KR101070834B1 - Led chip testing apparatus and led chip sorting a pparatus - Google Patents

Abstract

The present invention provides a loading unit for supplying the LED chip to be tested; A seating member on which the LED chip supplied from the loading unit is seated, a rotating member on which a plurality of seating members are installed, and a loading position where the LED chip supplied from the supply unit is loaded on the seating member, and a test position at which the LED chip is tested And a rotating unit for rotating the rotating member so that the mounting members are sequentially positioned at each of the unloading positions at which the LED chip is unloaded from the seating member, the supply unit being installed next to the loading unit; A test unit including a contact unit for emitting an LED chip positioned at the test position and a measuring unit measuring optical characteristics of the LED chip positioned at the test position, the test unit being installed next to the supply unit; And an unloading unit configured to unload an LED chip from the seating member positioned at the unloading position.

According to the present invention, it is possible to accurately measure the performance of the LED chip, thereby preventing the loss of the material cost, process cost, etc. by preventing the LED chip that is unnecessarily undergoing the packaging process and the test process, The manufacturing cost can be lowered.

Optical characteristics, LED chip

Description

LED Chip Tester and LED Chip Sorter {LED CHIP TESTING APPARATUS AND LED CHIP SORTING APPARATUS}

The present invention relates to a test device for testing the LED chip to check the performance of the LED chip and the LED chip classification device that can classify the tested LED chip.

LED (Light Emitting Diode) is a kind of light emitting device using a semiconductor that converts electricity into light, also known as a Luminescent diode. LEDs are smaller than conventional light sources, have a long life, low power consumption, and high-speed response. They are used to display lamps for various electronic devices such as display devices for automobile instrumentation, optical communication light sources, card readers for digital display devices, calculators, and backlights. It is widely used in various fields.

The LED is manufactured through an epi process (EPI), a chip process (Fabrication) and a package process (Package), etc., and is subjected to a test process in a packaged state through the package process. In the test process, the LEDs which are not normally operated (hereinafter referred to as 'defective products') are excluded, and the LEDs which are normally operated (hereinafter referred to as 'goods') are classified and classified according to their performance and shipped.

Here, the LED may be classified as a low grade even if it is excluded or defective in the test process due to a problem occurring during the packaging process, but the chip state before the packaging process (hereinafter referred to as 'LED chip') Due to a problem occurring in the process of manufacturing) may be excluded as a defective product in the test process or even classified as a low grade.

That is, even though the LED does not cause a problem that may affect the performance of the LED in the package process, the LED is excluded as a defective product or classified as a low grade in the test process due to a problem occurring in the process of manufacturing the LED chip. It can be.

The LEDs excluded from the test process due to problems caused by the manufacturing process of the LED chips are those that have gone through unnecessary packaging and testing processes, and these materials cause loss of material cost and process cost. There is a problem.

Due to the problems caused by the manufacturing process of LED chips, LEDs classified as low grade in the test process are often found in the packaging process as a reason for being classified as low grade, and therefore, time and cost to find an accurate analysis result. There is a problem that causes loss.

The problems as described above not only raise the manufacturing cost of the LED, but also increase the manufacturing cost of products using the LED.

The present invention has been made to solve the above-described problems, an object of the present invention is to provide an LED chip test apparatus that can accurately measure the performance of the LED chip and the LED chip classification apparatus comprising the same.

In order to achieve the above-mentioned object, the present invention can include the following configuration.

LED chip sorting apparatus according to the present invention includes a loading unit for supplying the LED chip to be tested; A seating member on which the LED chip supplied from the loading unit is seated, a rotating member on which a plurality of seating members are installed, and a loading position where the LED chip supplied from the supply unit is loaded on the seating member, and a test position at which the LED chip is tested And a rotating unit for rotating the rotating member so that the mounting members are sequentially positioned at each of the unloading positions at which the LED chip is unloaded from the seating member, the supply unit being installed next to the loading unit; A test unit including a contact unit for emitting an LED chip positioned at the test position and a measuring unit measuring optical characteristics of the LED chip positioned at the test position, the test unit being installed next to the supply unit; And an unloading part for unloading an LED chip from the seating member positioned at the unloading position.

In the LED chip sorting apparatus according to the present invention, the contact unit includes a contact pin in contact with the LED chip positioned at the test position; The test unit further comprises a contact moving unit for moving the contact unit such that the contact pin is in contact with an LED chip positioned at the test position; The contact moving unit may include a contact rotating mechanism for rotating the contact support mechanism such that the contact pin is in contact with the LED chip positioned at the test position.

In the LED chip sorting apparatus according to the present invention, the contact rotating mechanism includes a contact rotating member to which the contact supporting mechanism is coupled, and a contact driving mechanism to rotate the contact rotating member; The contact unit includes a contact body to which the contact pin is coupled; The contact body has an insertion hole through which the contact pin passes so that the contact pin contacts the LED chip positioned at the test position; The contact driving mechanism may rotate the contact rotating member about a contact rotating shaft positioned on the same vertical line as the center of the insertion hole.

In the LED chip sorting apparatus according to the present invention, the loading unit comprises: a supply mechanism for supplying a plurality of LED chips to be tested; A loading unit which picks up the LED chip to be tested in the supply mechanism and seats the seating chip positioned at the loading position; And a first supply unit supporting the supply mechanism and moving the supply mechanism so that the LED chip to be tested is positioned at a first pick-up position from which the loading unit can pick up the LED chip to be tested.

In the LED chip sorting apparatus according to the present invention, the loading unit includes a first cooling unit for cooling the supply mechanism; The first cooling unit may include a first injection unit for injecting a cooling gas toward the supply mechanism supported by the first supply unit.

In the LED chip sorting apparatus according to the present invention, the first injection unit may be installed in the first supply unit to be positioned below the supply mechanism.

In the LED chip sorting apparatus according to the present invention, the first injection unit may be installed in the loading unit to be positioned above the supply mechanism.

In the LED chip sorting apparatus according to the present invention, the first supply unit includes a first supply support device contacting the supply mechanism at the first pick-up position; The loading unit may include a first cooling unit cooling the first supply support device to cool the supply mechanism in contact with the first supply support device.

In the LED chip sorting apparatus according to the present invention, the loading unit includes a loading vision unit installed to be positioned above the first pick-up position; A loading picker which adsorbs an LED chip positioned at the first pick-up position under the loading vision unit, and has a first intake hole for adsorbing the LED chip; And a first transmission member coupled to the loading picker at one side of the first intake hole and configured to pass light passing through the first intake hole.

In the LED chip sorting apparatus according to the present invention, the unloading unit further includes a buffer unit installed next to the test unit, and a sorting unit installed next to the buffer unit; The buffer unit includes an unloading unit which performs an unloading process of picking up the tested LED chip from the seating member located at the unloading position and transferring the LED chip to the first storage mechanism; The sorting unit picks up the LED chip tested by the first storage device and transfers the LED chip to the second storage device. The sorting unit supports the first storage device and the sorting unit picks up the LED chip tested by the first storage device. It may include a second supply unit for moving the first storage mechanism so that the tested LED chip is located in the second pickup position.

In the LED chip sorting apparatus according to the invention, the sorting unit includes a second cooling unit for cooling the first storage mechanism; The second cooling unit may include a second injection unit for injecting a cooling gas toward the first storage mechanism supported by the second supply unit.

In the LED chip sorting apparatus according to the present invention, the second injection unit may be installed in the second supply unit to be located below the first storage mechanism.

In the LED chip sorting apparatus according to the present invention, the second injection unit may be installed in the sorting unit to be positioned on the first storage mechanism.

In the LED chip sorting apparatus according to the present invention, the second supply unit includes a second supply support device contacting the first storage mechanism at the second pick-up position; The sorting unit may include a second cooling unit that cools the second supply support device to cool the first storage mechanism contacting the second supply support device.

In the LED chip sorting apparatus according to the present invention, the sorting unit may include a sorting vision unit installed to be positioned above the second pick-up position; A sorting picker which adsorbs an LED chip positioned at the second pick-up position under the sorting vision unit, and a second intake hole for adsorbing the LED chip is formed; And a second transmission member coupled to the sorting picker at one side of the second intake hole and configured to pass light passing through the second intake hole.

In the LED chip sorting apparatus according to the present invention, the first storing mechanism includes a first housing member to which the tested LED chip is attached and a second housing to which the receiving member is coupled; The second supply unit includes a second supply body for supporting the second housing, and a second supply support device installed to be positioned inside the second supply body and for supporting the first receiving member; The second supply support device lifts and lowers the support mechanism in contact with the outside of the area where the LED chips tested in the first storage member are located, and the support mechanism so that the first storage member protrudes above the second supply body. It may include a support lifting device.

According to the present invention, the following effects can be obtained.

The present invention can accurately measure the performance of the LED chip, thereby preventing the loss of the material cost, process cost, etc. by preventing the LED chip that is unnecessarily undergoing the packaging process and the test process, the manufacturing cost of the LED The effect can be lowered.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the LED chip test apparatus according to the present invention will be described in detail.

1 is a schematic perspective view of an LED chip test apparatus according to the present invention, Figure 2 is a schematic perspective view of the supply unit, Figure 3 is a cross-sectional view of Figure 2 of the seating member, Figure 4 is a modified embodiment of the present invention A schematic perspective view of a seating member according to the present invention, FIG. 5 is a sectional view taken along line BB of FIG. 4, FIG. 6 is a schematic cross sectional view of a mounting member according to another modified embodiment of the present invention, and FIG. 8 is a schematic perspective view of a contact unit, a mobile unit, and a first transfer member, FIG. 9 is an exploded perspective view of FIG. 8, FIG. 10 is a sectional view taken along line DD of FIG. 8, and FIGS. 7 is an enlarged view of part C of FIG. 7 showing a state in which an LED chip is tested in the LED chip test apparatus according to the present invention, FIG. 13 is a schematic front view of the LED chip test apparatus according to a modified embodiment of the present invention, and FIGS. 17 is the LED chip is tested 18 is a schematic perspective view showing a process, FIG. 18 is a schematic perspective view of a contact mobile unit according to a modified embodiment of the present invention, FIG. 19 is an exploded perspective view of FIG. 18, and FIGS. 20 to 22 are modified embodiments of the present invention. FIG. 23 is a schematic exploded perspective view illustrating a process of testing an LED chip using a contact moving unit according to an example. FIG. 23 is a schematic exploded perspective view of a contact unit, a moving unit, a first transfer member, and a second transfer member. 23 is a side cross-sectional view of FIG. 23, FIG. 25 to FIG. 27 are enlarged views of part C of FIG. 7 showing a second transfer member according to a modified embodiment of the present invention, and FIG. 29 and 30 are schematic perspective views of a contact unit according to a modified embodiment of the present invention, and FIG. 31 is a contact unit according to a modified embodiment of the present invention. LED chip test site including Schematic perspective view of the FIG. 32 is a schematic enlarged view of a schematic front view, the test position 33 is 32 of the LED chip test device according to another modification by the present invention.

Referring to FIG. 1, the LED chip test apparatus 1 according to the present invention includes a supply unit 2 and a test unit 3. The test unit 3 may include a measuring unit 31, a contact unit 32, a first transfer member 33 (shown in FIG. 8), a contact moving unit 34, and a main body 35. .

<Supply unit (2)>

1 and 2, the supply unit 2 supplies the LED chip to be tested to the test position TP where the measurement unit 31 can measure the optical characteristics of the LED chip. The supply part 2 may include a seating member 21, a rotating member 22, and a rotating unit 23.

1 to 3, an LED chip is mounted on the seating member 21. The LED chip may be adsorbed in a state of being seated on the seating member 21 by the intake device (F, shown in Figure 11). The intake apparatus F (shown in FIG. 11) may be installed in the rotating member 22. The intake apparatus F (shown in FIG. 11) may adsorb the LED chip seated on the seating member 21 through the through hole 21a formed in the seating member 21. The seating member 21 may be formed in a cylindrical shape as a whole.

A plurality of seating members 21 may be installed on the rotating member 22. As the rotating unit 23 rotates the rotating member 22, the seating members 21 may be sequentially positioned at the test position TP. When the seating member 21 is positioned at the test position TP, the seating member 21 may be positioned below the measuring unit 31.

The seating member 21 may include a contact member 211 and a first seating body 212.

The contact member 211 may be coupled to one surface 212a of the first seating body 212 and may be in contact with an LED chip. The contact member 211 may be formed of a material having excellent conductivity, for example, may be formed of gold. The contact member 211 may be formed by coating the first seating body 212 with gold. The contact member 211 may lower the electrical resistance of the LED chip when the LED chip is emitted by the contact unit 32. Accordingly, the LED chip test apparatus 1 can accurately measure the optical characteristics and the electrical characteristics of the LED chip.

The contact member 211 may be formed of a material having high reflectance, for example, may be formed of a Teflon material. The contact member 211 may be formed by coating the first seating body 212 with Teflon. The contact member 211 may transmit light emitted from the LED chip toward the measurement unit 31 when the LED chip emits light by the contact unit 32. Light emitted from the LED chip may be reflected by the contact member 211 and transmitted toward the measuring unit 31. Accordingly, since a larger amount of light may be incident to the measuring unit 31, the LED chip test apparatus 1 may accurately measure optical characteristics of the LED chip.

The first seating body 212 is coupled to the rotating member 22. The contact member 211 is coupled to one surface 212a of the first seating body 212. The first seating body 212 may be formed in a cylindrical shape as a whole.

As described above, when the contact member 211 is a material having excellent conductivity, reflectivity, or the like, the contact member 211 may have a relatively low hardness. In this case, when the LED chip is repeatedly placed on the seating member 21, the contact member 211 may be easily worn.

In order to prevent this, the first seating body 212 has a plurality of protrusions formed to protrude in a direction (G arrow direction) toward the measurement unit 31 from the LED chip positioned at the test position TP ( 2121). The protrusions 2121 may be formed on one surface 212a of the first seating body 212. Due to the protrusions 2121, one surface 212a of the first seating body 212 is in a direction from the measuring unit 31 toward the LED chip positioned at the test position TP (in the direction of the H arrow). A plurality of grooves 2122 recessed to a predetermined depth may be formed.

The contact member 211 may be coupled to the first seating body 212 to be inserted between the protrusions 2121. That is, the contact member 211 may be formed on one surface 212a of the first seating body 212 to be inserted into the grooves 2122. Accordingly, even when the LED chip is repeatedly placed on the seating member 21, the contact member 211 inserted into the grooves 2122 remains, so that the seating member 211 is used for a long time. The performance of the LED chip can be accurately measured.

Each of the protrusions 2121 may be formed in a rectangular parallelepiped shape. The protrusions 2121 may be formed in other forms, such as hemispherical shape, in addition to a rectangular parallelepiped shape, if the contact member 211 may be inserted therebetween.

The protrusions 2121 may be formed by processing the grooves 2122 on one surface 212a of the first seating body 212. Some of the grooves 2122 may be formed to be elongated in the first direction, and others of the grooves 2122 may be formed to be elongated in the second direction perpendicular to the second direction. The protrusions 2121 may be formed in a lattice shape on one surface 212a of the seating body 212. The first direction and the second direction may be angles other than vertical, and the grooves 2122 may be formed in three or more different directions.

1 to 5, the seating member 21 according to the modified embodiment of the present invention may include a contact member 211 and a first seating body 212 as follows.

The contact member 211 may be coupled to one surface 212a of the first seating body 212 and may be in contact with an LED chip. The contact member 211 may be formed of a material having excellent hardness, for example, may be formed of sapphire. Thus, even if the LED chip is repeatedly placed on the seating member 21, the contact member 211 can be prevented from being easily worn. The contact member 211 may be formed of a material having a hardness that substantially matches the surface of the LED chip in contact with the contact member 211. The contact member 211 may be formed of the same material as the surface on which the LED chip is in contact with the contact member 211. For example, when the surface of the LED chip in contact with the contact member 211 is made of sapphire, the contact member 211 may be formed of sapphire.

A coupling groove 2123 into which the contact member 211 is inserted may be formed at one surface 212a of the first seating body 212. The coupling groove 2123 may be formed by recessing a predetermined depth in the direction (H arrow direction) toward the LED chip positioned at the test position TP in the measurement unit 31.

The coupling groove 2123 may be formed in a disk shape as a whole. The coupling groove 2123 may be formed in a shape substantially coincident with the contact member 211 so that the contact member 211 may be inserted therein, and may be formed in another shape such as a square plate shape in addition to the disc shape. The coupling groove 2123 may have a size substantially coincident with the contact member 211. The contact member 211 may be coupled to the first seating body 212 by a fitting method through the coupling groove 2123. The contact member 211 may be coupled to the first seating body 212 by being adhered by an adhesive material or the like.

As described above, when the contact member 211 is formed of a material having excellent hardness, the material may have a relatively low reflectance. For example, when the contact member 211 is formed of sapphire, light that is not incident to the measuring unit 31 may be generated among the light emitted from the LED chip.

To prevent this, the seating member 21 may further include a reflective member 213. The reflective member 213 may be inserted into the coupling groove 2123 to be positioned between the contact member 211 and the first seating body 212. The reflecting member 213 reflects the light emitted by the LED chip so that the light emitted by the LED chip is transmitted toward the measuring unit 31. Light emitted from the LED chip may be reflected by the reflective member 213 and transmitted to the measurement unit 31. The reflective member 213 may be formed of a material having high reflectance, and may be formed of, for example, Teflon. Accordingly, since a larger amount of light may be incident on the measuring unit 31, the LED chip testing apparatus 1 may more accurately measure the performance of the LED chip.

The reflective member 213 may be formed by mirror coating one surface 211a into which the contact member 211 is inserted into the coupling groove 2123. For example, the contact member 211 may be formed of sapphire, and the light emitted from the LED chip by mirror coating one surface 211a into which the contact member 211 is inserted into the coupling groove 2123. This can be delivered to the measuring unit 31.

The through hole 21a formed in the seating member 21 may pass through the contact member 211, the first seating body 212, and the reflective member 213. The intake apparatus F (shown in FIG. 11) may adsorb the LED chip seated on the seating member 21 through the through hole 21a.

1 to 6, the seating member 21 according to another modified embodiment of the present invention may further include a second seating body 214.

The second seating body 214 may include a through hole through which a portion of the LED chip is seated in the first seating body 212, and the LED chip may be disposed in the first seating body 212 through the through hole. The seated portion may be coupled to the first seating body 212 in a penetrating state.

The top surface of the second seating body 214 and the top surface of the first seating body 212 may be formed at different heights. As shown in FIG. 6, the first seating body 212 may be formed to protrude upward based on an upper surface of the second seating body 214. Although not shown, the second seating body 214 may be formed to protrude upward based on the top surface of the first seating body 212. The second seating body 214 may be formed in a cylindrical shape as a whole.

An inclined surface 2141 is formed in the second seating body 214 to transmit the light emitted from the LED chip to the measuring unit 31. In this case, the measuring unit 31 may be located above the LED chip positioned at the test position TP.

The inclined surface 2141 may be formed by an inclined groove 2142 formed by recessing a predetermined depth in the upper surface of the second seating body 214. The inclined groove 2142 may be formed to gradually decrease in size from the upper surface of the second seating body 214 (in the direction of the H arrow). Accordingly, the inclined surface 2141 may be formed to be inclined in the outward direction (E arrow direction). The second seating body 214 may be formed in a cylindrical shape as a whole, and the inclined groove 2142 may be formed to gradually decrease in diameter from the upper surface of the second seating body 214.

Since the inclined surface 2141 allows a greater amount of light to be incident on the measuring unit 31, the LED chip testing apparatus 1 according to the present invention can accurately measure the performance of the LED chip. The inclined surface 2141 may be coated with a material having high reflectance, for example, may be coated with Teflon or mirror coated.

1 and 2, the rotating member 22 is installed next to the main body 35.

A plurality of seating members 21 may be installed on the rotating member 22. The rotating member 22 may be rotated by the rotating unit 23. As the rotating member 22 is rotated, the seating members 21 may be sequentially positioned at the test position TP, and the LED chips to be tested seated on the seating members 21 may be tested. May be sequentially located at the position TP.

The seating member 21 may be spaced apart from the rotating member 22 at the same angle with respect to the rotating shaft 22a, and thus a plurality of mounting members 21 may be installed. Accordingly, the rotating unit 23 may rotate and stop the rotating member 22 at the same angle, thereby sequentially placing the seating members 21 at the test position TP.

For example, the seating member 21 may be spaced apart from each other by 45 ° with respect to the rotation shaft 22a and may be installed at the rotation member 22. In this case, the mounting unit 21 may be sequentially positioned at the test position TP by stopping the rotating unit 23 after rotating the rotating member 22 by 45 °. Twelve seats may be installed on the rotation member 22 by spaced apart by 30 ° from the rotation shaft 22a. In this case, the mounting unit 21 may be sequentially positioned at the test position TP by stopping the rotating unit 23 after rotating the rotating member 22 by 30 °.

That is, when the number of seating members 21 installed on the rotating member 22 is defined as N pieces (N is an integer greater than 1), the seating member 21 is rotated on the rotating member 22. N pieces may be installed spaced apart by (360 / N) ° with respect to 22a. By stopping the rotating unit 23 after rotating the rotating member 22 by (360 / N) °, the seating members 21 may be sequentially positioned at the test position TP. The seating member 21 is preferably installed in even numbers on the rotating member (22).

When any one of the seating members 21 is located at the test position TP, any one of the remaining seating members 21 may be located at a loading position LP at which the LED chip to be tested is loaded. One of the remaining mounting members 21 may be located at an unloading position ULP where the tested LED chip is unloaded.

The LED chip may be seated on the seating member 21 positioned at the loading position LP, moved to the test position TP and tested, and then moved to the unloading position ULP to be unloaded. That is, the supply unit 2 may supply the LED chip to be tested to the test position TP, and supply the tested LED chip to the unloading position TLP. The process of loading the LED chip to be tested on the seating member 21 located at the loading position LP and the process of unloading the LED chip tested at the seating member 21 positioned at the unloading position ULP Although not shown, it may be made by a transfer means for transferring the LED chip.

The seating members 21 may be installed on the rotating member 22 so that at least one of the seating members 21 may be simultaneously positioned at the test position TP, the loading position LP, and the unloading position ULP.

The rotating member 22 may include a support frame 221 on which the seating members 21 are installed. The rotating member 22 may include the same number of support frames 221 as the seating member 21. For example, when eight seating members 21 are installed in the rotating member 22, the rotating member 22 may include eight supporting frames 221. In this case, the support frames 221 may be spaced apart from each other by 45 ° with respect to the rotation axis 22a. The support frame 221 is outwardly from the rotating shaft 22a so that the seating member 21 can be located at the test position TP, the loading position LP, and the unloading position ULP. It may be formed long.

