的空心空间，在其中可以容纳例如变速控制器的电子元件。为了可以可靠地气密地密封两个电路板部件之间、即邻接间隔体的区域在这个区域构成密封环。
在此考虑到，一般对于电路板部件使用的热固塑性材料例如环氧树脂一般不能或者大多不良地与其它材料利用粘接或者类似方式连接。因此建议，代替仅仅粘附粘接的、力锁合的连接在密封环与不仅第一而且第二电路板部件之间构成形状锁合的连接。为了可以构成这种形状锁合的连接，一方面在第一电路板部件的向外指向的表面上在邻接其外周边的区域中构成微结构。另一方面也在第二电路板部件上在向外指向的表面上构成微结构。
在此关于这种微结构可以理解为三维的结构，具有例如至少部分地向外敞开的空心空间、凹部和/或倒钩，具有在纳米范围的结构尺寸，例如10至100纳米范围的结构尺寸。
所述密封环可以这样构成，至少靠近表面的密封环区域嵌入到第一或第二电路板部件上的微结构中，由此实现在密封环与这些电路板部件之间所期望的形状锁合的连接。通过这样构成的在密封环一侧与在两个电路板部件另一侧之间的不仅力锁合而且形状锁合的连接可以保证，所述密封环长时间可靠地使盖部件固定在电路板部件上并且可以气密地密封两个部件之间的分界面。
所述密封环可以通过在配有微结构的电路板部件表面上成形或注塑塑料材料构成。在此在加工电子模块时可以通过成形或注塑原先液体的塑料材料形成密封环，液体的塑料材料可以流入到微结构的凹穴或倒钩中，并且接着可以硬化。由此以简单的方式可以产生所期望的形状锁合的连接。
例如所述密封环可以由塑料例如热塑塑料（例如聚酰胺，PA6，PA66）、热固塑料（例如以二氧化硅填充的环氧树脂）等、浇注物质如硅、环氧树脂物质等和/或粘接剂例如环氧基的粘接剂组成。尤其对于密封环可以使用可液体加工的然后硬化的塑料。这些材料一方面可以相当方便地加工并且是成本有利的，但是另一方面也可以得到长时间气密的密封以及足够地耐抗侵蚀性介质。
所述密封环可以通过不同的工艺制成。例如所述密封环可以通过热塑注塑（喷射）、即通过围注热塑塑料构成。选择地，所述密封环可以通过热固塑料模制、即通过热固塑料的变形形成，例如无压力或以压力例如在压铸（传递模塑）时。作为另一备选方案可以将浇注物质充入到为此规定的在电路板部件与盖部件之间的中间空间中，接着固化。也可以考虑借助于适合的粘接剂、例如可以是硅、环氧树脂、PUR/EP基或类似的粘接剂粘接电路板部件与盖部件。
所述电路板部件可以由市场上常见的电路板例如由热固塑料、例如以玻璃纤维强化的环氧树脂构成。这些热固材料经常作为电路板的载体材料使用，并且尤其可以具有有利的特性，这些特性使它们适合地在机动车的电子模块中应用。热固塑料尤其可以是化学稳定的并且耐抗侵蚀性介质并且耐受高温以及剧烈的温度变化。
所述间隔体同样可以由塑料制成，例如热塑塑料、热固塑料或者类似材料。所述间隔体可以由简单的注塑件构成。所述间隔体具有环形的造型，由此它可以在其边缘上包围在两个要间隔的电路板部件之间形成的中间空间，由此完全包裹用于容纳电子元件的中心的空心空间。
用于实现所期望的与密封环在两个电路板部件上的微结构的形状锁合的连接可以通过不同的工艺构成。
例如，可以通过激光结构成型技术构成微结构。在此激光射线对准要形成结构的表面。通过其吸收可以剧烈地加热在那里存在的材料并最终至少局部地蒸发。因此通过适合地局部地照射要形成结构的表面可以形成所期望的用于微结构的凹部、空穴和/或倒钩。对于激光形成结构例如可以使用功率弱激光，其具有直到100瓦的激光功率，如同例如作为刻字激光器所使用的那样，但是也可以使用紫外短脉冲激光器。
所述微结构也可以选择地通过化学拉毛、机械拉毛和/等离子拉毛、即通过使要形成的结构处于高能量的等离子下产生。为此可以使用市场上常见的等离子清洁设备，它例如通过水、氢气、氧气、过氧化氢或者环境空气工作。
