JP2008070308A - Multichip prober - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multichip prober for inspecting a chip inspected in a separated state at high efficiency. <P>SOLUTION: The multichip prober includes: a stage 26 for holding a plurality of separated chips 14; a needle head 31 having a plurality of needles 33, 33A and 33E simultaneously brought into contact with electrodes 15 of the two or more chips of a prescribed numbetr; an electrode position detection mechanism 29 for detecting the positions of the electrodes of the plurality of the chips held at the stage; and a plurality of needle position adjusting mechanisms 36B-36H for adjusting the positions of each needle. The multichip prober simultaneously brings the plurality of the needles into contact with the electrodes of the plurality of the chips by adjusting the positions of the plurality of the needles so as to correspond to the positions of the electrodes of a plurality of detected chips by the plurality of the needle position adjusting mechanisms. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a multichip prober that performs electrical inspection of a plurality of devices (chips) that need to be inspected after being formed on a wafer and separated by a dicer, a scriber, or the like, and more particularly, transistors, diodes, and the like. The present invention relates to a multichip prober for inspecting a very large number of chips formed on one wafer with a small chip.

  In semiconductor manufacturing processes, etc., after various processes are performed on a thin disk-shaped wafer to form multiple devices (chips) on the wafer, the electrical characteristics of each device are inspected, and then separated by a dicer It is fixed to the lead frame and assembled. The inspection of the electrical characteristics is performed by a wafer test system composed of a prober and a tester. The prober holds the wafer on the wafer mounting table and brings the probe into contact with the electrode of each device. The tester supplies power and various test signals from the terminals connected to the probe, and analyzes the signals output to the electrodes of the device with the tester to confirm whether it operates normally.

  Devices include not only highly integrated devices such as MPUs and large-capacity memories, but also simple devices such as transistors and diodes. A device having such a simple configuration is a small device of 0.2 to 0.5 mm square, for example, but is often a high-withstand-voltage and high-output power device and is accurate when formed on a wafer. Inspection cannot be performed, and inspection is performed in a state where the wafer is cut by a dicer or a scriber and separated into individual chips.

  In order to perform accurate inspection of LEDs, it is necessary to perform inspection in a state of being separated into individual chips. It is necessary to operate by contacting the needle with the electrode of the chip, and to inspect the characteristics of the output light together with the electrical characteristics at that time There is. Hereinafter, the LED will be described as an example, but the multi-chip prober of the present invention is not limited to the LED, and can be used for inspection of a chip that needs to be inspected in a state of being separated into individual chips. .

  As described above, the LED chips are minute chips of 0.3 mm square, for example, and tens of thousands are formed on a wafer having a diameter of about 50 mm. Since the chips are formed on the wafer with a very high precision pitch, before separation, use a normal wafer prober to bring a large number of needles into contact with the electrodes of a large number of chips, and sequentially in time division. By operating, it is possible to inspect a large number of chips efficiently.

  As shown in FIG. 1, the separation of the chip from the wafer is performed by attaching the wafer 13 to the adhesive tape 12 attached to the back surface of the flat frame 11 having holes, and forming grooves on the wafer 13 using a dicer. This is done by cutting the wafer with a scriber or the like and separating it into individual chips 14. Even though the chips 14 are separated, they are still attached to the adhesive tape 12, but their positions are changed so that they are not regularly arranged.

  FIG. 2 is a diagram showing an example of how the chips 14 are arranged after the separation. Each chip 14 is displaced in position and direction. Reference numeral 15 denotes an electrode of the chip. When the inspection is performed, the tip 14 is operated by energizing the needle 15 in contact with the electrode 15.

  As shown in FIG. 2, since the arrangement position of the chip 14 after separation is shifted and the position of the electrode 15 is also shifted, if a conventional prober having a large number of needles arranged at predetermined positions is used, the needle is accurately In other words, it is impossible to make contact with the electrodes, and it is impossible to perform inspection by operating a large number of chips sequentially in a time division manner. Therefore, in the past, inspection was performed by providing a photodetector in a device called a chip selector that inspects resistors, transistors, diodes, etc. one by one and separates them for each characteristic.

