JP2008083586A - Exposure light source, exposure apparatus, exposure method and method for manufacturing panel substrate for display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make the surface temperature of lamps uniform and to stabilize illuminance of exposure light by using a plurality of lamps and responding to requirements for high luminance and changing the luminance. <P>SOLUTION: A plurality of lamps 31a, 31b, 31c, 31d are used for a light source generating exposure light, and barrier walls 50a, 50b, 50c, 50d, 50e are disposed between the lamps so as to prevent the exposure light emitting from each lamp from irradiating other lamps as well as to suppress the heat generating in each lamp from transmitting to other lamps. The lamps 31a, 31b, 31c, 31d, condenser mirrors 32a, 32b, 32c, 32d and barrier walls 50a, 50b, 50c, 50d, 50e are housed in a lamp house 39, and the lamp house 39 is provided with a gas suction port 39a and a gas discharge port 39b for cooling medium so as to produce a flow of the cooling medium around each lamp to cool each lamp. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an exposure light source, an exposure apparatus, an exposure method, and a display panel substrate manufacturing method using the exposure light source used when exposing a substrate in manufacturing a display panel substrate such as a liquid crystal display device. .

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, etc. for liquid crystal display devices used as display panels is performed using an exposure apparatus, and photolithography. This is performed by forming a pattern on the substrate by a technique. The exposure apparatus transfers a mask pattern onto a substrate by irradiating the substrate coated with a photosensitive resin material (photoresist) with exposure light through the mask.

As a light source for generating exposure light of an exposure apparatus, a lamp in which high-pressure gas is enclosed in a bulb, such as a mercury lamp, a halogen lamp, or a kinocene lamp, is used. These lamps generate a large amount of heat, and if the temperature is too high, the bulb may burst, so it must be used while cooling. For example, Patent Document 1 discloses a cooling mechanism for an exposure illumination device.
Japanese Patent Laid-Open No. 2004-71782

  In general, the illuminance of exposure light varies depending on the surface temperature of the lamp. A specified value of the surface temperature is determined for the lamp, and when performing an exposure process, the surface temperature of the lamp must be kept at a specified value in order to stabilize the illuminance of the exposure light.

  The amount of exposure light is proportional to the illuminance of the exposure light and the exposure time. In recent years, as the size of a substrate increases with an increase in the screen size of a display panel, a light source having a higher luminance has been required. The higher the brightness of the light source, the higher the illuminance of the exposure light, the shorter the exposure time, the shorter the tact time, and the higher the throughput.

  Further, when the amount of exposure light required for exposure differs depending on the size of the substrate and the type of photoresist, conventionally, it has been necessary to replace the lamp and change the luminance of the light source. Since replacing the lamp takes time and effort, there has been a demand to change the brightness of the light source without replacing the lamp.

  In order to satisfy these requirements, it is conceivable to use a plurality of lamps as a light source for generating exposure light, increase the luminance of the light source as a whole, and change the luminance of the light source by switching the lamp. However, if only a plurality of lamps are used, it is difficult to make the surface temperature of the lamp uniform, and there is a problem that the illuminance of the exposure light is not stable. This is because a part of the exposure light generated from each lamp is irradiated to the adjacent lamp through the condenser mirror provided directly or around each lamp, and the exposure light of the adjacent lamp is irradiated This is because a temperature difference is generated between the non-irradiated portion and the non-irradiated portion. Moreover, the heat generated from each lamp is transmitted to the adjacent lamp, and a temperature difference is generated between a location near and far from the adjacent lamp.

  An object of the present invention is to stabilize the illuminance of exposure light by using a plurality of lamps, making the surface temperature of the lamps uniform while meeting the demand for changing the brightness and brightness. Another object of the present invention is to manufacture a high-quality substrate with a short tact time.

  The exposure light source of the present invention is provided between each lamp and a plurality of lamps that generate exposure light, a plurality of condenser mirrors that are provided around each lamp and collect the exposure light generated from each lamp. A partition wall for preventing exposure light generated from each lamp from being irradiated to other lamps and suppressing heat generated from each lamp from being transmitted to the other lamps, and an intake port and an exhaust port for the cooling medium And a plurality of lamps, a plurality of condenser mirrors, and a partition wall, and a lamp house that cools each lamp by forming a flow of a cooling medium around each lamp.

  The exposure apparatus of the present invention includes the exposure light source, and exposes the substrate with exposure light generated from a plurality of lamps of the exposure light source.