在所建议的电子模块中尤其可以有利地这样构成密封环，使它向外敞露。这种纤维敞露的密封环在已经相应地布置两个电路板部件和间隔体以后可以方便地从外部成形、例如注塑（喷注）。在此在构成密封环之前电路板部件上的微结构也向外敞露，即设置在中心空心空间外部。
按照一实施例第一电路板部件可以具有第一电接头，它与至少一电子元件电连接，并且第二电路板部件可以具有第二电接头，它与至少一电子元件电连接。在此第一电接头可以与第二电接头通过导线电连接。通过这种方式可以使位于第一电路板部件上的电子元件与位于第二电路板部件上的电子元件接通。
第一电接头尤其可以与第二电接头在中心的空心空间内部通过挤压连接和/或弹簧触点电连接。因此作为连接的电导线的挤压连接或弹簧触点免受周围侵蚀性介质的侵蚀。
备选地可以使第一电接头与第二电接头在中心的空心空间以外通过在密封环中延伸的电导线电连接。在此，在所述密封环例如通过包封注塑这个区域形成之前，所述导线可以在第一与第二电路板部件之间设置在第一电路板部件周边附近。然后在接着包封注塑时将导线嵌入到密封环的还液体的材料中。
可以有利地使一个或两个电路板部件和/或间隔体配有金属层作为扩散阻挡。已经注意到，对于电路板部件或者间隔体使用的塑料不是总能完全地相对于侵蚀性介质密封。尤其某些介质可以穿过塑料扩散。例如通过在各自部件的内表面或外表面上淀积金属产生的附加金属层可以防止这种透过扩散，并因此改善气密的密封。
对此要指出，本发明实施例的可能的特征和优点在这里部分地参照按照本发明的电子模块、部分地参照按照本发明的变速器控制器并且部分地参照用于加工电子模块的方法描述。专业人员可以认识到，所述的特征可以通过适合的方式交换或者组合，并且尤其也可以从电子模块以类似的方式传递到加工方法，或者反之，由此可以得到其它实施例以及尤其协同效应。
附图说明
下面参照附图描述本发明的实施例，其中描述和附图不限制本发明。
图1（a），（b）示出按照本发明实施例的用于加工电子模块的方法以及完成加工的电子模块。
图2以横剖面示出利用微结构的形状锁合的连接。
图3（a），（b）示出按照本发明备选的实施例的用于加工电子模块的方法以及完成加工的电子模块。
图4示出按照本发明实施例的在变速器控制器中的电子模块。
图5示出具有变速控制器的变速器。
附图仅仅是示意的且不是比例真实的。相同的附图标记在不同的附图中表示相同或相同功能的特征。
具体实施方式
参照图1（a）和（b）描述按照本发明的电子模块1以及用于加工电子模块的方法的实施例。
首先制备第一电路板部件3和第二电路板部件5以及间隔体7。两个电路板部件3,5由热固塑料、例如玻璃纤维强化的环氧树脂组成。间隔体7作为框架设置在两个彼此平行设置的电路板部件3,5之间，由此电路板部件3,5与环形的间隔体7一起完全包裹中心的空心空间9。在此间隔体7在其厚度上这样设计尺寸，使中心的空心空间9提供足够的用于电子元件11的空间，这些电子元件在第一电路板部件3上设置在指向中心空心空间9的表面上。
然后在第一电路板部件3的向外指向的表面13上在这个第一电路板部件3的外周边15附近例如通过激光刻写（激光打毛技术）构成微结构17。在第二电路板部件5的相邻表面19上也构成微结构21。如同在图2中所示的那样，微结构17,21具有许多空穴或倒钩（内凹）形式的显微的小的凹部23。这些凹部一般具有亚微米范围的尺寸并且例如具有10至500nm的深度和/或宽度。
设置在电路板部件3,5上的微结构17,21可以接着在气密地封罩两个电路板部件3,5时相互辅助。为此例如在第一电路板部件3的外周边15区域中环形围绕这个周边15通过喷注涂覆可接着硬化的液体形式的塑料。在此液体塑料至少部分地流入到微结构17,21的凹部23中。在此间隔体7防止，液体塑料流入到中心的空心空间9中。在塑料硬化以后这个塑料形成密封环25。在此在流入到凹部23中并且然后硬化的塑料形成在密封环25与第一和第二电路板部件3,5的各自表面13,19之间的形状锁合和气密的连接。