JP-A-11-183523

  However, since the chip selector holds the chips one by one on the inspection stage and brings the needle into contact with the electrode of the chip, there is a problem that it takes a long time to inspect one chip. Of the time required for inspection, the time required to operate the chip and detect its electrical and optical characteristics is relatively short, and a large percentage of time is required to set the chip and bring the needle into contact with the electrode of the chip Accounted for.

  If the inspection time is lengthened, the productivity is reduced correspondingly and the cost is increased.

  In order to shorten the inspection time, it is conceivable to perform a sampling inspection. However, a high-quality LED must be completely inspected, and a reduction in cost due to the time required for the inspection is desired.

  An object of the present invention is to solve such a problem, and an object of the present invention is to realize a multi-chip prober capable of efficiently inspecting chips that need to be inspected separately.

  In order to achieve the above object, the multi-chip prober of the present invention makes it possible to adjust the positions of a plurality of needles that are simultaneously in contact with the electrodes of the plurality of chips, By adjusting the position of each needle in accordance with the position of the electrode shifted by the needle position adjusting mechanism, the needle accurately contacts the electrodes of the plurality of tips.

  In other words, the multi-chip prober of the present invention is held by the stage holding a plurality of separated chips, a needle head having a plurality of needles simultaneously contacting two or more predetermined numbers of electrodes of the chip, and the stage. An electrode position detecting mechanism for detecting the positions of the electrodes of the plurality of chips, and a plurality of needle position adjusting mechanisms for adjusting the positions of the needles, and the plurality of tips detected by the plurality of needle position adjusting mechanisms. The positions of the plurality of needles are adjusted so as to correspond to the positions of the electrodes, and the plurality of needles are simultaneously brought into contact with the electrodes of the plurality of chips.

  For the electrode position detection mechanism, the hardware of the alignment mechanism provided in the conventional prober can be used as it is. The chip and the electrode are recognized by the image processing board, the position of the electrode, and two electrodes as necessary. Software for detecting the inclination θ of the (virtual) line connecting the two.

  Each needle position adjusting mechanism moves the corresponding needle in at least two axial directions in a plane parallel to the stage surface. Since the displacement of the electrode position of the tip in the direction perpendicular to the stage surface is small and the needle is elastic, and if the displacement of the electrode position in this direction is small, it can be brought into contact correctly, so the needle is generally perpendicular to the stage surface. Each needle position adjusting mechanism is configured to move the corresponding needle in a direction perpendicular to the surface of the stage, for example, when accurate contact pressure is required. Thereby, it is possible to make the positional relationship of all the needles agree with the positional relationship of the electrodes of the separated tips.

  Further, although the positions and directions of the chips are shifted by being separated, the positional relationship of the electrodes in each chip does not change. In view of this, a plurality of tip-specific position adjusting mechanisms that move together a plurality of sets of needles that contact a plurality of electrodes for each tip are provided, and the tip-specific position adjusting mechanism includes at least a corresponding set of needles parallel to the stage surface. A rotation mechanism that rotates in a plane and a translation mechanism that moves a corresponding pair of needles are provided. Thereby, the positional relationship of all the needles can be matched with the positional relationship of the electrodes of the separated tips, and the moving axis is one axis compared to the configuration in which the needle position adjusting mechanism is provided for each needle. Can be reduced.

  It is desirable to provide a three-dimensional movement mechanism for changing the relative positions of the stage and the needle head, as in the conventional and prober, for transporting a plurality of chips onto the stage.

  When this three-dimensional movement mechanism is used, if the positions of a plurality of chips are not displaced by the three-dimensional movement mechanism, the electrode moves to a position where it contacts the needle, and each needle moves according to the positional deviation of the corresponding electrode. It is also possible to move the reference needle so that the position of the reference needle corresponding to one reference electrode is matched by the three-dimensional movement mechanism, and the positional relationship between the other electrode and the needle other than the reference electrode and the reference needle is Match each needle position adjustment mechanism. This eliminates the need to provide a needle position adjusting mechanism for the reference needle.