  In the exposure method of the present invention, a plurality of lamps are used as a light source for generating exposure light, and a condensing mirror is provided around each lamp to collect the exposure light generated from each lamp, and between the lamps. The partition wall is provided to prevent the exposure light generated from each lamp from being irradiated to other lamps and to prevent the heat generated from each lamp from being transmitted to the other lamps. Condensing mirror and bulkhead are housed in the lamp house. The lamp house is provided with an inlet and an outlet for the cooling medium, and a cooling medium flow is formed around each lamp to cool each lamp. The substrate is exposed with the exposed exposure light.

  Since a plurality of lamps are used as the light source that generates the exposure light, the luminance of the light source can be increased as a whole, and the luminance of the light source can be changed by switching the lamp. The partition provided between the lamps prevents the exposure light generated from each lamp from being irradiated to other lamps and suppresses the heat generated from each lamp from being transmitted to the other lamps. On the surface of the lamp, the temperature difference due to the influence of exposure light from other lamps and heat becomes small. Therefore, a plurality of lamps, a plurality of condenser mirrors, and a partition wall are accommodated in the lamp house, a cooling medium intake port and an exhaust port are provided in the lamp house, a flow of the cooling medium is formed around each lamp, and each lamp is installed. When cooled, the lamp surface is cooled uniformly.

  Furthermore, in the exposure light source of the present invention, the partition has a cooling water passage through which cooling water flows. An exposure apparatus according to the present invention includes the exposure light source, and exposes the substrate with exposure light generated from a plurality of lamps of the exposure light source. In the exposure method of the present invention, a cooling water passage is provided in the partition wall, and the partition wall is cooled by flowing cooling water through the cooling water passage.

  Since the partition walls are cooled by the cooling water, the heat generated from each lamp is further suppressed from being transmitted to other lamps, and the temperature difference on the lamp surface is further reduced. Therefore, a plurality of lamps, a plurality of condenser mirrors, and a partition wall are accommodated in the lamp house, a cooling medium intake port and an exhaust port are provided in the lamp house, a flow of the cooling medium is formed around each lamp, and each lamp is installed. When cooled, the lamp surface is more evenly cooled.

  The method for producing a display panel substrate of the present invention is to transfer the mask pattern onto the substrate using any one of the exposure apparatuses or exposure methods described above. By using the above-described exposure apparatus or exposure method, the illuminance of the exposure light is stabilized while meeting the demand for changing the high luminance and the luminance, so that a high-quality substrate is manufactured with a short tact time.

  According to the exposure light source, the exposure apparatus, and the exposure method of the present invention, a plurality of lamps can be used to reduce the temperature difference on the surface of the lamp while meeting the demands for changing the brightness and brightness. The surface can be cooled uniformly. Accordingly, the surface temperature of the lamp can be made uniform, and the illuminance of the exposure light can be stabilized.

  Furthermore, according to the exposure light source, the exposure apparatus, and the exposure method of the present invention, a cooling water passage is provided in the partition wall, and the cooling wall is cooled by flowing cooling water through the cooling water passage, thereby reducing the temperature difference on the surface of the lamp. The surface of the lamp can be cooled more uniformly by making it smaller. Therefore, the surface temperature of the lamp can be made more uniform, and the illuminance of the exposure light can be further stabilized.

  According to the method for manufacturing a display panel substrate of the present invention, the illuminance of the exposure light can be stabilized while responding to the demand for high brightness and change in brightness, and thus a high quality substrate is manufactured in a short tact time. be able to.

  FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. This embodiment shows an example of a proximity exposure apparatus that transfers a mask pattern to a substrate by providing a minute gap (proximity gap) between the mask and the substrate. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a Z-tilt mechanism 9, a chuck 10, a mask holder 20, and an exposure light irradiation device 30. Has been. In addition to these, the exposure apparatus includes a carry-in unit for carrying in the substrate 1, a carry-out unit for carrying out the substrate 1, a temperature control unit for managing the temperature in the apparatus, and the like.

  In FIG. 1, the chuck 10 is at an exposure position where the substrate 1 is exposed. The mask 2 is held by the mask holder 20 above the exposure position. The substrate 1 is mounted on the chuck 10 by a carry-in unit (not shown) at a delivery position away from the exposure position, and is recovered from the chuck 10 by a carry-out unit (not shown).