在图1（b）中在左侧，密封环25以喷注的“毛虫”的形式构成。在此以液体状态涂覆的塑料紧贴在电路板部件3,5的表面13,19上并且流到微结构17,21中。但是绝大多数随机地得到向外敞露的表面27形状。在图1（b）右侧，已经利用模具涂覆密封环25，借助于模具邻接要连接的表面13,19首先形成凹穴，然后使它以用于密封环25的液体塑料充满，其中紧接着塑料硬化，由此能够实现用于密封环25的给定的外部几何尺寸。
设置在第一电路板部件3上的电子元件11与第一电接头29连接。在第二电路板部件5上设有第二电接头31，设置在第二电路板部件5上的电子元件47（在图1中未示出，但是参见图4）与第二电接头电连接。通过挤压连接33或者通过弹簧触点第一电接头29与第二电接头31电连接。通过这种方式设置在中心空心空间9中的电子元件11与设置在这个中心空心空间9外部的电子元件47电连接。
为了可以更好地排出在电子元件11运行期间释放的热量，最后可以通过开孔35充入导热胶49到中心的空心空间9中。两个电路板部件3,5可以具有排热孔，它们导引元件11的热量到两个电路板部件3,5的外侧面上。
最后例如可以通过钎焊、粘接剂或者压入的销子或者压入的球体39密封地封闭在两个电路板部件3,5中的充入孔35以及排气孔37。
在图3（a）和3（b）中示出电子模块1的可选择的实施例。在这个实施例中不在中心的空心空间9内部实现位于第一电路板部件3上的电子元件11与位于第二电路板部件5上的电子元件47之间的电连接。取而代之，通过电导线45实现这种在第一电路板部件3上的位于外部的电接头41与在第二电路板部件5上的同样位于外部的接头43之间的电连接。这些电导线45例如可以以焊线、扁平带式电缆或SMD跳线的形式设置。在此这些电导线45可以靠近第一电路板部件3的周边15设置，并且接着在以液体塑料包封注塑这个周边15时为了形成密封环25被一起浇注。与在图1中所示的挤压触点相比，这种位于外部的电导线45、尤其以焊带的形式具有优点，它们不在电路板部件3,5中钻孔地发挥功能并因此能够实现更简单地准备部件。在用于挤压触点的钻孔时要避免通孔，以便不会产生对外的不密封性。
图4示出变速控制器100，具有多个电子模块1、用作电气元件47的外部的传感器101以及多个同样用作电气元件47的插头103。在此那个电路板称为第二电路板部件5，它承担电子部件与外电路的电气元件47的布线。在变速控制器100中电气元件是传感器101、插头103、其它电路和执行器等等。第一电路板部件3可以是HDI-PCB(highidentityinterconnect)、DBC(directbondedcopper),或者陶瓷衬底（LTCC,HTCC,厚层等）形式的电路板，它们形成例如用于变速器控制器的电子部件的开关回路。但是基于本发明的发明思想主要在PCB与PCB的密封中应用。载体板105机械地支承电子模块。
图5示出机动车变速器200，具有在其中利用按照本发明的电子模块构成的变速控制器100。但是所述的电子模块也可以用于其它应用，例如在发动机中或者在机动车中的其它位置，例如在油箱、冷却水、尿素设备、电驱动装置、在溅水区域等等中使用。

Claims (12)

1.一种电子模块（1），具有：第一电路板部件（3），其具有至少一设置在其上的电子元件（25）；第二电路板部件（5），其具有至少一设置在其上的电子元件（47）；一间隔体（7）；其中，第一电路板部件（3）、第二电路板部件（5）和间隔体（7）这样构成，使它们共同地完全包裹一个中心的空心空间（9），在其中容纳第一电路板部件（3）的电子元件（25），其特征在于，不仅在第一电路板部件（3）的向外指向的表面（13）上在第一电路板部件（3）的外周边（15）上，而且在第二电路板部件（5）的向外指向的表面（19）上与第一电路板部件（3）的外周边（15）相邻地分别环形环绕地构成微结构（17,21），并且沿着第一电路板部件（3）的外周边（15）构成密封环（25），该密封环不仅与在第一电路板部件（3）上构成的微结构（17）处于形状锁合的连接，而且与在第二电路板部件（5）上构成的微结构（21）处于形状锁合的连接。