  The same applies to the case where a three-dimensional movement mechanism is provided in the configuration in which the position adjustment mechanism for each chip is provided. When the positions of a plurality of chips are not shifted by the three-dimensional movement mechanism, the electrode moves to a position where it contacts the needle. It is also possible to move each needle in accordance with the displacement of the corresponding electrode, but the three-dimensional moving mechanism moves the reference needle so that the position of the corresponding reference needle matches with the reference electrode. The positional relationship between the electrode and the needle of the tip other than the tip having the tip is adjusted by the position adjusting mechanism for each tip. In addition, since the positions of the electrodes other than the reference electrode of the chip having the reference electrode and the corresponding needle match when the rotation components are combined by the rotation mechanism, the position adjustment mechanism for each chip of the chip having the reference electrode is a parallel movement mechanism. Need not be provided.

  As shown in FIG. 1, the plurality of chips may be held on the stage in a state of being attached to an adhesive tape attached to a frame. In this case, the stage is held so that the surface of the adhesive tape contacts. Since the position of the held adhesive tape and chip does not change, the electrode position detection mechanism detects the positions of the electrodes of all the chips attached to the adhesive tape. The needle head has a plurality of needles that simultaneously contact electrodes of a predetermined number, for example, four chips, of a plurality of chips attached to the adhesive tape. The larger the predetermined number, the better. However, it is necessary to increase the number of needles and the number of needle position adjusting mechanisms, and the prober becomes larger and the cost increases.

  The predetermined number of tips with which a plurality of needles simultaneously contact may be tips arranged adjacent to each other, or may be tips selected at predetermined tip intervals among the arranged tips. Thereby, it is possible to widen the space in which the needle position adjusting mechanism is provided. In this case, when the inspection of the tip in contact with the needle is completed, the inspection is performed by sequentially moving the tip so that the needle contacts the intermediate tip.

  Further, the stage may hold a plurality of chips independently without using the frame and the adhesive tape shown in FIG.

  When the chip is a light emitting element such as an LED, it is equipped with a photodetector that detects the light characteristics output from the light emitting element, and a plurality of chips that are simultaneously in contact with a plurality of needles are operated sequentially in a time division manner to emit light. Are sequentially detected in a time-sharing manner.

  In this case, a photodetector position adjustment memory for adjusting the position of the photodetector according to the position of the chip to be operated may be provided.

  According to the present invention, the needles can be simultaneously brought into contact with the electrodes of a plurality of tips, so that the inspection time can be shortened and the cost can be reduced.

  FIG. 3 is a diagram showing the overall configuration of the multichip prober according to the first embodiment of the present invention. As shown in FIG. 3, the multi-chip prober of the first embodiment includes a base 21, a moving base 22 provided on the base 21, and the moving base 22 on the X-axis direction (direction perpendicular to the drawing). X moving table 23 that moves, Y moving table 24 that moves on the X moving table 23 in the Y-axis direction (horizontal direction in the figure), and Z-axis movement provided in the Y moving table 24 (up and down direction in the figure). A θ rotation mechanism 25, a stage 26 supported by the Z-axis movement / θ rotation mechanism 25, a column 27, an upper plate 28, an alignment microscope 29, a needle head 31, and a light detection unit 40 are provided. Although not shown, the computer includes a control unit that performs overall control. With the above mechanism, the stage 26 can rotate in the three axis directions of the X, Y, and Z axes and in a plane perpendicular to the Z axis. On the stage 26, the inspection object 20 composed of the chip 11, from which the frame 11, the adhesive tape 12, and the wafer 13 shown in FIG. When detecting the position of the electrode of the separated chip 14, the stage 26 is moved below the alignment microscope 29, the entire chip is scanned, and the position of the electrode is detected and stored by image processing. The configuration excluding the needle head 31 and the light detection unit 40 is the same as that of a conventional wafer prober, and further description is omitted.