The seating member 21 may be installed on an upper surface of the support frame 221, and the intake apparatus F (shown in FIG. 11) may be installed on a bottom surface of the support frame 221. At the position where the seating member 21 is installed in the support frame 221, the through hole 22b and FIG. 11 communicating with the through hole 21a (shown in FIG. 11) formed in the seating member 21. Shown) can be formed. The through holes 21a and 22b (shown in FIG. 11) may be formed in a cylindrical shape as a whole.

1 and 2, the rotation unit 23 rotates the rotation member 22 such that the seating members 21 are sequentially positioned at the test position TP. The rotating unit 23 may be coupled to the bottom surface of the rotating member 22, and may rotate the rotating member 22 about the rotating shaft 22a.

The rotating unit 23 may include a motor 231. The motor 231 may be directly coupled to the rotary shaft 22a to rotate the rotary member 22, and coupled to a shaft (not shown) coupled to the rotary shaft 22a to thereby rotate the rotary member 22. It can also be rotated. When the motor 231 is installed at a position spaced apart from the shaft (not shown), the rotation unit 23 further includes a pulley and a belt connecting the motor 231 and the shaft (not shown). can do.

<Test section (3)>

1 to 7, the test unit 3 may be installed next to the rotating member 21 and test an LED chip positioned at the test position TP. As described above, the test unit 3 includes the measuring unit 31, the contact unit 32, the first transfer member 33 (shown in FIG. 8), the contact moving unit 34, and the main body 35. It may include.

The measuring unit 31 includes a light receiving hole 311 (shown in FIG. 11) to which light emitted from the LED chip is incident. The measuring unit 31 is connected to a tester (not shown) capable of analyzing a test result for the LED chip, and through the light receiving hole 311 (shown in FIG. 11) in connection with the tester (not shown). The optical characteristics of the LED chip can be measured from the incident light. The optical properties may be luminance, wavelength, luminous flux, luminous intensity, illuminance, spectral distribution, color temperature, and the like. An integrating sphere may be used as the measuring unit 31.

The measuring unit 31 may be coupled to the main body 35 such that the light receiving hole 311 (shown in FIG. 11) is positioned on the LED chip. At least one of a spectrometer or a photodetector may be installed in the measuring unit 31. The measuring unit 31 may be formed in a spherical shape as a whole, and may include a light receiving hole 311 (shown in FIG. 11) formed in a circular shape as a whole.

1 to 10, the contact unit 32 may be connected to a tester (not shown), and in conjunction with the tester (not shown) may emit an LED chip. Accordingly, the measuring unit 31 can measure the optical characteristics of the LED chip. The contact unit 32 may test the electrical characteristics of the LED chip in conjunction with a tester (not shown).

The contact unit 32 may include a contact pin 321 contacting the LED chip and a contact body 322 coupled to the contact movement unit 34. The contact unit 32 may be raised and lowered by the contact movement unit 34 and may be moved in the horizontal direction. The contact unit 32 may emit an LED chip in contact with the contact pin 321 in association with a tester (not shown). The contact unit 32 may include a plurality of contact pins 321. A probe card may be used as the contact unit 32.

The contact body 322 may include a terminal 3221 electrically connected to the contact pin 321. The contact pin 321 is coupled to the contact body 322 in contact with the terminal 3221. The contact pin 321 may be electrically connected to a tester (not shown) through the terminal 3221. The contact body 322 may include a plurality of terminals 3221, and the contact pins 321 may be connected to each of the terminals 3221.

The contact body 322 may be coupled to the contact movement unit 34 to be positioned between the measurement unit 31 and the LED chip in contact with the contact pin 321. The measurement unit 31 may be positioned on the contact body 322, and an LED chip positioned at the test position TP may be positioned below the contact body 322.

The contact body 322 may include an insertion hole 3222 through which the contact pin 321 may pass. The contact pin 321 is connected to a terminal 3221 formed at one side of the upper surface of the contact body 322, and the other side is positioned below the contact body 322 through the insertion hole 3322. Can be in contact with the LED chip. Light emitted by the LED chip may be incident into the measuring unit 31 through the insertion hole 3222 and the light receiving hole 311 (shown in FIG. 11). The contact body 322 may be formed in a rectangular plate shape as a whole, it may include an insertion hole 3322 formed in a circular shape as a whole.

The contact unit 32 may include a connection unit 323. At least one connection terminal 3223 is formed at one side of the contact body 322, and may be electrically connected to the connection unit 323 through the connection terminal 3223. The connecting unit 323 may be connected to a tester (not shown), and the contact pin 321 may be electrically connected to a tester (not shown) through the contact body 322 and the connection unit 323. have.

The connection unit 323 may include a connection groove 3231 into which the contact body 322 is inserted. The contact body 322 may include at least one or more connection terminals 3223 on one side of the contact body 3321. The connection unit 323 may be detachably coupled to the contact movement unit 34, the contact body 322 is inserted into the connection unit 323 is the measurement unit 31 and the test position ( TP) may be located between the LED chip located in.

1 to 11, the first transfer member 33 is installed to be positioned between the contact unit 32 and the LED chip positioned at the test position TP. Accordingly, since the LED chip test apparatus 1 may block a portion between the measurement unit 31 and the LED chip with the first transfer member 33, the light emitted by the LED chip as compared to the test apparatus according to the prior art. The amount of passage between the measuring unit 31 and the LED chip can be reduced.

The first transfer member 33 may be coupled to the contact movement unit 34. Accordingly, when the contact unit 32 needs to be replaced, only the contact unit 32 may be replaced regardless of the first transfer member 33.

The first transfer member 33 includes a first through hole 331 and a first transfer surface 332.

The first through hole 331 may be formed to penetrate through the first transfer member 33. The contact pin 321 may be in contact with the LED chip positioned below the first transfer member 33 by passing through the first through hole 331. That is, the contact pin 321 may be in contact with the LED chip positioned at the test position TP through the first through hole 331. A plurality of contact pins 321 may pass through the first through hole 331 to contact the LED chip positioned at the test position TP. Light emitted by the LED chip may pass through the first through hole 331 and the light receiving hole 311 to be incident into the measuring unit 31. Accordingly, the contact pin 321 may be in contact with the LED chip without being disturbed by the first transfer member 33, and the light emitted by the LED chip is not disturbed by the first transfer member 33. It may be incident into the measuring unit 31.

The first transfer member 33 is gradually reduced in size in the direction (H arrow direction) toward the LED chip positioned at the test position TP in the first test hole 331 in the measuring unit 31 Can be formed. That is, the first through hole 331 may be formed to gradually decrease in size in the lower direction (H arrow direction) on the upper surface (33a) of the first transfer member (33). The first through hole 331 may be formed to gradually reduce the diameter in the downward direction (H arrow direction) on the upper surface 33a of the first transfer member 33, it may be formed in a hemispherical shape as a whole.

The first transfer surface 332 transfers the light emitted from the LED chip toward the measurement unit 31 such that the light emitted from the LED chip is incident to the measurement unit 31 through the light receiving hole 311. Light emitted from the LED chip to the side may be transmitted toward the measuring unit 31 by the first transfer surface 332. Accordingly, since a larger amount of light may be incident into the measuring unit 31, the LED chip test apparatus 1 may more accurately measure the performance of the LED chip. The first transfer surface 332 may be coated with a material having high reflectance, for example, may be coated with Teflon or mirror coated.

The first transfer surface 332 may be formed along the outer surface of the first through hole 331 to transmit light emitted from the LED chip toward the measurement unit 31. That is, as shown in the enlarged view of FIG. 10, the first transfer surface 332 is directed toward the upper direction (G arrow direction) from the bottom surface 33b of the first transfer member 33. It may be formed away from the center (I) of the through-hole 331. When the first through hole 331 is formed in a hemispherical shape as a whole, the first transfer surface 332 may be formed to form a curved surface as a whole.

The first transfer member 33 may further include a first protrusion member 333.

The first protruding member 333 may be formed to protrude in a direction (G arrow direction) toward the measuring unit 31 from the LED chip positioned at the test position TP. That is, the first protruding member 333 may be formed to protrude in an upward direction (G arrow direction) from the upper surface 33a of the first transfer member 33. The first protruding member 333 may be inserted into the insertion hole 3322.

The first protruding member 333 may include a first inclined surface 3331 formed to be connected to the first transfer surface 332. The first transfer surface 332 and the first inclined surface 3331 may be formed at the same slope. That is, the first transfer surface 332 and the first inclined surface 3331 may be formed to form one inclination angle. The first transfer surface 332 and the first inclined surface 3331 may be formed to form one curved surface. Accordingly, the first transfer surface 332 and the first inclined surface 3331 may transmit light emitted from the LED chip toward the measuring unit 31.

Therefore, since the first transfer member 33 can increase the area for transmitting the light emitted by the LED chip toward the measurement unit 31, the LED chip test apparatus 1 is inside the measurement unit 31. As a result, a larger amount of light can be incident, and the performance of the LED chip can be measured more accurately. The first inclined surface 3331 may be coated with a material having high reflectance, for example, may be coated with Teflon or mirror coated.

1 to 12, the contact movement unit 34 may include a contact support mechanism 341, a contact coupling mechanism 342, and a contact lifting mechanism 343.

The contact support mechanism 341 supports the contact unit 32. The contact unit 32 may be detachably coupled to the contact support mechanism 341 by the contact coupling mechanism 342. The first transfer member 33 is coupled to the contact support mechanism 341 under the contact unit 32. Accordingly, when it is necessary to replace the contact unit 32, such as the type of the LED chip is changed or the contact pin 321 is damaged, the contact unit 32 regardless of the first transfer member 33 ) Can only be replaced.

At least one of the contact body 322 and the connection unit 323 may be coupled to the contact support mechanism 341. The contact support mechanism 341 is formed with a through hole into which the first transfer member 33 is inserted. The first transfer member 33 may be inserted into the through hole and coupled to the contact support mechanism 341 by a fitting method. The first transfer member 33 may be inserted into the through hole and coupled to the contact support mechanism 341 by a fastener such as a bolt.

The contact supporting mechanism 341 may be coupled to the contact raising and lowering mechanism 343. As the contact support mechanism 341 is raised and lowered by the contact raising and lowering mechanism 343, the contact unit 32 and the first transfer member 33 coupled to the contact supporting mechanism 341 are also together. Can be raised and lowered. The contact support mechanism 341 may be formed in a rectangular plate shape as a whole, and may be formed long in the direction toward the measurement unit 31 in the contact lift mechanism 343.

The contact coupling mechanism 342 detachably couples the contact unit 32 to the contact support mechanism 341. A fastening member such as a bolt may be used as the contact coupling mechanism 342. The contact unit 32 may include a through hole through which the contact coupling mechanism 342 passes, and the contact support mechanism 341 may include a groove to which the contact coupling mechanism 342 is coupled.

1 to 12, the contact raising and lowering mechanism 343 may move the contact unit 32 in a vertical direction (Z-axis direction, shown in FIG. 2). The contact raising and lowering mechanism 343 may lower the contact unit 32 so that the contact pin 321 contacts the LED chip. The contact raising and lowering mechanism 343 may raise the contact unit 32 so that the contact pin 321 and the LED chip are not damaged by contact when the test for the LED chip is completed. The contact raising and lowering mechanism 343 may raise and lower the contact unit 32 by raising and lowering the contact supporting mechanism 341.

The contact raising and lowering mechanism 343 may raise and lower the contact supporting mechanism 341 so that the first transfer member 33 is positioned at a first position or a second position. The first transfer member 33 is coupled to the contact support mechanism 341.

When the first transfer member 33 is positioned in the first position, as shown in FIG. 11, the first transfer member 33 is positioned on the seating member 21. The contact raising and lowering mechanism 343 may raise the contact supporting mechanism 341 such that the lower end 332a of the first transfer surface 332 is positioned on the upper surface 21b of the seating member 21. When the first transfer member 33 is positioned at the first position, the contact pin 321 is positioned at a predetermined distance from the LED chip seated on the seating member 21.

When the first transfer member 33 is located in the second position, as shown in FIG. 12, the first transfer member 33 is mounted in the first through hole 331 by the seating member 21. Is positioned at the insertion position. That is, the bottom surface 33b of the first transfer member 33 is positioned below the top surface 21b of the seating member 21 on which the LED chip is seated. The contact raising and lowering mechanism 343 may lower the contact supporting mechanism 341 such that the lower end 332a of the first transfer surface 332 is positioned below the upper surface 21b of the seating member 21. When the first transfer member 33 is located in the second position, the contact pin 321 is in contact with the LED chip seated on the seating member 21, the contact unit 32 is the contact pin The LED chip in contact with 321 is made to emit light.

Accordingly, since the light emitted from the LED chip to the side may be transmitted toward the measuring unit 31 by the first transfer surface 332, more light may be incident into the measuring unit 31. Therefore, the LED chip test apparatus 1 can more accurately measure the performance of the LED chip.

The contact raising and lowering mechanism 343 lowers the contact supporting mechanism 341 so that the first transfer member 33 is positioned at the second position when the LED chip to be tested is positioned at the test position TP. . When the test of the LED chip is completed, the contact raising and lowering mechanism 343 raises the contact supporting mechanism 341 so that the first transfer member 33 is positioned at the first position. Thereafter, the rotating unit 23 may rotate the rotating member 22.

Accordingly, even when the rotating member 22 is rotated, the LED chip seated on the seating member 21 or the seating member 21 does not collide with the first transfer member 33 and the contact pin 321. You may not. When a new LED chip is located at the test position TP, the rotating unit 23 may stop the rotating member 22, and the contact raising and lowering mechanism 343 may be provided in the first transfer member 33. The contact support mechanism 341 may be lowered so that the contact point is positioned at the second position.

The contact raising and lowering mechanism 343 may raise and lower the contact unit 32 using a motor and connecting means respectively coupled to the motor and the contact unit 32. The connecting means may be a pulley and a belt, a ball screw, a cam member, and the like. The contact raising and lowering mechanism 343 may raise and lower the contact unit 32 using a hydraulic cylinder or a pneumatic cylinder.

Here, the LED chip positioned at the test position TP may not always be seated at the same position in the seating member 21. When the LED chip is loaded on the seating member 21 in the loading position LP may not be seated in a certain position, the centrifugal force when the LED chip is moved from the loading position LP to the test position TP This is because the state that is moved by the seat and seated on the seating member 21 can be changed. In this case, the contact movement unit 34 moves the contact unit 32 in the horizontal direction (X-axis direction and Y-axis direction, as shown in FIG. 1) so that an accurate test can be made. ) May be further included.

The contact movement mechanism 344 may move the contact unit 32 such that the contact pin 321 is positioned at a position where the contact pin 321 may contact the LED chip. The contact raising and lowering mechanism 343 may be coupled to the contact moving mechanism 344. The contact movement mechanism 344 may move the contact unit 32 by moving the contact elevation mechanism 343. The contact support mechanism 341 may be coupled to the contact movement mechanism 344, and the contact movement mechanism 344 may be coupled to the contact elevation mechanism 343.

The contact movement mechanism 344 may move the contact unit 32 using a hydraulic cylinder or a pneumatic cylinder. The contact movement mechanism 344 may move the contact unit 32 using a motor and connecting means coupled to the motor and the contact unit 32, respectively. The connecting means may be a pulley and a belt, a ball screw, a cam member, and the like.

The contact movement mechanism 344 removes the first contact movement mechanism 341 and the contact unit 32 which move the contact unit 32 in a first horizontal direction (X-axis direction, shown in FIG. 1). And a second contact movement mechanism 3442 moving in the second horizontal direction (Y-axis direction, shown in FIG. 1).

The contact raising and lowering mechanism 343 may be coupled to the second contact movement mechanism 3442, and the second contact movement mechanism 3442 may be coupled to the first contact movement mechanism 3431. The contact raising and lowering mechanism 343 may be coupled to the first contact movement mechanism 341, and the first contact movement mechanism 341 may be coupled to the second contact movement mechanism 3442.

Although not shown, the contact movement mechanism 344 may include the contact pins 321 from the state information of the LED chip obtained by a detection unit (not shown) for checking a state in which the LED chip is seated on the seating member 21. ) May move the contact unit 32 to a position where it can contact the LED chip. The detection unit (not shown) may check the position where the LED chip is seated on the seating member 21. The sensing unit (not shown) may include a CCD camera capable of capturing a state in which the LED chip is seated on the seating member 21.

Here, the LED chip positioned at the test position TP may not always be seated in the same direction in the seating member 21. When the LED chip is loaded on the seating member 21 in the loading position LP may not be seated in a certain direction, the centrifugal force when the LED chip is moved from the loading position LP to the test position TP This is because the state seated on the seating member 21 by being rotated by the light may be changed.

In this case, the contact moving unit 34 according to the modified embodiment of the present invention further includes a contact rotating mechanism 345 (shown in FIG. 13) for rotating the contact unit 32. It may include.

1 to 14, the contact rotating mechanism 345 may rotate the contact supporting mechanism 341 such that the contact pin 321 contacts an LED chip positioned at the test position TP. . The contact supporting mechanism 341 is coupled to the contact rotating mechanism 345. As the contact rotating mechanism 345 rotates the contact supporting mechanism 341, the contact unit 32 coupled to the contact supporting mechanism 341 may be rotated.

Therefore, the contact pin 32 is rotated according to the state in which the LED chip positioned at the test position TP is seated on the seating member 21, so that the contact pin 321 is positioned at the test position TP. Since the LED chip can be accurately contacted, the LED chip testing apparatus 1 according to the present invention can more accurately measure the performance of the LED chip.

The contact rotating mechanism 345 may include a contact rotating member 3451, a contact driving mechanism 3652, and a contact connecting mechanism 3503.

The contact supporting mechanism 341 is coupled to the contact rotating member 3451. The contact rotating member 3451 may be rotatably coupled to the contact connecting mechanism 3503, and may be rotated about the contact rotating shaft 3451a by the contact driving mechanism 3452. When the contact rotation member 3451 is rotated, the contact support mechanism 341 may be rotated, and thus the contact unit 32 coupled to the contact support mechanism 341 may be rotated.

The contact driving mechanism 3452 may rotate the contact rotating member 3451 about the contact rotating shaft 3451a. The contact driving mechanism 3452 may rotate the contact rotating member 3451 such that the contact pin 321 contacts the LED chip positioned at the test position TP. The contact driving mechanism 3452 may rotate the contact rotating member 3451 in a clockwise or counterclockwise direction about the contact rotating shaft 3451a.

The contact driving mechanism 3452 may include a motor 3502a. The motor 3502a may be directly coupled to the contact rotation shaft 3451a to rotate the contact rotation member 3452, and may be coupled to a shaft (not shown) coupled to the contact rotation shaft 3651a to allow the rotation member ( 22) may be rotated. When the motor 3452a is installed at a position spaced apart from the shaft (not shown), the contact driving mechanism 3452 further includes a pulley and a belt connecting the motor 3452a and the shaft (not shown). It may include.

The contact rotating mechanism 3651 and the contact driving mechanism 3452 are coupled to the contact connecting mechanism 3345. The contact rotating member 3451 may be coupled to an upper surface of the contact coupling mechanism 3503, and the contact driving mechanism 3452 may be coupled to a bottom surface of the contact coupling mechanism 3503.

The contact connecting mechanism 3503 may be coupled to the contact raising and lowering mechanism 343, and the contact raising and lowering mechanism 343 may be coupled to the contact moving mechanism 344. Accordingly, the contact connecting mechanism 3503 can be lifted up and down by the contact raising and lowering mechanism 343, and is shown in the first horizontal direction (X-axis direction, FIG. 1) by the contact moving mechanism 344. ) And the second horizontal direction (Y-axis direction, shown in Figure 1). Accordingly, the contact rotating member 3501 and the contact unit 32 move in the first horizontal direction (X axis direction, shown in FIG. 1) and the second horizontal direction (Y axis direction, shown in FIG. 1). Can be raised and lowered. The contact connecting mechanism 3503 may be coupled to the contact moving mechanism 344, and the contact moving mechanism 344 may be coupled to the contact raising and lowering mechanism 343.

Here, the contact rotating mechanism 345 according to the present invention may be made in two embodiments according to the position of the contact rotating shaft (3451a), the following will be described sequentially with reference to the accompanying drawings for each embodiment.

As shown in the enlarged view of FIG. 14, the LED chip may include two pads P1 and P2, and the test is performed while the contact pins 321 are in contact with each of the pads P1 and P2. Can be. If the LED chip is positioned at the test position TP in a state where the LED chip is seated on the seating member 21 in the position and direction shown in the enlarged view of FIG. 14, the contact unit 32 is not moved or rotated in the horizontal direction. The contact pins 321 may be in contact with the pads P1 and P2 of the LED chip. However, as described above, the state in which the LED chip is mounted on the seating member 21 may change due to various factors.

In this case, in order to make an accurate test, in the contact rotating mechanism 345 according to the exemplary embodiment of the present invention, the contact driving mechanism 3652 is one end 321a of the contact pin 321 in contact with the LED chip. The contact rotating member 3501 may be rotated about the contact rotating shaft 3451a spaced apart from the predetermined distance from the contact rotating shaft 3451a. That is, the contact driving mechanism 3452 may rotate the contact rotating member 3501 about the contact rotating shaft 3451a spaced a predetermined distance from the seating member 21 positioned at the test position TP. Can be.

Referring to FIGS. 1 to 17, a process of contacting the contact pin 321 with the LED chip by the contact rotating mechanism 345 according to an embodiment of the present invention will be described below. 15 to 17 are conceptual views illustrating an operation process of the contact rotating mechanism 345 according to an embodiment of the present invention with respect to the enlarged view of FIG. 14 and the contact rotating shaft 3651a.

First, the LED chip may be positioned at the test position TP in a state as shown in FIG. 15 by being rotated at a predetermined distance and a predetermined angle from the position and direction shown in FIG. 14. 15 shows the state of the LED chip seated on the seating member 21 in the position and direction shown in Figure 14, the LED chip shown in solid line in Figure 15 is the test position The LED chip positioned at (TP) is moved and rotated by various factors as described above to show the mounted state on the seating member 21.

In this state, the contact driving mechanism 3452 rotates the contact rotating member 3401 about the contact rotating shaft 3501a so as to correspond to an angle at which the LED chip positioned at the test position TP is rotated. As illustrated in FIG. 16, the contact driving mechanism 3452 may rotate the contact rotating member 3451 in a counterclockwise direction about the contact rotating shaft 3451a. In this case, the contact unit 32 may be in a raised state by the contact raising and lowering mechanism 343 so as not to collide with the LED chip and the seating member 21 positioned at the test position TP. The first transfer member 33 may be in a state located at the first position.

