WO2010095810A2

WO2010095810A2 - Led chip classifying apparatus

Info

Publication number: WO2010095810A2
Application number: PCT/KR2009/007811
Authority: WO
Inventors: 유병소
Original assignee: (주)큐엠씨
Priority date: 2009-02-20
Filing date: 2009-12-24
Publication date: 2010-08-26
Also published as: TWI412761B; TW201102671A; WO2010095810A3

Abstract

The present invention is directed to provide an LED chip classifying apparatus, capable of accurately testing performances of LED chips and classifying those tested LED chips. To this end, the present invention provides an LED chip classifying apparatus for measuring properties of an LED chip and then classifying LED chips, the apparatus comprising: a supply section including a seat member for an LED chip to rest thereon, the supply section rotating the seat member to a loading position where an LED chip is loaded on the seat member, to a testing position where the LED chip is tested and to an unloading position where the LED chip is unloaded from the seat member; a loading section installed beside the supply section, so as to deliver an LED chip to be tested from the loading position to the seat member; a testing section installed beside the supply section, so as to measure properties of the LED chip in the testing position; and an unloading section installed beside the supply section, so as to collect tested LED chips from the seat member in the unloading position.

Description

LED Chip Sorter

The present invention relates to an LED chip sorting apparatus capable of testing an LED chip to verify the performance of the LED chip and classifying the tested LED chip.

LED (Light Emitting Diode) is a kind of light emitting device using a semiconductor that converts electricity into light, also known as a Luminescent diode. LEDs are smaller than conventional light sources, have a long life, low power consumption, and high-speed response. They are used to display lamps for various electronic devices such as display devices for automobile instrumentation, optical communication light sources, card readers for digital display devices, calculators, and backlights. It is widely used in various fields.

The LED is manufactured through an epi process (EPI), a chip process (Fabrication), and a package process (Package), etc., and is subjected to a test process in a packaged state through the package process. In the test process, the LEDs which are not normally operated (hereinafter referred to as 'defective products') are excluded, and the LEDs which are normally operated (hereinafter referred to as 'goods') are classified and classified according to their performance and shipped.

Here, the LED may be classified as a low grade even if it is excluded or defective in the test process due to a problem occurring during the package process, but before the package process (hereinafter referred to as 'LED chip') Due to a problem that occurs during the manufacturing process, it may be excluded as a defective product in the test process or even classified as a low grade product.

That is, even though the LED does not cause a problem that may affect the performance of the LED in the package process, the LED is excluded as a defective product or classified as a low grade in the test process due to a problem occurring in the process of manufacturing the LED chip. It can be.

The LEDs excluded from the test process due to problems caused by the manufacturing process of the LED chips are those that have gone through an unnecessary packaging process and a test process, and these materials cause loss of material cost and process cost. There is a problem.

Due to the problems caused by the manufacturing process of LED chips, LEDs classified as low grade in the test process are often found in the packaging process as a reason for being classified as low grade, and therefore, time and cost to find an accurate analysis result. There is a problem that causes loss.

The problems as described above not only raise the manufacturing cost of the LED, but also increase the manufacturing cost of products using the LED.

The present invention has been made to solve the above problems, an object of the present invention is to provide an LED chip sorting apparatus that can accurately test the performance of the LED chip, and can classify the tested LED chip.

In order to achieve the object as described above, the present invention may include the following configuration.

First, the present invention, in the LED chip sorting apparatus for classifying the LED chip by measuring the characteristics of the LED chip, comprising a seating member on which the LED chip is seated, a loading position in which the LED chip is loaded on the seating member, and A supply unit for rotating the seating member to a test position at which the LED chip is tested and to an unloading position at which the LED chip is unloaded from the seating member; A loading unit installed beside the supply unit and supplying an LED chip to be tested to the seating member in the loading position; A test unit installed beside the supply unit and measuring a characteristic of the LED chip at the test position; And an unloading part installed next to the supply part and collecting an LED chip tested from the seating member in the unloading position.

Here, the whole or part of the seating member may be made of a material including any one of sapphire, quartz, glass, iron alloy, copper alloy, aluminum alloy, stainless steel, cemented carbide, gold, platinum. In addition, all or part of the seating member may be Teflon coating, mirror coating, gold plating, or platinum plating.

Next, the supply part includes a plurality of support frames extending radially about the rotation axis, and the seating member may be installed at each end side of the plurality of support frames.

In addition, the unloading unit may be located on the opposite side of the loading unit with respect to the supply unit.

The present invention further includes a correction unit installed between the loading unit and the test unit, or between the test unit and the unloading unit and correcting a position of the LED chip seated on the seating member. The unit may include a correction mechanism capable of contacting the side surface of the LED chip, and an operation mechanism connected to the correction mechanism and changing the position of the LED chip seated on the seating member by moving the correction mechanism. Can be.

Here, the correction mechanism may include a first correction member in contact with one side of the LED chip, and a second correction member in contact with the other side of the LED chip.

In addition, the operating mechanism may move the first correcting member and the second correcting member in a direction approaching or away from the LED chip positioned between the first correcting member and the second correcting member.

On the other hand, the correction mechanism is provided between the first contact surface in contact with one side of the LED chip, the second contact surface in contact with the other side of the LED chip, and between the first contact surface and the second contact surface, the LED chip is located It may include a third correction member having an LED chip receiving groove.

The actuator may be configured to move a third correction member while the LED chip is not in contact with the second contact surface but only in contact with the first contact surface, and the LED chip is not in contact with the first contact surface. It is possible to switch between states in which the third correction member is moved while being in contact only with the second contact surface.

The present invention may further include a sensing unit installed on the correction mechanism and checking a position where the LED chip is seated on the seating member.

The present invention may also include a first removal unit which is installed at a first removal position located between the unloading position and the loading position, and removes residues remaining on the seating member past the unloading position. .

Here, the first removal unit, the body; And an injection unit connected to one side of the body and injecting a fluid for removing residue from the seating member in the first removal position.

In addition, the first removal unit may further include an intake unit connected to the other side of the body and sucking the fluid injected from the injection unit.

The present invention may include a second removal unit which is installed at a second removal position located between the unloading position and the loading position, and removes the adhesive substance remaining on the seating member passing through the unloading position.

Here, the second removal unit, at least one contact member in contact with the upper surface of the seating member past the unloading position; A support member rotatably coupled to the contact member; And a driving unit coupled to the support member and rotating the contact member.

In addition, the second removal unit, at least one contact member in contact with the upper surface of the seating member past the unloading position; A support member coupled to the contact member; And a moving unit coupled to the support member and moving the support member.

Next, the loading unit, a supply unit for supplying a plurality of LED chips to be tested, a loading unit for picking up the LED chip to be tested in the supply mechanism to be seated on the seating member located in the loading position, and the loading unit is tested And a first supply unit for moving the supply mechanism so that the LED chip to be tested is positioned at a first pick-up position where the LED chip to be picked up is located.

In addition, the loading unit may further include a first cooling unit for cooling the supply mechanism.

Here, the first cooling unit may include a first injection unit for injecting a cooling gas toward the supply mechanism supported by the first supply unit.

In addition, the loading unit, the loading vision unit is installed to be located above the first pickup position; A loading picker positioned below the loading vision unit and having a first intake hole for adsorbing an LED chip positioned at the first pickup position; And a first transmission member coupled to the loading picker at one side of the first intake hole and configured to pass light passing through the first intake hole.

The unloading unit may include a buffer unit installed next to the test unit and a sorting unit installed next to the buffer unit, and the buffer unit may pick up the LED chip tested by the seating member positioned at the unloading position. And an unloading unit configured to perform an unloading process for transferring the first chip to the first housing, wherein the sorting unit includes an LED chip tested with the second chip corresponding to the grade of the LED chip tested in the first housing. The first accommodating mechanism to support the sorting unit for transporting the first accommodating mechanism and to place the tested LED chip at a second pickup position in which the sorting unit can pick up the LED chip tested in the first accommodating mechanism. It may include a second supply unit for moving.

Here, the sorting unit may further include a second cooling unit for cooling the first receiving device.

In addition, the second cooling unit may include a second injection unit for injecting a cooling gas toward the first receiving mechanism supported by the second supply unit.

The sorting unit may further include: a sorting vision unit installed to be positioned above the second pickup position; A sorting picker positioned under the sorting vision unit and having a second intake hole for adsorbing an LED chip positioned at the second pick-up position; And a second transmission member coupled to the sorting picker at one side of the second intake hole and configured to pass light passing through the second intake hole.

Next, the unloading unit includes a sorting unit installed next to the test unit, wherein the sorting unit classifies the sorting device in which the tested LED chips are placed, and the sorting unit in the seating member located at the unloading position. It may include a sorting unit for transferring to the mechanism.

Here, the sorting device includes a plurality of empty blocks in which the tested LED chips are placed by grade, a moving plate in which the plurality of empty blocks are installed, and the empty blocks in a sorting position where the sorting unit can place the tested LED chips. And an actuating device for moving the bin block to be positioned, wherein the actuating device may be to move the movable plate such that a bin block corresponding to the class of the tested LED chip picked up in the sorting unit is located at the sorting position. have.

1 is a schematic perspective view of an LED chip test apparatus according to the present invention.

2 is a schematic perspective view of the supply unit.

3 is a sectional view taken along the line A-A of FIG.

4 is a schematic perspective view of a seating member according to a modified embodiment of the present invention.

5 is a cross-sectional view taken along line B-B in FIG. 4.

6 is a schematic cross-sectional view of a seating member according to another modified embodiment of the present invention.

7 is a schematic front view of the LED chip test apparatus according to the present invention.

8 is a schematic perspective perspective view of the contact unit, the mobile unit, and the first transfer member.

9 is an exploded perspective view of FIG. 8.

FIG. 10 is a cross-sectional view taken along the line D-D of FIG. 8.

11 and 12 are enlarged views of part C of FIG. 7 showing a state in which the LED chip is tested in the LED chip test apparatus according to the present invention.

13 is a schematic front view of an LED chip test apparatus according to a modified embodiment of the present invention.

14 to 17 is a schematic operation state diagram showing a process in which the LED chip is tested.

18 is a schematic perspective view of a contact moving unit according to a modified embodiment of the present invention.

19 is an exploded perspective view of FIG. 18.

20 to 22 is a schematic operation state diagram showing the process of the LED chip is tested using a contact mobile unit according to a modified embodiment of the present invention.

23 is a schematic exploded perspective view of the contact unit, the mobile unit, the first transfer member, and the second transfer member.

24 is a side cross-sectional view of FIG. 23.

25 to 27 are enlarged views of portion C of FIG. 7 showing a second transfer member according to a modified embodiment of the present invention.

28 is a schematic perspective view showing a measuring unit, a contact unit, and a main body according to a modified embodiment of the present invention.

29 and 30 are schematic perspective views of a contact unit according to a modified embodiment of the present invention.

31 is a schematic perspective view of an LED chip test apparatus including a contact unit according to a modified embodiment of the present invention.

32 is a schematic front view of an LED chip test apparatus according to a modified embodiment of the present invention.

33 is a schematic enlarged view of a test position of FIG. 32.

34 is a schematic plan view of the LED chip sorting apparatus according to the present invention.

35 is a schematic perspective view of the first supply mechanism and the first supply unit.

36 is a side view of FIG. 35.

37 is a schematic perspective view of the first supply body, the first supply support device, and the loading unit.

FIG. 38 is a schematic enlarged side cross-sectional view of the portion L of FIG. 37.

39 is a perspective view schematically illustrating the first supply unit and the loading unit.

40 is a perspective view schematically showing the first storage unit.

41 is a perspective view schematically showing the first transfer unit.

42 is a schematic perspective view of the first supply body, the first supply support device, the loading unit, and the first cooling unit.

43 to 45 are schematic enlarged side views of the portion M of FIG. 42 for a first cooling unit according to a modified embodiment of the invention.

46 is a schematic plan view of a supply unit according to a modified embodiment of the present invention.

47 and 48 are schematic perspective views showing an operation relationship of the first correction unit.

49 is a perspective view of a second correction unit.

50 is an exploded perspective view of the second correction mechanism of the second correction unit.

51 is an enlarged perspective view of the third correction member.

52 is a front view showing the operation relationship of the second correction unit.

53 is a schematic plan view of a supply unit in a modified embodiment of the present invention.

54 and 55 are schematic perspective views showing an operation relationship of the third correction unit.

56 is a perspective view of a fourth correction unit.

57 is an exploded perspective view of the fourth correction mechanism of the fourth correction unit.

58 is an enlarged perspective view of the sixth correction member.

59 is a front view showing the operation relationship of the fourth correction unit.

60 is a plan view schematically illustrating a seating member, a rotating member, and a first removal unit according to the present invention.

61 is a perspective view schematically showing a first removal unit according to the present invention.

62 is a side view schematically showing a first removal unit, a rotating member, and a seating member according to the present invention.

63 is a partial cross-sectional view of the first removal unit according to the present invention.

64 is a plan view schematically illustrating a seating member, a rotating member, a first removal unit, and a second removal unit according to the present invention.

65 is a side view schematically showing a seating member and a second removal unit according to the present invention.

66 and 67 schematically illustrate a second removal unit according to a modified embodiment of the present invention.

68 is a schematic perspective view of the unloading unit.

69 is a schematic perspective view of the first accommodation mechanism and the first accommodation unit.

70 is a schematic perspective view of the second storage unit.

71 is a schematic perspective view of the second transfer unit.

72 is a schematic perspective view of an LED chip sorting apparatus including an unloading unit according to a modified embodiment of the present invention.