  4A and 4B are diagrams showing the configuration of the needle head 31 and the light detection unit 40, wherein FIG. 4A is a side view and FIG. 4B is a top view. The light detection unit 40 is disposed immediately above the chip to be inspected, and moves the optical power meter 41 that detects the amount of light output from the chip (here, the LED), the support portion 42 of the optical power meter 41, and the support portion 42. An optical power meter moving mechanism 43, an optical fiber 44 extending in the vicinity of the tip to be inspected, and a monochromator (not shown) for holding the optical fiber 44 and detecting the wavelength of light incident on the optical fiber 44 ), A support part 46 that supports the relay unit 45, and a fiber moving mechanism 47 that moves the support part 46. As shown in FIG. 4B, the light detection unit 40 has a shape in which a portion that accommodates the fiber moving mechanism 47 protrudes from a circular portion. The optical power meter moving mechanism 43 and the fiber moving mechanism 47 can be realized by a known moving mechanism, and are preferably moving mechanisms using an element capable of high-speed operation such as a piezo element. However, a moving mechanism such as a combination of a drive screw and a motor may be used. As will be described later, the optical power meter moving mechanism 43 and the fiber moving mechanism 47 do not need to be provided when it is not necessary to move when inspecting different chips.

  The needle head 31 has a shape arranged around the light detection unit 40, and includes one needle unit 36A and seven needle position adjusting mechanisms 36B to 36H. The needle unit 36 </ b> A is a unit that fixes the reference needle 33 </ b> A to the needle head 31. The needle position adjusting mechanism 36E includes a needle 33E, a needle holding unit 34E that holds the needle 33E, a moving unit 35E to which the needle holding unit 34E is attached, and a moving mechanism 36E that moves the moving unit 35E. The moving mechanism 36 </ b> E can move the needle 33 </ b> E in two axial directions in a plane parallel to the mounting surface of the stage 26, for example, the X-axis direction and the Y-axis direction. The needle position adjusting mechanism can also be realized by a known moving mechanism, and is preferably a moving mechanism using an element capable of high-speed operation such as a piezo element. However, a moving mechanism combining a drive screw and a motor is preferable. May be used.

  The other needle position adjusting mechanisms 36B to 36D and 36F to 36H have the same configuration. As illustrated, the seven needle position adjusting mechanisms 36 </ b> B to 36 </ b> P are arranged radially around the light detection unit 40. Since the needle unit 36A does not have a position adjustment mechanism, the space for the arrangement may be small, and is disposed, for example, between the protruding portion of the light detection unit 40 and the needle position adjustment mechanism 36B.

  Since the deviation of the electrode position of the tip in the direction perpendicular to the mounting surface of the stage 26 is small, the needle is elastic, and if the deviation of the electrode position in this direction is small, the needle can be properly contacted. If the needle is not moved in the direction perpendicular to the stage surface but accurate contact pressure is required, each needle position adjustment mechanism may be configured to move the corresponding needle in the direction perpendicular to the stage surface. Good.

  With the above configuration, it is possible to match the positional relationship of all the needles with the positional relationship of the electrodes of the separated tips.

  FIG. 5 is a diagram showing the arrangement of the tips 14 that are in contact with the needles simultaneously. FIG. 5A shows an example in which the needles simultaneously contact the electrodes 15 of the four tips 14 arranged adjacent to one row. B) shows an example in which the needles simultaneously contact the electrodes 15 of the four chips 14 arranged adjacent to 2 rows and 2 columns. In FIG. 5, the reference symbol R indicates a reference electrode with which the reference needle 33A of FIG. The set of tips 14 that are in contact with the needles at the same time is referred to as a measurement unit here.

  FIG. 6 is a flowchart showing the inspection operation of the first embodiment.

  In step 101, the frame in which the divided chips as shown in FIG. 1 are attached to the tape is conveyed and held on the stage 26. It is assumed that the position of the chip does not change in this state.

  In step 102, the electrode positions of all the chips are detected and stored by an alignment mechanism including the alignment microscope 29 and the like.

  In step 103, the positional relationship between the reference electrode and the other electrodes is calculated for each measurement unit. This positional relationship is calculated as a deviation from the time when there is no electrode deviation. This process is performed by a control unit (not shown).