When the contact pins 321 are rotated at an angle capable of contacting the pads P1 and P2 of the LED chip positioned at the test position TP, the contact movement mechanism 344 is shown in FIG. As described above, the contact support mechanism 341 is moved such that the contact pins 321 are positioned on the pads P1 and P2 of the LED chip positioned at the test position TP. This means that the contact moving mechanism 344 moves the contact raising and lowering mechanism 343 in a first horizontal direction (X axis direction, shown in FIG. 1) and a second horizontal direction (Y axis direction, shown in FIG. 1). This can be done by moving to.

When the contact pins 321 are positioned on the pads P1 and P2 of the LED chip positioned at the test position TP, the contact raising and lowering mechanism 343 may include the contact pins 321 at the test position TP. The contact unit 32 is lowered so as to be in contact with the pads P1 and P2 of the LED chip respectively positioned at the C). This may be achieved by the contact raising and lowering mechanism 343 descending the contact connecting mechanism 3503. The first transfer member 33 may be lowered by the contact raising and lowering mechanism 343 and positioned at the second position.

1 to 13 and 18 to 20, in the contact rotating mechanism 345 according to another embodiment of the present invention, the contact driving mechanism 3452 is a seating member located at the test position TP ( 21) The contact rotating member 3501 may be rotated about the contact rotating shaft 3451a positioned below. The seating member 21 positioned at the test position TP may be located between the contact unit 32 and the contact rotation shaft 3451a.

The contact rotating member 3451 may include a vertical frame 3451b to which the contact support mechanism 341 is coupled, and a horizontal frame 3451c rotatably coupled to the contact connection mechanism 3503. The contact driving mechanism 3452 may rotate the contact rotating member 3451 about the contact rotating shaft 3451a in the horizontal frame 3451c.

The vertical frame 3451b may be formed at a height at which the seating member 21 positioned at the test position TP may be positioned between the contact unit 32 and the horizontal frame 3541c. The horizontal frame 3451c has a seating member positioned at the test position TP at the vertical frame 3451b such that the contact rotation shaft 3501a is positioned below the seating member 21 positioned at the test position TP. It may be formed long toward the (21). The contact rotating member 3451 may be formed in a 'b' shape as a whole.

Accordingly, in comparison with the contact rotating mechanism 345 according to the above-described embodiment, the distance from which the contact rotating shaft 3501a is spaced apart from one end 321a of the contact pin 321 in contact with the LED chip. Can be reduced. Therefore, after the contact pins 321 are rotated at an angle capable of contacting the pads P1 and P2 of the LED chip positioned at the test position TP, the contact movement mechanism 344 is rotated. The distance at which the contact support mechanism 341 is moved to be positioned on the pads P1 and P2 of the LED chip positioned at the test position TP may be reduced.

The contact driving mechanism 3452 is configured to move the contact rotating member 3451 about the contact rotating shaft 3451a positioned on the same vertical line J as the one end 321a of the contact pin 321 contacting the LED chip. Can be rotated. When the contact unit 32 includes a plurality of contact pins 321, the contact rotation shaft 3501a is the same vertical line as one end 321a of any one of the contact pins 321. May be located on (J).

The contact driving mechanism 3452 rotates the contact rotating member 3501 about the contact rotating shaft 3501a positioned on the same vertical line I (shown in FIG. 10) as the center of the insertion hole 3322. You can. The contact rotation shaft 3451a may be positioned on the same vertical line I (shown in FIG. 10) as the center of the insertion hole 3322 and the center of the first through hole 331.

When the contact axis of rotation (3451a) is located on the same vertical line (I, shown in Figure 10) and the center of the insertion hole 3322, another embodiment of the present invention with reference to Figures 13, 18 to 20 When the contact pin 321 is in contact with the LED chip by the contact rotating mechanism 345 according to the following.

First, the LED chip may be rotated at a predetermined distance and a predetermined angle from the position and direction shown in FIG. 14 to be positioned at the test position TP in a state as shown in FIG. 20. The LED chip shown by dotted lines in FIG. 20 shows the state of the LED chip seated on the seating member 21 in the position and direction shown in FIG. 14, and the LED chip shown in solid line in FIG. 20 is the test position. The LED chip positioned at (TP) is moved and rotated by various factors as described above to show the mounted state on the seating member 21.

In this state, the contact driving mechanism 3452 rotates the contact rotating member 3501 about the contact rotating shaft 3451a so as to correspond to the angle at which the LED chip positioned at the test position TP is rotated. . As shown in FIG. 21, the contact driving mechanism 3452 may rotate the contact rotating member 3451 counterclockwise about the contact rotating shaft 3451a.

When the contact pins 321 are rotated at an angle capable of contacting each of the pads P1 and P2 of the LED chip positioned at the test position TP, the contact movement mechanism 344 is as shown in FIG. As described above, the contact support mechanism 341 is moved such that the contact pins 321 are positioned on the pads P1 and P2 of the LED chip positioned at the test position TP. This means that the contact moving mechanism 344 moves the contact raising and lowering mechanism 343 in a first horizontal direction (X axis direction, shown in FIG. 1) and a second horizontal direction (Y axis direction, shown in FIG. 1). This can be done by moving to. As compared to the contact rotating mechanism 345 according to the above-described embodiment as shown in FIG. 22, the contact moving mechanism 344 according to another embodiment of the present invention has a shorter distance than the contact supporting mechanism. By moving the 341, the contact support mechanism 341 may be moved such that the contact pins 321 are positioned on the pads P1 and P2 of the LED chip positioned at the test position TP.

When the contact pins 321 are positioned on the pads P1 and P2 of the LED chip positioned at the test position TP, the contact raising and lowering mechanism 343 may include the contact pins 321 at the test position TP. The contact unit 32 is lowered so as to be in contact with the pads P1 and P2 of the LED chip respectively positioned at the C). This may be achieved by the contact raising and lowering mechanism 343 descending the contact connecting mechanism 3503. The first transfer member 33 may be lowered by the contact raising and lowering mechanism 343 and positioned at the second position.

Referring to FIG. 13, the main body 35 is installed next to the supply part 2. The contact movement unit 34 and the measurement unit 31 are respectively coupled to the main body 35. The main body 35 is a first frame 351 is coupled to the measuring unit 31 is formed long in the horizontal direction, the second frame is formed long in the lower direction (H arrow direction) from the first frame 351 352, and a third frame 353 to which the second frame 352 is coupled. The contact movement unit 34 may be coupled to an upper surface of the third frame 353. The contact lifting mechanism 343 or the contact movement mechanism 344 may be coupled to an upper surface of the third frame 353.

1 to 26, the LED chip test apparatus 1 may further include a second transfer member 36.

The second transfer member 36 may be coupled to the contact movement unit 34 to be positioned between the measurement unit 31 and the contact unit 32. Accordingly, since the LED chip test apparatus 1 may block a portion between the measuring unit 31 and the contact unit 32 with the second transfer member 36, the light emitted from the LED chip is measured by the measuring unit. The amount of passage between the 31 and the LED chip can be further reduced. The contact unit 32 may be coupled to the contact movement unit 34 to be positioned between the first transfer member 33 and the second transfer member 36. The second transfer member 36 and the contact unit 32 may each be coupled to the contact support mechanism 341.

The second transfer member 36 includes a second through hole 361 and a second transfer surface 362.

The second through hole 361 may be formed through the second transfer member 36. Light emitted from the LED chip may pass through the first through hole 331, the second through hole 361, and the light receiving hole 311 to be incident into the measurement unit 31. Accordingly, the light emitted by the LED chip may be incident into the measuring unit 31 without being disturbed by the first transfer member 33 and the second transfer member 36.

The second transfer member 36 may be formed such that the second through hole 361 is gradually reduced in size in the direction (H arrow direction) toward the LED chip in the measuring unit 31. That is, the second through hole 361 may be formed to gradually decrease in the downward direction (H arrow direction) on the upper surface (36a) of the second transfer member (36). The second through hole 361 may be formed to gradually decrease in diameter in the downward direction (H arrow direction) on the upper surface 36a of the second transfer member 36.

The second transfer surface 362 transfers the light emitted by the LED chip toward the measurement unit 31 such that the light emitted from the LED chip passes through the light receiving hole 311 and is incident to the measurement unit 31. Accordingly, since a larger amount of light may be incident into the measuring unit 31, the LED chip test apparatus 1 may more accurately measure the performance of the LED chip. The second transfer surface 362 may be coated with a material having a high reflectance, for example, may be coated with a Teflon material.

The second transfer surface 362 may be formed along the outer surface of the second through hole 361 so as to transmit light emitted from the LED chip toward the measurement unit 31. That is, the second transfer surface 362, as shown in the enlarged view of FIG. 24, moves toward the upper direction (G arrow direction) from the bottom surface 36b of the second transfer member 36. It may be formed away from the center (K) of the through hole (361). When the second through hole 361 is gradually reduced in diameter in the downward direction (H arrow direction) from the upper surface 36a of the second transfer member 36, the second transfer surface 362 is generally It may be formed to form a curved surface.

The second transfer surface 362 and the first transfer surface 332 may be formed on one curved surface. That is, when the first transfer surface 332 and the second transfer surface 362 are connected to each other, the first transfer surface 332 and the second transfer surface 362 may be formed to form one curved surface. Can be. Light emitted by the LED chip may be transmitted toward the measurement unit 31 by the first transfer surface 332 and the second transfer surface 362.

The second transfer member 36 may further include an accommodation groove 363 capable of receiving the contact pin 321. The second transfer member 36 is the contact support mechanism 341 so that the contact pin 321 is located between the measuring unit 31 and the contact unit 32 in a state where the contact pin 321 is located in the receiving groove 363. ) May be combined. The second transfer member 36 may be formed in a '∩' shape as a whole.

Referring to FIG. 25, the second transfer member 36 may further include a second protrusion member 364. In FIG. 25, the second transfer member 36 is illustrated as being coupled to the measurement unit 31, but the second transfer member 36 has the second protruding member 364 at the light receiving hole 311. It may be coupled to the contact moving unit 34 in the inserted state.

The second protruding member 364 may be formed to protrude in a direction (G arrow direction) toward the measuring unit 31 from the LED chip positioned at the test position TP. That is, the second protruding member 364 may be formed to protrude upward (G arrow direction) from the upper surface 36a of the second transfer member 36. The second protruding member may be inserted into the measuring unit 31 through the light receiving hole 311.

The second protruding member 364 may include a second inclined surface 3641 formed to extend to the second transfer surface 362. That is, the second transfer surface 362 and the second inclined surface 3641 may be formed to form one curved surface. Accordingly, the second transfer surface 362 and the second inclined surface 3641 may transmit light emitted from the LED chip toward the measuring unit 31.

Accordingly, since the second transfer member 36 may increase the area for transmitting the light emitted by the LED chip toward the measurement unit 31, the LED chip test apparatus 1 may be formed inside the measurement unit 31. As a result, a larger amount of light can be incident, and the performance of the LED chip can be measured more accurately. The second inclined surface 3641 may be coated with a material having a high reflectance, and for example, may be coated with a Teflon material.

1, 2, 25, and 26, the second transfer member 36 according to a modified embodiment of the present invention may be coupled to the measurement unit 31.

The second transfer member 36 may be coupled to the measurement unit 31 to protrude in the direction (H arrow direction) toward the LED chip positioned at the test position TP in the measurement unit 31. That is, the second transfer member 36 may be coupled to the measurement unit 31 to protrude in the downward direction (H arrow direction) from the measurement unit 31.

As shown in FIG. 25, the second transfer member 36 may be coupled to the measurement unit 31 with the second protrusion member 364 inserted into the light receiving hole 311. Accordingly, since the second transfer member 36 may increase the area for transmitting the light emitted by the LED chip toward the measurement unit 31, the LED chip test apparatus 1 may measure the measurement unit 31. More light can be injected into the interior, and the performance of the LED chip can be measured more accurately.

The second transfer member 36 may be coupled to the measurement unit 31 by the second protruding member 364 inserted into the light receiving hole 311 and fitted. The second transfer member 36 may be coupled to the measuring unit 31 by a fastening member such as a bolt while the second protruding member 364 is inserted into the light receiving hole 311.

As shown in FIG. 26, the second transfer member 36 may be coupled to the measurement unit 31 such that the measurement unit 31 is positioned in the second through hole 361. The second transfer member 36 may be coupled to the measurement unit 31 by a fitting method, or may be coupled to the measurement unit 31 by a fastening member such as a bolt.

1, 2, 27 and 28, the second transfer member 36 according to another modified embodiment of the present invention, one side is coupled to the measuring unit 31, the other side is the contact May be coupled to the unit 32. The second transfer member 36 may be coupled to the contact body 322 at the other side. Although not shown, the second transfer member 36 may have one side coupled to the measuring unit 31 and the other side coupled to the contact support mechanism 341.

An insertion groove 365 into which the contact pin 321 may be inserted may be formed in the second transfer member 36. When the contact unit 32 includes a plurality of contact pins 321, a plurality of insertion grooves 365 may be formed in the second transfer member 36. The second transfer member 36 may have the same number of insertion grooves 365 as the contact pins 321.

The second transfer member 36 may be coupled to the contact body 322 on the other side while the contact pin 321 is inserted into the insertion groove 365, and one side may be connected to the measurement unit 31. Can be combined. Therefore, the second transfer member 36 may block the distance between the measurement unit 31 and the contact unit 32, so that light emitted from the LED chip does not pass between the measurement unit 31 and the LED chip. Can be. Therefore, the LED chip test apparatus 1 may allow a greater amount of light to enter the measurement unit 31 and more accurately measure the performance of the LED chip.

When the second transfer member 36 is coupled to the measuring unit 31 and the contact body 322, the measuring unit 31 may be movably coupled to the main body 35. Accordingly, when the contact movement unit 34 moves the contact unit 32, the measurement unit 31 coupled to the contact unit 32 may also move together. To this end, the main body 35 may include a first connection frame 354, a second connection frame 355, and a third connection frame 356. The measuring unit 31 may be coupled to the third connection frame 346.

The first connection frame 354 may be coupled to the first frame 351 to be raised and lowered. Accordingly, when the contact movement unit 34 raises and lowers the contact unit 32, the first connection frame 354 may move up and down, and thus the measurement unit 31 may also move up and down. have. The first frame 351 may include an LM rail, and the first connection frame 354 may include an LM block movably coupled to the LM rail of the first frame 351.

The second connection frame 355 may be movably coupled to the first connection frame 354 in a first horizontal direction (X-axis direction). Accordingly, when the contact movement unit 34 moves the contact unit 32 in the first horizontal direction (X axis direction), the second connection frame 355 moves in the first horizontal direction (X axis direction). ), And thus the measuring unit 31 may be moved in the first horizontal direction (X-axis direction). The first connection frame 354 may include an LM rail, and the second connection frame 355 may include an LM block movably coupled to the LM rail of the first connection frame 354. .

The third connection frame 356 may be coupled to the second connection frame 355 so as to be movable in a second horizontal direction (Y-axis direction) perpendicular to the first horizontal direction (X-axis direction). Accordingly, when the contact movement unit 34 moves the contact unit 32 in the second horizontal direction (Y-axis direction), the third connection frame 356 moves in the second horizontal direction (Y-axis direction). ), And thus the measuring unit 31 may be moved in the second horizontal direction (Y-axis direction). The second connection frame 355 may include an LM rail, and the third connection frame 356 may include an LM block movably coupled to the LM rail of the second connection frame 355. .

The measuring unit 31 may be rotatably coupled to the third connection frame 356. Accordingly, when the contact movement unit 34 rotates the contact unit 32, the measurement unit 31 may also rotate.

As described above, when the contact movement unit 321 moves the contact unit 32 such that the contact pin 321 contacts the LED chip positioned at the test position TP, the measurement unit 31 Since it moves together, the LED chip located at the test position (TP) can be tested in a state positioned on the same vertical line as the center of the light receiving hole (311) irrespective of the position seated on the seating member (21) have. Therefore, the LED chip test apparatus 1 can more accurately measure the performance of the LED chip.

29 to 31, the contact unit 32 according to the modified embodiment of the present invention includes a contact pin 321, a first body 324, a second body 325, and a third body 326. , And a coupling member 327. The contact unit 32 may be moved up and down by the contact movement unit 34 and may be moved in the first horizontal direction (X axis direction) and the second horizontal direction (Y axis direction). The test unit 3 may include a plurality of contact units 32 according to a modified embodiment of the present invention.

The contact pin 321 is coupled to the first body 324. The first body 324 is coupled to the second body 325. The first body 324 may be formed long in the direction toward the LED chip positioned at the test position TP in the second body 325. The first body 324 may be electrically connected to a tester (not shown), and the contact pin 321 may be electrically connected to a tester (not shown) through the first body 324.

The contact pin 321 may be detachably coupled to the first body 324 by a connection member 3241. Accordingly, when the contact pin 321 is damaged or broken, the user may easily replace only the contact pin 321. Even when the LED chip to be tested is replaced with an LED chip having a different specification from the existing one, the user can easily replace the contact pin 321 meeting the specifications of the new LED chip.

The connection member 3241 may be rotatably coupled to the first body 324. As the connection member 3241 is rotated in one direction, the connection member 3241 may couple the contact pin 321 to the first body 324 by applying a force to the first body 324. As the connection member 3241 is rotated in the other direction, the force applied to the first body 324 by the connection member 3321 is removed, so that the contact pin 321 is removed from the first body 324. It may be in a detachable state. A fastening member (not shown) such as a bolt may be used as the connection member 3241.

The first body 324 is coupled to the second body 325. The second body 325 and the third body 326 may be detachably coupled by the coupling member 327. Accordingly, when the contact pin 321 needs to be replaced, the contact pin 321 may be easily replaced by separating the second body 325 from the third body 326. The second body 325 may be electrically connected to a tester (not shown), and the contact pin 321 may be connected to a tester (not shown) through the first body 324 and the second body 325. Can be electrically connected.

The second body 325 is coupled to the third body 326. The second body 325 may be detachably coupled to the third body 326 by the coupling member 327. The third body 326 may be coupled to the contact moving unit 34. As the third body 326 is moved by the contact movement unit 34, the second body 325, the first body 324, and the contact pin 321 may move together. The third body 326 may be electrically connected to a tester (not shown), and the contact pin 321 may be the first body 324, the second body 325, and the third body 326. ) May be electrically connected to a tester (not shown).

The coupling member 327 detachably couples the second body 325 and the third body 326. A fastening member (not shown) such as a bolt may be used as the coupling member 327.

31 to 33, the test unit 3 according to the modified embodiment of the present invention may further include a contact mechanism 37.

The contact mechanism 37 includes a contact hole 371 in contact with a seating member 21 positioned at the test position TP. The contact mechanism 37 may be installed next to the rotating member 22 such that the contact hole 371 may contact the seating member 21 positioned at the test position TP.

The LED chip positioned at the test position TP while the contact hole 371 is in contact with the seating member 21 positioned at the test position TP and the contact pin 321 contacts the LED chip. The light may be emitted by the power applied through the contact unit 32 and the contact hole 371. The contact unit 32 and the contact mechanism 37 may emit an LED chip in association with a tester (not shown). The contact unit 32 and the contact mechanism 37 may test the electrical characteristics of the LED chip in conjunction with a tester (not shown).

The contact hole 371 may be in contact with a side surface of the seating member 21 positioned at the test position TP. The contact hole 371 may be elongated in a direction toward the seating member 21 positioned at the test position TP.

The contact mechanism 37 may further include a contact movement means 372 for moving the contact hole 371 such that the contact hole 371 is closer to or away from the seating member 21.

When the LED chip to be tested is positioned at the test position TP, the contact movement means 372 contacts the contact hole 371 so as to be closer to the seating member 21 positioned at the test position TP. The sphere 371 is moved. The contact hole 371 may be moved by the contact moving means 372 to be in contact with the seating member 21 positioned at the test position TP.

When the test of the LED chip positioned at the test position TP is completed, the contact movement means 372 moves the contact hole 371 away from the seating member 21 positioned at the test position TP. The contact hole 371 is moved. The contact hole 371 may be moved by the contact moving means 372 to be spaced apart from the mounting member 21 positioned at the test position TP.

Accordingly, when the rotating member 22 is rotated to place the new LED chip to be tested at the test position TP, the mounting member 21 and the contact hole 371 do not come into contact with or collide with each other. Can be. Therefore, the mounting member 21 and the contact hole 371 can be prevented from being worn by friction or damaged by a collision.

The contact moving means 372 may move the contact hole 371 by using a hydraulic cylinder or a pneumatic cylinder. The contact movement means 372 may move the contact hole 371 by using a converter mechanism for converting a rotational motion of the motor and the motor into a linear movement. The converter mechanism may be a pulley and a belt, a rack and pinion gear, a ball screw, a cam member, or the like. The contact hole 371 is coupled to the contact movement means 372.

Here, when the seating member 21 is formed in a cylindrical shape as a whole, the contact hole 371 may not accurately contact the seating member 21 by slipping or the like in the process of contacting the seating member 21. have. To prevent this, the seating member 21 may further include a contact surface 215 to which the contact hole 371 is in contact.

The contact surface 215 may be formed at a side facing the contact hole 371 from the seating member 21 when the seating member 21 is positioned at the test position TP. Due to the contact surface 215, the mounting member 21 may have a side surface facing the contact hole 371. Accordingly, since the contact hole 371 may minimize the occurrence of slips and the like in the process of contacting the seating member 21, the LED chip sorting apparatus 10 according to the present invention is the contact hole 371 The LED chip can be tested in a state in which the mounting member 21 is correctly contacted.

The mounting member 21 includes a contact surface 215 where the contact hole 371 and the contact surface 215 may be perpendicular to each other when the contact hole 371 is in contact with the contact surface 215. can do. The seating member 21 may include a contact groove 21c formed by recessing a predetermined depth from a side at which the contact surface 215 is formed.

The contact hole 371 according to the modified embodiment of the present invention may be coupled to the contact body 322, as shown in FIGS. 20 to 22. The contact hole 371 may be coupled to the contact body 322 while being in contact with the terminal 3221. When the contact pin 321 is in contact with the LED chip positioned at the test position TP, the contact hole 371 is on the upper surface 21b of the seating member 21 located at the test position TP. It may be coupled to the contact body 322 to be in contact. The contact hole 371 may be in contact with the contact member 211 (shown in FIG. 3).

Accordingly, the contact moving unit 34 moves the contact unit 32 so that the contact pin 321 is in contact with the LED chip located at the test position TP. The contact hole 371 may be in contact with the upper surface 21b of the seating member 21 positioned at the test position TP. A plurality of contact holes 371 may be coupled to the contact body 322.