73 is a top view of FIG. 72.

74 and 75 are schematic perspective views of a second storage unit according to a modified embodiment of the present invention.

76 is a schematic perspective view of the second transfer unit and the third transfer unit.

77 is a schematic perspective view of the first receiving device and the second supply unit.

78 is a side view of FIG. 77.

79 is a schematic perspective view of the second supply body, the second supply support device, and the sorting unit.

FIG. 80 is a schematic enlarged side cross-sectional view of the portion T of FIG. 79.

81 is a schematic perspective view of the sorting unit.

82 is a schematic perspective view of a second supply body, a second supply support device, a sorting unit, and a second cooling unit.

83 to 85 are schematic enlarged side views of the U portion of FIG. 82 for the first cooling unit according to a modified embodiment of the present invention.

86 is a schematic perspective view of the second accommodation mechanism and the second accommodation unit.

87 is a schematic perspective view of the third storage unit.

88 is a schematic perspective view of a fourth transfer unit.

89 is a perspective view schematically illustrating a part of an LED chip sorting apparatus including an unloading unit according to a modified embodiment of the present invention.

90 is a top view of FIG. 89.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the LED chip sorting apparatus according to the present invention will be described in detail.

1 and 34, the LED chip sorting apparatus 10 according to the present invention includes an LED chip testing apparatus 1, a loading unit 4, and an unloading unit 9. The LED chip test apparatus 1 includes a supply unit 2 and a test unit 3, and the test unit 3 includes a measuring unit 31, a contact unit 32, and a first transfer member 33 (FIG. 8). Shown), the contact movement unit 34, and the main body 35.

First, the preferred embodiment of the LED chip test apparatus 1, that is, the supply unit 2 and the test unit 3 according to the present invention will be described in detail.

1 is a schematic perspective view of an LED chip test apparatus according to the present invention, Figure 2 is a schematic perspective view of the supply unit, Figure 3 is a cross-sectional view AA of Figure 2 for the seating member, Figure 4 is a modified embodiment of the present invention A schematic perspective view of a seating member according to the present invention, FIG. 5 is a sectional view taken along line BB of FIG. 4, FIG. 6 is a schematic cross sectional view of a mounting member according to another modified embodiment of the present invention, and FIG. 7 is a schematic view of an LED chip test apparatus according to the present invention. 8 is a schematic perspective view of a contact unit, a mobile unit, and a first transfer member, FIG. 9 is an exploded perspective view of FIG. 8, FIG. 10 is a sectional view taken along line DD of FIG. 8, and FIGS. 7 is an enlarged view of part C of FIG. 7 showing a state in which an LED chip is tested in the LED chip test apparatus according to the present invention, FIG. 13 is a schematic front view of the LED chip test apparatus according to a modified embodiment of the present invention, and FIGS. 17 is the LED chip is tested 18 is a schematic perspective view showing a process, FIG. 18 is a schematic perspective view of a contact mobile unit according to a modified embodiment of the present invention, FIG. 19 is an exploded perspective view of FIG. 18, and FIGS. 20 to 22 are modified embodiments of the present invention. FIG. 23 is a schematic exploded perspective view illustrating a process in which an LED chip is tested using a contact moving unit according to an example, FIG. 23 is a schematic exploded perspective view of a contact unit, a mobile unit, a first transfer member, and a second transfer member; 23 is a side cross-sectional view of FIG. 23, FIG. 25 to FIG. 27 are enlarged views of part C of FIG. 7 showing a second transmission member according to a modified embodiment of the present invention, and FIG. 28 according to a modified embodiment of the present invention 29 and 30 are schematic perspective views of a contact unit according to a modified embodiment of the present invention, and FIG. 31 is a contact unit according to a modified embodiment of the present invention. LED chip test including Schematic perspective view value, Figure 32 is a schematic enlarged view of a schematic front view, the test position 33 is 32 of the LED chip test device according to another modification by the present invention.

Referring to FIG. 1, the LED chip test apparatus 1 according to the present invention includes a supply unit 2 and a test unit 3. The test unit 3 may include a measuring unit 31, a contact unit 32, a first transfer member 33 (shown in FIG. 8), a contact moving unit 34, and a main body 35. .

1 and 2, the supply unit 2 supplies the LED chip to be tested to the test position TP where the measurement unit 31 can measure the optical characteristics of the LED chip. The supply part 2 may include a seating member 21, a rotating member 22, and a rotating unit 23.

1 to 3, an LED chip is mounted on the seating member 21. The LED chip may be adsorbed in a state of being seated on the seating member 21 by the intake device (F, shown in Figure 11). The intake apparatus F (shown in FIG. 11) may be installed in the rotating member 22. The intake apparatus F (shown in FIG. 11) may adsorb the LED chip seated on the seating member 21 through the through hole 21a formed in the seating member 21. The seating member 21 may be formed in a cylindrical shape as a whole.

A plurality of seating members 21 may be installed on the rotating member 22. As the rotating unit 23 rotates the rotating member 22, the seating members 21 may be sequentially positioned at the test position TP. When the seating member 21 is positioned at the test position TP, the seating member 21 may be positioned below the measuring unit 31.

The mounting member 21 serves to absorb and fix the LED chip. Since a plurality of LED chips are continuously attached to the seating member 21, the seating member 21 is preferably formed of a material having excellent wear resistance and hardness, or coated with such a material. In addition, when the light emitted from the LED chip is transmitted or reflected to the seating member 21 side, the light is transmitted to the measuring unit 31 side so that the light loss does not occur, the seating member 21 is made of a material having a high reflectance It is preferred to be formed or coated with such a material.

In particular, the mounting member 21 is preferably formed of a material having a high reflectance at the measurement wavelength band and a wavelength band adjacent thereto, that is, 200 nm to 1000 nm, or coated with such a material. In other words, when light is transmitted to the remaining area except the area where the LED chip is placed on the top surface of the seating member 21 and the side area of the seating member 21, the light is absorbed by the seating member 21 in large quantities. In this case, since the optical characteristics of the LED chip cannot be accurately measured, the seating member 21 is preferably formed of a material having high reflectance in the measurement wavelength band and the wavelength band adjacent thereto. In addition, even when the reflectance of the plurality of seating members 21 is different, or the reflectance of the seating member 21 is different from the initial time due to wear due to long use, it is impossible to accurately measure the optical characteristics of the LED chip, It is preferable that the reflectance of the member 21 is constantly high in the measurement wavelength band and the wavelength band adjacent thereto.

On the other hand, when the LED chip is a horizontal chip, an electrode is formed only on the upper surface of the LED chip during packaging, whereas in the case of the vertical chip, one electrode is formed on the upper surface of the LED chip, and one electrode is different from the lower part of the LED chip. Becomes Since the characteristics of the LED chip are preferably measured under the same conditions as the environment after packaging, the vertical chip should be energized through the lower part of the LED chip. Therefore, in the case of the vertical chip, the mounting member 21 in contact with the lower portion of the LED chip should be formed of a material having excellent conductivity so as to lower the electrical resistance when the LED chip emits light.

As described above, in order to measure optical properties stably and reliably in consideration of various conditions such as wear resistance, hardness, reflectance, conductivity, and the like, all or part of the mounting member 21 may be sapphire, quartz, glass, iron alloy, copper. Alloy, aluminum alloy, stainless steel, cemented carbide, PTFE (polytetrafluoroethylene), gold, platinum, or any one of the materials including silver, or all or part of the mounting member 21 is a mirror (mirror) coating, gold plating, platinum plating, or silver plating is preferable.

Meanwhile, the seating member 21 may include a contact member 211 and a first seating body 212.

The contact member 211 may be coupled to one surface 212a of the first seating body 212 and may be in contact with an LED chip. The contact member 211 may be formed of a material having excellent conductivity, and for example, may be formed of gold, platinum, or silver. In particular, the contact member 211 may be formed by coating the first seating body 212 with gold, platinum, or silver. The contact member 211 may lower the electrical resistance of the LED chip when the LED chip is emitted by the contact unit 32. Accordingly, the LED chip test apparatus 1 can accurately measure the optical characteristics and the electrical characteristics of the LED chip.

The first seating body 212 is coupled to the rotating member 22. The contact member 211 is coupled to one surface 212a of the first seating body 212. The first seating body 212 may be formed in a cylindrical shape as a whole.

As described above, when the contact member 211 is a material having excellent conductivity, reflectivity, or the like, the contact member 211 may have a relatively low hardness. In this case, when the LED chip is repeatedly placed on the seating member 21, the contact member 211 may be easily worn.

In order to prevent this, the first seating body 212 has a plurality of protrusions protruding from the LED chip positioned at the test position TP toward the measurement unit 31 (G arrow direction). 2121). The protrusions 2121 may be formed on one surface 212a of the first seating body 212. Due to the protrusions 2121, one surface 212a of the first seating body 212 is in a direction (H arrow direction) toward the LED chip positioned at the test position TP in the measurement unit 31. A plurality of grooves 2122 recessed to a predetermined depth may be formed.

The contact member 211 may be coupled to the first seating body 212 to be inserted between the protrusions 2121. That is, the contact member 211 may be formed on one surface 212a of the first seating body 212 to be inserted into the grooves 2122. Accordingly, even when the LED chip is repeatedly placed on the seating member 21, the contact member 211 inserted into the grooves 2122 remains, so that the seating member 21 is used for a long time. The performance of the LED chip can be accurately measured.

Each of the protrusions 2121 may be formed in a rectangular parallelepiped shape. The protrusions 2121 may be formed in other forms, such as hemispherical shape, in addition to a rectangular parallelepiped shape, if the contact member 211 may be inserted therebetween.

The protrusions 2121 may be formed by processing the grooves 2122 on one surface 212a of the first seating body 212. Some of the grooves 2122 may be elongated in a first direction, and others of the grooves 2122 may be elongated in a second direction perpendicular to the second direction. The protrusions 2121 may be formed in a lattice shape on one surface 212a of the seating body 212. The first direction and the second direction may be angles other than vertical, and the grooves 2122 may be formed in three or more different directions.

1 to 5, the seating member 21 according to the modified embodiment of the present invention may include a contact member 211 and a first seating body 212 as follows.

The contact member 211 may be coupled to one surface 212a of the first seating body 212 and may be in contact with an LED chip. The contact member 211 may be formed of a material having excellent hardness, and for example, may be formed of sapphire, quartz, glass, iron alloy, copper alloy, aluminum alloy, stainless steel, cemented carbide, and PTFE. Thus, even if the LED chip is repeatedly placed on the seating member 21, the contact member 211 can be prevented from being easily worn. A coupling groove 2123 into which the contact member 211 is inserted may be formed at one surface 212a of the first seating body 212. The coupling groove 2123 may be formed by recessing a predetermined depth in the direction (H arrow direction) toward the LED chip positioned at the test position TP in the measurement unit 31.

The coupling groove 2123 may be formed in a disk shape as a whole. The coupling groove 2123 may be formed in a shape substantially coincident with the contact member 211 so that the contact member 211 may be inserted therein, and may be formed in another shape such as a square plate shape in addition to the disc shape. The coupling groove 2123 may have a size substantially coincident with the contact member 211. The contact member 211 may be coupled to the first seating body 212 by a fitting method through the coupling groove 2123. The contact member 211 may be coupled to the first seating body 212 by being adhered by an adhesive material or the like.

As described above, when the contact member 211 is formed of a material having excellent hardness, the material may have a relatively low reflectance. For example, when the contact member 211 is formed of sapphire, quartz, glass, iron alloy, copper alloy, aluminum alloy, stainless steel, cemented carbide, or PTFE, the incident light incident to the measuring unit 31 in the light emitted from the LED chip Light may not be generated.

To prevent this, the seating member 21 may further include a reflective member 213. The reflective member 213 may be inserted into the coupling groove 2123 to be positioned between the contact member 211 and the first seating body 212. The reflecting member 213 reflects the light emitted by the LED chip so that the light emitted by the LED chip is transmitted toward the measuring unit 31. Light emitted from the LED chip may be reflected by the reflective member 213 and transmitted to the measurement unit 31. The reflective member 213 may be formed of a material having high reflectance, and for example, may be formed by mirror coating a metal or a resin material. Accordingly, since a larger amount of light may be incident on the measuring unit 31, the LED chip testing apparatus 1 may more accurately measure the performance of the LED chip.

The reflective member 213 may be formed by mirror coating one surface 211a into which the contact member 211 is inserted into the coupling groove 2123. For example, the contact member 211 may be formed of sapphire, and the light emitted from the LED chip by mirror coating one surface 211a into which the contact member 211 is inserted into the coupling groove 2123. This can be delivered to the measuring unit 31. In this case, even though the contact member 211 formed of sapphire is reduced in reflectance due to surface damage due to repeated use, the back side of the sapphire is mirror-coated so that a constant high level of reflectance can be maintained over time.

The through hole 21a formed in the seating member 21 may pass through the contact member 211, the first seating body 212, and the reflective member 213. The intake apparatus F (shown in FIG. 11) may adsorb the LED chip seated on the seating member 21 through the through hole 21a.

1 to 6, the seating member 21 according to another modified embodiment of the present invention may further include a second seating body 214.

The second seating body 214 may include a through hole through which a portion of the LED chip is seated in the first seating body 212, and the LED chip may be formed in the first seating body 212 through the through hole. The seated portion may be coupled to the first seating body 212 in a penetrating state.