  The chuck 10 is mounted on the θ stage 8 via a Z-tilt mechanism 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 moves in the X direction (the horizontal direction in the drawing) along the X guide 4 provided on the base 3. As the X stage 5 moves in the X direction, the chuck 10 moves between the delivery position and the exposure position. The Y stage 7 moves in the Y direction (the drawing depth direction) along the Y guide 6 provided on the X stage 5. The θ stage 8 rotates in the θ direction, and the Z-tilt mechanism 9 moves and tilts in the Z direction (vertical direction in the drawing).

  At the exposure position, the substrate 1 is positioned by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Further, the gap control between the mask 2 and the substrate 1 is performed by the movement and tilt of the Z-tilt mechanism 9 in the Z direction.

  An exposure light irradiation device 30 is provided above the mask holder 20. The exposure light irradiation device 30 includes lamps 31a, 31b, 31c, and 31d, condensing mirrors 32a, 32b, 32c, and 32d, a first plane mirror 33, a lens 34, a shutter 35, a collimator lens 36, a second plane mirror 37, and a power source 38. , A lamp cooling mechanism, and partition walls 50a, 50b, 50c, 50d, and 50e.

  FIG. 2 is a top view of a lamp according to an embodiment of the present invention. In the present embodiment, four lamps 31a, 31b, 31c, and 31d are used as light sources that generate exposure light. As the lamps 31a, 31b, 31c, and 31d, lamps in which high pressure gas is enclosed in a bulb, such as mercury lamps, halogen lamps, and kinocene lamps, are used.

  Around the lamps 31a, 31b, 31c, and 31d, condensing mirrors 32a, 32b, 32c, and 32d that collect the exposure light generated from the lamps 31a, 31b, 31c, and 31d are provided. In the present embodiment, two adjacent lamps are arranged close to a distance smaller than the diameter of the condenser mirror by cutting out part of the condenser mirrors 32a, 32b, 32c, and 32d. However, two adjacent lamps may be arranged at a distance larger than the diameter of the condenser mirror without cutting out a part of the condenser mirrors 32a, 32b, 32c, 32d.

  The lamps 31a, 31b, 31c, and 31d are turned on when a voltage is applied from the power supply 38 in FIG. 1, and generate exposure light. The exposure light generated from the lamps 31a, 31b, 31c, 31d is condensed by the condensing mirrors 32a, 32b, 32c, 32d and irradiated to the first flat mirror 33 in FIG.

  In FIG. 1, the exposure light reflected by the first plane mirror 33 enters a lens 34 such as a fly-eye lens or a lot lens, passes through the lens 34, and the illuminance distribution becomes uniform. When the shutter 35 is open, the exposure light transmitted through the lens 34 is transmitted through the collimator lens 36 to become a parallel light beam, reflected by the second plane mirror 37, and irradiated onto the mask 2.

  Since the four lamps 31a, 31b, 31c, and 31d are used as the light source that generates the exposure light, the luminance of the light source can be increased as a whole, and the luminance of the light source can be changed by switching the lamps 31a, 31b, 31c, and 31d. it can. For example, using all lamps with the same brightness, turn on all lamps when the amount of exposure light required for exposure is high, and select some lamps when the amount of exposure light required for exposure is low. You may turn on only. Alternatively, use lamps with different brightness for all or some of the lamps, turn on all lamps when the amount of exposure light required for exposure is high, and expose when the amount of exposure light required for exposure is low. Only a lamp having a luminance suitable for the amount of light may be turned on.

  In FIG. 2, a partition wall 50a is provided between the lamp 31a and the lamp 31b. A partition wall 50b is provided between the lamp 31b and the lamp 31c. Further, a partition wall 50c is provided between the lamp 31c and the lamp 31d. Further, a partition wall 50d is provided between the lamp 31d and the lamp 31a. Further, a partition wall 50e is provided between the lamp 31a and the lamp 31c.

  In addition, what is necessary is just to provide a partition between lamps, and the number can be suitably determined according to arrangement | positioning of a some lamp. For example, when four lamps are arranged with the same distance between adjacent lamps, the number of partition walls may be four. Further, a plurality of partition walls may be connected to form an integral structure.

  3 is a partial cross-sectional side view of the AA portion of FIG. 4 is a partial cross-sectional side view of the BB portion in FIG. In FIG. 3 or FIG. 4, the condenser mirrors 32a, 32b, 32c, and 32d are shown in a cross-sectional view of the AA portion or the BB portion, and the lamps 31a, 31b, 31c, 31d and the partition walls 50a, 50b, 50d and 50e are shown in a side view.