32 and 33, the first transfer member 33 according to the modified embodiment of the present invention protrudes in the direction toward the LED chip positioned at the test position TP in the measurement unit 31. It may be installed in the measuring unit 31. When the LED chip is tested, when the measuring unit 31 is positioned above the LED chip, the first transfer member 33 may be formed to protrude downward from the measuring unit 31.

Although not shown, the first transfer member 33 may be installed on the seating member 21 to protrude in a direction from the seating member 21 toward the measuring unit 31. When the measurement unit 31 is positioned on the LED chip when the LED chip is tested, the first transfer member 33 may be formed to protrude upward from the seating member 21. An LED chip and the support member 312 may be located inside the first transfer member 33.

The first transfer member 33 has a groove 334 through which the contact pin 321 passes. Accordingly, even if the contact unit 32 is located between the measurement unit 31 and the LED chip, the LED chip can be tested in a state in which the first transfer member 33 is located close to the LED chip. Therefore, since a larger amount of light emitted by the LED chip can be incident to the measuring unit 31 through the first transfer member 33, the performance of the LED chip can be accurately measured.

The first transfer member 33 may be formed in a hollow cylindrical shape as a whole. The groove 334 may be formed in the direction in which the contact unit 32 is installed in the first transfer member 33. The inside of the first transfer member 33 may be coated with a material having a high reflectance.

The groove 334 formed in the first transfer member 33 may have a size that allows the contact pin 321 to pass through. The contact pin 321 may be in contact with the LED chip positioned at the test position TP through the groove 334.

32 and 33, the test unit 3 according to a modified embodiment of the present invention may further include a measurement elevating unit 38.

The measuring raising and lowering unit 38 may be coupled to the main body 35 and raise and lower the measuring unit 31. The measuring unit 31 may be coupled to the first frame 351 to be moved up and down.

The measurement raising and lowering unit 38 may raise the measuring unit 31 when the rotating unit 23 rotates the rotating member 22. When the LED chip to be tested is positioned at the test position TP, the measurement raising and lowering unit 38 may lower the measuring unit 31. Accordingly, the LED chip sorting apparatus 1 according to the present invention may allow the LED chip positioned at the test position TP to be tested in a state located close to the measuring unit 31.

Therefore, the LED chip sorting apparatus 1 according to the present invention can allow a larger amount of light emitted by the LED chip to be incident on the measuring unit 31 through the first transfer member 33. The branch can measure the performance more accurately.

When the first transfer member 33 is installed on the seating member 21, the LED chip sorting apparatus 1 according to the present invention is the first transfer member 33 when the rotating member 22 is rotated While reducing the possibility of colliding with the measuring unit 31, the LED chip can be tested in a state where the measuring unit 31 is located close to the first transfer member 33. It is also possible to allow the LED chip to be tested in a state where the first transfer member 33 is inserted into the measurement unit 31 or the first transfer member 33 is in contact with the measurement unit 31. Do.

Therefore, the LED chip sorting apparatus 1 according to the present invention can allow a larger amount of light emitted by the LED chip to be incident on the measuring unit 31 through the first transfer member 33. The branch can measure the performance more accurately.

The measuring raising and lowering unit 38 may raise and lower the measuring unit 31 using a hydraulic cylinder or a pneumatic cylinder. The measuring raising and lowering unit 38 may raise and lower the measuring unit 31 by using a motor and connecting means respectively coupled to the motor and the measuring unit 31. The connecting means may include a pulley and a belt, a ball screw, a cam member, and the like.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the LED chip sorting apparatus according to the present invention will be described in detail.

34 is a schematic plan view of the LED chip sorting apparatus according to the present invention.

1 and 34, the LED chip sorting apparatus 10 according to the present invention includes an LED chip testing apparatus 1, a loading unit 4, and an unloading unit 9. Since the LED chip test apparatus 1 includes the loading unit 4 and the test unit 3 as described above, a description thereof will be omitted in order not to obscure the subject matter of the present invention.

<Loading section 4>

FIG. 35 is a schematic perspective view of the first supply mechanism and the first supply unit, FIG. 36 is a side view of FIG. 35, FIG. 37 is a schematic perspective view of the first supply body, the first supply support device, and the loading unit, and FIG. 38 is 37 is a schematic enlarged side cross-sectional view of part L of FIG. 37, FIG. 39 is a perspective view schematically showing a first supply unit and a loading unit, FIG. 40 is a perspective view schematically showing a first storage unit, and FIG. 41 is a first transport unit; 42 is a schematic perspective view of a first supply body, a first supply support device, a loading unit, and a first cooling unit, and FIGS. 43 to 45 are first cooling views according to a modified embodiment of the present invention. A schematic enlarged side view of part M of FIG. 42 for the unit.

34 and 35, the loading unit 4 supplies the LED chip to be tested. The loading part 4 may be installed next to the supply part 2. The loading unit 4 may use a supply mechanism 100 for supplying a plurality of LED chips to be tested.

34 to 36, the supply mechanism 100 includes a housing 101 in which a hollow part (not shown) is formed, and a supply member 102 in which the LED chips to be tested are located and coupled to the housing 101. ) May be included. The supply member 102 may be a tape having an adhesive material. The LED chips to be tested may be attached to the top surface of the supply member 102. The supply member 102 may be a blue tape, and the LED chips to be tested through the breaking and expansion process may be attached to the blue tape at predetermined intervals.

The housing 101 may be formed in a disk shape as a whole. The housing 101 may include the hollow part (not shown) which is formed in a disk shape as a whole. The housing 101 and the hollow part (not shown) may be formed in other shapes such as an elliptical disc shape and a rectangular shape in addition to the disc shape.

Although not shown, the loading unit 4 may use a supply mechanism 100 having a plurality of receiving grooves in which the LED chip to be tested is formed.

34 to 39, the loading unit 4 may include a first supply unit 41 and a loading unit 42.

The first supply unit 41 moves the supply mechanism 100 such that the LED chip to be tested is positioned at the first pick-up position PP1 through which the loading unit 42 can pick up the LED chip to be tested. The first supply unit 41 may include a first supply body 411, a first supply support device 412, a first alignment unit 413, and a first moving unit 414.

The first supply body 411 supports the bottom of the supply mechanism 100. The first supply body 411 may be moved in the X axis direction and the Y axis direction by the first moving unit 414. As the first supply body 411 moves, the supply mechanism 100 may be moved such that the LED chip to be tested is positioned at the first pick-up position PP1.

The first supply body 411 may be moved in the X-axis direction and the Y-axis direction by the first moving unit 414, and may be rotated. As the first supply body 411 moves and rotates, when the loading unit 42 picks up the LED chip to be tested, the supply mechanism 100 picks up the LED chip to be tested in the same direction. Can be moved. Accordingly, the loading unit 42 may be transferred to the supply unit 2 while all the LED chips to be tested face the same direction.

34 to 39, the first supply support device 412 may support the bottom surface of the LED chip to be tested picked up by the loading unit 42. The first supply support device 412 may support the bottom surface of the supply member 102 under the first pick-up position PP1. It may be installed to be located in the first supply space (411a) formed in the first supply body 411.

The first supply support device 412 may include a first elevating member 4121, a first elevating device 4122, a first supporting pin 4123, and a first pin elevating device 4124. .

The first elevating member 4121 may support the bottom surface of the supply member 102 below the first pick-up position PP1. The first elevating member 4121 may be coupled to the first elevating device 4122 and elevated by the first elevating device 4122. The first elevating member 4121 may be elongated in the vertical direction (Z-axis direction), and may be formed in a cylindrical rod shape as a whole.

The first support pin 4123 is coupled to the inside of the first elevating member 4121 so that it can be elevated. The first lifting member 4121 is formed with a first through hole 4121a through which the first support pin 4123 may pass so that the first support pin 4123 may protrude upward. have.

The first elevating device 4122 may elevate the first elevating member 4121. The first lifting device 4122 is provided when the supply mechanism 100 is positioned on the first supply body 411 or when the supply mechanism 100 is removed from the first supply body 411. The first lifting member 4121 may be lowered. When the first elevating device 4122 lowers the first elevating member 4121, the first elevating member 4121 may be spaced apart from the supply member 102. The first elevating device 4122 may raise the first elevating member 4121 when the supply mechanism 100 is positioned on the first supply body 411. When the first elevating device 4122 raises the first elevating member 4121, the first elevating member 4121 may support the bottom surface of the supply member 102.

The first elevating device 4122 is the first elevating member (method using a cylinder, such as a hydraulic cylinder or a pneumatic cylinder, a pulley and a belt, a ball screw, or a cam member) 4121) can be raised and lowered.

The first support pin 4123 may be coupled to the inner side of the first elevating member 4121 to be elevated and lowered by the first pin elevating device 4124. The first support pin 4123 may be coupled to the first pin lift device 4124. The first support pin 4123 may be formed long in the vertical direction (Z-axis direction), and may be formed in a conical shape as a whole.

The first pin elevating device 4124 may elevate the first support pin 4123. The first pin lifting device 4124 may raise the first support pin 4123 when the loading unit 42 picks up the LED chip located at the first pick-up position PP1. Accordingly, the first support pin 4123 may protrude upward from the first elevating member 4121 through the first through hole 4121a, and the LED chip is picked up by the loading unit 42. Can be pushed upwards. Therefore, the loading unit 42 can be easily picked up the LED chip to be tested. When the loading unit 42 picks up the LED chip to be tested, the first pin elevating device 4124 allows the first support pin 4123 to be positioned inside the first elevating member 4121. The support pin 4123 may be lowered.

The first pin elevating device 4124 may include the first support pin 4123 by a cylinder, such as a hydraulic cylinder or a pneumatic cylinder, a pulley and a belt, a ball screw, a cam member, or the like. Can be raised and lowered.

34 to 39, the first alignment unit 413 aligns the positions of the supply mechanism 100 supported by the first supply body 411. The first alignment unit 413 includes a first fixing member 4131, a first moving member 4132, and a first moving mechanism 4133.

The first fixing member 4131 is installed on the first supply body 411 and determines the position of the supply mechanism 100. The first fixing member 4131 may be coupled to the first supply body 411 to protrude a predetermined length upward from an upper surface of the first supply body 411. The supply mechanism 100 may be aligned in position by contacting the first fixing member 4131. The first alignment unit 413 may include a plurality of first fixing members 4131.

The first moving member 4132 may be coupled to the first moving mechanism 4133 and moved by the first moving mechanism 4133. The first moving member 4132 may be coupled to the first moving mechanism 4133 to protrude a predetermined length upward from an upper surface of the first supply body 411. The first moving member 4132 may be located at a position opposite to the position where the first fixing member 4131 is installed in the first supply body 411. The first alignment unit 413 may include a plurality of first moving members 4132.

The first moving member 4132 may be moved closer to or away from the first fixing member 4131 by the first moving mechanism 4133. When the first moving member 4132 is moved closer to the first fixing member 4131, the supply mechanism 100 is pushed by the first moving member 4132 to the first fixing member 4131. Can be contacted. Accordingly, the supply mechanism 100 may be aligned in position.

The first moving mechanism 4133 may be coupled to the first supply body 411 and move the first moving member 4132. The first moving mechanism 4133 may move the first moving member 4132 until the supply mechanism 100 contacts the first fixing member 4131. The first moving mechanism 4133 may move the first moving member 4132 using a hydraulic cylinder or a pneumatic cylinder. The first moving mechanism 4133 may move the first moving member 4132 by using a pulley and a belt, a method using a ball screw, or a method using a cam member.

34 to 39, the first moving unit 414 may move the first supply body 411 such that the LED chip to be tested is positioned at the first pick-up position PP1. The first moving unit 414 may move the first supply body 411 in the X-axis direction and the Y-axis direction.

The first moving unit 414 includes a first upper member 4141 to which the first supply body 411 is movably coupled, and a first lower member to which the first upper member 4141 is movably coupled. 4142).

The first supply body 411 and the first upper member 4141 may be moved in a direction perpendicular to each other. When the first upper member 4141 is movably coupled to the first lower member 4422 in the X-axis direction, the first supply body 411 is in the Y-axis direction with the first upper member 4141. It can be movably coupled. When the first upper member 4141 is movably coupled to the first lower member 4142 in the Y-axis direction, the first supply body 411 is connected to the first upper member 4141 in the X-axis direction. It can be movably coupled.

The first moving unit 414 moves the first supply body 411 and the first upper side member 4141 by a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. You can.

The first moving unit 414 may rotate the first supply body 411. The first moving unit 414 may rotate the first supply body 411 so that the loading unit 42 picks up the LED chip in a direction that can be tested by the test unit 3. .

2, 34 to 39, the loading unit 42 picks up the LED chip to be tested in the supply mechanism 100 and seats the seating member 21 located at the loading position LP. . The loading unit 42 may include a loading rotary arm 421 and a loading driving unit 422.

The loading rotary arm 421 is provided with a loading picker 4211 for adsorbing the LED chip to be tested. The loading rotary arm 421 may be lifted up and down by lifting means (not shown). The loading rotary arm 421 is rotated by the loading driving unit 422, and the loading picker 4211 may be reciprocated to be positioned at the loading position LP and the first pick-up position PP1.

The loading unit 42 may include one loading rotary arm 421 and one loading picker 4211. Although the loading rotary arm 421 and the loading picker 4211 are illustrated in three in FIG. 4, this is to indicate a reciprocating movement path of the loading rotary arm 421.

The loading driving arm 421 is coupled to the loading driving unit 422. The loading driving unit 422 may rotate the loading rotary arm 421 such that the loading picker 4211 is positioned at the loading position LP or the first pickup position PP1.

Although not shown, the loading unit 42 may include a plurality of loading rotary arms 421 and a plurality of loading pickers 4211 respectively coupled to the loading rotary arms 421. The loading driving unit 422 rotates the loading rotary arms 421 about a rotation axis (not shown), and any one of the loading pickers 4211 is positioned at the first pick-up position PP1, One of the loading pickers 4211 may be positioned at the loading position LP. The loading driving unit 422 may sequentially position the loading pickers 4211 at the first pick-up position PP1 and the loading position LP.

The loading driving unit 422 may include a motor, and may further include a pulley and a belt if the motor and the loading rotary arm 421 are spaced apart by a predetermined distance.

34 to 39, the loading unit 42 may further include a loading vision unit 423.

The loading vision unit 423 may be installed to be positioned above the first pick-up position PP1, and may check the state of the LED chip positioned at the first pick-up position PP1. The loading vision unit 423 may check whether the LED chip to be tested is located at the first pick-up position PP1, and the degree of rotation of the LED chip positioned at the first pick-up position PP1. The first moving unit 414 may be configured to accurately pick up the LED chip positioned at the first pick-up position PP1 from the state information of the LED chip acquired by the loading vision unit 423 to the loading unit 42. The first supply body 411 may be moved. A CCD camera may be used as the loading vision unit 423.

34 to 39, when the loading unit 42 includes the loading vision unit 423, the loading rotary arm 421 may further include a first transmission member 4212.

The first transmission member 4212 may be coupled to the loading picker 4211 and formed of a material having high transparency. For example, the first transparent member 4212 may be formed of glass. As shown in FIG. 38, a first intake hole 4211a is formed in the loading picker 4211 so that the LED chip can be adsorbed. The first intake hole 4211a may be formed through the loading picker 4211. The first penetrating member 4212 may be coupled to the loading picker 4211 at one side of the first intake hole 4211a, and thus may seal one side of the first intake hole 4211a. Therefore, the LED chip may be adsorbed to the loading picker 4211. Although not shown, the first intake hole 4211a may be connected to the intake apparatus.

The first transmission member 4212 may pass light passing through the first intake hole 4211a. Accordingly, even when the loading picker 4211 is positioned at the first pick-up position PP1, the first vision member 4212 may allow the loading vision unit 423 to reach the first pick-up position PP1. It is possible to check the status of the placed LED chip. The loading vision unit 423 may check the state of the LED chip positioned at the first pick-up position PP1 through the first penetrating member 4212 and the first intake hole 4211a. Accordingly, the first moving unit 414 is an LED chip positioned at the first pick-up position PP1 from the state information of the LED chip acquired by the loading vision unit 423 to accurately load the 42. The first supply body 411 may be moved to be picked up.

The first transmission member 4212 may also be used in the process of aligning the positions of the first support pin 4123, the loading picker 4211, and the loading vision unit 423. Even when the loading picker 4211 is positioned at the first pick-up position PP1, the loading vision unit 423 is configured to pass through the first permeation member 4212 and the first intake hole 4211a. 1 can check the position of the support pin (4123). Accordingly, the loading vision unit 423, the first support pin 4123, and the loading so that the loading picker 4211 accurately picks up the LED chip positioned at the first pick-up position PP1. The position of the picker 4211 can be easily aligned. The loading vision unit 423, the first support pin 4123, and the loading picker 4211 may be aligned to be positioned on the same vertical line.

34 to 40, the loading unit 4 may further include a first storage unit 43.

The first storage unit 43 includes a first storage mechanism 431 capable of storing a plurality of the supply mechanism 100.

The first storage mechanism 431 may include a plurality of first storage members 4311 for supporting both bottom surfaces of the supply mechanism 100. The first storage members 4311 may be formed in plural numbers spaced apart from each other by a predetermined distance in a vertical direction (Z-axis direction). The space in which the first storage members 4311 are spaced apart from each other may be a first storage groove 4312, and the supply mechanisms 100 may be inserted therein.

34 to 41, the loading unit 4 may further include a first transfer unit 44.

The first transfer unit 44 may transfer the supply mechanism 100 from the first storage mechanism 431 to the first supply body 411, the first supply body 411 to the first The supply mechanism 100 may be transferred to the storage mechanism 431.

When the supply mechanism 100 positioned in the first supply body 411 becomes empty as the loading process is completed, the first transfer unit 44 moves the empty supply mechanism 100 to the first supply body 411. ) May be transferred to the first storage mechanism 431. If there is no supply mechanism 100 in the first supply body 411, the first transfer unit 44 is a new supply mechanism 100 to supply the LED chip to be tested in the first storage mechanism 431 It can be transferred to the first supply body (411).

Therefore, the LED chip sorting apparatus 10 according to the present invention can automatically supply the supply mechanisms 100 to supply the LED chip to be tested to the first supply body 411, so that the loading process can be made continuously. In addition, it is possible to eliminate the loss of work time caused by manual work.

The first transfer unit 44 may include a first transfer member 441 and a first transfer mechanism 442.

The first transfer member 441 may hold the supply mechanism 100, and may include a first holding member 4411, a second holding member 4412, a first driving mechanism 4413, and a first connecting body. 4442.

The first holding member 4411 is in contact with the top surface of the supply mechanism 100. The first holding member 4411 is rotatably coupled to the first connection body 4414. The first gripping member 4411 may be moved closer to or farther from the second gripping member 4412 by the first driving mechanism 4413.

The second holding member 4412 is in contact with the bottom surface of the supply mechanism 100. The second gripping member 4412 is coupled to the first connecting body 4414. The first holding member 4411 is in contact with the upper surface of the supply mechanism 100, and the second holding member 4412 is in contact with the bottom surface of the supply mechanism 100, thereby providing the first transfer member 441. May grasp the supply mechanism 100. The supply mechanism 100 may be gripped by the first transfer member 441 by a predetermined force applied by the first grip member 4411.

The first driving mechanism 4413 may move the first holding member 4411 so that the first holding member 4411 and the second holding member 4412 move closer to or away from each other.

The first driving mechanism 4413 may move the first holding member 4411 closer to or away from the second holding member 4412 by rotating the first holding member 4411. In this case, the first holding member 4411 is rotatably coupled to the first connecting body 4414.

The first driving mechanism 4413 is coupled to the first connecting body 4414. The first driving mechanism 4413 may include a hydraulic cylinder or a pneumatic cylinder, and the first holding member 4411 may be coupled to a rod of such a cylinder. As the rod of the cylinder is moved, the first gripping member 4411 may be rotated about the rotation shaft 4411a.

The first gripping member 4411, the second gripping member 4412, and the first driving mechanism 4413 are coupled to the first connection body 4414. The first connecting body 4414 is coupled to the first transfer mechanism 442.

The first transfer mechanism 442 moves the first transfer member 441 between the first storage mechanism 431 and the first supply unit 41.

The first transfer mechanism 442 may move the first transfer member 441 such that the empty supply mechanism 100 is transferred from the first supply body 411 to the first storage mechanism 431. have. The first transfer mechanism 442 allows the first transfer member 441 to transfer a new supply mechanism 100 for supplying the LED chip to be tested from the first storage mechanism 431 to the first supply body 411. ) Can be moved.

The first transfer mechanism 442 uses the cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, a method using a cam member, or the like. You can move it.

The first transport mechanism 442 may be coupled to the first gantry 443. The first connecting body 4414 is movably coupled to the first gantry 443. The first connecting body 4414 may move in the Y-axis direction along the first gantry 443.

Here, the supply mechanism 100 may be stacked and stored in the vertical direction (Z-axis direction) in the first storage mechanism 431. In this case, the first storage unit 43 may further include a first storage lifting mechanism 432.

The first storage raising and lowering mechanism 432 may raise and lower the first storage mechanism 431. The first storage raising and lowering mechanism 432 is the first storage mechanism 431 such that the supply mechanism 100 is positioned at a position where the first transfer member 441 can grip the supply mechanism 100. Can be raised and lowered. The first storage raising and lowering mechanism 432 can raise and lower the first storage mechanism 431 so that the first transfer member 441 can store the empty supply mechanism 100 in the storage mechanism 231. Can be.

The first storage raising and lowering mechanism 432 is the first storage mechanism 431 by a method using a cylinder such as a hydraulic cylinder or pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. ) Can be raised and lowered.

In addition to the manner in which the first storage mechanism 431 is moved up and down by the first storage raising and lowering mechanism 432, the first transfer member 441 may be raised and lowered, and the first transfer member 441 And both of the first storage mechanism 431 may be raised and lowered.

The first storage lifting mechanism 432 may include a first vertical body 4321 and a first lifting body 4322. The first lifting body 4322 is coupled to the first vertical body 4321 to be able to move up and down.

The first storage mechanism 431 may be detachably coupled to the first lifting body 4322. Accordingly, when only empty supply mechanisms 100 are stored in the first storage mechanism 431, the first storage mechanism 431 is a new supply mechanism 100 in which the LED chips to be tested are stored. It may be replaced with the first storage mechanism 431. Therefore, the replacement work is easy and the time taken for the replacement work can be reduced, thereby preventing the work time lost due to the replacement work.

When the first transfer member 441 is configured to be movable only in the Y-axis direction without being raised or lowered, the first supply body 411 and the first alignment unit 413 may be configured as follows. have.

