KR20130032716A - Exposure apparatus having projection lens position function using underpressure system - Google Patents

Exposure apparatus having projection lens position function using underpressure system Download PDF

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Publication number
KR20130032716A
KR20130032716A KR1020110096475A KR20110096475A KR20130032716A KR 20130032716 A KR20130032716 A KR 20130032716A KR 1020110096475 A KR1020110096475 A KR 1020110096475A KR 20110096475 A KR20110096475 A KR 20110096475A KR 20130032716 A KR20130032716 A KR 20130032716A
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KR
South Korea
Prior art keywords
negative pressure
projection lens
exposure apparatus
vacuum
circulation
Prior art date
Application number
KR1020110096475A
Other languages
Korean (ko)
Inventor
차문길
정강석
Original Assignee
(주)모스타
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Publication date
Application filed by (주)모스타 filed Critical (주)모스타
Priority to KR1020110096475A priority Critical patent/KR20130032716A/en
Publication of KR20130032716A publication Critical patent/KR20130032716A/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus having a position control function of a projection lens using a negative pressure system, and more particularly, to an exposure apparatus for irradiating light onto a semiconductor substrate having an insulating film or a conductive film to form a pattern on the substrate. It has a negative pressure space in the upper surface portion is provided with a transparent panel, the bottom portion is provided on the negative pressure case and the negative pressure case provided with a projection lens is disposed on the lower portion of the projection lens through the transparent panel and the projection lens. An illumination device for irradiating light to the semiconductor substrate and a circulation negative pressure device for circulating internal air of the negative pressure case and maintaining the horizontal state of the projection lens by negative pressure in the negative pressure space. The center part of the deflected projection lens is moved horizontally and is kept horizontal to irradiate light uniformly. In addition, since the light can be irradiated in proximity to the printed circuit board, there is an effect of forming a film with a uniform thickness on the surface.

Description

Exposure apparatus with position control function of projection lens using negative pressure system {EXPOSURE APPARATUS HAVING PROJECTION LENS POSITION FUNCTION USING UNDERPRESSURE SYSTEM}

The present invention relates to an exposure apparatus having a position control function of a projection lens using a negative pressure system, and more particularly, by installing a circulation negative pressure device in a negative pressure case and applying a projection lens installed in the negative pressure case to a negative pressure due to circulation of air. Projected lens using a negative pressure system that forms a film with a uniform thickness on the surface by allowing the light to be uniformly irradiated to the printed circuit board, while maintaining the horizontal position as the central part of the projection lens is moved upward. An exposure apparatus having a position control function of.

The exposure process is a technique of forming a photoresist film on an LCD glass substrate using an organic photoresist and then exposing the photoresist film to form a photoresist pattern.

Specifically, when light is irradiated onto the LCD glass substrate on which the insulating film or the conductive film is formed, a photoresist film, which is an organic layer in which the solubility change in the alkaline solution occurs, is formed.

Light is irradiated to the photoresist film in a state where the reticle is disposed so as to selectively expose only a predetermined portion over the photoresist film. By developing the photoresist film irradiated with light, a photoresist pattern is formed on the LCD glass substrate.

The photoresist pattern is a mask for etching the film formed on the LCD glass substrate. Therefore, it is very important that the photoresist pattern is formed in the correct position at the correct size.

In particular, in order to manufacture a recent semiconductor device having a fine line width, it is required to optimize exposure conditions such as focus in the exposure process.

That is, the upper surface of the stage must be perpendicular to the optical axis of the projection lens.

However, the conventional projection lens is disposed horizontally with the ground on which the printed circuit board is placed, and due to its own weight, the center portion of the projection lens is drooped downward, which causes the focus to be blurred or biased, so that the entire surface of the projection lens cannot be uniformly irradiated with light. There is a problem that is difficult to form a film.

The present invention has been made to solve the above problems, an object of the present invention is to install a circulation negative pressure device in the negative pressure case, the center portion of the projection lens sag by the negative pressure according to the air circulation circulated through the projection lens installed in the negative pressure case Is maintained horizontally as it is moved upwards to uniformly irradiate light and has a position control function of the projection lens using a negative pressure system that forms a film with a uniform thickness on the surface by irradiating light close to the printed circuit board. Its purpose is to provide an exposure apparatus.

The present invention is an exposure apparatus for forming a pattern on a substrate by irradiating light to a semiconductor substrate formed with an insulating film or a conductive film, a negative pressure space therein, a transparent panel is provided on the upper surface portion, the projection lens is provided on the bottom portion A negative pressure case and an illumination device which is provided on an upper portion of the negative pressure case and circulates the internal air of the negative pressure case and an illumination device for irradiating light to the semiconductor substrate disposed under the projection lens through the transparent panel and the projection lens. And a circulating negative pressure device for maintaining the horizontal state of the projection lens by the negative pressure of the negative pressure space.