The upper surface of the second seating body 214 and the upper surface of the first seating body 212 may be formed at different heights. As shown in FIG. 6, the first seating body 212 may be formed to protrude upward based on an upper surface of the second seating body 214. Although not shown, the second seating body 214 may be formed to protrude upward based on the top surface of the first seating body 212. The second seating body 214 may be formed in a cylindrical shape as a whole.

An inclined surface 2141 is formed on the second seating body 214 to transmit the light emitted from the LED chip to the measuring unit 31. In this case, the measuring unit 31 may be located above the LED chip positioned at the test position TP.

The inclined surface 2141 may be formed by an inclined groove 2142 which is formed by recessing a predetermined depth in the upper surface of the second seating body 214. The inclined groove 2142 may be formed to gradually decrease in size from the upper surface of the second seating body 214 (in the direction of the H arrow). Accordingly, the inclined surface 2141 may be formed to be inclined in the outward direction (E arrow direction). The second seating body 214 may be formed in a cylindrical shape as a whole, and the inclined groove 2142 may be formed to gradually decrease in diameter from the upper surface of the second seating body 214.

Since the inclined surface 2141 allows a greater amount of light to be incident on the measuring unit 31, the LED chip testing apparatus 1 according to the present invention can accurately measure the performance of the LED chip. The inclined surface 2141 may be formed of a material having high reflectance or coated with such a material. For example, the inclined surface 2141 may be a surface of a metal or an alloy thereof, or may be a mirror coating of a metal or a resin material.

1 and 2, the rotating member 22 is installed next to the main body 35.

A plurality of seating members 21 may be installed on the rotating member 22. The rotating member 22 may be rotated by the rotating unit 23. As the rotating member 22 is rotated, the seating members 21 may be sequentially positioned at the test position TP, and the LED chips to be tested seated on the seating members 21 may be tested. May be sequentially located at the position TP.

The seating member 21 may be spaced apart from the rotating member 22 at the same angle with respect to the rotating shaft 22a, and a plurality of mounting members 21 may be installed. Accordingly, the rotating unit 23 may rotate and stop the rotating member 22 at the same angle, thereby sequentially placing the seating members 21 at the test position TP.

For example, the seating member 21 may be spaced apart from each other by 45 ° with respect to the rotation shaft 22a and may be installed at the rotation member 22. In this case, the mounting unit 21 may be sequentially positioned at the test position TP by stopping the rotating unit 23 after rotating the rotating member 22 by 45 °. Twelve seats may be installed on the rotation member 22 by spaced apart by 30 ° from the rotation shaft 22a. In this case, the mounting unit 21 may be sequentially positioned at the test position TP by stopping the rotating unit 23 after rotating the rotating member 22 by 30 °.

That is, when the number of seating members 21 installed on the rotating member 22 is defined as N pieces (N is an integer greater than 1), the seating member 21 is rotated on the rotating member 22. N pieces may be installed spaced apart by (360 / N) ° with respect to 22a. By stopping the rotating unit 23 after rotating the rotating member 22 by (360 / N) °, the seating members 21 may be sequentially positioned at the test position TP. The seating member 21 is preferably installed in even numbers on the rotating member (22).

When any one of the seating members 21 is located at the test position TP, any one of the remaining seating members 21 may be located at a loading position LP at which the LED chip to be tested is loaded. One of the remaining mounting members 21 may be located at an unloading position ULP where the tested LED chip is unloaded.

The LED chip may be seated on the seating member 21 positioned at the loading position LP, moved to the test position TP and tested, and then moved to the unloading position ULP to be unloaded. That is, the supply unit 2 may supply the LED chip to be tested to the test position TP, and supply the tested LED chip to the unloading position TLP. The process of loading the LED chip to be tested on the seating member 21 located at the loading position LP and the process of unloading the LED chip tested at the seating member 21 positioned at the unloading position ULP Although not shown, it may be made by a transfer means for transferring the LED chip.

The seating members 21 may be installed on the rotating member 22 so that at least one of the seating members 21 may be simultaneously positioned at the test position TP, the loading position LP, and the unloading position ULP.

The rotating member 22 may include a support frame 221 on which the seating members 21 are installed. The rotating member 22 may include the same number of support frames 221 as the seating member 21. For example, when eight seating members 21 are installed in the rotating member 22, the rotating member 22 may include eight supporting frames 221. In this case, the support frames 221 may be spaced apart from each other by 45 ° with respect to the rotation axis 22a. The support frame 221 is outwardly from the rotating shaft 22a so that the seating member 21 can be located at the test position TP, the loading position LP, and the unloading position ULP. It may be formed long.

The seating member 21 may be installed on an upper surface of the support frame 221, and the intake apparatus F (shown in FIG. 11) may be installed on a bottom surface of the support frame 221. At the position where the seating member 21 is installed in the support frame 221, the through hole 22b and FIG. 11 communicating with the through hole 21a (shown in FIG. 11) formed in the seating member 21. Shown) can be formed. The through

holes

21a and 22b (shown in FIG. 11) may be formed in a cylindrical shape as a whole.

1 and 2, the rotation unit 23 rotates the rotation member 22 such that the seating members 21 are sequentially positioned at the test position TP. The rotating unit 23 may be coupled to the bottom surface of the rotating member 22, and may rotate the rotating member 22 about the rotating shaft 22a.

The rotating unit 23 may include a motor 231. The motor 231 may be directly coupled to the rotary shaft 22a to rotate the rotary member 22, and coupled to a shaft (not shown) coupled to the rotary shaft 22a to thereby rotate the rotary member 22. It can also be rotated. When the motor 231 is installed at a position spaced apart from the shaft (not shown), the rotation unit 23 further includes a pulley and a belt connecting the motor 231 and the shaft (not shown). can do.

1 to 7, the test unit 3 may be installed next to the rotating member 21 and test an LED chip positioned at the test position TP. As described above, the test unit 3 includes the measuring unit 31, the contact unit 32, the first transfer member 33 (shown in FIG. 8), the contact moving unit 34, and the main body 35. It may include.

The measuring unit 31 includes a light receiving hole 311 (shown in FIG. 11) to which light emitted from the LED chip is incident. The measuring unit 31 is connected to a tester (not shown) capable of analyzing a test result for the LED chip, and through the light receiving hole 311 (shown in FIG. 11) in connection with the tester (not shown). The optical characteristics of the LED chip can be measured from the incident light. The optical properties may be luminance, wavelength, luminous flux, luminous intensity, illuminance, spectral distribution, color temperature, and the like. An integrating sphere may be used as the measuring unit 31.

The measuring unit 31 may be coupled to the main body 35 such that the light receiving hole 311 (shown in FIG. 11) is positioned on the LED chip. At least one of a spectrometer or a photodetector may be installed in the measuring unit 31. The measuring unit 31 may be formed in a spherical shape as a whole, and may include a light receiving hole 311 (shown in FIG. 11) formed in a circular shape as a whole.

1 to 10, the contact unit 32 may be connected to a tester (not shown), and in conjunction with the tester (not shown) may emit an LED chip. Accordingly, the measuring unit 31 can measure the optical characteristics of the LED chip. The contact unit 32 may test the electrical characteristics of the LED chip in conjunction with a tester (not shown).

The contact unit 32 may include a contact pin 321 contacting the LED chip and a contact body 322 coupled to the contact movement unit 34. The contact unit 32 may be raised and lowered by the contact movement unit 34 and may be moved in the horizontal direction. The contact unit 32 may emit an LED chip in contact with the contact pin 321 in association with a tester (not shown). The contact unit 32 may include a plurality of contact pins 321. A probe card may be used as the contact unit 32.

The contact body 322 may include a terminal 3221 electrically connected to the contact pin 321. The contact pin 321 is coupled to the contact body 322 in contact with the terminal 3221. The contact pin 321 may be electrically connected to a tester (not shown) through the terminal 3221. The contact body 322 may include a plurality of terminals 3221, and the contact pins 321 may be connected to each of the terminals 3221.

The contact body 322 may be coupled to the contact movement unit 34 to be positioned between the measurement unit 31 and the LED chip in contact with the contact pin 321. The measurement unit 31 may be positioned on the contact body 322, and an LED chip positioned at the test position TP may be positioned below the contact body 322.

The contact body 322 may include an insertion hole 3222 through which the contact pin 321 may pass. The contact pin 321 is connected to a terminal 3221 formed at one side of the upper surface of the contact body 322, and the other side is positioned below the contact body 322 through the insertion hole 3322. Can be in contact with the LED chip. Light emitted by the LED chip may be incident into the measuring unit 31 through the insertion hole 3222 and the light receiving hole 311 (shown in FIG. 11). The contact body 322 may be formed in a rectangular plate shape as a whole, it may include an insertion hole 3322 formed in a circular shape as a whole.

The contact unit 32 may include a connection unit 323. At least one connection terminal 3223 is formed at one side of the contact body 322, and may be electrically connected to the connection unit 323 through the connection terminal 3223. The connection unit 323 may be connected to a tester (not shown), and the contact pin 321 may be electrically connected to a tester (not shown) through the contact body 322 and the connection unit 323. .

The connection unit 323 may include a connection groove 3231 into which the contact body 322 is inserted. The contact body 322 may include at least one or more connection terminals 3223 on one side of the contact body 3321. The connection unit 323 may be detachably coupled to the contact movement unit 34, the contact body 322 is inserted into the connection unit 323 is the measurement unit 31 and the test position ( TP) may be located between the LED chip located in.

1 to 11, the first transfer member 33 is installed to be located between the contact unit 32 and the LED chip positioned at the test position TP. Accordingly, since the LED chip test apparatus 1 may block a portion between the measurement unit 31 and the LED chip with the first transfer member 33, the light emitted by the LED chip compared to the test apparatus according to the prior art. The amount of passage between the measuring unit 31 and the LED chip can be reduced.

The first transfer member 33 may be coupled to the contact movement unit 34. Accordingly, when it is necessary to replace the contact unit 32, it is possible to replace only the contact unit 32 irrespective of the first transfer member 33.

The first transfer member 33 includes a first through hole 331 and a first transfer surface 332.

The first through hole 331 may be formed through the first transfer member 33. The contact pin 321 may pass through the first through hole 331 to be in contact with the LED chip positioned below the first transfer member 33. That is, the contact pin 321 may contact the LED chip positioned at the test position TP through the first through hole 331. A plurality of contact pins 321 may pass through the first through hole 331 to contact the LED chip positioned at the test position TP. Light emitted from the LED chip may pass through the first through hole 331 and the light receiving hole 311 to be incident into the measuring unit 31. Accordingly, the contact pin 321 may be in contact with the LED chip without being disturbed by the first transfer member 33, and the light emitted by the LED chip is not disturbed by the first transfer member 33. It may be incident into the measuring unit 31.

The first transfer member 33 is gradually reduced in size in the direction (H arrow direction) toward the LED chip positioned in the test position TP in the test unit 31 in the first through hole 331 Can be formed. That is, the first through hole 331 may be formed to gradually decrease in size in the downward direction (H arrow direction) on the upper surface (33a) of the first transfer member (33). The first through hole 331 may be formed to gradually decrease in diameter in the downward direction (H arrow direction) on the upper surface 33a of the first transfer member 33, and may be formed in a hemispherical shape as a whole.

The first transfer surface 332 transmits the light emitted from the LED chip toward the measurement unit 31 such that the light emitted from the LED chip is incident to the measurement unit 31 through the light receiving hole 311. Light emitted from the LED chip to the side may be transmitted toward the measuring unit 31 by the first transfer surface 332. Accordingly, since a larger amount of light may be incident into the measuring unit 31, the LED chip test apparatus 1 may more accurately measure the performance of the LED chip. The first transfer surface 332 may be formed of a material having a high reflectance or coated with such a material. For example, the first transfer surface 332 may be a surface of a metal or an alloy thereof, or may be a mirror coating of a metal or a resin material.

The first transfer surface 332 may be formed along the outer surface of the first through hole 331 to transmit light emitted from the LED chip toward the measurement unit 31. That is, as shown in the enlarged view of FIG. 10, the first transfer surface 332 is directed toward the upper direction (G arrow direction) from the bottom surface 33b of the first transfer member 33. It may be formed away from the center (I) of the through-hole 331. When the first through hole 331 is formed in a hemispherical shape as a whole, the first transfer surface 332 may be formed to form a curved surface as a whole.

The first transfer member 33 may further include a first protruding member 333.

The first protruding member 333 may be formed to protrude in a direction (G arrow direction) toward the measuring unit 31 from the LED chip positioned at the test position TP. That is, the first protruding member 333 may be formed to protrude in an upward direction (G arrow direction) from the upper surface 33a of the first transfer member 33. The first protruding member 333 may be inserted into the insertion hole 3322.

The first protruding member 333 may include a first inclined surface 3331 formed to be connected to the first transmission surface 332. The first transfer surface 332 and the first inclined surface 3331 may be formed with the same slope. That is, the first transfer surface 332 and the first inclined surface 3331 may be formed at one inclination angle. The first transfer surface 332 and the first inclined surface 3331 may be formed to form one curved surface. Accordingly, the first transfer surface 332 and the first inclined surface 3331 may transmit light emitted from the LED chip toward the measuring unit 31.

Therefore, since the first transfer member 33 can increase the area for transmitting the light emitted by the LED chip toward the measurement unit 31, the LED chip test apparatus 1 is inside the measurement unit 31. As a result, a larger amount of light can be incident, and the performance of the LED chip can be measured more accurately. The first inclined surface 3331 may be formed of a material having high reflectance or coated with such a material. For example, the first inclined surface 3331 may be a surface of a metal or an alloy thereof, or may be a mirror coating of a metal or a resin material.