The first supply body 411 may include a first supply passage groove 4111. The first supply passage groove 4111 may be formed by recessing a predetermined depth from an upper surface of the first supply body 411. The first supply body 411 may include a plurality of first supply passage grooves 4111. The first transfer member 441 may pass through the first supply passage groove 4111 when the supply mechanism 100 is transferred.

The first alignment unit 413 may further include a first elevating mechanism 4134. Referring to FIG. 36, the first elevating mechanism 4134 may be coupled to the first moving mechanism 4133. The first moving member 4132 may be coupled to the first elevating mechanism 4134. Accordingly, the first lifting mechanism 4134 may be moved in the Y-axis direction by the first moving mechanism 4133, and the first moving member 4132 may be lifted up and down.

34 to 41, when the first transfer member 441 is moved toward the first supply body 411 to position the supply mechanism 100 on the first supply body 411. The first elevating mechanism 4134 may lower the first moving member 4132. Accordingly, the supply mechanism 100 or the first transfer member 441 may be prevented from colliding with the first transfer member 4132.

When the supply mechanism 100 is positioned on the first supply body 411, the first lifting mechanism 4134 may raise the first moving member 4132. Thereafter, the first moving member 4132 may be moved by the first moving mechanism 4133 to align the position of the supply mechanism 100.

When the first feed member 441 transfers the empty supply mechanism 100 from the first supply body 411 to the first storage mechanism 431, the first lifting mechanism 4134 may be The first moving member 4132 may be lowered. Accordingly, the supply mechanism 100 or the first transfer member 441 may be prevented from colliding with the first transfer member 4132.

Referring to FIGS. 2 and 34 to 42, the loading unit 4 may further include a first cooling unit 45.

The first cooling unit 45 may cool the supply mechanism 100. The first cooling unit 45 may cool the supply mechanism 100 such that the supply mechanism 100 is at room temperature or lower than room temperature, and the supply mechanism 100 is about 20 ° C. or less. The supply mechanism 100 can be cooled.

As described above, the LED chip may be supplied in a state of being attached to the supply member 102 including a tape having an adhesive material such as blue tape. In this case, the LED chip may be loaded on the seating member 2 positioned at the loading position LP in a state where the adhesive material is buried in a high temperature environment higher than room temperature. Due to this adhesive material, the LED chip may adhere to the seating member 2, and thus may not normally be unloaded at the unloading position ULP.

The first cooling unit 45 may cool the supply member 102, thereby cooling the adhesive material in the supply member 102. Accordingly, the first cooling unit 45 may be loaded in the loading position LP without the adhesive material on the LED chip, and the LED chip is normally unloaded at the unloading position ULP. can do.

The first cooling unit 45 may include a first injection unit 451 for spraying a cooling gas. The first injection unit 451 may spray a cooling gas toward the supply mechanism 100 supported by the first supply unit 41. The first injection unit 451 may receive a cooling gas from a cooling gas supply system (not shown). The first cooling unit 45 may include a plurality of first injection units 451.

As shown in FIG. 43, the first spray unit 451 may be installed in the loading unit 42 to be positioned on the supply mechanism 100. The first spraying unit 451 may be installed in the loading vision unit 423 to be positioned on the first supply unit 41. The loading vision unit 423 may include a loading illumination device 4231 for irradiating light to the first pick-up position PP1, and the first injection unit 451 may include the loading illumination device ( 4231). The first injection unit 451 may cool the supply mechanism 100 by spraying a cooling gas onto the supply mechanism 100 from the supply mechanism 100. The first injection unit 451 may cool the supply member 102 by spraying a cooling gas toward the supply member 102. The first injection unit 451 may spray a cooling gas toward the first pick-up position PP1.

As shown in FIG. 44, the first injection unit 451 may be installed in the first supply unit 41 to be positioned below the supply mechanism 100. The first spray unit 451 may be installed in the first supply support device 412 to be positioned below the first supply body 411. The first spraying unit 451 may be installed in the first elevating member 4121. The first injection unit 451 may cool the supply mechanism 100 by spraying a cooling gas under the supply mechanism 100 toward the supply mechanism 100. The first injection unit 451 may cool the supply member 102 by spraying a cooling gas toward the supply member 102. The first injection unit 451 injects a cooling gas around a portion in which the LED chip picked up by the loading unit 42 is located in the supply member 102, thereby causing the loading unit ( 42), the portion having the LED chip to be picked up in the next order can be cooled.

As shown in FIG. 45, the first cooling unit 45 is installed on the loading vision unit 423 so as to be positioned on the first supply unit 41 and the first upper injection unit 4511 and the first. It may include a first lower injection unit (4512) installed in the first supply support device 412 to be positioned below the supply body 411.

The first upper side injection unit 4511 may cool the supply mechanism 100 by injecting a cooling gas onto the supply mechanism 100 from the supply mechanism 100. The first upper side injection unit 4511 may cool the supply member 102 by spraying a cooling gas toward the supply member 102. The first upper side injection unit 451 may spray a cooling gas toward the first pick-up position PP1.

The first lower injection unit 4512 may cool the supply mechanism 100 by spraying a cooling gas under the supply mechanism 100 toward the supply mechanism 100. The first lower injection unit 4512 may cool the supply member 102 by spraying a cooling gas toward the supply member 102. The first lower injection unit 4512 sprays a cooling gas around a portion of the supply member 102 where the LED chip is picked up by the loading unit 42, thereby supplying the loading unit to the loading unit 102. By 42, the portion with the LED chip to be picked up in the next order can be cooled.

Although not shown, the first cooling unit 45 according to the modified embodiment of the present invention cools the first supply support device 412 in contact with the supply mechanism 100 at the first pick-up position PP1. As a result, the supply mechanism 100 that is in contact with the first supply support device 412 may be cooled.

The first cooling unit 45 may cool the supply member 102 in contact with the first elevating member 4121 by cooling the first elevating member 4121. The first cooling unit 45 may cool the first elevating member 4121 by circulating a cooling fluid inside the first elevating member 4121. In this case, the first elevating member 4121 may include a flow path through which the cooling fluid is moved. The first cooling unit 45 may cool the first elevating member 4121 by using a thermoelectric element.

<1st correction unit>

As described above, the LED chip positioned at the test position TP may not always be seated at the same position in the seating member 21. When the LED chip is loaded on the seating member 21 in the loading position LP may not be seated in a certain position, the centrifugal force when the LED chip is moved from the loading position LP to the test position TP This is because the state seated on the seating member 21 by being moved or rotated by the back may be changed. In such a case, in order to perform an accurate test, the LED chip sorting apparatus 1 according to the present invention may further include the following configuration.

46 is a schematic plan view of a supply unit according to a modified embodiment of the present invention, and FIGS. 47 and 48 are schematic perspective views showing an operation relationship of the first calibration unit.

14, 34, 46, and 48, the LED chip sorting apparatus 1 according to the present invention may further include a first correction unit 5.

The first compensation unit 5 is installed between the loading unit 4 and the test unit 3, and the LED chip is mounted on the seating member 21 in a state in which an LED chip can be tested at the test position TP. The state of the LED chip mounted on the seating member 21 is corrected to be seated. Accordingly, the LED chip sorting apparatus 1 according to the present invention can accurately test the performance of the LED chip.

The LED chip includes pads P1 and P2. Electrical characteristics may be tested and light may be emitted only when the contact pins 321 are in contact with the pads P1 and P2. The first compensation unit 5 may correct the state of the LED chip such that the pads P1 and P2 are positioned at positions where the pads P1 and P2 may be in contact with the contact pins 321.

The first correction unit 5 may correct the state of the LED chip by rotating the LED chip mounted on the seating member 21. The first compensation unit 5 may correct the state of the LED chip by moving the LED chip mounted on the seating member 21.

The first calibration unit 5 may correct a state of the LED chip seated on the seating member 21 positioned at the first calibration position CP1 between the loading position LP and the test position TP. Can be. In this case, the seating members 21 may be simultaneously positioned at least one at the loading position LP, the first correction position CP1, the test position TP, and the unloading position ULP. It may be installed on the rotating member (22). The mounting unit 21 is sequentially positioned at each of the loading position LP, the first correction position CP1, the test position TP, and the unloading position ULP. The rotating member 22 can be rotated so as to.

The first correction unit 5 may include a first correction mechanism 51 and a first operating mechanism 52. The first correction mechanism 51 includes a first correction member 511 and a second correction member 512.

The first compensation member 511 is in contact with one side of the LED chip when the state in which the LED chip is seated on the seating member 21 is corrected. The first compensation member 511 may be moved closer to or farther from the second compensation member 512 by the first operating mechanism 52.

When the first compensation member 511 is moved closer to the second compensation member 512 by the first operating mechanism 52, the first compensation member 511 is seated on the seating member 21. One side of the LED chip is in contact, and one side of the LED chip may be pushed and moved until the other side of the LED chip contacts the second compensation member 512.

The second compensation member 512 is in contact with the other side of the LED chip when the state in which the LED chip is seated on the seating member 21 is corrected. The second compensation member 512 may be moved closer to or farther from the first compensation member 511 by the first operating mechanism 52.

When the second correction member 512 is moved closer to the first correction member 511 by the first operating mechanism 52, the second correction member 512 is seated on the seating member 21. The other side of the LED chip is brought into contact with each other, and the other side of the LED chip may be pushed and moved until one side of the LED chip is in contact with the first compensation member 511.

The first compensation member 511 and the second compensation member 512 are based on the LED chip positioned at the first compensation position CP1, and the first compensation member 511 is connected to the LED chip. It may be located inside, and the second compensation member 512 may be located outside the LED chip. That is, as shown in FIG. 46, the first calibrating member 511 may move closer to or farther from the second calibrating member 512 in a state located inside the LED chip, and the second calibrating member may move away from the second calibrating member 512. The member 512 may be moved near or away from the first compensation member 511 in a state located outside the LED chip.

Accordingly, when the first compensation member 511 and the second compensation member 512 are moved away from each other, even if the seating members 21 are rotated according to the rotation of the rotation member 22, the first compensation member 511 is rotated. The possibility of collision between the member 511 and the second compensation member 512 and the LED chip can be reduced.

The first calibrating member 511 and the second calibrating member 512 may be coupled to the first calibrating body 51a in a first direction (N arrow direction) to be movable.

The first operating mechanism 52 includes the first compensation member 511 and the second compensation member such that the first compensation member 511 and the second compensation member 512 are closer to or farther away from the LED chip. 512). The LED chip is mounted on the seating member 21 positioned at the first correction position CP1.

The first operating mechanism 52 may be configured such that the first compensation member 511 is in contact with the first compensation member 511 until the first compensation member 511 contacts one side of the LED chip and the second compensation member 512 contacts the other side of the LED chip. 511 and the second compensation member 512 may be moved. When the first compensation member 511 is in contact with one side of the LED chip and the second compensation member 512 is in contact with the other side of the LED chip, the LED chip is pad (P1, P2) to the contact pin 321 It can be corrected to a state that can be contacted. In this process, the LED chip can be rotated and moved in a state seated on the seating member 21.

The first operating mechanism 52 is a direction perpendicular to the first direction from the first motor 521, the first cam member 522 rotated by the first motor 521, and the first correction body 51a. It may include a first moving body 523 movably coupled in the direction (O arrow). The first moving body 523 may include a first cam surface 5231 to which the first compensation member 511 contacts and a second cam surface 5302 to which the second compensation member 512 contacts. The first cam surface 5231 and the second cam surface 5252 may be inclined in directions opposite to each other.

When the first motor 521 rotates the first cam member 522, the first moving body 523 is perpendicular to the first direction according to the angle at which the first cam member 522 is rotated. Direction (O arrow direction). As the first moving body 523 is moved, the first calibrating member 511 may move along the first cam surface 5231, and the second calibrating member 512 may be moved to the second cam surface ( 5232).

When the first moving body 523 is moved toward the direction in which the first correction mechanism 51 is installed, as shown in FIG. 48, the first correction member 511 and the second correction member 512 are mutually opposite. It can be moved closer. That is, the first compensation member 511 and the second compensation member 512 may be moved closer to the LED chip.

When the first moving body 523 is moved in a direction opposite to the direction in which the first correction mechanism 51 is installed, as shown in FIG. 47, the first correction member 511 and the second correction member ( 512 may be moved away from each other. That is, the first compensation member 511 and the second compensation member 512 may be moved away from the LED chip.

The first operating mechanism 52, the first compensation member 511 so that the first compensation member 511 and the second compensation member 512 away from each other when the rotating member 22 is rotated. And the second correction member 512 may be moved. Accordingly, it is possible to reduce the possibility that the LED chip or the mounting member 21 collides with the first compensation member 511 and the second compensation member 512.

Although not shown, the first compensation unit 5 may be lifted up and down by the first lifting device. The first elevating device may raise the first compensation unit 5 when the rotating member 22 is rotated. Accordingly, when the rotary member 22 is rotated, it is possible to reduce the possibility that the LED chip or the seating member 21 collides with the first correction mechanism 51. The first lifting device may lower the first compensation unit 5 when the rotating member 22 is stopped and the seating member 21 is positioned at the first compensation position CP1.

In this case, regardless of the position where the first compensation member 511 and the second compensation member 512 are installed, the LED chip or seating member 21 is the first chip when the rotating member 22 is rotated. It is possible not to collide with the correction mechanism 51. That is, even if the first compensation member 511 and the second compensation member 512 are installed to be positioned on the path in which the seating members 21 are moved in accordance with the rotation of the rotating member 22, LED chip or The seating member 21 may be prevented from colliding with the first correction mechanism 51.

The first elevating device may elevate the first compensation unit 5 by using a hydraulic cylinder or a pneumatic cylinder. The first lifting device may lift and lower the first compensation unit 5 by using a motor and a coupling mechanism coupled to the motor and the first compensation unit 5, respectively. The connecting mechanism may include a pulley and a belt, a ball screw, a cam member, and the like.

In this case, when the first compensation member 511 and the second compensation member 512 are located on a path in which the seating members 21 are moved, an LED may be mounted when the rotating member 22 is rotated. In order not to collide with the first correction mechanism 51, the first correction unit 5 should be raised by the first lifting device. In addition, in order for the first correction unit 5 to correct the state of the LED chip, the first correction unit 5 should be lowered to the second lifting device.

In order to eliminate the additional work time caused by the addition of this operation, the first correction member 511 and the second correction member 512, as described above, is located in the first correction position (CP1) The first compensation member 511 may be located inside the LED chip, and the second compensation member 512 may be located outside the LED chip based on the LED chip.

Accordingly, when the first compensation member 511 and the second compensation member 512 are moved away from each other without generating additional working time, the seating member (according to the rotation of the rotating member 22) Even when the 21 is rotated, the LED chip may not collide with the first compensation member 511 and the second compensation member 512. In addition, since the first lifting device is not provided, it is possible to reduce the manufacturing cost.

1 to 48, the LED chip sorting apparatus 1 according to the present invention may selectively include any one of the first compensating member 511 and the contact rotating mechanism 345. It may include both the first compensation member 511 and the contact rotating mechanism 345.

<First sensing unit>

46 to 48, the LED chip sorting apparatus 1 according to the present invention may further include a first sensing unit 6.

The first sensing unit 6 checks a state in which the LED chip is seated on the seating member 21 positioned at the first correction position CP1. The first sensing unit 6 may check the position where the LED chip is seated on the seating member 21. A CCD camera may be used as the first sensing unit 6.

The first sensing unit 6 is installed to be positioned on the first correction mechanism 51, and the LED chip corrected by the first correction mechanism 51 is seated on the seating member 21. You can check it. The first sensing unit 6 may be installed in the first correction body 51a.

1 to 48, the contact movement mechanism 344 is a position where the contact pin 321 may contact the LED chip from the state information of the LED chip acquired by the first sensing unit 6. The contact unit 32 can be moved. Accordingly, the LED chip sorting apparatus 1 according to the present invention can accurately test the performance of the LED chip. The contact unit 32 may be moved in the X-axis direction and the Y-axis direction by the contact movement mechanism 344 so that the contact pin 321 may be in contact with the LED chip. The contact unit 32 may be rotated by the contact movement mechanism 344 so that the contact pin 321 may be in contact with the LED chip.

Although not shown, the first sensing unit 6 has an LED chip seated on a seating member 21 positioned at a first sensing position between the first calibration position CP1 and the test position TP. You can check.

In this case, the rotary unit 33 is seated at each of the loading position LP, the first correction position CP1, the first sensing position, the test position TP, and the unloading position ULP. The rotating member 22 may be rotated to sequentially position the members 21.

The seating members 21 may be simultaneously positioned at least one at the loading position LP, the first correction position CP1, the first sensing position, the test position TP, and the unloading position ULP. It may be installed on the rotating member 22 to be.

<2nd correction unit>

Referring to FIGS. 34 and 46, the LED chip is mounted on the seating member in a process of being tested by the test unit 3 or moving from the test position TP to the unloading position ULP after completion of the test. The state seated at 21 can be changed. In this case, the LED chip sorting apparatus 1 according to the present invention may be configured so that the unloading unit 9 can accurately unload the LED chip from the seating member 21 positioned at the unloading position ULP. It may further include a correction unit.

FIG. 49 is a schematic plan view of a supply unit according to a modified embodiment of the present invention, and FIGS. 50 and 51 are schematic perspective views showing an operation relationship of the second correction unit.

34 and 49 to 51, the second compensation unit 7 is installed between the test unit 3 and the unloading unit 9, and an LED chip is placed in the unloading position ULP. The state of the LED chip seated on the seating member 21 is corrected to be seated on the seating member 21 in a state that can be unloaded. Accordingly, the unloading part 9 can accurately unload the LED chip from the seating member 21.

The second correction unit 7 may correct the state of the LED chip by rotating the LED chip mounted on the seating member 21. The second correction unit 7 may correct the state of the LED chip by moving the LED chip mounted on the seating member 21.

The second correction unit 7 corrects the state of the LED chip seated on the seating member 21 positioned at the second correction position CP2 between the test position TP and the unloading position ULP. can do. In this case, the seating members 21 may have the loading position LP, the first correction position CP1, the test position TP, the second correction position CP2, and the unloading position ULP. ) May be installed on the rotating member 22 so that at least one at a time may be simultaneously positioned. The rotating unit 33 may be disposed at each of the loading position LP, the first correction position CP1, the test position TP, the second correction position CP2, and the unloading position ULP. The rotating member 22 may be rotated so that the seating members 21 may be sequentially positioned.

The second correction unit 7 may include a second correction mechanism 71 and a second operation mechanism 72. The second correction mechanism 71 includes a third correction member 711 and a fourth correction member 712.

The third compensation member 711 is in contact with one side of the LED chip when the state in which the LED chip is seated on the seating member 21 is corrected. The third compensation member 711 may be moved closer or farther from the fourth compensation member 712 by the second operating mechanism 72.

When the third compensation member 711 is moved closer to the fourth compensation member 712 by the second operating mechanism 72, the third compensation member 711 is seated on the seating member 21. One side of the LED chip is brought into contact with each other, and one side of the LED chip may be pushed and moved until the other side of the LED chip contacts the fourth compensation member 712.

The fourth compensation member 712 is in contact with the other side of the LED chip when the state in which the LED chip is seated on the seating member 21 is corrected. The fourth compensation member 712 may be moved closer or farther from the third compensation member 711 by the second operating mechanism 72.

When the fourth compensation member 712 is moved closer to the third compensation member 711 by the second operating mechanism 72, the fourth compensation member 712 is secured to the seating member 21. The other side of the LED chip is in contact with each other, and the other side of the LED chip can be pushed and moved until one side of the LED chip is in contact with the third compensation member 711.

The third compensation member 711 and the fourth compensation member 712 are based on the LED chip positioned at the second compensation position CP2, and the third compensation member 711 is connected to the LED chip. It may be located inside, and the fourth compensation member 512 may be located outside the LED chip. That is, as shown in FIG. 49, the third compensation member 711 may be moved closer to or farther from the fourth compensation member 712 in a state located inside the LED chip. The member 712 may be moved closer to or away from the third compensation member 711 in a state located outside the LED chip.

Accordingly, when the third compensation member 711 and the fourth compensation member 712 are moved away from each other, even if the seating members 21 are rotated according to the rotation of the rotation member 22, the third compensation. The possibility of collision between the member 711 and the fourth compensation member 712 and the LED chip can be reduced.

The third compensation member 711 and the fourth compensation member 712 may be coupled to the second compensation body 71a so as to be movable in a second direction (P arrow direction).

The second operating mechanism 72 has the third compensation member 711 and the fourth compensation member 712 so that the third compensation member 711 and the fourth compensation member 712 are closer to or farther away from the LED chip. Move). The LED chip is mounted on a seating member 21 positioned at the second correction position CP2.

The second operating mechanism 72 may be configured such that the third compensation member 711 is in contact with the third compensation member 711 until the third compensation member 711 contacts one side of the LED chip and the fourth compensation member 712 contacts the other side of the LED chip. 711 and the fourth compensation member 712 may be moved. When the third compensation member 711 is in contact with one side of the LED chip and the fourth compensation member 712 is in contact with the other side of the LED chip, the LED chip can be correctly unloaded by the unloading unit 9. Can be corrected. In this process, the LED chip can be rotated and moved in a state seated on the seating member 21.

The second operating mechanism 72 is a direction perpendicular to the second direction in the second motor 721, the second cam member 722 rotated by the second motor 721, and the second correction body 71a. It may include a second moving body 723 is movably coupled in the (Q arrow direction). The second movable body 723 may include a third cam surface 7221 to which the third correction member 711 is in contact, and a fourth cam surface 7222 to which the fourth correction member 712 is in contact. The third cam surface 7221 and the fourth cam surface 7222 may be formed to be inclined in opposite directions to each other.

When the second motor 721 rotates the second cam member 722, the second moving body 723 is perpendicular to the second direction according to the angle at which the second cam member 722 is rotated. Direction (Q arrow direction). As the second moving body 723 is moved, the third calibrating member 711 may be moved along the third cam surface 7181, and the fourth calibrating member 712 may be moved to the fourth cam surface ( 7232).

When the second moving body 723 is moved toward the direction in which the second correction mechanism 71 is installed, as shown in FIG. 51, the third correction member 711 and the fourth correction member 712 are mutually opposite. It can be moved closer. That is, the third compensation member 711 and the fourth compensation member 712 may be moved closer to the LED chip.

When the second movable body 723 is moved in a direction opposite to the direction in which the second correction mechanism 71 is installed, as shown in FIG. 50, the third correction member 711 and the fourth correction member ( 712 may be moved away from each other. That is, the third compensation member 711 and the fourth compensation member 712 may be moved away from the LED chip.