  The partitions 50a, 50b, 50c, 50d, and 50e are made of aluminum having a high ultraviolet reflectivity, and prevent exposure light generated from the lamps 31a, 31b, 31c, and 31d from being irradiated to other lamps. The heat generated from 31a, 31b, 31c, and 31d is prevented from being transmitted to other lamps.

  The partition walls 50a, 50b, 50c, 50d, 50e provided between the lamps 31a, 31b, 31c, 31d prevent the exposure light generated from the lamps 31a, 31b, 31c, 31d from being irradiated to other lamps. In addition, since heat generated from the lamps 31a, 31b, 31c, and 31d is suppressed from being transmitted to other lamps, the surfaces of the lamps 31a, 31b, 31c, and 31d are affected by exposure light and heat from the other lamps. The temperature difference becomes smaller. Therefore, when the lamps 31a, 31b, 31c and 31d are cooled by a lamp cooling mechanism which will be described later, the surfaces of the lamps 31a, 31b, 31c and 31d are uniformly cooled.

  Further, in the present embodiment, a cooling mechanism is provided in the partition walls 50a, 50b, 50c, 50d, and 50e. FIG. 5 is a view showing a partition wall cooling mechanism according to an embodiment of the present invention. A cooling water passage 51 through which cooling water flows is provided inside the partition wall 50e. The temperature-adjusted cooling water is supplied from the water supply pipe 52 to the cooling water passage 51, and the cooling water flowing through the cooling water passage 51 is discharged from the drain pipe 53. The partition wall 50 e is cooled by the cooling water flowing through the cooling water passage 51. The partitions 50a, 50b, 50c, and 50d have the same configuration as the partition 50e.

  Since the partition walls 50a, 50b, 50c, 50d, and 50e are cooled by the cooling water, the heat generated from the lamps 31a, 31b, 31c, and 31d is further suppressed from being transmitted to other lamps, and the lamps 31a, 31b, 31c, and 31d. The temperature difference on the surface of the film becomes even smaller. Therefore, when the lamps 31a, 31b, 31c, 31d are cooled by a lamp cooling mechanism described later, the surfaces of the lamps 31a, 31b, 31c, 31d are cooled more uniformly.

  FIG. 6 is a diagram showing a lamp cooling mechanism according to an embodiment of the present invention. The lamp cooling mechanism includes a lamp house 39 and an exhaust fan 40.

  The lamp house 39 accommodates lamps 31a, 31b, 31c, 31d, condensing mirrors 32a, 32b, 32c, 32d, a first plane mirror 33, a lens 34, and partition walls 50a, 50b, 50c, 50d, 50e. . The lamp house 39 has an air intake port 39a at a position below the lamps 31a, 31b, 31c, 31d, and an air exhaust port 39b at a position above the lamps 31a, 31b, 31c, 31d. An exhaust fan 40 is connected to the exhaust port 39b. When the exhaust fan 40 is started, air in the lamp house 39 is exhausted from the exhaust port 39b, and air is sucked from the intake port 39a in order to supplement the air into the lamp house 39.

  At the bottom of the condenser mirrors 32a, 32b, 32c, 32d, openings through which the lamps 31a, 31b, 31c, 31d pass are provided, and the air sucked from the air inlets 39a is indicated by arrows as shown by arrows. The lamps 31a, 31b, 31c, and 31d flow through the openings of the condenser mirrors 32a, 32b, 32c, and 32d to cool the lamps 31a, 31b, 31c, and 31d. The air that flows around the lamps 31a, 31b, 31c, and 31d absorbs heat from the lamps 31a, 31b, 31c, and 31d, increases in temperature, and is discharged from the exhaust port 39b.

  According to the embodiment described above, a plurality of lamps 31a, 31b, 31c, and 31d are used, and the temperature difference between the surfaces of the lamps 31a, 31b, 31c, and 31d is achieved while meeting the demand for changing the high brightness and the brightness. The surface of the lamps 31a, 31b, 31c, 31d can be uniformly cooled. Accordingly, the surface temperature of the lamps 31a, 31b, 31c, 31d can be made uniform, and the illuminance of the exposure light can be stabilized.