1 to 12, the contact movement unit 34 may include a contact support mechanism 341, a contact coupling mechanism 342, and a contact lifting mechanism 343.

The contact support mechanism 341 supports the contact unit 32. The contact unit 32 may be detachably coupled to the contact support mechanism 341 by the contact coupling mechanism 342. The first support member 33 is coupled to the contact support mechanism 341 under the contact unit 32. Accordingly, when it is necessary to replace the contact unit 32, such as the type of the LED chip is changed or the contact pin 321 is damaged, the contact unit 32 regardless of the first transfer member 33 ) Can only be replaced.

At least one of the contact body 322 and the connection unit 323 may be coupled to the contact support mechanism 341. The contact support mechanism 341 is formed with a through hole into which the first transfer member 33 is inserted. The first transfer member 33 may be inserted into the through hole and coupled to the contact support mechanism 341 by a fitting method. The first transfer member 33 may be inserted into the through hole and coupled to the contact support mechanism 341 by a fastener such as a bolt.

The contact supporting mechanism 341 may be coupled to the contact raising and lowering mechanism 343. As the contact support mechanism 341 is raised and lowered by the contact raising and lowering mechanism 343, the contact unit 32 and the first transfer member 33 coupled to the contact supporting mechanism 341 are also together. Can be raised and lowered. The contact support mechanism 341 may be formed in a rectangular plate shape as a whole, and may be formed long in the direction toward the measurement unit 31 in the contact lift mechanism 343.

The contact coupling mechanism 342 detachably couples the contact unit 32 to the contact support mechanism 341. A fastening member such as a bolt may be used as the contact coupling mechanism 342. The contact unit 32 may include a through hole through which the contact coupling mechanism 342 passes, and the contact support mechanism 341 may include a groove to which the contact coupling mechanism 342 is coupled.

1 to 12, the contact raising and lowering mechanism 343 may move the contact unit 32 in a vertical direction (Z-axis direction, shown in FIG. 2). The contact raising and lowering mechanism 343 may lower the contact unit 32 so that the contact pin 321 contacts the LED chip. The contact raising and lowering mechanism 343 may raise the contact unit 32 so that the contact pin 321 and the LED chip are not damaged by contact when the test for the LED chip is completed. The contact raising and lowering mechanism 343 may raise and lower the contact unit 32 by raising and lowering the contact supporting mechanism 341.

The contact raising and lowering mechanism 343 may raise and lower the contact supporting mechanism 341 such that the first transfer member 33 is positioned at a first position or a second position. The first transfer member 33 is coupled to the contact support mechanism 341.

When the first transfer member 33 is positioned in the first position, as shown in FIG. 11, the first transfer member 33 is positioned above the seating member 21. The contact raising and lowering mechanism 343 may raise the contact supporting mechanism 341 such that the lower end 332a of the first transfer surface 332 is positioned on the upper surface 21b of the seating member 21. When the first transfer member 33 is positioned at the first position, the contact pin 321 is positioned at a distance away from the LED chip seated on the seating member 21.

When the first transfer member 33 is located in the second position, as shown in FIG. 12, the first transfer member 33 is mounted in the first through hole 331 by the seating member 21. Is positioned at the insertion position. That is, the bottom surface 33b of the first transfer member 33 is positioned below the top surface 21b of the seating member 21 on which the LED chip is seated. The contact raising and lowering mechanism 343 may lower the contact supporting mechanism 341 such that the lower end 332a of the first transfer surface 332 is positioned below the upper surface 21b of the seating member 21. When the first transfer member 33 is located in the second position, the contact pin 321 is in contact with the LED chip seated on the seating member 21, the contact unit 32 is the contact pin The LED chip in contact with 321 is made to emit light.

Accordingly, since the light emitted from the LED chip to the side may be transmitted toward the measuring unit 31 by the first transfer surface 332, more light may be incident into the measuring unit 31. Therefore, the LED chip test apparatus 1 can more accurately measure the performance of the LED chip.

The contact raising and lowering mechanism 343 lowers the contact supporting mechanism 341 so that the first transfer member 33 is positioned at the second position when the LED chip to be tested is positioned at the test position TP. . The contact raising and lowering mechanism 343 raises the contact supporting mechanism 341 so that the first transfer member 33 is positioned at the first position when the test of the LED chip is completed. Thereafter, the rotating unit 23 may rotate the rotating member 22.

Accordingly, even when the rotating member 22 is rotated, the LED chip seated on the seating member 21 or the seating member 21 does not collide with the first transfer member 33 and the contact pin 321. You may not. When a new LED chip is positioned at the test position TP, the rotating unit 23 may stop the rotating member 22, and the contact raising and lowering mechanism 343 may be the first transfer member 33. The contact support mechanism 341 may be lowered so that the contact point is positioned at the second position.

The contact raising and lowering mechanism 343 may raise and lower the contact unit 32 using a motor and connecting means respectively coupled to the motor and the contact unit 32. The connecting means may be a pulley and a belt, a ball screw, a cam member, and the like. The contact raising and lowering mechanism 343 may raise and lower the contact unit 32 using a hydraulic cylinder or a pneumatic cylinder.

Here, the LED chip positioned at the test position TP may not always be seated at the same position in the seating member 21. When the LED chip is loaded on the seating member 21 in the loading position LP may not be seated in a certain position, the centrifugal force when the LED chip is moved from the loading position LP to the test position TP This is because the state that is moved by the seat and seated on the seating member 21 can be changed. In this case, the contact movement unit 34 moves the contact unit 32 in the horizontal direction (X-axis direction and Y-axis direction, as shown in FIG. 1) so that an accurate test can be made. ) May be further included.

The contact movement mechanism 344 may move the contact unit 32 such that the contact pin 321 is positioned at a position where the contact pin 321 may contact the LED chip. The contact raising and lowering mechanism 343 may be coupled to the contact moving mechanism 344. The contact movement mechanism 344 may move the contact unit 32 by moving the contact elevation mechanism 343. The contact support mechanism 341 may be coupled to the contact movement mechanism 344, and the contact movement mechanism 344 may be coupled to the contact elevation mechanism 343.

The contact movement mechanism 344 may move the contact unit 32 using a hydraulic cylinder or a pneumatic cylinder. The contact movement mechanism 344 may move the contact unit 32 using a motor and connecting means coupled to the motor and the contact unit 32, respectively. The connecting means may be a pulley and a belt, a ball screw, a cam member, and the like.

The contact movement mechanism 344 removes the first contact movement mechanism 341 and the contact unit 32 for moving the contact unit 32 in a first horizontal direction (X-axis direction, shown in FIG. 1). And a second contact movement mechanism 3442 moving in a second horizontal direction (Y-axis direction, shown in FIG. 1).

The contact raising and lowering mechanism 343 may be coupled to the second contact movement mechanism 3442, and the second contact movement mechanism 3442 may be coupled to the first contact movement mechanism 3431. The contact raising and lowering mechanism 343 may be coupled to the first contact movement mechanism 341, and the first contact movement mechanism 341 may be coupled to the second contact movement mechanism 3442.

Although not shown, the contact movement mechanism 344 may include the contact pins 321 from the state information of the LED chip obtained by a detection unit (not shown) for checking a state in which the LED chip is seated on the seating member 21. ) May move the contact unit 32 to a position where it can contact the LED chip. The detection unit (not shown) may check the position where the LED chip is seated on the seating member 21. The sensing unit (not shown) may include a CCD camera capable of capturing a state in which the LED chip is seated on the seating member 21.

Here, the LED chip positioned at the test position TP may not always be seated in the same direction in the seating member 21. When the LED chip is loaded on the seating member 21 in the loading position LP may not be seated in a certain direction, the centrifugal force when the LED chip is moved from the loading position LP to the test position TP This is because the state seated on the seating member 21 by being rotated by the light may be changed.

In this case, the contact moving unit 34 according to the modified embodiment of the present invention further includes a contact rotating mechanism 345 (shown in FIG. 13) for rotating the contact unit 32. It may include.

1 to 14, the contact rotating mechanism 345 may rotate the contact supporting mechanism 341 such that the contact pin 321 contacts an LED chip positioned at the test position TP. . The contact supporting mechanism 341 is coupled to the contact rotating mechanism 345. As the contact rotating mechanism 345 rotates the contact supporting mechanism 341, the contact unit 32 coupled to the contact supporting mechanism 341 may be rotated.

Therefore, the contact pin 32 is rotated according to the state in which the LED chip positioned at the test position TP is seated on the seating member 21, so that the contact pin 321 is positioned at the test position TP. Since the LED chip can be accurately contacted, the LED chip testing apparatus 1 according to the present invention can more accurately measure the performance of the LED chip.

The contact rotating mechanism 345 may include a contact rotating member 3451, a contact driving mechanism 3652, and a contact connecting mechanism 3503.

The contact supporting mechanism 341 is coupled to the contact rotating member 3451. The contact rotating member 3451 may be rotatably coupled to the contact connecting mechanism 3503, and may be rotated about the contact rotating shaft 3451a by the contact driving mechanism 3452. When the contact rotation member 3451 is rotated, the contact support mechanism 341 may be rotated, and thus the contact unit 32 coupled to the contact support mechanism 341 may be rotated.

The contact driving mechanism 3452 may rotate the contact rotating member 3451 about the contact rotating shaft 3451a. The contact driving mechanism 3452 may rotate the contact rotating member 3451 such that the contact pin 321 contacts the LED chip positioned at the test position TP. The contact driving mechanism 3452 may rotate the contact rotating member 3451 in a clockwise or counterclockwise direction about the contact rotating shaft 3451a.

The contact driving mechanism 3452 may include a motor 3502a. The motor 3502a may be directly coupled to the contact rotation shaft 3451a to rotate the contact rotation member 3452, and may be coupled to a shaft (not shown) coupled to the contact rotation shaft 3651a to allow the rotation member ( 22) may be rotated. When the motor 3452a is installed at a position spaced apart from the shaft (not shown), the contact driving mechanism 3452 further includes a pulley and a belt connecting the motor 3452a and the shaft (not shown). It may include.

The contact rotating mechanism 3651 and the contact driving mechanism 3452 are coupled to the contact connecting mechanism 3345. The contact rotating member 3451 may be coupled to an upper surface of the contact coupling mechanism 3503, and the contact driving mechanism 3452 may be coupled to a bottom surface of the contact coupling mechanism 3503.

The contact connecting mechanism 3503 may be coupled to the contact raising and lowering mechanism 343, and the contact raising and lowering mechanism 343 may be coupled to the contact moving mechanism 344. Accordingly, the contact connecting mechanism 3503 can be lifted up and down by the contact raising and lowering mechanism 343, and is shown in FIG. 1 by the contact moving mechanism 344 in a first horizontal direction (X-axis direction, FIG. 1). ) And the second horizontal direction (Y-axis direction, shown in Figure 1). Therefore, the contact rotating member 3501 and the contact unit 32 move in a first horizontal direction (X axis direction, shown in FIG. 1) and a second horizontal direction (Y axis direction, shown in FIG. 1). Can be raised and lowered. The contact connecting mechanism 3503 may be coupled to the contact moving mechanism 344, and the contact moving mechanism 344 may be coupled to the contact raising and lowering mechanism 343.

Here, the contact rotating mechanism 345 according to the present invention may be made in two embodiments according to the position of the contact rotating shaft (3451a), the following will be described sequentially with reference to the accompanying drawings for each embodiment.

As shown in the enlarged view of FIG. 14, the LED chip may include two pads P1 and P2, and the test is performed while the contact pins 321 are in contact with each of the pads P1 and P2. Can be. If the LED chip is positioned at the test position TP in a state where the LED chip is seated on the seating member 21 in the position and direction shown in the enlarged view of FIG. 14, the contact unit 32 is not moved or rotated in the horizontal direction. The contact pins 321 may be in contact with the pads P1 and P2 of the LED chip. However, as described above, the state in which the LED chip is mounted on the seating member 21 may change due to various factors.

In this case, in order to make an accurate test, in the contact rotating mechanism 345 according to the exemplary embodiment of the present invention, the contact driving mechanism 3652 is one end 321a of the contact pin 321 in contact with the LED chip. The contact rotating member 3501 may be rotated about the contact rotating shaft 3451a spaced apart from the predetermined distance from the contact rotating shaft 3451a. That is, the contact driving mechanism 3452 may rotate the contact rotating member 3451 about the contact rotating shaft 3451a spaced a predetermined distance from the seating member 21 positioned at the test position TP. have.

Referring to FIGS. 1 to 17, a process of contacting the contact pin 321 with the LED chip by the contact rotating mechanism 345 according to an embodiment of the present invention will be described below. 15 to 17 are conceptual views illustrating an operation process of the contact rotating mechanism 345 according to an embodiment of the present invention with reference to the enlarged view of FIG.

First, the LED chip may be positioned at the test position TP in a state as shown in FIG. 15 by being rotated at a predetermined distance and a predetermined angle from the position and direction shown in FIG. 14. 15 shows the state of the LED chip seated on the seating member 21 in the position and direction shown in Figure 14, the LED chip shown in solid line in Figure 15 is the test position The LED chip positioned at (TP) is moved and rotated by various factors as described above to show the mounted state on the seating member 21.