The second operating mechanism 72 may include the third compensation member 711 so that the third compensation member 711 and the fourth compensation member 712 are separated from each other when the rotation member 22 is rotated. And the fourth compensation member 712 may be moved. Accordingly, the possibility that the LED chip or the mounting member 21 collides with the third compensation member 711 and the fourth compensation member 712 can be reduced.

Although not shown, the second correction unit 7 may be lifted up and down by a second lifting device. The second elevating device may raise the second correction unit 7 when the rotating member 22 is rotated. Accordingly, when the rotating member 22 is rotated, it is possible to reduce the possibility that the LED chip or the seating member 21 collides with the second correction mechanism 71. The second lifting device may lower the second compensation unit 7 when the rotating member 22 is stopped and the seating member 21 is positioned at the second compensation position CP2.

The second lifting device may lift up and down the second correction unit 7 by using a hydraulic cylinder or a pneumatic cylinder. The second lifting device may lift and lower the second compensation unit 7 using a motor and a coupling mechanism coupled to the motor and the second compensation unit 7, respectively. The connecting mechanism may include a pulley and a belt, a ball screw, a cam member, and the like.

In this case, regardless of the position where the third compensation member 711 and the fourth compensation member 712 are installed, the LED chip or seating member 21 is the second chip when the rotating member 22 is rotated. The collision with the correction mechanism 71 can be prevented. That is, even if the third compensation member 711 and the fourth compensation member 712 is installed to be positioned on the path in which the seating members 21 are moved in accordance with the rotation of the rotary member 22, LED chip or The seating member 21 may be prevented from colliding with the second correction mechanism 71.

In this case, when the third compensation member 711 and the fourth compensation member 712 are located on a path along which the seating members 21 are moved, an LED may be used when the rotating member 22 is rotated. In order not to collide with the second correction mechanism 71, the second correction unit 7 must be raised by the second lifting device. In addition, in order for the second correction unit 7 to correct the state of the LED chip, the second correction unit 7 should be lowered to the second lifting device.

In order to eliminate the additional work time caused by the addition of this operation, the third correction member 711 and the fourth correction member 712, as described above, is located in the second correction position (CP2) Based on the LED chip, the third compensation member 711 may be located inside the LED chip, and the fourth compensation member 712 may be located outside the LED chip.

Accordingly, when the third compensation member 711 and the fourth compensation member 712 are moved away from each other without generating additional working time, the seating member (according to the rotation of the rotating member 22) Even if the 21 is rotated, the LED chip may not collide with the third compensation member 711 and the fourth compensation member 712. In addition, since the second lifting device is not provided, it is possible to reduce the manufacturing cost.

<2nd detection unit>

34 and 49 to 51, the LED chip sorting apparatus 1 according to the present invention may further include a second sensing unit 8.

The second sensing unit 8 checks a state in which the LED chip is seated on the seating member 21 positioned at the second correction position CP2. The second sensing unit 8 may check the position and the degree of rotation of the LED chip is seated on the seating member 21. A CCD camera may be used as the second sensing unit 8.

The second sensing unit 8 is installed so as to be positioned on the second correction mechanism 71, and the LED chip corrected by the second correction mechanism 71 is seated on the seating member 21. You can check it. The second sensing unit 8 may be installed in the second correction body 71a.

When the LED chip sorting apparatus 1 according to the present invention includes the second sensing unit 8, the unloading unit 9 uses the state information of the chip acquired by the second sensing unit 8. The LED chip can be accurately unloaded from the mounting member 21 positioned at the unloading position ULP.

Although not shown, an LED chip is mounted on the seating member 21 positioned at a second sensing position between the second correcting position CP2 and the unloading position ULP. You can check the status. The second sensing unit 8 may check the position and the degree of rotation of the LED chip is seated on the seating member 21.

In this case, the rotation unit 33 includes the loading position LP, the first correction position CP1, the first detection position, the test position TP, the second correction position CP2, and the second position. The rotating member 22 may be rotated such that the seating members 21 are sequentially positioned at the sensing position and the unloading position ULP, respectively.

The seating members 21 may include the loading position LP, the first correction position CP1, the first sensing position, the test position TP, the second correction position CP2, the second sensing position, And at least one of the rotating members 22 in the unloading position ULP at the same time.

<Unloading section 9>

34 and 46, the unloading unit 9 unloads an LED chip from the mounting member 21 positioned at the unloading position ULP. Here, the LED chip classification apparatus according to the present invention includes an unloading unit 9 largely divided into three embodiments, which will be described sequentially with reference to the accompanying drawings for each embodiment.

First Embodiment

52 is a schematic perspective view of the unloading unit, FIG. 53 is a schematic perspective view of the first storage mechanism and the first storage unit, FIG. 54 is a schematic perspective view of the second storage unit, and FIG. 55 is a schematic view of the second transfer unit. Perspective view.

34, 46, and 52 to 55, the unloading unit 9 may include a buffer unit 91 installed next to the test unit 3.

The buffer unit 91 may use a first storage mechanism 200 that supports a plurality of tested LED chips.

The first housing 200 includes a first housing 201 having a hollow portion (not shown) and a first storage member 202 on which the tested LED chips are located and coupled to the first housing 201. It may include. The first receiving member 202 may be a tape having an adhesive material. The tested LED chips may be attached to an upper surface of the first housing member 202. The first housing member 202 may be a blue tape.

The first housing 201 may be formed in a rectangular shape as a whole. The first housing 201 may include the hollow part (not shown) which is formed in a rectangular shape as a whole. Although not shown, the first housing 201 and the hollow part (not shown) may be formed in a disc shape. The first housing 201 and the hollow portion (not shown) may be formed in other shapes, such as an elliptical disc shape.

Although not shown, the buffer unit 91 may use the first storage device 200 having a plurality of receiving grooves in which the tested LED chips are stored.

34, 46, and 52 to 55, the buffer unit 91 may include an unloading unit 911, a first storage unit 912, a second storage unit 913, and a second transfer. Unit 914 may be included.

The unloading unit 911 performs an unloading process of picking up the tested LED chip from the seating member 21 located at the unloading position ULP and transferring the tested LED chip to the first storage mechanism 200.

The unloading unit 911 may include an unloading rotary arm 9111 and an unloading driving unit 9112.

The unloading rotary arm 9111 is provided with an unloading picker 9111a capable of absorbing the tested LED chip. The unloading rotary arm 9111 may be lifted up and down by lifting means (not shown).

The unloading rotary arm 9111 is rotated by the unloading driving unit 9112 to reciprocate the unloading picker 9111a to be positioned above the unloading position ULP and the first storage mechanism 200. Can be moved. The unloading picker 9111a may be positioned on the first storage mechanism 200 positioned in the first storage unit 912.

The unloading unit 911 may include one unloading rotary arm 9111 and one unloading picker 9111a. In FIG. 52, the unloading rotary arm 9111 and the unloading picker 9111a are illustrated as three, but this is for indicating a reciprocating movement path of the unloading rotary arm 9111.

The unloading rotary arm 9111 is coupled to the unloading driving unit 9112. The unloading driving unit 9112 may rotate the unloading rotary arm 9111 such that the unloading picker 9111a is positioned on the unloading position ULP or the first storage mechanism 200.

Although not shown, the unloading unit 911 may include a plurality of unloading rotary arms 9111 and a plurality of unloading pickers 9111a respectively coupled to the unloading rotary arms 9111. The unloading driving unit 9112 rotates the unloading rotary arms 9111 about a rotation axis (not shown), and any one of the unloading pickers 9111a is positioned at the unloading position ULP. One of the unloading pickers 9111a may be positioned on the first storage device 200. The unloading driving unit 9112 may sequentially position the unloading pickers 9111a on the unloading position ULP and the first storage mechanism 200.

The unloading driving unit 9112 may include a motor, and may further include a pulley and a belt if the motor and the unloading rotary arm 9111 are spaced apart by a predetermined distance.

The unloading unit 911 is configured to mount the tested LED chips to the seating member 21 such that the LED chips are positioned in the first storage device 200 in the same configuration as the LED chips are supported by the supply device 100. In the first storage mechanism 200 can be transferred to.

34, 46, and 52 to 55, the first storage unit 912 is the first storage mechanism 200 in a position where the unloading unit 911 can place the tested LED chip. ) Moves the first storage mechanism 200 to be positioned.

The first storage unit 912 may include a first storage body 9121, a second alignment unit 9222, and a second moving unit 9223.

The first housing body 9121 supports the bottom surface of the first storage mechanism 200. The first housing body 9121 may be moved in the X-axis direction and the Y-axis direction by the second moving unit 9223. As the first storage body 9121 moves, the first storage mechanism 200 may be moved to a position where the unloading unit 911 may place the tested LED chip.

The first receiving body 9121 may be moved in the X-axis direction and the Y-axis direction by the second moving unit 9223, and may be rotated. As the first storage body 9121 moves and rotates, the unloading unit 911 may be placed on the first storage device 200 such that all of the tested LED chips face the same direction.

A second support device 9121a may be installed in the first housing body 9121. The first storage body 9121 may include a first storage space 9121b on which the second support device 9121a may be installed. The second support device 9121a may support the bottom surface of the tested LED chip placed by the unloading unit 22 on the first storage device 200. The second support device 9121a may support a bottom surface of the first storage member 202 under the first storage mechanism 200. The second support device 9121a may be lifted up and down by lifting means (not shown).

The first receiving body 9121 may include a first receiving groove 9121c. The first storage passage groove 9121c may be formed by recessing a predetermined depth from an upper surface of the first storage body 9121. The first housing body 9121 may include a plurality of first storage passageways 9121c. The second transfer unit 914 may pass through the first storage passage 9121c to position the first storage mechanism 200 in the first storage body 9121.

34, 46, and 52 to 55, the second alignment unit 9222 aligns positions of the first storage mechanism 200 supported by the first storage body 9121. The second alignment unit 9222 includes a second fixing member 9222a, a second moving member 9922b, a second moving mechanism 9222c, and a second lifting mechanism 9922d.

The second fixing member 9922a is installed in the first housing body 9121 to determine the position of the first storage mechanism 200. The second fixing member 9922a may be coupled to the first housing body 9121 so as to protrude upward from a top surface of the first housing body 9121 for a predetermined length. The first storage mechanism 200 may be aligned by contact with the second fixing member 9922a. The second alignment unit 9222 may include a plurality of second fixing members 9922a.

The second moving member 9222b may be coupled to the second moving mechanism 9222c and may be moved by the second moving mechanism 9922c. The second moving member 9222b may be coupled to the second moving mechanism 9922c to protrude a predetermined length upward from an upper surface of the first housing body 9121. The second moving member 9222b may be positioned at a position opposite to the position where the second fixing member 9222a is installed in the first housing body 9121. The second alignment unit 9222 may include a plurality of second moving members 9222b.

The second moving member 9222b may be moved closer to or farther from the second fixing member 9922a by the second moving mechanism 9222c. When the second moving member 9222b is moved closer to the second fixing member 9922a, the first receiving mechanism 200 is pushed by the second moving member 9922b to allow the second fixing member 9922a to be moved. ) May be contacted. Accordingly, the first storage device 200 may be aligned in position.

The second moving mechanism 9222c may be coupled to the first housing body 9121, and move the second eastern member 9922b. The second moving mechanism 9222c may move the second moving member 9222b until the first receiving mechanism 200 contacts the second fixing member 9922a. The second moving mechanism 9222c may move the second moving member 9122b by using a hydraulic cylinder or a pneumatic cylinder. The second moving mechanism 9222c may move the second moving member 9222b by a method using a pulley and a belt, a method using a ball screw, or a method using a cam member.

The second elevating mechanism 9222d may be coupled to the second moving mechanism 9922c. The second moving member 9922b may be coupled to the second lifting mechanism 9222d. Accordingly, the second elevating mechanism 9222d may be moved in the Y-axis direction by the second moving mechanism 9222c, and the second movable member 9922b may be raised and lowered.

When the second transfer unit 914 is moved toward the first storage body 9121 to position the first storage mechanism 200 on the first storage body 9121, the second lifting mechanism ( 9122d may lower the second moving member 9122b. Accordingly, the first storage mechanism 200 or the second transfer unit 914 may be prevented from colliding with the second moving member 9222b.

When the first storage mechanism 200 is positioned on the first storage body 9121, the second lifting mechanism 9222d may raise the second moving member 9922b. Thereafter, the second moving member 9222b may be moved by the second moving mechanism 9922c to align the position of the first storage mechanism 200.

When the second transfer unit 914 transfers the first storage device 200 supporting the tested LED chips from the first storage body 9121 to the second storage unit 913, the second power is increased. The lowering mechanism 9922d may lower the second moving member 9922b. Accordingly, the first storage mechanism 200 or the second transfer unit 914 may be prevented from colliding with the second moving member 9222b.

Referring to FIGS. 34, 46, and 52 to 55, the second moving unit 9123 may include the first storing mechanism 200 at a position where the unloading unit 911 may place the tested LED chip. ) May move the first housing body (9121). The second moving unit 9123 may move the first housing body 9121 in the X-axis direction and the Y-axis direction.

The second moving unit 9223 has a second upper member 9223a to which the first housing body 9121 is movably coupled and a second lower member to which the second upper member 9123a is movably coupled. 9123b).

The first housing body 9121 and the second upper member 9123a may be moved in a direction perpendicular to each other. When the second upper member 9123a is movably coupled to the second lower member 9123b in the X-axis direction, the first housing body 9121 is in the Y-axis direction with the second upper member 9123a. It can be movably coupled. When the second upper member 9123a is movably coupled to the second lower member 9123b in the Y-axis direction, the first housing body 9121 may be attached to the second upper member 9123a in the X-axis direction. It can be movably coupled.

The second moving unit 9223 is the first storage body 9121 and the cylinder method using a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member and the like. The second upper member 9323a may be moved.

The second moving unit 9123 may rotate the first housing body 9121. The second moving unit 9223 rotates the first housing body 9121 so that the unloading unit 911 can be placed on the first storage mechanism 200 so that all of the tested LED chips face the same direction. You can.

34, 46, and 52 to 55, the second storage unit 913 includes a second storage mechanism 9131 capable of storing a plurality of the first storage mechanisms 200.

The second storage mechanism 9131 may include a plurality of second storage members 9131a capable of supporting both bottom surfaces of the first storage mechanism 200. The second storage members 9131a may be formed in plurality in a vertical distance (Z-axis direction) at a predetermined distance. The space in which the second storage members 9131a are spaced apart from each other may be a second storage groove 9131b, and the first storage mechanisms 200 may be inserted.

34, 46, and 52 to 55, the second transfer unit 914 moves the first storage mechanism 200 from the second storage mechanism 9131 to the first storage body 9121. The first storage mechanism 200 may be transferred from the first storage body 9121 to the second storage mechanism 9131.

The second transfer unit 914 may transfer the empty first storage mechanism 200 from the second storage mechanism 9131 to the first storage body 9121. When the first storage device 200 positioned in the first storage body 9121 is filled with the tested LED chips, the second transfer unit 914 stores the first storage device 200 in the first storage device. The body 9121 may be transferred to the second storage mechanism 9131.

Therefore, the LED chip sorting apparatus 1 according to the present invention can automatically supply the first storage mechanisms 200 in which the tested LED chips are placed on the first storage body 9121. It can be used to eliminate the loss of work time caused by manual work.

The second transfer unit 914 may transfer the first storage mechanism 200 between the first storage unit 912 and the second storage mechanism 9131. The second transfer unit 914 includes a second transfer member 9141 and a second transfer mechanism 9142.

The second transfer member 9141 may hold the first storage mechanism 200. The second transfer member 9141 corresponds to each of the first holding member 2411, the second holding member 2412, the first driving mechanism 2413, and the first connecting body 2414. Since the description is made to include the approximately matching configuration, the description of these configurations will be omitted in order not to obscure the subject matter of the present invention.

The second transfer mechanism 9142 moves the second transfer member 9141 between the second storage mechanism 9131 and the first storage unit 912. The second transfer mechanism 9142 moves the second transfer member 9141 so that the empty first storage mechanism 200 is transferred from the second storage mechanism 9131 to the first storage body 9121. You can. The second transfer mechanism 9142 is configured to transfer the first storage mechanism 200 filled with the tested LED chips from the first storage body 9121 to the second storage mechanism 9131. 9141 can be moved.

The second transfer mechanism 9142 uses the second transfer member 9141 by a method using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. You can move it.

The second transfer mechanism 9142 may be coupled to the second gantry 9143. The second transfer member 9141 may move in the Y-axis direction along the second gantry 9143.

The first storage mechanism 200 may be stacked and stored in the vertical direction (Z-axis direction) in the second storage mechanism 9131. In this case, the second storage unit 913 may further include a second storage lift mechanism 9332.

The second storage elevating mechanism 9332 may raise and lower the second storage mechanism 9131. The second storage raising and lowering mechanism 9332 stores the second storage member 200 so that the first storage mechanism 200 is positioned at a position where the second transfer member 9141 can hold the first storage mechanism 200. The mechanism 9131 can be raised and lowered. The second storage raising and lowering mechanism 9332 lifts and lowers the second storage mechanism 9131 so that the second transfer member 9141 stores the first storage mechanism 200 in the storage mechanism 231. You can.

The second storage raising and lowering mechanism (9132) is the second storage mechanism (9131) by using a cylinder such as a hydraulic cylinder or pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. ) Can be raised and lowered.

In addition to the manner in which the second storage mechanism 9131 is raised and lowered by the second storage raising and lowering mechanism 9332, the second transfer member 9141 may be raised and lowered, and the second transfer member 9141 may be elevated. And both of the second storage mechanisms 9131 may be elevated.

The second storage lifting mechanism 9332 may include a second vertical body 9332a and a second lifting body 9332b. The second lifting body 9332b is coupled to the second vertical body 9132a to be capable of lifting up and down.

The second storage mechanism 9131 may be detachably coupled to the second lifting body 9332b. Accordingly, when only the first storage mechanisms 200 filled with the tested LED chips are stored in the second storage mechanism 9131, the second storage mechanism 9131 may be filled with empty first storage mechanisms 200. It may be replaced with a new second storage mechanism 9131 that is stored. Therefore, the replacement work is easy and the time taken for the replacement work can be reduced, thereby preventing the work time lost due to the replacement work.

When only the empty supply mechanisms 100 are stored in the first storage mechanism 231 as the loading process is completed, the first storage mechanism 231 may be used as the second storage mechanism 9131. Do.

Second Embodiment

56 is a schematic perspective view of an LED chip sorting apparatus including an unloading unit according to a modified embodiment of the present invention, FIG. 57 is a plan view of FIG. 56, and FIGS. 58 and 59 are views according to a modified embodiment of the present invention. 2 is a schematic perspective view of the storage unit, FIG. 60 is a schematic perspective view of the second transfer unit and a third transfer unit, FIG. 61 is a schematic perspective view of the first storage mechanism and the second supply unit, FIG. 62 is a side view of FIG. 63 is a schematic perspective view of a second supply body, a second supply support device, and a sorting unit, FIG. 64 is a schematic enlarged side cross-sectional view of a portion T of FIG. 63, FIG. 65 is a schematic perspective view of a sorting unit, FIG. 66 is a schematic perspective view of a second supply body, a second supply support device, a sorting unit, and a second cooling unit, and FIGS. 67 to 69 are views of FIG. 66 for a first cooling unit according to a modified embodiment of the present invention. 70 is a schematic enlarged side view of the U portion, and FIG. 70 is a schematic view of the second storage mechanism and the second storage unit. 71 is a schematic perspective view of a third storage unit, and FIG. 72 is a schematic perspective view of a fourth transfer unit.

56 to 72, the unloading part 9 according to the modified embodiment of the present invention includes a sorting part 92 installed next to the buffer part 91.

The sorting unit 92 may use a second storage mechanism 300 that supports a plurality of tested LED chips.

61 and 62, the second housing mechanism 300 includes a second housing 301 in which a hollow part (not shown) is formed, and tested LED chips are located in the second housing 301. It may include a second receiving member 302 is coupled. The second housing member 302 may be a tape having an adhesive material. The tested LED chips may be attached to an upper surface of the second housing member 302. The second housing member 302 may be a blue tape.

As illustrated in FIG. 61, the second housing 301 may be formed in a rectangular shape as a whole. The second housing 301 may include the hollow part (not shown) formed in a quadrangular shape as a whole. Although not shown, the second housing 301 and the hollow part (not shown) may be formed in other shapes, such as a disc shape, an elliptical disc shape, and the like.

Although not shown, the sorting unit 92 may use the second storage mechanism 300 having a plurality of storage grooves in which the tested LED chips are stored.

56 to 72, the sorting unit 92 classifies the tested LED chips supported by the first storage device 200 through the buffer unit 91 by grade according to a test result. It can be transferred to the two storage mechanism (300). The tested LED chip may be transferred to the second storage device 300 corresponding to the grade.

The sorting unit 92 may include a third transfer unit 921, a second supply unit 922, a sorting unit 923, a second storage unit 924, a third storage unit 925, and a fourth transfer unit. 926 may include.

56 to 61, when the unloading unit 9 according to the present invention includes the sorting unit 92, the second storage unit 913 may further include a mobile device 9133. have.

The moving device 9133 may move the second storage mechanism 9131 between the first position R and the second position S. FIG. The second storage mechanism 9131 may be movably coupled to the moving device 9133.

In the first position R, the second transfer unit 914 inserts the first storage mechanism 200 into the second storage mechanism 9131 or receives the first storage mechanism from the second storage mechanism 9131. It is a position where the mechanism 200 can be taken out.

In the second position S, the third transfer unit 921 inserts the first storage mechanism 200 into the second storage mechanism 9131 or receives the first storage mechanism from the second storage mechanism 9131. It is a position where the mechanism 200 can be taken out.

Accordingly, the LED chip sorting apparatus 1 according to the present invention utilizes the second storage unit 913, and the first storage mechanism 200 in which the LED chip tested through the buffer unit 91 is supported. May be automatically transferred to the sorting unit 91.

Although not shown, the first storage mechanism 200 on which the tested LED chip is supported via the buffer unit 91 may be manually transferred to the sorting unit 91, or automatically by using a separate transfer means. It can also be implemented to be transported. In contrast to this method, the method of utilizing the second storage unit 913 including the mobile device 9133 as described above has advantages in many aspects, such as material cost and shortening waiting time.

The moving device 9133 may move the second storage mechanism 9131 by a method using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. Can be. The second storage elevating mechanism 9332 may be coupled to the moving device 9133. The moving device 9133 may move the second storage mechanism 9131 by moving the second storage raising and lowering mechanism 9332.