In addition, the negative pressure case is further provided with a vacuum device for maintaining the interior in a vacuum state, the vacuum device is made of a vacuum tube installed on one side of the negative pressure case in communication with the negative pressure space and a vacuum blower installed in the vacuum tube It is characterized by.

In addition, the circulation negative pressure device is characterized in that both ends of the circulation pipe is installed in the negative pressure casing in communication with the negative pressure space and the circulation blower is installed in the circulation pipe and the shut-off valve for blocking the blow.

In the exposure apparatus having the position control function of the projection lens using the negative pressure system of the present invention, the central portion of the projection lens sag due to negative pressure due to the air circulation circulated through the projection lens installed in the negative pressure case by installing the circulation negative pressure device in the negative pressure case As it is moved horizontally, the light is uniformly irradiated and the light is irradiated close to the printed circuit board, thereby forming a film having a uniform thickness on the surface.

1 is a block diagram showing an exposure apparatus having a position control function of a projection lens using a negative pressure system according to the present invention.
2 is a view showing an operating state of the circulation negative pressure device in the exposure apparatus having the position control function of the projection lens using the negative pressure system according to the present invention.
3 is a view showing an operating state of the vacuum apparatus in the exposure apparatus having the position control function of the projection lens using the negative pressure system according to the present invention.
4 is a view illustrating an operating state of a circulation negative pressure device and a vacuum device in an exposure apparatus having a position control function of a projection lens using the negative pressure system according to the present invention.

Hereinafter, exemplary embodiments of an exposure apparatus having a position control function of a projection lens using a negative pressure system according to the present invention will be described with reference to the accompanying drawings. In this process, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation. In addition, the terms described below are defined in consideration of the functions in the present invention, and this may vary depending on the intention or custom of the user, the operator. Therefore, definitions of these terms should be made based on the contents throughout this specification.

In addition, the following examples are not intended to limit the scope of the present invention but merely presented by way of example, and there may be various embodiments implemented through the present invention.

1 is a configuration diagram showing an exposure apparatus having a position control function of a projection lens using a negative pressure system according to the present invention, Figure 2 is an operation of the exposure apparatus having a position control function of a projection lens using a negative pressure system according to the present invention Figure 3 is a view showing a state, Figure 3 is an exposure apparatus having a position control function of a projection lens using a negative pressure system according to the present invention, a view showing an operating state of the vacuum apparatus, Figure 4 is a negative pressure system according to the present invention In the exposure apparatus having the position control function of the projection lens used, the circulation negative pressure device and the vacuum device are shown in an operating state together.

As shown in the drawing, the exposure apparatus 10 (hereinafter referred to as an exposure apparatus) having a position control function of a projection lens using the negative pressure system of the present invention is irradiated with light on a semiconductor substrate 100 having an insulating film or a conductive film on the substrate. As a pattern is formed, such an exposure apparatus 10 includes a negative pressure case 20, an illumination device 30, and a circulation negative pressure device 40.

The negative pressure case 20 is formed in a rectangular case shape made of a metal material or a synthetic resin material, has a negative pressure space therein, a transparent panel 211 is provided on the upper surface portion 21, and a projection on the bottom surface portion 22. The lens 221 is provided. The transparent panel 211 is made of glass material and the light irradiated from the lighting device 30 passes, and the projection lens 221 is made of synthetic resin material or glass material and the light passed through the transparent panel 211 is The semiconductor substrate 100 disposed under the negative pressure case 20 is exposed through the projection lens 221 so that the surface of the semiconductor substrate is exposed to light (film formation).

At this time, the fastening hole is formed in the upper surface portion 21 and the lower surface portion 22 of the negative pressure case 20, and the transparent panel 211 and the projection lens 221 are each airtight on the edge of the fastening hole. It is fixed by fusion or screwing to maintain it.

As described above, the photosensitive (irradiating a chemical change in response to light) by irradiating light onto the semiconductor substrate 100 through the projection lens 221 is already widely known and used in the same field, and thus will be described in more detail. Is omitted.

The lighting device 30 is disposed above the negative pressure case 20 to irradiate light, and the light irradiated from the lighting device 30 passes through the transparent panel 211 and the projection lens 221. Light is transmitted to the semiconductor substrate 100 disposed below.

The circulation negative pressure device 40 maintains the projection lens 221 in a horizontal state by negative pressure in the negative pressure space by circulating internal air of the negative pressure case 20, and the circulation negative pressure device 40 has both ends. Is composed of a circulation pipe 41 installed in the negative pressure case 20 and the circulation blower 42 installed in the circulation pipe 41 and the shut-off valve 43 to block the air flow in communication with the negative pressure space.