In this state, the contact driving mechanism 3452 rotates the contact rotating member 3401 about the contact rotating shaft 3501a so as to correspond to an angle at which the LED chip positioned at the test position TP is rotated. As illustrated in FIG. 16, the contact driving mechanism 3452 may rotate the contact rotating member 3451 in a counterclockwise direction about the contact rotating shaft 3451a. In this case, the contact unit 32 may be in a state of being lifted by the contact raising and lowering mechanism 343 so as not to collide with the LED chip positioned in the test position TP and the seating member 21. The first transfer member 33 may be in a state located at the first position.

When the contact pins 321 are rotated at an angle capable of contacting the pads P1 and P2 of the LED chip positioned at the test position TP, the contact movement mechanism 344 is shown in FIG. As described above, the contact support mechanism 341 is moved such that the contact pins 321 are positioned on the pads P1 and P2 of the LED chip positioned at the test position TP. This means that the contact moving mechanism 344 moves the contact raising and lowering mechanism 343 in a first horizontal direction (X axis direction, shown in FIG. 1) and a second horizontal direction (Y axis direction, shown in FIG. 1). This can be done by moving to.

When the contact pins 321 are positioned on the pads P1 and P2 of the LED chip positioned at the test position TP, the contact raising and lowering mechanism 343 may include the contact pins 321 at the test position TP. The contact unit 32 is lowered so as to be in contact with the pads P1 and P2 of the LED chip respectively positioned at the C). This may be achieved by the contact raising and lowering mechanism 343 descending the contact connecting mechanism 3503. The first transfer member 33 may be lowered by the contact raising and lowering mechanism 343 and positioned at the second position.

1 to 13 and 18 to 20, in the contact rotating mechanism 345 according to another embodiment of the present invention, the contact driving mechanism 3452 is a seating member located at the test position TP ( 21) The contact rotating member 3501 may be rotated about the contact rotating shaft 3451a positioned below. The seating member 21 positioned at the test position TP may be located between the contact unit 32 and the contact rotation shaft 3451a.

The contact rotating member 3451 may include a vertical frame 3451b to which the contact support mechanism 341 is coupled, and a horizontal frame 3451c rotatably coupled to the contact connection mechanism 3503. The contact driving mechanism 3452 may rotate the contact rotating member 3451 about the contact rotating shaft 3451a in the horizontal frame 3451c.

The vertical frame 3451b may be formed at a height at which the seating member 21 positioned at the test position TP may be positioned between the contact unit 32 and the horizontal frame 3541c. The horizontal frame 3451c has a seating member positioned at the test position TP at the vertical frame 3451b such that the contact rotation shaft 3501a is positioned below the seating member 21 positioned at the test position TP. It may be formed long toward the (21). The contact rotating member 3451 may be formed in a 'b' shape as a whole.

Accordingly, in comparison with the contact rotating mechanism 345 according to the above-described embodiment, the distance from which the contact rotating shaft 3501a is spaced apart from one end 321a of the contact pin 321 in contact with the LED chip. Can be reduced. Therefore, after the contact pins 321 are rotated at an angle capable of contacting the pads P1 and P2 of the LED chip positioned at the test position TP, the contact movement mechanism 344 is rotated. The distance at which the contact support mechanism 341 is moved to be positioned on the pads P1 and P2 of the LED chip positioned at the test position TP may be reduced.

The contact driving mechanism 3452 is configured to move the contact rotating member 3451 about the contact rotating shaft 3451a positioned on the same vertical line J as the one end 321a of the contact pin 321 contacting the LED chip. Can be rotated. When the contact unit 32 includes a plurality of contact pins 321, the contact rotation shaft 3501a is the same vertical line as one end 321a of any one of the contact pins 321. May be located on (J).

The contact driving mechanism 3452 rotates the contact rotating member 3501 about the contact rotating shaft 3501a positioned on the same vertical line I (shown in FIG. 10) as the center of the insertion hole 3322. You can. The contact rotation shaft 3501a may be positioned on the same vertical line I (shown in FIG. 10) as the center of the insertion hole 3322 and the center of the first through hole 331.

When the contact axis of rotation (3451a) is located on the same vertical line (I, shown in Figure 10) and the center of the insertion hole 3322, another embodiment of the present invention with reference to Figures 13, 18 to 20 When the contact pin 321 is in contact with the LED chip by the contact rotating mechanism 345 according to the following.

First, the LED chip may be positioned at the test position TP in a state as shown in FIG. 20 by being rotated at a predetermined distance and a predetermined angle from the position and direction shown in FIG. 14. The LED chip shown by dotted lines in FIG. 20 shows the state of the LED chip seated on the seating member 21 in the position and direction shown in FIG. 14, and the LED chip shown by solid lines in FIG. The LED chip positioned at (TP) is moved and rotated by various factors as described above to show the mounted state on the seating member 21.

In this state, the contact driving mechanism 3452 rotates the contact rotating member 3401 about the contact rotating shaft 3501a so as to correspond to an angle at which the LED chip positioned at the test position TP is rotated. As shown in FIG. 21, the contact driving mechanism 3452 may rotate the contact rotating member 3451 counterclockwise about the contact rotating shaft 3451a.

When the contact pins 321 are rotated at an angle capable of contacting each of the pads P1 and P2 of the LED chip positioned at the test position TP, the contact movement mechanism 344 is as shown in FIG. As described above, the contact support mechanism 341 is moved such that the contact pins 321 are positioned on the pads P1 and P2 of the LED chip positioned at the test position TP. This means that the contact moving mechanism 344 moves the contact raising and lowering mechanism 343 in a first horizontal direction (X axis direction, shown in FIG. 1) and a second horizontal direction (Y axis direction, shown in FIG. 1). This can be done by moving to. As compared to the contact rotating mechanism 345 according to the above-described embodiment as shown in FIG. 22, the contact moving mechanism 344 according to another embodiment of the present invention has a shorter distance than the contact supporting mechanism. By moving the 341, the contact support mechanism 341 may be moved such that the contact pins 321 are positioned on the pads P1 and P2 of the LED chip positioned at the test position TP.

Referring to FIG. 13, the main body 35 is installed next to the supply part 2. The contact movement unit 34 and the measurement unit 31 are respectively coupled to the main body 35. The main body 35 is a first frame 351 is coupled to the measuring unit 31 is formed long in the horizontal direction, the second frame is formed long in the lower direction (H arrow direction) from the first frame 351 352, and a third frame 353 to which the second frame 352 is coupled. The contact movement unit 34 may be coupled to an upper surface of the third frame 353. The contact lifting mechanism 343 or the contact movement mechanism 344 may be coupled to an upper surface of the third frame 353.

1 to 26, the LED chip test apparatus 1 may further include a second transfer member 36.

The second transfer member 36 may be coupled to the contact movement unit 34 to be positioned between the measurement unit 31 and the contact unit 32. Accordingly, since the LED chip test apparatus 1 may block a portion between the measuring unit 31 and the contact unit 32 with the second transfer member 36, the light emitted from the LED chip is measured by the measuring unit. The amount of passage between the 31 and the LED chip can be further reduced. The contact unit 32 may be coupled to the contact movement unit 34 to be positioned between the first transfer member 33 and the second transfer member 36. The second transfer member 36 and the contact unit 32 may be respectively coupled to the contact support mechanism 341.

The second transfer member 36 includes a second through hole 361 and a second transfer surface 362.

The second through hole 361 may be formed through the second transfer member 36. Light emitted by the LED chip may pass through the first through hole 331, the second through hole 361, and the light receiving hole 311 to be incident into the measuring unit 31. Accordingly, the light emitted by the LED chip may be incident into the measuring unit 31 without being disturbed by the first transfer member 33 and the second transfer member 36.

The second transfer member 36 may be formed such that the size of the second through hole 361 is gradually reduced in the direction (H arrow direction) toward the LED chip in the measuring unit 31. That is, the second through hole 361 may be formed to gradually decrease in size in the downward direction (H arrow direction) on the upper surface 36a of the second transfer member 36. The second through hole 361 may be formed such that the diameter of the second through hole 361 is gradually reduced in the downward direction (the direction of the H arrow) from the upper surface 36a of the second transfer member 36.

The second transfer surface 362 transfers the light emitted by the LED chip toward the measurement unit 31 such that the light emitted by the LED chip passes through the light receiving hole 311 and is incident to the measurement unit 31. Accordingly, since a larger amount of light may be incident into the measuring unit 31, the LED chip test apparatus 1 may more accurately measure the performance of the LED chip. The second transfer surface 362 may be formed of a material having a high reflectance or coated with such a material. For example, the second transfer surface 362 may be a surface of a metal or an alloy thereof, or may be a mirror coating of a metal or a resin material.

The second transfer surface 362 may be formed along the outer surface of the second through hole 361 so as to transmit light emitted from the LED chip toward the measurement unit 31. That is, as shown in the enlarged view of FIG. 24, the second transfer surface 362 is directed toward the upper direction (G arrow direction) from the bottom surface 36b of the second transfer member 36. It may be formed away from the center (K) of the through hole (361). When the second through hole 361 is gradually reduced in diameter in the downward direction (in the direction of the H arrow) from the upper surface 36a of the second transfer member 36, the second transfer surface 362 is generally It may be formed to form a curved surface.

The second transfer surface 362 and the first transfer surface 332 may be formed on one curved surface. That is, when the first transfer surface 332 and the second transfer surface 362 are connected to each other, the first transfer surface 332 and the second transfer surface 362 may be formed to form one curved surface. Can be. Light emitted by the LED chip may be transmitted toward the measuring unit 31 by the first transfer surface 332 and the second transfer surface 362.

The second transfer member 36 may further include an accommodation groove 363 capable of receiving the contact pin 321. The second transfer member 36 is the contact support mechanism 341 so that the contact pin 321 is positioned between the measuring unit 31 and the contact unit 32 in a state where the contact pin 321 is located in the receiving groove 363. ) May be combined. The second transfer member 36 may be formed in a '∩' shape as a whole.

Referring to FIG. 25, the second transfer member 36 may further include a second protruding member 364. In FIG. 25, the second transfer member 36 is illustrated as being coupled to the measurement unit 31, but the second transfer member 36 has the second protruding member 364 attached to the light receiving hole 311. It may be coupled to the contact moving unit 34 in the inserted state.

The second protruding member 364 may be formed to protrude in a direction (G arrow direction) toward the measuring unit 31 from the LED chip positioned at the test position TP. That is, the second protruding member 364 may be formed to protrude in an upward direction (G arrow direction) from the upper surface 36a of the second transfer member 36. The second protruding member may be inserted into the measuring unit 31 through the light receiving hole 311.

The second protruding member 364 may include a second inclined surface 3641 formed to extend to the second transfer surface 362. That is, the second transfer surface 362 and the second inclined surface 3641 may be formed to form one curved surface. Accordingly, the second transfer surface 362 and the second inclined surface 3641 may transmit light emitted from the LED chip toward the measuring unit 31.

Therefore, since the second transfer member 36 can increase the area for transmitting the light emitted by the LED chip toward the measurement unit 31, the LED chip test apparatus 1 is inside the measurement unit 31. As a result, a larger amount of light can be incident, and the performance of the LED chip can be measured more accurately. The second inclined surface 3641 may be formed of a material having high reflectance or coated with such a material. For example, the second inclined surface 3641 may be a surface of a metal or an alloy thereof, or may be mirror coated with a metal or a resin material.

On the other hand, as described above, since the second transfer member 36 may be coupled to the contact support mechanism 341 together with the contact unit 32, the second transfer member 36 may deform the contact unit 32. It may also have a function of preventing the reinforcing plate. In this case, it is preferable to firmly couple the second transfer member 36 to the contact unit 32 by screwing or the like.

Alternatively, although not shown, a separate reinforcing plate may be coupled to the contact unit 32. For example, when the contact unit 32 is a probe card, the reinforcing plate may be a plate or a structure having a predetermined shape to be integrally coupled to the upper or lower surface of the probe card to prevent deformation of the probe card. The reinforcement plate functions to prevent deformation of the probe card due to external mechanical stress or thermal stress. To this end, the reinforcing plate is preferably made of a material having a higher strength and / or rigidity than the probe card and a low thermal expansion coefficient. Therefore, the reinforcement plate may be made of a material such as metal or alloy, or a nonmetal material such as resin or ceramic. Examples of these materials include steel, titanium, nickel, invar, kovar, graphite, epoxy, ceramic, carbon fiber-reinforced polymer (CFRP), or these and / or other materials. Arbitrary alloys and mixtures thereof.

1, 2, 25, and 26, the second transfer member 36 according to a modified embodiment of the present invention may be coupled to the measurement unit 31.

The second transfer member 36 may be coupled to the measurement unit 31 to protrude in the direction (H arrow direction) toward the LED chip positioned at the test position TP in the measurement unit 31. That is, the second transfer member 36 may be coupled to the measurement unit 31 to protrude in the downward direction (H arrow direction) from the measurement unit 31.

As shown in FIG. 25, the second transfer member 36 may be coupled to the measurement unit 31 with the second protruding member 364 inserted into the light receiving hole 311. Accordingly, since the second transfer member 36 may increase the area for transmitting the light emitted by the LED chip toward the measurement unit 31, the LED chip test apparatus 1 may measure the measurement unit 31. More light can be injected into the interior, and the performance of the LED chip can be measured more accurately.

The second transfer member 36 may be coupled to the measurement unit 31 by the second protruding member 364 is inserted into the light receiving hole 311 and fitted. The second transfer member 36 may be coupled to the measurement unit 31 by a fastening member such as a bolt while the second protruding member 364 is inserted into the light receiving hole 311.

As shown in FIG. 26, the second transfer member 36 may be coupled to the measurement unit 31 such that the measurement unit 31 is positioned in the second through hole 361. The second transfer member 36 may be coupled to the measurement unit 31 by a fitting method, or may be coupled to the measurement unit 31 by a fastening member such as a bolt.