  In step 104, the needle position adjusting mechanisms 36 </ b> B to 36 </ b> H move the positions of the needles other than the reference needle of the measurement unit based on the positional relationship calculated in step 103. Thus, the eight needles have a positional relationship corresponding to the positions of the eight electrodes of the four tips.

  In step 105, the stage 26 is moved so that the reference electrode contacts the reference needle. At this time, after the reference electrode is moved so as to be positioned directly below the reference needle, the stage is raised (moved in the Z-axis direction) so that the electrode is in contact with the needle.

  In step 106, the positions of the optical power meter 41 and the fiber 44 are moved in accordance with the position of the chip to be inspected among the four chips in the measurement unit. If the difference between the positions of the chips within the measurement unit is small and does not affect the detected values of the optical power meter 41 and the fiber 44, this step 106 does not need to be performed, and the optical power meter moving mechanism 43 and the fiber moving mechanism. 47 need not be provided.

  In step 107, an electrical signal is applied from the needle to perform an inspection for detecting electrical characteristics and optical characteristics.

  In step 108, it is determined whether the inspection of all the chips in the measurement unit has been completed. If not completed, the process returns to step 106, and steps 106 to 108 are repeated until the inspection of all the chips in the measurement unit is completed. Therefore, when it is not necessary to perform step 106, the inspection is performed by sequentially operating all the chips in the measurement unit in a time division manner.

  In step 109, it is determined whether the inspection of all the chips on the stage is completed. If not completed, the process returns to step 104, and steps 104 to 109 are repeated until the inspection of all the chips on the stage is completed.

  In any case, in the above operation, four chips can be inspected by one operation of bringing the probe into contact with the electrode, so that the measurement efficiency can be improved.

  In the first embodiment, the stage is moved so that the reference electrode is in contact with the reference probe without providing the probe moving mechanism of the reference probe corresponding to the reference electrode, that is, the movement base 22, the X moving table 23, and the Y movement. The reference electrode is brought into contact with the reference probe by moving the stage by a three-dimensional movement mechanism composed of the base 24 and the Z-axis movement / θ rotation mechanism 25. For example, a probe movement mechanism is also provided in the reference probe. The stage is moved by the three-dimensional moving mechanism so that the stage moves to the standard position when there is no positional deviation of the tip, and each probe moving mechanism moves according to the positional deviation of each electrode from the standard position. The amount may be controlled.

  Further, in the first embodiment, four chips arranged adjacent to each other as shown in FIG. 5 were inspected. However, as shown in FIG. 7, at a predetermined chip interval among the arranged chips 14. You may make it contact a needle with the electrode of the selected chip | tip 14S simultaneously. FIG. 7 (A) corresponds to FIG. 5 (A) and shows an example in which the tips 14S in which the needles are brought into contact with one of four tips 14 arranged in one row are selected. 7 (B) corresponds to FIG. 5 (B), and the tip 14S that contacts the needles at a pitch of one in two in each direction from the tips 14 arranged in 4 rows and 4 columns. An example of selection is shown. As shown in FIG. 7, it is possible to widen the space in which the needle position adjusting mechanism is provided by selecting the tip with which the needle contacts. In the case of FIG. 7, when the inspection of the tip contacted with the needle is completed, the inspection is performed by sequentially moving the tip so that the needle contacts the tip between the inspected tips.

  As shown in FIG. 8A, the needle 33 that contacts the electrode of the tip 14 may be one, but when a large current needs to flow, the needle 33 is shown in FIG. Thus, a plurality of needles 33 may be in contact with the electrode 15.

  In the first embodiment, a needle moving mechanism is provided for each needle other than the reference needle so that the position of each needle can be moved independently. However, the positional relationship (interval) between the two electrodes of each chip is constant because it is determined based on a highly accurate pattern exposed by the exposure apparatus. In the second embodiment, the configuration of the needle moving mechanism is simplified using this characteristic.