  Further, a cooling water passage 51 is provided in the partition walls 50a, 50b, 50c, 50d, and 50e, and the cooling water is allowed to flow through the cooling water passage 51 to cool the partition walls, whereby the temperature difference between the surfaces of the lamps 31a, 31b, 31c, and 31d. Can be further reduced to cool the surfaces of the lamps 31a, 31b, 31c, and 31d more uniformly. Accordingly, the surface temperatures of the lamps 31a, 31b, 31c, and 31d can be made more uniform, and the illuminance of the exposure light can be further stabilized.

  In the embodiment described above, four lamps 31a, 31b, 31c, and 31d are used as light sources for generating exposure light. However, the present invention is not limited to this, and two, three, or five or more are used. The lamp may be used. In the embodiment described above, air is used as a cooling medium for cooling the lamps 31a, 31b, 31c, and 31d. However, the present invention is not limited to this, and a gas other than air may be used as the cooling medium. Good. In the embodiment described above, the lamp house 39 is provided with the two air inlets 39a. However, one or three or more air inlets may be provided. Similarly, in the embodiment described above, one exhaust port 39b is provided in the lamp house 39, but two or more exhaust ports may be provided.

  The present invention can be applied not only to a proximity exposure apparatus but also to a projection exposure apparatus that projects a mask pattern onto a substrate using a lens or a mirror.

  By using the exposure apparatus or exposure method of the present invention to transfer the mask pattern to the substrate, the illuminance of the exposure light can be stabilized while meeting the demands for changing the brightness and brightness. Can be manufactured with a short tact time.

  For example, FIG. 7 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on a glass substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the glass substrate.

  FIG. 8 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the glass substrate by processes such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the glass substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 7, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 8, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure process, the exposure apparatus or the exposure method of the present invention can be applied.

1 is a diagram showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. It is a top view of the lamp | ramp by one Embodiment of this invention. It is a partial cross section side view of the AA part of FIG. It is a partial cross section side view of the BB part of FIG. It is a figure which shows the partition cooling mechanism by one embodiment of this invention. It is a figure which shows the lamp cooling mechanism by one embodiment of this invention. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Mask 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 Z-tilt mechanism 10 Chuck 20 Mask holder 30 Exposure light irradiation devices 31a, 31b, 31c, 31d Lamps 32a, 32b, 32c, 32d Condenser mirror 33 First plane mirror 34 Lens 35 Shutter 36 Collimator lens 37 Second plane mirror 38 Power source 39 Lamp house 39a Inlet port 39b Exhaust port 40 Exhaust fans 50a, 50b, 50c, 50d, 50e Partition wall 51 Cooling water passage 52 Water supply Pipe 53 Drain pipe

Claims (7)

A plurality of lamps for generating exposure light;
A plurality of condensing mirrors that are provided around each lamp and condense exposure light generated from each lamp;
A partition provided between the lamps, preventing exposure light generated from each lamp from being irradiated to other lamps, and suppressing heat generated from each lamp from being transmitted to the other lamps;
A lamp house having an inlet and an outlet for a cooling medium, accommodating the plurality of lamps, the plurality of condenser mirrors, and the partition wall, and forming a flow of a cooling medium around each lamp to cool each lamp And a light source for exposure.   The exposure light source according to claim 1, wherein the partition wall has a cooling water passage through which cooling water flows.   An exposure apparatus comprising the exposure light source according to claim 1, wherein the substrate is exposed with exposure light generated from the plurality of lamps of the exposure light source. Using multiple lamps as a light source that generates exposure light
A condenser mirror is provided around each lamp to collect the exposure light generated from each lamp,
A partition is provided between each lamp to prevent exposure light generated from each lamp from being irradiated to other lamps, and to prevent the heat generated from each lamp from being transmitted to other lamps,
A plurality of lamps, a plurality of condenser mirrors and a partition wall are accommodated in a lamp house,
The lamp house is provided with an inlet and an outlet for a cooling medium, and a cooling medium flow is formed around each lamp to cool each lamp.
An exposure method comprising exposing a substrate with exposure light generated from a plurality of lamps.   5. The exposure method according to claim 4, wherein a cooling water passage is provided in the partition wall, and the partition wall is cooled by flowing cooling water through the cooling water passage.   A method of manufacturing a display panel substrate, wherein the mask pattern is transferred to the substrate using the exposure apparatus according to claim 3.   6. A method for manufacturing a display panel substrate, wherein the mask pattern is transferred to the substrate using the exposure method according to claim 4.

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