1, 2, 27 and 28, the second transfer member 36 according to another modified embodiment of the present invention, one side is coupled to the measuring unit 31, the other side is the contact May be coupled to the unit 32. The second transfer member 36 may be coupled to the contact body 322 at the other side. Although not shown, one side of the second transfer member 36 may be coupled to the measurement unit 31, and the other side may be coupled to the contact support mechanism 341.

An insertion groove 365 into which the contact pin 321 may be inserted may be formed in the second transfer member 36. When the contact unit 32 includes a plurality of contact pins 321, a plurality of insertion grooves 365 may be formed in the second transfer member 36. The second transfer member 36 may have the same number of insertion grooves 365 as the contact pins 321.

The second transfer member 36 may be coupled to the contact body 322 on the other side while the contact pin 321 is inserted into the insertion groove 365, and one side may be connected to the measurement unit 31. Can be combined. Accordingly, the second transfer member 36 may block the gap between the measurement unit 31 and the contact unit 32, so that light emitted from the LED chip does not pass between the measurement unit 31 and the LED chip. Can be. Therefore, the LED chip test apparatus 1 may allow a greater amount of light to enter the measurement unit 31 and more accurately measure the performance of the LED chip.

When the second transfer member 36 is coupled to the measurement unit 31 and the contact body 322, the measurement unit 31 may be movably coupled to the main body 35. Accordingly, when the contact movement unit 34 moves the contact unit 32, the measurement unit 31 coupled to the contact unit 32 may also move together. To this end, the main body 35 may include a first connection frame 354, a second connection frame 355, and a third connection frame 356. The measuring unit 31 may be coupled to the third connection frame 346.

The first connection frame 354 may be coupled to the first frame 351 to be lifted and lowered. Accordingly, when the contact movement unit 34 raises and lowers the contact unit 32, the first connection frame 354 may move up and down, and thus the measurement unit 31 may also move up and down. have. The first frame 351 may include an LM rail, and the first connection frame 354 may include an LM block movably coupled to the LM rail of the first frame 351.

The second connection frame 355 may be coupled to the first connection frame 354 so as to be movable in a first horizontal direction (X-axis direction). Accordingly, when the contact movement unit 34 moves the contact unit 32 in the first horizontal direction (X axis direction), the second connection frame 355 moves in the first horizontal direction (X axis direction). ), And thus the measuring unit 31 may be moved in the first horizontal direction (X-axis direction). The first connection frame 354 may include an LM rail, and the second connection frame 355 may include an LM block movably coupled to the LM rail of the first connection frame 354. .

The third connection frame 356 may be movably coupled to the second connection frame 355 in a second horizontal direction (Y-axis direction) perpendicular to the first horizontal direction (X-axis direction). Accordingly, when the contact movement unit 34 moves the contact unit 32 in the second horizontal direction (Y axis direction), the third connection frame 356 moves in the second horizontal direction (Y axis direction). ), And thus the measuring unit 31 may be moved in the second horizontal direction (Y-axis direction). The second connection frame 355 may include an LM rail, and the third connection frame 356 may include an LM block movably coupled to the LM rail of the second connection frame 355. .

The measuring unit 31 may be rotatably coupled to the third connection frame 356. Accordingly, when the contact movement unit 34 rotates the contact unit 32, the measurement unit 31 may also rotate.

As described above, when the contact movement unit 321 moves the contact unit 32 such that the contact pin 321 contacts the LED chip positioned at the test position TP, the measurement unit 31 Since it moves together, the LED chip located at the test position (TP) can be tested in a state positioned on the same vertical line as the center of the light receiving hole (311) irrespective of the position seated on the seating member (21) have. Therefore, the LED chip test apparatus 1 can more accurately measure the performance of the LED chip.

29 to 31, the contact unit 32 according to the modified embodiment of the present invention includes a contact pin 321, a first body 324, a second body 325, and a third body 326. , And a coupling member 327. The contact unit 32 may be moved up and down by the contact movement unit 34 and may be moved in the first horizontal direction (X-axis direction) and the second horizontal direction (Y-axis direction). The test unit 3 may include a plurality of contact units 32 according to a modified embodiment of the present invention.

The contact pin 321 is coupled to the first body 324. The first body 324 is coupled to the second body 325. The first body 324 may be elongated in the direction toward the LED chip positioned at the test position TP in the second body 325. The first body 324 may be electrically connected to a tester (not shown), and the contact pin 321 may be electrically connected to a tester (not shown) through the first body 324.

The contact pin 321 may be detachably coupled to the first body 324 by a connection member 3321. Accordingly, when the contact pin 321 is damaged or broken, the user may easily replace only the contact pin 321. Even when the LED chip to be tested is replaced with an LED chip having a different specification from the existing one, the user can easily replace the contact pin 321 meeting the specifications of the new LED chip.

The connection member 3241 may be rotatably coupled to the first body 324. As the connecting member 3321 is rotated in one direction, the connecting member 3241 may couple the contact pin 321 to the first body 324 by applying a force to the first body 324. As the connecting member 3241 is rotated in the other direction, the force applied to the first body 324 by the connecting member 3321 is removed, so that the contact pin 321 is removed from the first body 324. It may be in a detachable state. A fastening member (not shown) such as a bolt may be used as the connection member 3241.

The first body 324 is coupled to the second body 325. The second body 325 and the third body 326 may be detachably coupled by the coupling member 327. Accordingly, when it is necessary to replace the contact pins 321, the contact pins 321 may be easily replaced by separating the second body 325 from the third body 326. The second body 325 may be electrically connected to a tester (not shown), and the contact pin 321 may be connected to a tester (not shown) through the first body 324 and the second body 325. Can be electrically connected.

The second body 325 is coupled to the third body 326. The second body 325 may be detachably coupled to the third body 326 by the coupling member 327. The third body 326 may be coupled to the contact movement unit 34. As the third body 326 is moved by the contact movement unit 34, the second body 325, the first body 324, and the contact pin 321 may be moved together. The third body 326 may be electrically connected to a tester (not shown), and the contact pin 321 may be the first body 324, the second body 325, and the third body 326. ) May be electrically connected to a tester (not shown).

The coupling member 327 detachably couples the second body 325 and the third body 326. A fastening member (not shown) such as a bolt may be used as the coupling member 327.

31 to 33, the test unit 3 according to the modified embodiment of the present invention may further include a contact mechanism 37.

The contact mechanism 37 includes a contact hole 371 in contact with a seating member 21 positioned at the test position TP. The contact mechanism 37 may be installed next to the rotating member 22 such that the contact hole 371 may contact the seating member 21 positioned at the test position TP.

The LED chip positioned at the test position TP while the contact hole 371 is in contact with the seating member 21 positioned at the test position TP and the contact pin 321 contacts the LED chip. The light may be emitted by the power applied through the contact unit 32 and the contact hole 371. The contact unit 32 and the contact mechanism 37 may emit an LED chip in association with a tester (not shown). The contact unit 32 and the contact mechanism 37 may test the electrical characteristics of the LED chip in conjunction with a tester (not shown).

The contact hole 371 may be in contact with a side surface of the seating member 21 positioned at the test position TP. The contact hole 371 may be elongated in a direction toward the seating member 21 positioned at the test position TP.

The contact mechanism 37 may further include a contact movement means 372 for moving the contact hole 371 such that the contact hole 371 is closer to or away from the seating member 21.

When the LED chip to be tested is positioned at the test position TP, the contact movement means 372 contacts the contact hole 371 so as to be closer to the seating member 21 positioned at the test position TP. The sphere 371 is moved. The contact hole 371 may be moved by the contact moving means 372 to be in contact with the seating member 21 positioned at the test position TP.

When the test of the LED chip positioned at the test position TP is completed, the contact movement means 372 moves the contact hole 371 away from the seating member 21 positioned at the test position TP. The contact hole 371 is moved. The contact hole 371 may be moved by the contact moving means 372 to be spaced apart from the mounting member 21 positioned at the test position TP.

Accordingly, when the rotating member 22 is rotated to place the new LED chip to be tested at the test position TP, the mounting member 21 and the contact hole 371 do not come into contact or collide with each other. Can be. Therefore, the mounting member 21 and the contact hole 371 can be prevented from being worn by friction or damaged by a collision.

The contact moving means 372 may move the contact hole 371 by using a hydraulic cylinder or a pneumatic cylinder. The contact movement means 372 may move the contact hole 371 by using a converter mechanism for converting a rotational motion of the motor and the motor into a linear movement. The converter mechanism may be a pulley and a belt, a rack-pinion gear, a ball screw, a cam member, or the like. The contact hole 371 is coupled to the contact movement means 372.

Here, when the seating member 21 is formed in a cylindrical shape as a whole, the contact hole 371 may not accurately contact the seating member 21 by slipping or the like in the process of contacting the seating member 21. have. To prevent this, the seating member 21 may further include a contact surface 215 to which the contact hole 371 is in contact.

The contact surface 215 may be formed at a side facing the contact hole 371 from the seating member 21 when the seating member 21 is positioned at the test position TP. Due to the contact surface 215, the mounting member 21 may have a side surface facing the contact hole 371. Accordingly, since the contact hole 371 may minimize the occurrence of slips and the like in the process of contacting the seating member 21, the LED chip test apparatus 1 according to the present invention may include the contact hole 371. The LED chip can be tested in a state in which the mounting member 21 is correctly contacted.

The mounting member 21 includes a contact surface 215 where the contact hole 371 and the contact surface 215 may be perpendicular to each other when the contact hole 371 is in contact with the contact surface 215. can do. The seating member 21 may include a contact groove 21c formed by recessing a predetermined depth from a side at which the contact surface 215 is formed.

The contact hole 371 according to the modified embodiment of the present invention may be coupled to the contact body 322, as shown in FIGS. 20 to 22. The contact hole 371 may be coupled to the contact body 322 while being in contact with the terminal 3221. When the contact pin 321 is in contact with the LED chip positioned at the test position TP, the contact hole 371 is on the upper surface 21b of the seating member 21 located at the test position TP. It may be coupled to the contact body 322 to be in contact. The contact hole 371 may be in contact with the contact member 211 (shown in FIG. 3).

Accordingly, the contact moving unit 34 moves the contact unit 32 so that the contact pin 321 is in contact with the LED chip located at the test position TP. The contact hole 371 may be in contact with the upper surface 21b of the seating member 21 positioned at the test position TP. A plurality of contact holes 371 may be coupled to the contact body 322.

32 and 33, the first transfer member 33 according to the modified embodiment of the present invention protrudes from the measuring unit 31 toward the LED chip positioned at the test position TP. It may be installed in the measuring unit 31. When the LED chip is tested, when the measuring unit 31 is positioned above the LED chip, the first transfer member 33 may be formed to protrude downward from the measuring unit 31.

Although not shown, the first transfer member 33 may be installed on the seating member 21 to protrude in the direction from the seating member 21 toward the measuring unit 31. When the measurement unit 31 is positioned above the LED chip when the LED chip is tested, the first transfer member 33 may be formed to protrude upward from the seating member 21. An LED chip and the support member 312 may be located inside the first transfer member 33.

The first transfer member 33 has a groove 334 through which the contact pin 321 passes. Accordingly, even if the contact unit 32 is located between the measurement unit 31 and the LED chip, the LED chip can be tested in a state in which the first transfer member 33 is located close to the LED chip. Therefore, since a larger amount of light emitted by the LED chip can be incident to the measuring unit 31 through the first transfer member 33, the performance of the LED chip can be accurately measured.

The first transfer member 33 may be formed in a hollow cylindrical shape as a whole. The groove 334 may be formed in the direction in which the contact unit 32 is installed in the first transfer member 33. The inside of the first transfer member 33 may be formed of a material having high reflectance or coated with such a material. For example, the inside of the first transfer member 33 may be a polished surface of a metal or an alloy thereof, or may be a mirror coating of a metal or a resin material.

The groove 334 formed in the first transfer member 33 may have a size that allows the contact pin 321 to pass through. The contact pin 321 may be in contact with the LED chip positioned at the test position TP through the groove 334.

32 and 33, the test unit 3 according to a modified embodiment of the present invention may further include a measurement elevating unit 38.

The measuring raising and lowering unit 38 may be coupled to the main body 35 and raise and lower the measuring unit 31. The measuring unit 31 may be coupled to the first frame 351 to be moved up and down.

The measurement raising and lowering unit 38 may raise the measuring unit 31 when the rotating unit 23 rotates the rotating member 22. When the LED chip to be tested is positioned at the test position TP, the measurement raising and lowering unit 38 may lower the measuring unit 31. Accordingly, the LED chip test apparatus 1 according to the present invention can be tested in a state in which the LED chip located at the test position (TP) is located close to the measuring unit 31.

Therefore, the LED chip test apparatus 1 according to the present invention can allow a larger amount of light emitted by the LED chip to be incident to the measuring unit 31 through the first transfer member 33. The branch can measure the performance more accurately.

When the first transfer member 33 is installed on the seating member 21, the LED chip test apparatus 1 according to the present invention is the first transfer member 33 when the rotating member 22 is rotated While reducing the possibility of collision with the measuring unit 31, the LED chip can be tested in a state where the measuring unit 31 is located close to the first transfer member 33. It is also possible to allow the LED chip to be tested while the first transfer member 33 is inserted into the measurement unit 31 or the first transfer member 33 is in contact with the measurement unit 31. Do.