  FIG. 9 is a diagram for explaining the principle of alignment of the multichip prober according to the second embodiment of the present invention. Assume that the chip 14 is displaced from the position of the chip 14 ′ that is not displaced with rotation θ as shown in the figure. In response to this, it is assumed that the position of the electrode 15 is also displaced, and that one electrode is displaced by the vector P from the center position CO when there is no displacement to the center position C1. When the chip 14 ′ without deviation is rotated by θ and the center position of one of the electrodes is shifted by the vector P, the chip 14 ′ overlaps. That is, when the two needles that are in contact with the two electrodes 15 are maintained in mutual position and are rotated by θ and translated by the vector P, the two needles can be brought into contact with the displaced electrodes.

  In FIG. 9, the needle can be brought into contact with two electrodes that are displaced by a total of three axes of rotation θ and two axes of parallel movement. On the other hand, in the first embodiment, two axes must be moved for each of the two electrodes, and a total of four axes must be moved. In other words, the movement of FIG. 9 can reduce the movement of one axis.

  FIG. 10 is a diagram illustrating a schematic configuration of a position adjustment mechanism for each chip that realizes the movement of FIG. As shown in FIG. 10, the tip-by-tip position adjusting mechanism is configured such that the two needles 33A and 33B are fixed to the turntable 51 so that the distance between the tips corresponds to the distance between the two electrodes of one chip. Yes. The turntable 51 is supported so as to be rotatable with respect to the X-axis moving table 52. The X-axis moving table 52 is supported so as to be movable in the X-axis direction with respect to the Y-axis moving table 53. The Y-axis moving table 53 is supported so as to be movable in the Y-axis direction with respect to the base table 54. The position adjustment mechanism for each chip in FIG. 10 can be realized by a known movement mechanism, and is preferably a movement mechanism using an element capable of high-speed operation such as a piezo element.

  Also in the second embodiment, it is possible to perform a parallel movement corresponding to the vector P in FIG. 9 for one chip by using a three-dimensional movement mechanism that moves the stage 26. The position adjustment mechanism for each chip only needs to be rotatable.

  In the first embodiment, the chip is held on the stage with the separated chip attached to the adhesive tape to which the frame is attached. However, as shown in FIG. A plurality of chips 14 may be fixed at the same time. Also in this case, since it is difficult to precisely set the positions and rotations of the plurality of tips 14, a needle position moving mechanism that moves the positions of the needles in contact with the electrodes of the plurality of tips 14 is provided, and the positions of the needles are determined. After alignment with the positions of the 14 electrodes, the needle is brought into contact with the electrodes.

  When holding chips as shown in FIG. 11, a transfer mechanism that holds a plurality of held chips by vacuum suction or the like and transports them to the stage at the same time, and transports a plurality of inspected chips to the outside of the stage at the same time. Try to provide it. Thereby, efficient inspection of the chip is possible.

  As mentioned above, although the Example of this invention was described, it cannot be overemphasized that this invention is not limited to the described Example, and various modifications are possible. For example, in the embodiment, the inspection of the LED has been described as an example, but the present invention can be applied to the inspection of other devices such as a resistor, a transistor, and an IC.

  In the embodiment, the example in which the probe is simultaneously brought into contact with the eight electrodes of the four chips has been described. However, the number of the chips is not particularly limited as long as it is two or more chips.

  The present invention can be applied to the inspection of any device that needs to be inspected in a state separated from the wafer.

It is a figure which shows the state with which the isolate | separated chip | tip was affixed on the adhesive tape which stuck the flame | frame which is an example of the supply form of the chip | tip test | inspected with the multichip prober of this invention. It is a figure explaining the example of the arrangement | sequence state of the isolate | separated chip | tip. It is a figure which shows schematic structure of the multichip prober of 1st Example of this invention. It is a figure which shows the structure of the part of the needle head and light detection unit of 1st Example. It is a figure which shows the example of an arrangement | sequence of the chip | tip which contacts a needle simultaneously. It is a flowchart which shows the test | inspection operation | movement in 1st Example. It is a figure which shows the modification of the arrangement | sequence of the chip | tip which contacts a needle simultaneously. It is a figure which shows the modification of the number of the needles which an electrode contacts. It is a figure explaining the principle of the alignment in 2nd Example of this invention. It is a figure which shows schematic structure of the probe moving mechanism in 2nd Example. It is a figure which shows the modification of the holding | maintenance form on the stage of the isolate | separated chip | tip.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Frame 12 Adhesive tape 13 Wafer 14 Separated chip 15 Electrode 26 Stage 29 Alignment microscope 31 Needle head 32 Photodetection unit 33 Needle 36B-36H Needle moving mechanism