That is, the circulation negative pressure device 40 circulates air in the negative pressure space and the circulation pipe 41 by driving the circulation blower 42 to generate negative pressure in the negative pressure case 20, thereby causing self-weight. The center portion of the projection lens 221, which is curved downward and is curved downward, is horizontally disposed while being upwardly moved, thereby preventing the irradiated light from being refracted or biased to be uniformly exposed to the semiconductor substrate 100. Will be.

In the above, the circulation negative pressure device 40 circulates the air inside the circulation pipe 41 and the negative pressure case 20 to move the central portion of the projection lens 221 sagging due to negative pressure upwards, thereby causing the projection lens 221 to be moved. It is shown in the description and drawings to be arranged horizontally without sag, but is not limited thereto.

For example, the vacuum device 50 is further installed in the negative pressure case 20 to maintain the interior in a vacuum state, and the vacuum device 50 is in communication with the negative pressure space on one side of the negative pressure case 20. It consists of a vacuum tube 51 installed in the vacuum blower 52 is installed in the vacuum tube 51.

That is, one end of the vacuum tube 51 is fused and fixed to communicate with the inside of one side of the negative pressure case 20, and the other end is fused and communicated with the inside of the other side corresponding to one side of the negative pressure case 20. It is fixed to maintain the inside of the negative pressure case 20 by the driving of the vacuum blower 42 in a vacuum state to be able to move the center portion of the projection lens 221 sagging downward by its own weight. In addition, an on-off valve 53 is installed inside the vacuum tube 51.

In this case, the circulation negative pressure device 40 and the vacuum device 50 may be driven separately, and may be simultaneously driven to maintain the projection lens 221 horizontally, or may be driven separately to maintain the vacuum state. Do.

That is, the circulating blower 42 is driven in a state in which the vacuum tube is blocked by an on / off valve when the circulating blower 42 is driven. On the contrary, when the vacuum blower 52 is driven, the vacuum blower 42 is driven while the shutoff valve 43 is closed. The vacuum state is maintained inside the case 20.

Referring to the operating state of the exposure apparatus 10 having the position control function of the projection lens using the negative pressure system configured as described above, first, the vacuum blower 52 is driven to operate the circulation pipe 41 and the negative pressure case 20. The air is circulated to arrange the projection lens 221 horizontally by the negative pressure inside the negative pressure case 20, and after the light irradiated from the lighting device 30 passes through the transparent panel 211, the projection lens ( The surface of the semiconductor substrate 100 is moved by the transfer belt 200 and irradiated uniformly and intimately to the semiconductor substrate 100 disposed under the negative pressure case 20 while passing through 221. To form a coating layer on the substrate.

10: exposure apparatus 20: negative pressure case
30: lighting device 40: circulation negative pressure device
50: vacuum apparatus 21: upper surface
211: transparent panel 22: bottom part
221: projection lens 41: circulation tube
42: circulation blower 43: shutoff valve
51: vacuum tube 52: vacuum blower
53: on-off valve 100: semiconductor substrate
200: transfer belt

Claims (3)

An exposure apparatus for forming a pattern on a substrate by irradiating light to a semiconductor substrate having an insulating film or a conductive film,
A negative pressure case having a negative pressure space therein and having a transparent panel at an upper surface thereof, and a projection lens provided at a bottom thereof;
An illumination device provided on an upper portion of the negative pressure case to irradiate light to the semiconductor substrate disposed under the projection lens through the transparent panel and the projection lens; And
And an circulating negative pressure device for circulating the internal air of the negative pressure case to maintain the projection lens in a horizontal state by the negative pressure in the negative pressure space.
The method of claim 1,
The negative pressure case is further provided with a vacuum device for maintaining the interior in a vacuum state, the vacuum device is characterized in that the vacuum tube is installed on one side of the negative pressure case and the vacuum blower is installed in the vacuum tube in communication with the negative pressure space An exposure apparatus having a position control function of a projection lens using a negative pressure system.
The method of claim 1,
The circulation negative pressure device includes a circulation pipe installed at the negative pressure case so that both ends communicate with the negative pressure space, a circulation blower installed at the circulation pipe, and a shutoff valve for blocking the blower. Exposure apparatus having a position control function.
KR1020110096475A 2011-09-23 2011-09-23 Exposure apparatus having projection lens position function using underpressure system KR20130032716A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110096475A KR20130032716A (en) 2011-09-23 2011-09-23 Exposure apparatus having projection lens position function using underpressure system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110096475A KR20130032716A (en) 2011-09-23 2011-09-23 Exposure apparatus having projection lens position function using underpressure system

Publications (1)

Publication Number Publication Date
KR20130032716A true KR20130032716A (en) 2013-04-02

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KR1020110096475A KR20130032716A (en) 2011-09-23 2011-09-23 Exposure apparatus having projection lens position function using underpressure system

Country Status (1)

Country Link
KR (1) KR20130032716A (en)

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