The measuring raising and lowering unit 38 may raise and lower the measuring unit 31 using a hydraulic cylinder or a pneumatic cylinder. The measuring raising and lowering unit 38 may raise and lower the measuring unit 31 by using a motor and connecting means respectively coupled to the motor and the measuring unit 31. The connecting means may include a pulley and a belt, a ball screw, a cam member, and the like.

The LED chip test apparatus 1 according to the present invention, that is, the supply unit 2 and the test unit 3 has been described. Next, a preferred embodiment of the rest of the LED chip sorting apparatus 10 according to the present invention, that is, the loading section 4, the unloading section 9, and other components will be described in detail with reference to the accompanying drawings.

FIG. 35 is a schematic perspective view of the first supply mechanism and the first supply unit, FIG. 36 is a side view of FIG. 35, FIG. 37 is a schematic perspective view of the first supply body, the first supply support device, and the loading unit, and FIG. 38 is 37 is a schematic enlarged side cross-sectional view of part L of FIG. 37, FIG. 39 is a perspective view schematically showing a first supply unit and a loading unit, FIG. 40 is a perspective view schematically showing a first storage unit, and FIG. 41 is a first transport unit. 42 is a schematic perspective view of a first supply body, a first supply support device, a loading unit, and a first cooling unit, and FIGS. 43 to 45 are first cooling views according to a modified embodiment of the present invention. A schematic enlarged side view of part M of FIG. 42 for the unit.

34 and 35, the loading unit 4 supplies the LED chip to be tested. The loading part 4 may be installed next to the supply part 2. The loading unit 4 may use a supply mechanism 100 for supplying a plurality of LED chips to be tested.

34 to 36, the supply mechanism 100 includes a housing 101 in which a hollow part (not shown) is formed, and a supply member 102 in which the LED chips to be tested are located and coupled to the housing 101. ) May be included. The supply member 102 may be a tape having an adhesive material. The LED chips to be tested may be attached to the top surface of the supply member 102. The supply member 102 may be a blue tape, and the LED chips to be tested through the breaking and expansion process may be attached to the blue tape at predetermined intervals.

The housing 101 may be formed in a disk shape as a whole. The housing 101 may include the hollow part (not shown) which is formed in a disk shape as a whole. The housing 101 and the hollow part (not shown) may be formed in other shapes such as an elliptical disc shape and a rectangular shape in addition to the disc shape.

Although not shown, the loading unit 4 may use a supply mechanism 100 having a plurality of receiving grooves in which the LED chip to be tested is formed.

34 to 39, the loading unit 4 may include a first supply unit 41 and a loading unit 42.

The first supply unit 41 moves the supply mechanism 100 such that the LED chip to be tested is positioned at the first pickup position PP1 through which the loading unit 42 can pick up the LED chip to be tested. The first supply unit 41 may include a first supply body 411, a first supply support device 412, a first alignment unit 413, and a first moving unit 414.

The first supply body 411 supports the bottom of the supply mechanism 100. The first supply body 411 may be moved in the X axis direction and the Y axis direction by the first moving unit 414. As the first supply body 411 moves, the supply mechanism 100 may be moved such that the LED chip to be tested is positioned at the first pick-up position PP1.

The first supply body 411 may be moved in the X axis direction and the Y axis direction by the first moving unit 414, and may be rotated. As the first supply body 411 moves and rotates, when the loading unit 42 picks up the LED chip to be tested, the supply mechanism 100 picks up the LED chip to be tested in the same direction. Can be moved. Accordingly, the loading unit 42 may be transferred to the supply unit 2 while all the LED chips to be tested face the same direction.

34 to 39, the first supply support device 412 may support the bottom surface of the LED chip to be tested picked up by the loading unit 42. The first supply support device 412 may support the bottom surface of the supply member 102 under the first pickup position PP1. It may be installed to be located in the first supply space (411a) formed in the first supply body 411.

The first supply support device 412 may include a first elevating member 4121, a first elevating device 4122, a first support pin 4123, and a first pin elevating device 4124. .

The first elevating member 4121 may support the bottom surface of the supply member 102 below the first pickup position PP1. The first elevating member 4121 may be coupled to the first elevating device 4122 and elevated by the first elevating device 4122. The first elevating member 4121 may be elongated in the vertical direction (Z-axis direction), and may be formed in a cylindrical rod shape as a whole.

The first support pin 4123 is coupled to the inner side of the first elevating member 4121 so that the elevating member can move up and down. The first lifting member 4121 has a first through hole 4121a through which the first support pin 4123 may be formed so that the first support pin 4123 may be protruded upward. have.

The first elevating device 4122 may elevate the first elevating member 4121. The first raising and lowering device 4122 is provided when the supply mechanism 100 is positioned on the first supply body 411 or when the supply mechanism 100 is removed from the first supply body 411. The first lifting member 4121 may be lowered. When the first elevating device 4122 lowers the first elevating member 4121, the first elevating member 4121 may be spaced apart from the supply member 102. When the supply mechanism 100 is positioned on the first supply body 411, the first elevating device 4122 may raise the first elevating member 4121. When the first elevating device 4122 raises the first elevating member 4121, the first elevating member 4121 may support the bottom surface of the supply member 102.

The first elevating device 4122 is the first elevating member 4121 by using a cylinder such as a hydraulic cylinder or pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. ) Can be raised and lowered.

The first support pin 4123 may be coupled to the inner side of the first elevating member 4121 to be elevated and lowered, and may be elevated by the first pin elevating device 4124. The first support pin 4123 may be coupled to the first pin lift device 4124. The first support pin 4123 may be formed long in the vertical direction (Z-axis direction), and may be formed in a conical shape as a whole.

The first pin lifter 4124 may lift the first support pin 4123 up and down. The first pin lifting device 4124 may raise the first support pin 4123 when the loading unit 42 picks up the LED chip located at the first pick-up position PP1. Accordingly, the first support pin 4123 may protrude upward from the first elevating member 4121 through the first through hole 4121a and be led by the loading unit 42. Can be pushed upwards. Therefore, the loading unit 42 can be easily picked up the LED chip to be tested. When the loading unit 42 picks up the LED chip to be tested, the first pin elevating device 4124 allows the first support pin 4123 to be positioned inside the first elevating member 4121. The support pin 4123 may be lowered.

The first pin lift device 4124 may include the first support pin 4123 by a cylinder, such as a hydraulic cylinder or a pneumatic cylinder, a pulley and a belt, a ball screw, or a cam member. Can be raised and lowered.

34 to 39, the first alignment unit 413 aligns the position of the supply mechanism 100 supported by the first supply body 411. The first alignment unit 413 includes a first fixing member 4131, a first moving member 4132, and a first moving mechanism 4133.

The first fixing member 4131 is installed on the first supply body 411 and determines the position of the supply mechanism 100. The first fixing member 4131 may be coupled to the first supply body 411 to protrude a predetermined length upward from an upper surface of the first supply body 411. The supply mechanism 100 may be aligned by contact with the first fixing member 4131. The first alignment unit 413 may include a plurality of first fixing members 4131.

The first moving member 4132 may be coupled to the first moving mechanism 4133 and moved by the first moving mechanism 4133. The first moving member 4132 may be coupled to the first moving mechanism 4133 to protrude a predetermined length upward from an upper surface of the first supply body 411. The first moving member 4132 may be located at a position opposite to the position where the first fixing member 4131 is installed in the first supply body 411. The first alignment unit 413 may include a plurality of first moving members 4132.

The first moving member 4132 may be moved closer to or farther from the first fixing member 4131 by the first moving mechanism 4133. When the first moving member 4132 is moved closer to the first fixing member 4131, the supply mechanism 100 is pushed by the first moving member 4132 to the first fixing member 4131. Can be contacted. Accordingly, the supply mechanism 100 may be aligned in position.

The first moving mechanism 4133 may be coupled to the first supply body 411 and move the first moving member 4132. The first moving mechanism 4133 may move the first moving member 4132 until the supply mechanism 100 contacts the first fixing member 4131. The first moving mechanism 4133 may move the first moving member 4132 using a hydraulic cylinder or a pneumatic cylinder. The first moving mechanism 4133 may move the first moving member 4132 by a method using a pulley and a belt, a method using a ball screw, or a method using a cam member.

34 to 39, the first moving unit 414 may move the first supply body 411 such that the LED chip to be tested is positioned at the first pick-up position PP1. The first moving unit 414 may move the first supply body 411 in the X-axis direction and the Y-axis direction.

The first moving unit 414 has a first upper member 4141 to which the first supply body 411 is movably coupled and a first lower member to which the first upper member 4141 is movably coupled. 4142).

The first supply body 411 and the first upper member 4141 may be moved in a direction perpendicular to each other. When the first upper member 4141 is movably coupled to the first lower member 4422 in the X-axis direction, the first supply body 411 is in the Y-axis direction with the first upper member 4141. It can be movably coupled. When the first upper member 4141 is movably coupled to the first lower member 4142 in the Y-axis direction, the first supply body 411 is connected to the first upper member 4141 in the X-axis direction. It can be movably coupled.

The first moving unit 414 moves the first supply body 411 and the first upper member 4141 by a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. Can be.

The first moving unit 414 may rotate the first supply body 411. The first moving unit 414 may rotate the first supply body 411 so that the loading unit 42 picks up the LED chip in a direction that can be tested by the test unit 3. .

2, 34 to 39, the loading unit 42 picks up the LED chip to be tested in the supply mechanism 100 and seats the seating member 21 located at the loading position LP. . The loading unit 42 may include a loading rotary arm 421 and a loading driving unit 422.

The loading rotary arm 421 is provided with a loading picker 4211 for adsorbing the LED chip to be tested. The loading rotary arm 421 may be lifted up and down by lifting means (not shown). The loading rotary arm 421 is rotated by the loading driving unit 422, and the loading picker 4211 may be reciprocated to be positioned at the loading position LP and the first pickup position PP1.

The loading unit 42 may include one loading rotary arm 421 and one loading picker 4211. Although the loading rotary arm 421 and the loading picker 4211 are illustrated in three in FIG. 4, this is to indicate a reciprocating movement path of the loading rotary arm 421.

The loading driving arm 421 is coupled to the loading driving unit 422. The loading driving unit 422 may rotate the loading rotary arm 421 such that the loading picker 4211 is positioned at the loading position LP or the first pickup position PP1.

Although not shown, the loading unit 42 may include a plurality of loading rotary arms 421 and a plurality of loading pickers 4211 respectively coupled to the loading rotary arms 421. The loading driving unit 422 rotates the loading rotary arms 421 about a rotation axis (not shown), and any one of the loading pickers 4211 is positioned at the first pickup position PP1, One of the loading pickers 4211 may be positioned at the loading position LP. The loading driving unit 422 may sequentially position the loading pickers 4211 at the first pick-up position PP1 and the loading position LP.

The loading driving unit 422 may include a motor, and may further include a pulley and a belt if the motor and the loading rotary arm 421 are spaced apart by a predetermined distance.

34 to 39, the loading unit 42 may further include a loading vision unit 423.

The loading vision unit 423 may be installed to be positioned above the first pick-up position PP1, and may check the state of the LED chip positioned at the first pick-up position PP1. The loading vision unit 423 may check whether the LED chip to be tested is located at the first pick-up position PP1, and the degree of rotation of the LED chip located at the first pick-up position PP1. The first mobile unit 414 is configured such that the LED chip positioned at the first pickup position PP1 is accurately picked up by the loading unit 42 from the state information of the LED chip acquired by the loading vision unit 423. The first supply body 411 may be moved. A CCD camera may be used as the loading vision unit 423.

34 to 39, when the loading unit 42 includes the loading vision unit 423, the loading rotary arm 421 may further include a first penetrating member 4212.

The first transmission member 4212 may be coupled to the loading picker 4211 and formed of a material having high transparency. For example, the first transmission member 4212 may be formed of glass. As illustrated in FIG. 38, a first intake hole 4211a is formed in the loading picker 4211 so that the LED chip may be adsorbed. The first intake hole 4211a may be formed through the loading picker 4211. The first transmission member 4212 may be coupled to the loading picker 4211 at one side of the first intake hole 4211a, and thus may seal one side of the first intake hole 4211a. Therefore, the LED chip may be adsorbed to the loading picker 4211. Although not shown, the first intake hole 4211a may be connected to the intake apparatus.

The first transmission member 4212 may pass light passing through the first intake hole 4211a. Accordingly, even when the loading picker 4211 is positioned at the first pick-up position PP1, the first transmission member 4212 may allow the loading vision unit 423 to move to the first pick-up position PP1. It is possible to check the status of the placed LED chip. The loading vision unit 423 may check the state of the LED chip positioned at the first pickup position PP1 through the first transmission member 4212 and the first intake hole 4211a. Accordingly, the first mobile unit 414 is an LED chip positioned at the first pick-up position PP1 from the state information of the LED chip acquired by the loading vision unit 423 to accurately match the loading unit 42. The first supply body 411 may be moved to be picked up.

The first transmission member 4212 may also be used in the process of aligning positions of the first support pin 4123, the loading picker 4211, and the loading vision unit 423. Even when the loading picker 4211 is positioned at the first pick-up position PP1, the loading vision unit 423 is configured to pass through the first penetrating member 4212 and the first intake hole 4211a. 1 You can check the position of the support pin (4123). Accordingly, the loading vision unit 423, the first support pin 4123, and the loading so that the loading picker 4211 accurately picks up the LED chip positioned at the first pick-up position PP1. The position of the picker 4211 can be easily aligned. The loading vision unit 423, the first support pin 4123, and the loading picker 4211 may be aligned to be positioned on the same vertical line.