Claims (12)

A stage for holding a plurality of separated chips;
A needle head having a plurality of needles that simultaneously contact two or more predetermined numbers of electrodes of the tip;
An electrode position detection mechanism for detecting the positions of the electrodes of the plurality of chips held on the stage;
A plurality of needle position adjustment mechanisms for adjusting the position of each needle,
The plurality of needle position adjusting mechanisms adjust the positions of the plurality of needles so as to correspond to the detected positions of the electrodes of the plurality of chips, and simultaneously contact the plurality of needles with the electrodes of the plurality of chips. Multi-chip prober characterized by   2. The multi-chip prober according to claim 1, wherein each needle position adjusting mechanism moves a corresponding needle in at least two axial directions in a plane parallel to the stage surface. The plurality of needle position adjusting mechanisms includes a plurality of tip-specific position adjusting mechanisms that move together a plurality of needle sets that contact a plurality of electrodes for each tip,
The position adjustment mechanism for each tip includes a rotation mechanism that rotates the corresponding set of needles in a plane parallel to at least the stage surface, and a parallel movement mechanism that moves the corresponding set of needles. A multi-chip prober as described in 1.   The multi-chip prober according to claim 1, further comprising a three-dimensional moving mechanism that changes a relative position between the stage and the needle head. A three-dimensional movement mechanism for changing the relative position of the stage and the needle head;
The plurality of needle position adjusting mechanisms are provided for each needle other than one reference needle, and the relative positions of other needles with respect to the reference needle can be adjusted.
3. The multi of claim 2, wherein the reference needle is moved so as to contact a corresponding electrode by the three-dimensional movement mechanism, and another needle is moved so as to contact a corresponding electrode by the plurality of needle position adjusting mechanisms. Chip prober. A three-dimensional movement mechanism for changing the relative position of the stage and the needle head;
The position adjustment mechanism for each chip corresponding to the reference chip includes only the rotation mechanism,
The three-dimensional movement mechanism and the tip-by-chip position adjustment mechanism of the reference tip move so that the electrode of the reference tip comes into contact with the corresponding needle, and the plurality of tip-by-chip position adjustment mechanisms move to other tip electrodes. The multi-chip prober according to claim 3, wherein the corresponding needle moves so as to come into contact. The plurality of chips are attached to an adhesive tape attached to a frame,
The stage is held so that the surface of the adhesive tape contacts,
The electrode position detection mechanism detects the positions of the electrodes of a plurality of chips attached to the adhesive tape,
2. The multi-chip prober according to claim 1, wherein the needle head has a plurality of needles that simultaneously contact electrodes of a predetermined number of the chips out of a plurality of chips attached to the adhesive tape.   The multi-chip prober according to claim 1, wherein the predetermined number of tips with which a plurality of needles contact at the same time are tips arranged adjacent to each other.   2. The multi-chip prober according to claim 1, wherein the predetermined number of chips with which a plurality of needles simultaneously contact is a chip selected at a predetermined chip interval among the arranged chips. The stage holds the plurality of chips independently,
The electrode position detection mechanism detects the positions of the electrodes of the plurality of chips,
The multi-chip prober according to claim 1, wherein the needle head has a plurality of needles that simultaneously contact electrodes of the plurality of chips. The chip is a light emitting element,
A photodetector for detecting a light characteristic output from the light emitting element;
2. The multi-chip prober according to claim 1, wherein the plurality of chips that are simultaneously in contact with the plurality of needles are sequentially operated in a time division manner to emit light, and the output of the photodetector is sequentially detected in a time division manner.   The multichip prober according to claim 11, further comprising a photodetector position adjustment mechanism that adjusts a position of the photodetector in accordance with a position of a chip to be operated.

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