Here, the sorting unit 92 is based on the second storage mechanism 300 located in the second storage unit 924, only the LED chips of a specific grade to be transferred to the second storage mechanism 300. First of all, the first storage device 200 may be transferred from the first storage device 200 to the second storage device 300. When only the LED chips other than the LED chip of the specific grade remain in the first storage mechanism 200 positioned in the second supply unit 922, the sorting unit 92 may be configured to connect the first storage mechanism 200 to the first storage mechanism 200. After the transfer to the second storage mechanism (9131), the other first storage mechanism 200 is transferred to the second supply unit 922 and only the LED chip of the specific grade continues to the first storage mechanism ( 200 may be transferred to the second storage mechanism 300.

That is, until the second storage mechanism 300 is filled with the LED chips of a specific grade, the sorting unit 92 stores the first storage mechanisms 200 stored in the second storage mechanism 9131. The second supply unit 922 may be sequentially located.

The sorting unit 92 is based on the first storage mechanism 200 located in the second supply unit 922, and the third storage unit 925 until the first storage mechanism 200 becomes empty. The second storage mechanism 300 stored in the) may be sequentially located in the second storage unit 924.

In the above operation, the operation of transferring the first storage mechanism 200 between the second storage mechanism 9131 and the second supply unit 922 may be performed by the third transfer unit 921. have.

The third transfer unit 921 may transfer the first storage mechanism 200 on which the tested LED chips are supported from the second storage mechanism 9131 to the second supply unit 922. When the work on the first storage mechanism 200 located in the second supply unit 922 is completed, the third transfer unit 921 transfers the first storage mechanism 200 to the second supply unit ( In 922, the second storage device 9131 may be transferred to the second storage mechanism 9131.

As described above, the sorting unit 92 classifies the tested LED chips supported by the first storage device 200 through the buffer unit 91 by grade according to a test result, so that the second storage device ( 300). Each of the tested LED chips may be transferred to the second storage device 300 corresponding to the class.

The third transfer unit 921 may transfer the first storage mechanism 200 between the second storage mechanism 9131 and the second supply unit 922. The third transfer unit 921 may transfer the first storage mechanism 200 from the second storage mechanism 9131 to the second supply unit 922, and in the second supply unit 922. The first storage mechanism 200 may be transferred to the second storage mechanism 9131. The third transfer unit 921 includes a third transfer member 9211 and a third transfer mechanism 9212.

The third transfer member 9211 may grip the first storage mechanism 200. The third transfer member 9211 corresponds to each of the first holding member 2411, the second holding member 2412, the first driving mechanism 2413, and the first connecting body 2414. Since the description is made to include the approximately matching configuration, the description of these configurations will be omitted in order not to obscure the subject matter of the present invention.

The third transfer mechanism 9212 moves the third transfer member 9211 between the second storage mechanism 9131 and the second supply unit 922.

The third transfer mechanism 9212 may move the third transfer member 9211 so that the first storage mechanism 200 is transferred from the second storage mechanism 9131 to the second supply unit 922. Can be. The third transfer mechanism 9212 may move the third transfer member 9211 so that the first storage mechanism 200 is transferred from the second supply unit 922 to the second storage mechanism 9131. Can be.

The third transfer mechanism 9212 uses the third transfer member 9211 by a method using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. You can move it.

The third transfer mechanism 9212 may be coupled to the third gantry 9213. The third transfer member 9211 may move in the Y-axis direction along the third gantry 9213. As illustrated in FIG. 60, the third gantry 9213 and the second gantry 9143 may be integrally formed. The third transfer mechanism 9212 and the second transfer mechanism 9142 may be installed to face each other.

56 to 65, the second supply unit 922 has the tested LED chip in a position where the sorting unit 923 can pick up the LED chip tested by the first storage device 200. The first storage mechanism 200 is moved so as to. 61 and 62, the first storage mechanism 200 is shown in a disk shape, but as described above, the first storage mechanism 200 formed in another shape such as a square shape may be used.

The second supply unit 922 may include a second supply body 9221, a second supply support device 9222, a third alignment unit 9223, and a third moving unit 9224.

The second supply body 9121 supports the bottom of the first storage mechanism 200. The second supply body 9221 may be moved in the X-axis direction and the Y-axis direction by the third moving unit 9224. As the second supply body 9221 moves, the first storage device 200 may be moved to a position where the tested LED chip can be picked up by the sorting unit 923.

The second supply body 9221 may be moved in the X-axis direction and the Y-axis direction by the third moving unit 9224, and may be rotated. In response to the movement and rotation of the second supply body 9221, when the sorting unit 923 picks up the tested LED chip, the first storage device 200 is in a state in which the tested LED chip faces the same direction. It may be moved to be picked up. Accordingly, the sorting unit 923 may be transferred to the second storage mechanism 300 while directing all of the tested LED chips to face the same direction.

The second supply body 9221 may include a second supply space 9221 a in which the second supply support device 9222 may be installed. The second supply body 9221 may include a second supply passage groove 9221b. The second supply passage groove 9221b may be formed by recessing a predetermined depth from an upper surface of the second supply body 9221. The second supply body 9221 may include a plurality of second supply passage grooves 9221b. The third transfer unit 921 may pass through the second supply passage groove 9121b to position the first receiving mechanism 200 on the second supply body 9221.

The second supply support device 9222 may support the bottom surface of the tested LED chip picked up by the sorting unit 923. The first housing 200 has the first housing 201 supported by the second supply body 9221, and the first housing member 202 supported by the second supply support device 9222. Can be. The second supply support device 9222 may support the bottom surface of the first storage member 202 under the second pick-up position PP2. The second pick-up position PP2 is a position at which the sorting unit 923 can pick up the tested LED chip from the first storage mechanism 200. The second supply support device 9222 may be installed to be located in the second supply space 9121a.

The second supply support device 9222 may include a second lifting member 9222a, a second lifting device 9222b, a second support pin 9222c, and a second pin lifting device 9222d. .

The second lifting member 9222a may support a bottom surface of the first storage member 202 under the second pick-up position PP2. The second elevating member 9222a may be coupled to the second elevating device 9222b and may be elevated by the second elevating device 9222b. The second elevating member 9222a may be elongated in the vertical direction (Z-axis direction) and may be formed in a cylindrical rod shape as a whole.

The second support pin 9222c is coupled to the inside of the second elevating member 9222a so that the elevating member can be elevated. The second lifting member 9222a is formed with a second through-hole 9222e through which the second support pin 9222c may pass so that the second support pin 9222c may protrude upward. have.

The second elevating device 9222b may elevate the second elevating member 9222a. The second lifting device when the first storage device 200 is positioned on the second supply body 9221 or when the first storage device 200 is removed from the second supply body 9221. 9222b may lower the second elevating member 9222a. When the second elevating device 9222b lowers the second elevating member 9222a, the second elevating member 9222a may be spaced apart from the first storage member 202. When the first storage mechanism 200 is positioned on the second supply body 9221, the second lifting device 9222b may raise the second lifting member 9222a. When the second elevating device 9222b raises the second elevating member 9222a, the second elevating member 9222a may support the bottom surface of the first storage member 202.

The second elevating device 9222b is the second elevating member 9222a by using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. ) Can be raised and lowered.

The second support pin 9222c may be coupled to the inner side of the second elevating member 9222a to be elevated, and may be elevated by the second pin elevating device 9222d. The second support pin 9222c may be coupled to the second pin elevating device 9222d. The second support pin 9222c may be elongated in the vertical direction (Z-axis direction) and may be formed in a conical shape as a whole.

The second pin elevating device 9222d may elevate the second support pin 9222c. The second pin elevating device 9222d may raise the second support pin 9222c when the sorting unit 923 picks up the LED chip located at the second pick-up position PP2. Accordingly, the second support pin 9222c may protrude upward from the second elevating member 9222a through the second through hole 9222e, and the LED chip picked up by the sorting unit 923. Can be pushed upwards. Therefore, the sorting unit 923 can be easily picked up the tested LED chip. When the sorting unit 923 picks up the tested LED chip, the second pin elevating device 9222d may allow the second support pin 9222c to be positioned inside the second elevating member 9222a. The support pin 9222c can be lowered.

The second pin elevating device 9222d may include the second support pin 9222c by a method using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. ) Can be raised and lowered.

Here, the first storage member 202 may include a tape having an adhesive material, such as blue tape. In this case, the first storage member 202 may not be maintained in a horizontal state due to thermal expansion in a high temperature environment higher than room temperature, and thus the LED chip tested according to the degree of thermal expansion of the first storage member 202. The location of this can be changed. Accordingly, the sorting unit 923 may not accurately pick up the tested LED chip from the first storage member 202.

In a modified embodiment of the present invention, the sorting unit 923 can accurately pick up the tested LED chip from the first storage member 202 regardless of the degree of thermal expansion of the first storage member 202. Accordingly, the second supply support device 9222 may include a support mechanism 9222f and a support lift device 9222g.

The support mechanism 9222f is coupled to the support lift device 9222g. The support mechanism 9222f may be installed on the second supply body 9221 to be positioned below the first storage mechanism 200. The second supply support device 9222 may include a plurality of support mechanisms 9222f, and may include at least two support mechanisms 9222f.

The support mechanisms 9222f are lifted up and down by the support lifting device 9222g, and may push upward the outside of the area where the LED chips tested by the first storage member 202 are located. The support mechanism 9222f may be elongated in the vertical direction (Z-axis direction) and may be formed in a 'b' shape as a whole.

The support raising and lowering device 9222g can raise and lower the support mechanism 9222f. The second supply support device 9222 may include a plurality of support lift devices 9222g, and may include the same number of support lift devices 9222g as the support mechanism 9222f. The support mechanisms 9222f may be coupled to the support elevating devices 9222g, respectively. The support elevating device 9222g may raise and lower the support mechanism 9222f so that the first storage member 202 protrudes above the supply body 9221.

When the support elevating device 9222g raises the support mechanism 9222f, the support mechanism 9222f may push upward the outside of the area where the LED chips tested by the first storage member 202 are located. Accordingly, the first storage member 202 may be pulled by the support mechanisms 9222f while protruding upward from the supply body 9221, and a predetermined tension acts on the first storage member 202. While the area of the LED chip tested in the first housing member 202 can be maintained in a horizontal state. Therefore, regardless of the degree of thermal expansion of the first storage member 202, the sorting picker 923 can accurately pick up the tested LED chip from the first storage mechanism (200).

When the support elevating device 9222g lowers the support mechanism 9222f, the support mechanism 9222f may be spaced apart from the first storage member 202. Accordingly, the third transfer unit 921 may position the first receiving mechanism 200 on the second supply body 9221 without being disturbed by the support mechanism 9222f. The first receiving mechanism 200 may be removed from the supply body 9221.

The support elevating device 9922g moves up and down the support mechanism 9222f by a method using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. You can.

56 to 65, the third alignment unit 9223 aligns positions of the first storage mechanism 200 supported by the second supply body 9221. The third alignment unit 9223 substantially coincides with each of the above-described second fixing member 9222a, second moving member 9222b, second moving mechanism 9222c, and second lifting mechanism 9922d. Since the configuration is made to include, the description of these components will be omitted in order not to obscure the subject matter of the present invention.

56 to 65, the third moving unit 9224 has the second supply body 9221 so that the tested LED chip is positioned at a position where the sorting unit 923 can pick up the tested LED chip. ) Can be moved. The third moving unit 9224 may move the second supply body 9221 in the X-axis direction and the Y-axis direction.

The third moving unit 9224 has a third upper member 9223a to which the second supply body 9221 is movably coupled and a third lower member to which the third upper member 9223a is movably coupled. 9223b).

The second supply body 9221 and the third upper member 9223a may be moved in a direction perpendicular to each other. When the third upper member 9223a is movably coupled to the third lower member 9223b in the X-axis direction, the second supply body 9221 is in the Y-axis direction with the third upper member 9223a. It can be movably coupled. When the third upper member 9223a is movably coupled to the third lower member 9223b in the Y-axis direction, the second supply body 9221 is connected to the third upper member 9223a in the X-axis direction. It can be movably coupled.

The third moving unit 9224 is the second supply body (9221) and the cylinder by using a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member The third upper member 9223a may be moved.

The third moving unit 9224 may rotate the second supply body 9221. The third moving unit 9224 can rotate the second supply body 9221 so that the sorting unit 923 can pick up the tested LED chips facing the same direction.

56 to 65, the sorting unit 923 transfers the tested LED chip from the first storage device 200 to the second storage device 300.

The sorting unit 923 picks up the tested LED chip from the first storage device 200 located in the second supply body 9221, and the LED tested with the second storage device 300 corresponding to the grade. The chip can be transported.

The sorting unit 923 may include a sorting rotary arm 9231 and a sorting driving unit 9232.

The sorting rotary arm 9231 is provided with a sorting picker 9231a capable of absorbing the tested LED chip. The sorting rotary arm 9231 may be lifted up and down by lifting means (not shown). The sorting rotary arm 9231 is rotated by the sorting driving unit 9232 so that the sorting picker 9231a is reciprocated so as to be positioned on the first storage mechanism 200 and on the second storage mechanism 300. Can be. The sorting picker 931 a may be positioned on the first storage mechanism 200 positioned on the second supply body 9221 and on the second storage mechanism 300 positioned on the second storage unit 924. have.

The sorting unit 923 may include one sorting rotary arm 9231 and one sorting picker 9231a. Although the sorting rotary arm 9231 and the sorting picker 9231a are illustrated in FIG. 31, this is to indicate a reciprocating movement path of the sorting rotary arm 9231.

The sorting rotary arm 9231 is coupled to the sorting driving unit 9232. The sorting driving unit 9232 may rotate the sorting rotary arm 9231 so that the sorting picker 931 a is positioned on the first storage mechanism 200 and on the second storage mechanism 300.

Although not shown, the sorting unit 923 may include a plurality of sorting rotary arms 9231 and a plurality of sorting pickers 9231a respectively coupled to the sorting rotary arms 9231. The sorting driving unit 9232 rotates the sorting rotary arm 9231 about an axis of rotation (not shown), and any one of the sorting pickers 9231a is positioned on the second supply body 9121. Located on the first storage mechanism 200, one of the sorting pickers (9231a) may be positioned on the second storage mechanism 300 located in the second storage unit (924). The sorting driving unit 9232 may sequentially position the sorting pickers 9231a on the first storage mechanism 200 and on the second storage mechanism 300.

The sorting driving unit 9232 may include a motor, and may further include a pulley and a belt if the motor and the sorting rotary arm 9231 are spaced apart by a predetermined distance.

56 to 65, the sorting unit 923 may further include a sorting vision unit 9333.

The sorting vision unit 9333 may be installed to be positioned above the second pick-up position PP2, and may check the state of the LED chip positioned at the second pick-up position PP2. The sorting vision unit 9333 may check whether the tested LED chip is positioned at the second pick-up position PP2, the degree of rotation of the LED chip positioned at the second pick-up position PP2, and the like. The third moving unit 9224 is configured to accurately pick up the LED chip positioned at the second pick-up position PP2 from the state information of the LED chip acquired by the sorting vision unit 9233 to the sorting unit 923. The second supply body 9221 can be moved. A CCD camera may be used as the sorting vision unit 9333.

Referring to FIGS. 56 to 65, when the sorting unit 923 includes the sorting vision unit 9333, the sorting rotation arm 9231 may further include a second transmission member 9231b.

The second transparent member 9231b may be coupled to the sorting picker 9231a and formed of a material having high transparency. For example, the second transmission member 9231 a may be formed of glass. As illustrated in FIG. 64, a second intake hole 9231c is formed in the sorting picker 9231a to allow the LED chip to be adsorbed. The second intake hole 9231c may be formed through the sorting picker 9231a. The second permeable member 9231b may be coupled to the sorting picker 9231a at one side of the second intake hole 9231c, and thus may seal one side of the second intake hole 9231c. Therefore, the LED chip may be adsorbed to the sorting picker 9231 a. Although not shown, the second intake hole 9231c may be connected to the intake apparatus.

The second transmission member 9231b may pass light passing through the second intake hole 9231c. Accordingly, even when the sorting picker 9231a is positioned at the second pick-up position PP2, the sorting vision unit 9333 can check the state of the LED chip positioned at the second pick-up position PP2. Make sure The sorting vision unit 9333 may check the state of the LED chip positioned at the second pick-up position PP2 through the second transmission member 9231b and the second intake hole 9231c. Accordingly, in the third moving unit 9224, the LED chip positioned at the second pick-up position PP2 is accurately aligned with the sorting unit 923 from the state information of the LED chip acquired by the sorting vision unit 9233. The second supply body 9221 may be moved to be picked up.

The second transmission member 9231b may also be used in the process of aligning positions of the second support pin 9222c, the sorting picker 9231a, and the sorting vision unit 9333. Even when the sorting picker 9231a is positioned at the second pick-up position PP2, the sorting vision unit 9333 is configured to pass through the second penetrating member 9231b and the second intake hole 9231c. The position of the two support pins 9922c can be confirmed. Accordingly, the sorting vision unit 9333, the second support pin 9222c, and the sorting are performed so that the sorting picker 9231a may pick up the LED chip positioned at the second pick-up position PP2 accurately. The position of the picker 9231a can be easily aligned. The sorting vision unit 9333, the second support pin 9222c, and the sorting picker 9231a may be aligned to be positioned on the same vertical line.

56 to 69, the sorting unit 92 according to a modified embodiment of the present invention may further include a second cooling unit 927.

The second cooling unit 927 may cool the first storage device 200. The second cooling unit 927 may cool the first storage device 200 such that the first storage device 200 is at room temperature or lower than room temperature, and the first storage device 200 is approximately The first storage device 200 may be cooled to be 20 ° C. or less.

As described above, the LED chip may be supplied in a state of being attached to the first storage member 202 including a tape having an adhesive material such as blue tape. In this case, the LED chip may be picked up from the first storage mechanism 200 in a state where the adhesive material is buried in a high temperature environment higher than room temperature. Due to this adhesive material, the LED chip may be attached to the second storage device 300 with a strong adhesive force. The second cooling unit 927 may cool the first storage member 202, thereby cooling the adhesive material in the first storage member 202. Accordingly, the second cooling unit 927 may allow the LED chip to be picked up at the second pick-up position PP2 without the adhesive material being attached to the LED chip.

The second cooling unit 927 may include a second injection unit 9927 for injecting cooling gas. The second spray unit 9927 may spray a cooling gas toward the first storage mechanism 200 supported by the second supply unit 922. The second injection unit 9191 may be supplied with a cooling gas from a cooling gas supply system (not shown). The second cooling unit 927 may include a plurality of second injection units 9927.

As illustrated in FIG. 67, the second spray unit 9927 may be installed in the sorting unit 923 so as to be positioned on the first container sphere 200. The second injection unit 9191 may be installed in the sorting vision unit 9333 to be positioned on the second supply unit 922. The sorting vision unit 9333 may include a sorting illumination device 9333a for irradiating light to the second pick-up position PP2, and the second injection unit 9131 may include the sorting illumination device ( 9233a). The second injection unit 9191 may cool the first storage mechanism 200 by injecting a cooling gas from the first storage mechanism 200 toward the first storage mechanism 200. The second injection unit 9927 may cool the second storage member 202 by spraying a cooling gas toward the first storage member 202. The second spray unit 9191 may spray a cooling gas toward the second pick-up position PP2.

As shown in FIG. 68, the second spray unit 9927 may be installed in the second supply unit 922 to be positioned below the first receiving mechanism 200. The second spray unit 9191 may be installed in the second supply support device 9222 to be positioned below the second supply body 9221. The second spray unit 9191 may be installed on the second elevating member 9222a. The second spray unit 9927 may cool the first storage mechanism 200 by spraying a cooling gas from the first storage mechanism 200 toward the first storage mechanism 200. The second spray unit 9191 may cool the first storage member 202 by spraying a cooling gas toward the first storage member 202. The second injection unit 9191 is configured to inject a cooling gas from the first storage member 202 to a portion around the LED chip picked up by the sorting unit 923, thereby allowing the second storage unit 202 to be discharged from the first storage member 202. The sorting unit 923 may cool the portion where the LED chip to be picked up in the next order.

As shown in FIG. 69, the second cooling unit 927 is installed on the sorting vision unit 9333 so as to be positioned on the second supply unit 922 and the second upper injection unit 9331a and the second. It may include a second lower injection unit (9271b) installed in the second supply support device (9222) to be positioned below the supply body (9221).

The second upper side injection unit 9191a may cool the first storage mechanism 200 by spraying a cooling gas onto the first storage mechanism 200 from the first storage mechanism 200. The second upper injection unit 9927a may cool the first storage member 202 by spraying a cooling gas toward the first storage member 202. The second upper side injection unit 451 may spray a cooling gas toward the second pick-up position PP2.

The second lower injection unit 9927b may cool the first storage mechanism 200 by spraying a cooling gas from the first storage mechanism 200 toward the first storage mechanism 200. The second lower injection unit 9927b may cool the first storage member 202 by spraying a cooling gas toward the first storage member 202. The second lower injection unit (9271b) injects a cooling gas from the first storage member 202 around the portion where the LED chip is picked up by the sorting unit (923), thereby the first storage member (202) In the sorting unit 923, it is possible to cool the portion where the LED chip to be picked up in the next order.

Although not shown, the second cooling unit 927 according to the modified embodiment of the present invention is the second supply support device 9222 contacting the first storage mechanism 200 in the second pickup position (PP2). Cooling the first storage mechanism 100 in contact with the second supply support device 9222 may be cooled.

The second cooling unit 927 cools the second elevating member 9222a to cool the first storage member 202 in contact with the second elevating member 9222a. The second cooling unit 927 may cool the second elevating member 9222a by circulating a cooling fluid inside the second elevating member 9222a. In this case, the second elevating member 9222a may include a flow path through which the cooling fluid is moved. The second cooling unit 927 may cool the second elevating member 9222a by using a thermoelectric element.

56 to 70, the second storage unit 924 supports the second storage mechanism 300, and the sorting unit 923 may place the tested LED chip on the second position. The second storage device 300 is moved so that the storage device 300 is positioned.

The second storage unit 924 includes a second storage body 9191, a fourth alignment unit 9924, and a fourth moving unit 9243.

The second housing body 9191 includes substantially identical components corresponding to the first housing body 9121 described above. The second housing body 9191 may be moved in the X-axis direction and the Y-axis direction by the fourth moving unit 9241, and may be rotated. As the second housing body 9191 moves and rotates, the sorting unit 923 may be placed on the second storage mechanism 300 such that all of the tested LED chips face the same direction. The fourth alignment unit 9924 is substantially corresponding to each of the second fixing member 9222a, the second moving member 9122b, the second synchronizing tool 9922c, and the second lifting mechanism 9922d. Including matching configurations. The fourth mobile unit 9243 includes substantially identical components corresponding to the second mobile unit 9223 described above. Therefore, description of these configurations will be omitted in order not to obscure the subject matter of the present invention.