2.如权利要求1所述的电子模块，其中，所述密封环（13）通过在配有微结构（17,21）的第一电路板部件（3）和第二电路板部件（5）的表面上成形塑料材料构成。
3.如权利要求1或2所述的方法，其中，所述第一电路板部件（3）和/或第二电路板部件（5）由热固塑料制成。
4.如权利要求1至3中任一项所述的电子模块，其中，所述密封环（25）由塑料、浇铸物质和/或粘接剂组成。
5.如权利要求1至4中任一项所述的电子模块，其中，所述密封环（25）向外敞露。
6.如权利要求1至5中任一项所述的电子模块，其中，所述第一电路板部件（3）具有第一电接头（29），它们与至少一电子元件（25）电连接，和其中第二电路板部件（5）具有第二电接头（31），它们与至少一电子元件（47）电连接，和其中第一电接头（29）与第二电接头（31）通过导线（33,45）电连接。
7.如权利要求6所述的电子模块，其中，所述第一电接头Z(29)与第二电接头（31）在中心空心空间（9）内部通过挤压连接（33）和/或弹簧触点电连接。
8.如权利要求6所述的电子模块，其中，所述第一电接头（29）与第二电接头（31）在中心空心空间（9）外部通过在密封环（25）中延伸的电导线（45）电连接。
9.一种用于机动车的变速器控制器（100），具有如权利要求1至8中任一项所述的电子模块（1）。
10.一种用于加工电子模块（1）的方法，具有：提供第一电路板部件（3）、第二电路板部件（5）和间隔体（7），其中第一电路板部件（3）、第二电路板部件（5）和间隔体（7）这样构成，使它们共同地完全包裹中心的空心空间（9），在其中容纳第一电路板部件（3）的电子元件（25），其特征在于，所述方法还具有：不仅在第一电路板部件（3）的向外指向的表面（13）上在第一电路板部件（3）的外周边（15）上、而且在第二电路板部件（5）的向外指向的表面（19）上与第一电路板部件（3）外周边（15）相邻地构成环形环绕的微结构（17,21）；布置至少一电子元件（25）在指向中心空心空间（9）的第一电路板部件（3）的表面上；并且沿着第一电路板部件（3）的外周边（15）这样构成密封环（25），使密封环（25）不仅与在第一电路板部件（3）上构成的微结构（17）处于形状锁合的连接，而且与在第二电路板部件（5）上构成的微结构（21）处于形状锁合的连接。
11.如权利要求10所述的方法，其中，所述微结构（17,21）通过选自包括激光结构成型、化学拉毛、机械拉毛和等离子拉毛的组中的至少一种方法构成。
12.如权利要求10或11所述的方法，其中，所述密封环（25）通过选自包括热塑性注塑、热固模塑、粘接和充入浇铸物质组成的组中的至少一种方法构成。
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CN107613644B (zh) * 2017-09-18 2019-09-17 Oppo广东移动通信有限公司 电路板、电子设备及封装方法
CN108156782A (zh) * 2018-01-15 2018-06-12 维沃移动通信有限公司 一种通孔密封结构及电子设备
CN110779564A (zh) * 2018-07-30 2020-02-11 罗伯特·博世有限公司 具有两个以封装的方式共同作用的塑料封装元件的构件
CN110779564B (zh) * 2018-07-30 2023-10-20 罗伯特·博世有限公司 具有两个以封装的方式共同作用的塑料封装元件的构件

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