56 to 71, the third storage unit 925 includes a third storage mechanism 9151 capable of storing a plurality of the second storage mechanisms 300.

The third storage mechanism 9151 may include a plurality of third storage members 9501a that may support both bottom surfaces of the second storage mechanism 300. The third storage members 9151a may be formed in plurality in a vertical distance from each other in a vertical direction (Z-axis direction). The space in which the third storage members 9501a are spaced apart from each other may be a third storage groove 9501b and the second storage mechanisms 300 may be inserted.

The second storage mechanism 300 may be stacked and stored in the vertical direction (Z-axis direction) in the third storage mechanism 9151. In this case, the third storage unit 925 may further include a third storage raising and lowering mechanism (9252).

The third storage raising and lowering mechanism 9252 may raise and lower the third storage mechanism 9501. The third storage raising and lowering mechanism (9252) is the third storage so that the second storage mechanism 300 is positioned at a position where the fourth transfer unit (926) can hold the second storage mechanism (300). The mechanism 9501 can be raised and lowered. The third storage raising and lowering mechanism 9152 lifts and lowers the third storage mechanism 9151 so that the fourth transfer unit 926 can store the second storage mechanism 300 in the storage mechanism 231. You can.

The third storage raising and lowering mechanism (9252) is the third storage mechanism (9251) by using a cylinder such as a hydraulic cylinder or pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. ) Can be raised and lowered.

In addition to the manner in which the third storage mechanism 9151 is raised and lowered by the third storage raising and lowering mechanism 9252, the fourth transfer unit 926 may be raised and lowered, and the fourth transfer unit 926 may be elevated. And both the third storage mechanism (9251) may be raised and lowered.

The third storage lifting mechanism 9252 may include a third vertical body 9502a and a third lifting body 9252b. The third lifting body 9252b is coupled to the third vertical body 9152a to be able to move up and down.

The third storage mechanism (9251) may be detachably coupled to the third lifting body (9252b). Accordingly, not only the operation of replacing the third storage mechanism 9501 is easy, but also the other components can be continuously performed during the replacement of the third storage mechanism 9501, so that the operation is performed due to the replacement operation. The loss of time can be prevented.

56 to 72, the fourth transfer unit 926 may transfer the second storage mechanism 300 from the third storage mechanism 9151 to the second storage body 9191. The second storage mechanism 300 may be transferred from the second storage body 9191 to the third storage mechanism 9151.

As described above, the sorting unit 92 has a specific grade to be transferred to the second storage mechanism 300 based on the second storage mechanism 300 positioned in the second storage unit 924. Only LED chips may be preferentially transferred from the first storage device 200 to the second storage device sphere 300. When only the LED chips other than the LED chip of the specific grade remain in the first storage mechanism 200 positioned in the second supply unit 922, the sorting unit 92 may be configured to connect the first storage mechanism 200 to the first storage mechanism 200. After the transfer to the second storage mechanism (9131), the other first storage mechanism 200 is transferred to the second supply unit 922 and then only the LED chip of the specific grade continues the first storage mechanism (200) ) May be transferred to the second storage mechanism 300.

That is, the sorting unit 92 is stored in the first storage mechanism 9131 until the second storage mechanism 300 is filled with LED chips of a specific grade to be transferred thereto. The instruments 200 may be sequentially positioned in the second supply unit 922.

The sorting unit 92 is based on the first storage mechanism 200 located in the second supply unit 922, and the third storage mechanism 9151 is until the first storage mechanism 200 is empty. The second storage mechanism 300 stored in the) may be sequentially located in the second storage unit 924.

In the above operation, the operation of transferring the second storage mechanism 300 between the third storage mechanism 9151 and the second storage unit 924 may be performed by the fourth transfer unit 926. have.

The fourth transfer unit 926 may transfer the second storage mechanism 300 between the second storage unit 924 and the third storage mechanism 9151. The fourth conveying unit 926 includes a fourth conveying member 9221 and a fourth conveying mechanism 9252.

The fourth conveying member 9221 may grasp the second receiving mechanism 300. The fourth conveying member 9221 corresponds to each of the first holding member 2411, the second holding member 2412, the first driving mechanism 2413, and the first connecting body 2414. Since the description is made to include the approximately matching configuration, the description of these configurations will be omitted in order not to obscure the subject matter of the present invention.

The fourth transfer mechanism 9252 moves the fourth transfer member 9201 between the third storage mechanism 9151 and the second storage unit 924. The fourth transfer mechanism 9302 may use the fourth transfer unit 926 by a cylinder, such as a hydraulic cylinder or a pneumatic cylinder, a pulley and a belt, a ball screw, or a cam member. You can move it. The fourth transfer mechanism 9252 may be coupled to the fourth gantry 9203. The fourth transfer member 9221 may move in the Y-axis direction along the fourth gantry 9203.

Third Embodiment

73 is a perspective view schematically illustrating a part of an LED chip sorting apparatus including an unloading unit according to a modified embodiment of the present invention, and FIG. 74 is a plan view of FIG. 73.

Referring to FIGS. 56, 57, 74, and 74, the unloading part 9 according to the modified embodiment of the present invention may include a sorting part 93 installed next to the test part 3. Can be. 73 and 74 omit some components shown in FIGS. 56 and 57, the LED chip sorting apparatus 1 has the same configuration except for the buffer unit 91 and the sorting unit 92. It may include.

The classifier 93 may classify the tested LED chips positioned at the unloading position ULP by grades according to test results. In this respect, there is a difference from the unloading section 9 including the buffer section 91 and the sorting section 92 as described above. According to the third embodiment, there is an advantage that the overall size of the equipment can be reduced compared to the first and second embodiments described above.

The classification unit 93 may include a classification unit 931 and a classification mechanism 932.

The sorting unit 931 transfers the LED chip to be tested from the seating member 21 positioned at the unloading position ULP to the sorting mechanism 932. The classification unit 931 may include a classification rotary arm 9311 and a first driving device 9312.

The sorting rotary arm 9311 is provided with a sorting picker 9311a capable of absorbing the tested LED chip. The sorting rotary arm 9311 is rotated by the driving device 9312, and the sorting picker 9311a may be reciprocated to be positioned on the unloading position ULP and the sorting mechanism 932. The split rotary arm 9311 may be lifted up and down by lifting means (not shown).

The sorting unit 931 may include one sorting rotary arm 9311 and one sorting picker 9311a. 73 and 74, the sorting rotary arm 9311 and the sorting picker 9311a are shown in four, but this is to indicate the reciprocating movement path of the sorting rotary arm 9311.

The dividing rotary arm 9311 is coupled to the driving device 9312. The driving device 9312 may rotate the sorting rotary arm 9311 such that the sorting picker 9311a is positioned on the unloading position ULP and the sorting mechanism 932. The driving unit 9312 may rotate the split rotary arm 9311 in a 180 ° range, and may rotate the split rotary arm 9311 in a clockwise or counterclockwise direction.

Although not shown, the sorting unit 931 may include a plurality of sorting rotary arms 9311 and a plurality of sorting pickers 9311a coupled to the sorting rotary arms 9311 respectively. The driving device 9312 rotates the classification rotary arm 9311 about a rotation axis (not shown), and one of the classification pickers 9311a is positioned at the unloading position ULP, and the classification is performed. At least one of the pickers 9311a may be positioned above the classifier 932. The driving device 9312 may sequentially position the sorting pickers 9311a on the unloading position ULP and the sorting mechanism 932.

The driving unit 9312 may include a motor, and may further include a pulley and a belt if the motor and the jet rotating arm 9311 are spaced apart from each other by a predetermined distance.

The sorting mechanism 932 includes a moving plate 9321, an empty block 9922, and an operating device 9323.

A plurality of empty blocks 9922 are installed in the movable plate 9321. The movable plate 9321 may be moved in the X-axis direction and the Y-axis direction by the operating device 9323.

In the empty block 9322, the LED chips tested by the classification unit 931 are placed by grade. The bin block 9322 may be installed in the movable plate 9321 in a number corresponding to the number of ratings desired by the user.

The operating device 9323 moves the bin block 9322 so that the bin block is positioned at a sorting position (not shown) in which the sorting unit 931 can put the tested LED chip. The actuator 9223 moves the movable plate 9321 so that the bin block 9322 corresponding to the class of the LED chip to be tested picked up by the sorting unit 931 is located at the sorting position (not shown). Can be. The sorting position may be below a path in which the first sorting picker 9311a is rotated by the first driving device 9312. The operating device 9323 can move the movable plate 9321 by a method using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. .

The sorting unit 93 may include a plurality of sorting units 931 and the sorting mechanism 932. The classifying unit 931 and the classifying apparatus 932 may classify the tested LED chips belonging to different class ranges, respectively.

Accordingly, a relatively small number of empty blocks 9322 may be installed in the movable plates 9321 provided in the sorting mechanisms 932, respectively. Accordingly, the movable plate 9321 is provided so that each of the actuators 9323 has a bin block 9322 corresponding to the class of the LED chip picked up by the sorting unit 931 at the sorting position (not shown). Distance and the time taken for this operation can be reduced.

In this case, the rotating unit 33 may rotate the rotating member 32 such that the seating members 21 are sequentially positioned in the plurality of unloading positions ULP. As shown in FIG. 36, the rotating unit 33 moves the rotating member 32 such that the seating member 21 is positioned at the first unloading position ULP1 and the second unloading position ULP2, respectively. Can be rotated.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and alterations are possible within the scope without departing from the technical spirit of the present invention. It will be apparent to those who have knowledge.

1 is a schematic perspective view of an LED chip test apparatus according to the present invention

2 is a schematic perspective view of the supply unit;

3 is a cross-sectional view taken along line A-A of FIG.

4 is a schematic perspective view of a seating member according to a modified embodiment of the present invention;

5 is a cross-sectional view taken along the line B-B of FIG.

6 is a schematic cross-sectional view of a seating member according to another modified embodiment of the present invention.

7 is a schematic front view of the LED chip test apparatus according to the present invention

8 is a schematic perspective perspective view of the contact unit, the mobile unit, and the first transfer member;

9 is an exploded perspective view of FIG. 8;

10 is a cross-sectional view taken along the line D-D of FIG. 8.

11 and 12 are enlarged views of part C of FIG. 7 showing a state in which the LED chip is tested in the LED chip test apparatus according to the present invention;

13 is a schematic front view of an LED chip test apparatus according to a modified embodiment of the present invention.

14 to 17 is a schematic operation state diagram showing the process of the LED chip is tested

18 is a schematic perspective view of a contact moving unit according to a modified embodiment of the present invention;

19 is an exploded perspective view of FIG. 18;

20 to 22 is a schematic operation state diagram showing a process in which the LED chip is tested by using a contact mobile unit according to a modified embodiment of the present invention

23 is a schematic exploded perspective view of a contact unit, a mobile unit, a first transfer member, and a second transfer member;

24 is a side cross-sectional view of FIG. 23.

25 to 27 are enlarged views of portion C of FIG. 7 showing a second transfer member according to a modified embodiment of the present invention.

28 is a schematic perspective view of a measuring unit, a contact unit, and a main body according to a modified embodiment of the present invention;

29 and 30 are schematic perspective views of a contact unit according to a modified embodiment of the present invention.

31 is a schematic perspective view of an LED chip test apparatus including a contact unit according to a modified embodiment of the present invention.

32 is a schematic front view of an LED chip test apparatus according to a modified embodiment of the present invention.

33 is a schematic enlarged view of a test position of FIG. 32.

34 is a schematic plan view of the LED chip sorting apparatus according to the present invention.

35 is a schematic perspective view of the first supply mechanism and the first supply unit;

36 is a side view of FIG. 35

37 is a schematic perspective view of the first supply body, the first supply support device, and the loading unit;

FIG. 38 is a schematic enlarged side sectional view of the portion L of FIG. 37; FIG.

39 is a perspective view schematically showing a first supply unit and a loading unit;

40 is a perspective view schematically showing the first storage unit;

41 is a perspective view schematically showing the first transfer unit

42 is a schematic perspective view of a first supply body, a first supply support device, a loading unit, and a first cooling unit;

43 to 45 are schematic enlarged side views of a portion M of FIG. 42 for a first cooling unit according to a modified embodiment of the present invention.

46 is a schematic plan view of a supply unit according to a modified embodiment of the present invention;

47 and 48 are schematic perspective views showing the operating relationship of the first correction unit;

49 is a schematic plan view of a supply unit in a modified embodiment of the present invention;

50 and 51 are schematic perspective views showing the operation relationship of the second correction unit

52 is a schematic perspective view of the unloading unit;

53 is a schematic perspective view of the first storage mechanism and the first storage unit;

54 is a schematic perspective view of a second storage unit;

55 is a schematic perspective view of a second transfer unit;

56 is a schematic perspective view of an LED chip sorting apparatus including an unloading unit according to a modified embodiment of the present invention.

FIG. 57 is a top view of FIG. 56

58 and 59 are schematic perspective views of a second storage unit according to a modified embodiment of the present invention.

60 is a schematic perspective view of the second transfer unit and the third transfer unit;

61 is a schematic perspective view of the first storage mechanism and the second supply unit;

FIG. 62 is a side view of FIG. 61

63 is a schematic perspective view of a second supply body, a second supply support device, and a sorting unit;

64 is a schematic enlarged side cross-sectional view of the portion T of FIG. 63;

65 is a schematic perspective view of the sorting unit;

66 is a schematic perspective view of the second supply body, the second supply support device, the sorting unit, and the second cooling unit;

67 to 69 are schematic enlarged side views of a portion U of FIG. 66 for a first cooling unit according to a modified embodiment of the present invention.

70 is a schematic perspective view of the second storage mechanism and the second storage unit;

71 is a schematic perspective view of the third storage unit;

72 is a schematic perspective view of a fourth transfer unit;

73 is a perspective view schematically showing a part of an LED chip sorting apparatus including an unloading unit according to a modified embodiment of the present invention;

74 is a top view of FIG. 73.

Claims (44)

In the LED chip test apparatus for measuring the characteristics of the LED chip, A rotating member which supports the LED chip and rotates the LED chip to a test position for measuring characteristics of the LED chip; And Is installed next to the rotating member, including a test unit for measuring the characteristics of the LED chip in the test position, The rotating member is an LED chip test apparatus, characterized in that it comprises a plurality of support frames extending radially about the rotation axis. The method of claim 1, wherein the rotating member, LED chip testing apparatus, characterized in that provided on each end side of the plurality of support frames, comprising a plurality of seating members for mounting the LED chip. delete The LED chip testing apparatus of claim 2, wherein the seating member is formed of a material including any one of sapphire or gold. delete delete The apparatus of claim 2, wherein the seating member comprises a seating body coupled to the rotating member, and a contact member in contact with the LED chip. 8. The LED chip testing apparatus of claim 7, wherein the contact member is formed of sapphire, and a surface of the contact member facing the seating body is mirror coated. The method of claim 1, 2, 4, 7, or 8, wherein the test unit, A contact unit which contacts the LED chip at the test position and emits the LED chip; And a measurement unit for measuring optical characteristics of the LED chip at the test position. 10. The LED chip testing apparatus of claim 9, further comprising a transmission member installed at the contact unit and transmitting the light emitted from the LED chip to the test unit. 10. The LED chip testing apparatus of claim 9, wherein the contact unit comprises a detachable contact pin contacting the LED chip. 10. The LED chip testing apparatus of claim 9, wherein the measuring unit is an integrating sphere including a light receiving hole that enters light emitted from the LED chip at the test position. The LED chip testing apparatus according to claim 9, wherein the test unit further comprises a measuring raising and lowering unit for raising and lowering the measuring unit. In the LED chip sorting apparatus for classifying the LED chip by measuring the characteristics of the LED chip, And a seating member on which the LED chip is seated, a loading position at which the LED chip is loaded on the seating member, a test position at which the LED chip is tested, and an unloading position at which the LED chip is unloaded from the seating member. Supply unit for rotating the seating member; A loading unit installed beside the supply unit and supplying an LED chip to be tested to the seating member in the loading position; A test unit installed beside the supply unit and measuring a characteristic of the LED chip at the test position; And It is installed next to the supply portion, and includes an unloading portion for collecting the LED chip tested from the seating member in the unloading position, The supply unit LED chip sorting apparatus, characterized in that it comprises a plurality of support frames extending radially about the axis of rotation. delete 15. The LED chip sorting apparatus according to claim 14, wherein the seating member is formed of a material containing any one of sapphire or gold. delete delete 15. The LED chip sorting apparatus according to claim 14, wherein the seating member includes a seating body coupled to the supply unit, and a contact member in contact with the LED chip. 20. The LED chip sorting apparatus according to claim 19, wherein the contact member is formed of sapphire, and a surface of the contact member facing the seating body is mirror coated. 21. The LED chip sorting apparatus according to any one of claims 14, 16, 19, or 20, wherein the seating members are provided at end portions of the plurality of support frames, respectively. 21. The LED chip sorting apparatus according to any one of claims 14, 16, 19 or 20, wherein the unloading part is located on the opposite side of the loading part about the supply part. 21. The method of any one of claims 14, 16, 19, or 20, wherein the first correction position is provided between the loading portion and the test portion, and between the loading position and the test position. LED chip sorting apparatus further comprises a first correction unit for correcting the position of the LED chip seated on the seating member. The method of claim 23, wherein the first correction unit, A first calibrating mechanism including a first calibrating member contacting one side of the LED chip at the first calibrating position and a second calibrating member contacting the other side of the LED chip; And a first actuating mechanism for moving the first compensating member and the second compensating member such that the first compensating member and the second compensating member are closer to or farther away from the LED chip. 25. The LED chip sorting apparatus according to claim 24, further comprising a first sensing unit which is installed on the first calibration mechanism and checks a position where the LED chip is seated on the seating member at the first calibration position. . The second correction according to any one of claims 14, 16, 19, or 20, which is provided between the test section and the unloading section and is between the test position and the unloading position. And a second correction unit for correcting a position of the LED chip seated on the seating member at the position. The method of claim 26, wherein the second correction unit, A second correction mechanism including a third correction member contacting one side of the LED chip at the second correction position and a fourth correction member contacting the other side of the LED chip; And a second operating mechanism for moving the third compensation member and the fourth compensation member such that the third compensation member and the fourth compensation member are closer to or farther away from the LED chip. 28. The LED chip sorting apparatus according to claim 27, further comprising a second sensing unit which is installed on the second correcting mechanism and checks a position where the LED chip is seated on the seating member at the second correcting position. . The method of claim 14, 16, 19, or 20, wherein the loading unit, A supply mechanism for supplying a plurality of LED chips to be tested, A loading unit which picks up the LED chip to be tested in the supply mechanism and seats the seating chip positioned at the loading position; And a first supply unit for moving the supply mechanism to position the LED chip to be tested at a first pick-up position at which the loading unit can pick up the LED chip to be tested. 30. The LED chip sorting apparatus of claim 29, wherein the loading unit further comprises a first cooling unit for cooling the supply mechanism. 31. The LED chip sorting apparatus according to claim 30, wherein the first cooling unit comprises a first spraying unit for injecting a cooling gas toward the supplying mechanism supported by the first supplying unit. 32. The LED chip sorting apparatus according to claim 31, wherein the first injection unit is installed in the first supply unit to be positioned below the supply mechanism. 32. The LED chip sorting apparatus according to claim 31, wherein the first spraying unit is installed in the loading unit to be positioned above the supply mechanism. 30. The apparatus of claim 29, wherein the first supply unit includes a first supply support device contacting the supply mechanism at the first pick-up position, The loading unit further comprises a first cooling unit for cooling the first supply support device for cooling the supply mechanism in contact with the first supply support device. The method of claim 29, wherein the loading unit, A loading vision unit installed to be positioned above the first pickup position; A loading picker positioned below the loading vision unit and having a first suction hole for adsorbing an LED chip positioned at the first pick-up position; And And a first transmission member coupled to the loading picker at one side of the first intake hole and configured to pass light passing through the first intake hole. The method according to any one of claims 14, 16, 19, or 20, wherein the unloading part includes a buffer part installed next to the test part, and a sorting part installed next to the buffer part. , The buffer unit includes an unloading unit that performs an unloading process of picking up the tested LED chip from the seating member located at the unloading position and transferring the LED chip to the first storage mechanism. The sorting unit may include a sorting unit configured to transfer the tested LED chip to a second storage device corresponding to a grade of the LED chip tested by the first storage device, the first storage device, and the sorting unit configured to support the first storage device. And a second supply unit which moves the first storage device such that the tested LED chip is positioned at a second pick-up position capable of picking up the tested LED chip in the storage device. 37. The LED chip sorting apparatus according to claim 36, wherein the sorting unit further comprises a second cooling unit for cooling the first storage mechanism. 38. The LED chip sorting apparatus according to claim 37, wherein the second cooling unit includes a second injection unit for injecting a cooling gas toward the first storage mechanism supported by the second supply unit. 39. The LED chip sorting apparatus according to claim 38, wherein the second spraying unit is installed in the second supply unit to be positioned below the first receiving mechanism. 39. The LED chip sorting apparatus according to claim 38, wherein the second spraying unit is installed in the sorting unit so as to be positioned on the first receiving mechanism. 37. The apparatus of claim 36, wherein the second supply unit includes a second supply support device that contacts the first storage mechanism at the second pickup position; And the sorting unit includes a second cooling unit to cool the second supply support device to cool the first storage device in contact with the second supply support device. The method of claim 36, wherein the sorting unit, A sorting vision unit installed to be positioned above the second pickup position; A sorting picker positioned under the sorting vision unit and having a second intake hole for adsorbing an LED chip positioned at the second pick-up position; And And a second transmission member coupled to the sorting picker at one side of the second intake hole and configured to pass light passing through the second intake hole. The method according to claim 14, 16, 19, or 20, wherein the unloading part includes a sorting part installed next to the test part, And the sorting unit includes a sorting device on which the tested LED chips are placed, and a sorting unit for transferring the tested LED chip from the seating member positioned at the unloading position to the sorting device. The method of claim 43, The sorting device may be configured such that the bin block is positioned at a sorting position in which a plurality of bin blocks in which the tested LED chips are placed according to a grade, a moving plate in which the bin blocks are installed in a plurality, and a sorting unit in which the sorting unit can put the tested LED chips. An actuator for moving the bin block; And said operating device moves said moving plate such that a bin block corresponding to the class of the tested LED chip picked up by said sorting unit is located at said sorting position.

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