34 to 40, the loading unit 4 may further include a first storage unit 43.

The first storage unit 43 includes a first storage mechanism 431 capable of storing a plurality of the supply mechanism 100.

The first storage mechanism 431 may include a plurality of first storage members 4311 for supporting both bottom surfaces of the supply mechanism 100. The first storage members 4311 may be formed in plural numbers spaced apart from each other by a predetermined distance in a vertical direction (Z-axis direction). The space in which the first storage members 4311 are spaced apart from each other may be a first storage groove 4312.

34 to 41, the loading unit 4 may further include a first transfer unit 44.

The first transfer unit 44 may transfer the supply mechanism 100 from the first storage mechanism 431 to the first supply body 411, the first supply body 411 to the first The supply mechanism 100 may be transferred to the storage mechanism 431.

When the supply mechanism 100 positioned in the first supply body 411 becomes empty as the loading process is completed, the first transport unit 44 moves the empty supply mechanism 100 to the first supply body 411. ) May be transferred to the first storage device 431. If there is no supply mechanism 100 in the first supply body 411, the first transfer unit 44 is a new supply mechanism 100 to supply the LED chip to be tested in the first storage mechanism 431 It can be transferred to the first supply body (411).

Therefore, the LED chip sorting apparatus 10 according to the present invention can automatically supply the supply mechanisms 100 to supply the LED chip to be tested to the first supply body 411, so that the loading process can be continuously performed. In addition, it is possible to eliminate the loss of work time caused by manual work.

The first transfer unit 44 may include a first transfer member 441 and a first transfer mechanism 442.

The first transfer member 441 may hold the supply mechanism 100, and may include a first holding member 4411, a second holding member 4412, a first driving mechanism 4413, and a first connecting body. 4442.

The first holding member 4411 is in contact with an upper surface of the supply mechanism 100. The first gripping member 4411 is rotatably coupled to the first connecting body 4414. The first holding member 4411 may be moved closer to or farther away from the second holding member 4412 by the first driving mechanism 4413.

The second gripping member 4412 is in contact with the bottom surface of the supply mechanism 100. The second gripping member 4412 is coupled to the first connecting body 4414. The first holding member 4411 is in contact with the upper surface of the supply mechanism 100, and the second holding member 4412 is in contact with the bottom surface of the supply mechanism 100, thereby providing the first transfer member 441. May grasp the supply mechanism 100. The supply mechanism 100 may be gripped by the first transfer member 441 by a predetermined force applied by the first grip member 4411.

The first driving mechanism 4413 may move the first gripping member 4411 so that the first gripping member 4411 and the second gripping member 4412 move closer or farther from each other.

The first driving mechanism 4413 may move the first holding member 4411 closer to or away from the second holding member 4412 by rotating the first holding member 4411. In this case, the first gripping member 4411 is rotatably coupled to the first connecting body 4414.

The first drive mechanism 4413 is coupled to the first connection body 4414. The first drive mechanism 4413 may include a hydraulic cylinder or a pneumatic cylinder, and the first gripping member 4411 may be coupled to a rod of such a cylinder. As the rod of the cylinder is moved, the first gripping member 4411 may be rotated about the rotation shaft 4411a.

The first gripping member 4411, the second gripping member 4412, and the first driving mechanism 4413 are coupled to the first connection body 4414. The first connecting body 4414 is coupled to the first transfer mechanism 442.

The first transfer mechanism 442 moves the first transfer member 441 between the first storage mechanism 431 and the first supply unit 41.

The first transfer mechanism 442 may move the first transfer member 441 such that the empty supply mechanism 100 is transferred from the first supply body 411 to the first storage mechanism 431. have. The first transfer mechanism 441 is configured to transfer the new supply mechanism 100 for supplying the LED chip to be tested from the first storage mechanism 431 to the first supply body 411. ) Can be moved.

The first transfer mechanism 442 may be configured to use the first transfer member 441 in a manner using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. You can move it.

The first transport mechanism 442 may be coupled to the first gantry 443. The first connecting body 4414 is movably coupled to the first gantry 443. The first connection body 4414 may move in the Y-axis direction along the first gantry 443.

The supply mechanism 100 may be stacked and stored in the vertical direction (Z-axis direction) in the first storage mechanism 431. In this case, the first storage unit 43 may further include a first storage raising and lowering mechanism 432.

The first storage raising and lowering mechanism 432 may raise and lower the first storage mechanism 431. The first storage raising and lowering mechanism 432 is the first storage mechanism 431 such that the supply mechanism 100 is positioned at a position where the first transfer member 441 can hold the supply mechanism 100. Can be raised and lowered. The first storage raising and lowering mechanism 432 can raise and lower the first storage mechanism 431 so that the first transfer member 441 can store the empty supply mechanism 100 in the storage mechanism 231. Can be.

The first storage raising and lowering mechanism 432 is the first storage mechanism 431 by using a cylinder such as a hydraulic cylinder or pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. ) Can be raised and lowered.

In addition to the manner in which the first storage mechanism 431 is moved up and down by the first storage raising and lowering mechanism 432, the first transfer member 441 may be raised and lowered, and the first transfer member 441 And both of the first storage mechanism 431 may be raised and lowered.

The first storage lifting mechanism 432 may include a first vertical body 4321 and a first lifting body 4322. The first lifting body 4322 is coupled to the first vertical body 4321 so that the lifting device can be lifted up and down.

The first storage device 431 may be detachably coupled to the first lifting body 4322. Accordingly, when only empty supply devices 100 are stored in the first storage device 431, the first storage device 431 may be a new storage device 100 that supplies supply LEDs to be tested. The first storage device 431 may be replaced. Therefore, the replacement operation is easy and the time taken for the replacement operation can be reduced, thereby preventing the loss of working time due to the replacement operation.

When the first transfer member 441 is configured to be movable only in the Y-axis direction without being lowered, the first supply body 411 and the first alignment unit 413 may be configured as follows. .

The first supply body 411 may include a first supply passage groove 4111. The first supply passage groove 4111 may be formed by recessing a predetermined depth from an upper surface of the first supply body 411. The first supply body 411 may include a plurality of first supply passage grooves 4111. The first transfer member 441 may pass through the first supply passage groove 4111 when the supply mechanism 100 is transferred.

The first alignment unit 413 may further include a first elevating mechanism 4134. Referring to FIG. 36, the first elevating mechanism 4134 may be coupled to the first moving mechanism 4133. The first moving member 4132 may be coupled to the first elevating mechanism 4134. Accordingly, the first raising and lowering mechanism 4134 may be moved in the Y-axis direction by the first moving mechanism 4133, and the first moving member 4132 may be raised and lowered.

34 to 41, when the first transfer member 441 is moved toward the first supply body 411 in order to position the supply mechanism 100 on the first supply body 411. The first lifting mechanism 4134 may lower the first moving member 4132. Accordingly, the supply mechanism 100 or the first transfer member 441 may be prevented from colliding with the first moving member 4132.

When the supply mechanism 100 is positioned on the first supply body 411, the first lifting mechanism 4134 may raise the first moving member 4132. Thereafter, the first moving member 4132 may be moved by the first moving mechanism 4133 to align the position of the supply mechanism 100.

When the first supply member 441 transfers the empty supply mechanism 100 from the first supply body 411 to the first storage mechanism 431, the first lifting mechanism 4134 may be The first moving member 4132 may be lowered. Accordingly, the supply mechanism 100 or the first transfer member 441 may be prevented from colliding with the first moving member 4132.

Referring to FIGS. 2 and 34 to 42, the loading unit 4 may further include a first cooling unit 45.

The first cooling unit 45 may cool the supply mechanism 100. The first cooling unit 45 may cool the supply mechanism 100 such that the supply mechanism 100 is at room temperature or lower than room temperature, and the supply mechanism 100 is approximately 20 ° C. or lower The supply mechanism 100 can be cooled.

As described above, the LED chip may be supplied in a state of being attached to the supply member 102 including a tape having an adhesive material such as blue tape. In this case, the LED chip may be loaded on the seating member 2 positioned at the loading position LP in a state where the adhesive material is buried in a high temperature environment higher than room temperature. Due to this adhesive material, the LED chip may adhere to the seating member 2, and thus may not normally be unloaded at the unloading position ULP.

The first cooling unit 45 may cool the supply member 102, thereby cooling the adhesive material in the supply member 102. Accordingly, the first cooling unit 45 may be loaded in the loading position LP without the adhesive material on the LED chip, and the LED chip is normally unloaded at the unloading position ULP. can do.

The first cooling unit 45 may include a first injection unit 451 for injecting a cooling gas. The first injection unit 451 may inject a cooling gas toward the supply mechanism 100 supported by the first supply unit 41. The first injection unit 451 may receive a cooling gas from a cooling gas supply system (not shown). The first cooling unit 45 may include a plurality of first injection units 451.

As shown in FIG. 43, the first injection unit 451 may be installed in the loading unit 42 to be positioned above the supply mechanism 100. The first injection unit 451 may be installed in the loading vision unit 423 to be positioned on the first supply unit 41. The loading vision unit 423 may include a loading illumination device 4231 for irradiating light to the first pickup position PP1, and the first injection unit 451 may include the loading illumination device ( 4231). The first injection unit 451 may cool the supply mechanism 100 by injecting a cooling gas onto the supply mechanism 100 from the supply mechanism 100. The first injection unit 451 may cool the supply member 102 by injecting a cooling gas toward the supply member 102. The first injection unit 451 may spray a cooling gas toward the first pickup position PP1.

As shown in FIG. 44, the first injection unit 451 may be installed in the first supply unit 41 to be positioned below the supply mechanism 100. The first injection unit 451 may be installed in the first supply support device 412 to be positioned below the first supply body 411. The first injection unit 451 may be installed on the first elevating member 4121. The first injection unit 451 may cool the supply mechanism 100 by injecting a cooling gas under the supply mechanism 100 toward the supply mechanism 100. The first injection unit 451 may cool the supply member 102 by injecting a cooling gas toward the supply member 102. The first injection unit 451 injects a cooling gas around a portion where the LED chip is picked up by the loading unit 42 from the supply member 102, thereby causing the loading unit ( 42), the portion having the LED chip to be picked up in the next order can be cooled.

As shown in FIG. 45, the first cooling unit 45 is installed on the loading vision unit 423 so as to be positioned on the first supply unit 41. It may include a first lower injection unit (4512) installed in the first supply support device 412 to be positioned below the supply body 411.

The first upper injection unit 4511 may cool the supply mechanism 100 by spraying a cooling gas onto the supply mechanism 100 from the supply mechanism 100. The first upper injection unit 4511 may cool the supply member 102 by spraying a cooling gas toward the supply member 102. The first upper injection unit 451 may spray a cooling gas toward the first pickup position PP1.

The first lower injection unit 4512 may cool the supply mechanism 100 by spraying a cooling gas under the supply mechanism 100 toward the supply mechanism 100. The first lower injection unit 4512 may cool the supply member 102 by spraying a cooling gas toward the supply member 102. The first lower injection unit 4512 sprays a cooling gas around a portion where the LED chip is picked up by the loading unit 42 from the supply member 102, thereby causing the loading unit to be loaded from the supply member 102. By 42, the portion with the LED chip to be picked up in the next order can be cooled.

Although not shown, the first cooling unit 45 according to the modified embodiment of the present invention cools the first supply support device 412 in contact with the supply mechanism 100 at the first pickup position PP1. As a result, the supply mechanism 100 in contact with the first supply support device 412 may be cooled.

The first cooling unit 45 may cool the supply member 102 in contact with the first elevating member 4121 by cooling the first elevating member 4121. The first cooling unit 45 may cool the first elevating member 4121 by circulating a cooling fluid inside the first elevating member 4121. In this case, the first elevating member 4121 may include a flow path through which the cooling fluid is moved. The first cooling unit 45 may cool the first elevating member 4121 by using a thermoelectric element.

<1st correction unit>

As described above, the LED chip positioned at the test position TP may not always be seated at the same position in the seating member 21. When the LED chip is loaded on the seating member 21 in the loading position LP may not be seated in a certain position, the centrifugal force when the LED chip is moved from the loading position LP to the test position TP This is because the state seated on the seating member 21 by being moved or rotated by the back may be changed. In such a case, in order to perform an accurate test, the LED chip classification apparatus 10 according to the present invention may further include a first correction unit as follows. This first correction unit is an example of the LED chip position correction unit.

46 is a schematic plan view of a supply unit according to a modified embodiment of the present invention, and FIGS. 47 and 48 are schematic perspective views showing an operation relationship of the first correction unit.

14, 34, 46 to 48, the LED chip sorting apparatus 10 according to the present invention may further include a first correction unit (5).

The first correction unit 5 is installed between the loading unit 4 and the test unit 3, and the LED chip is mounted on the seating member 21 in a state in which an LED chip can be tested at the test position TP. The state of the LED chip mounted on the seating member 21 is corrected to be seated. Accordingly, the LED chip sorting apparatus 10 according to the present invention can accurately test the performance of the LED chip.

The LED chip includes pads P1 and P2. Electrical characteristics may be tested and light may be emitted only when the contact pins 321 are in contact with the pads P1 and P2. The first correction unit 5 may correct the state of the LED chip so that the pads P1 and P2 are positioned at positions where the pads P1 and P2 may contact the contact pins 321.

The first correction unit 5 may correct the state of the LED chip by rotating the LED chip mounted on the seating member 21. The first correction unit 5 may correct the state of the LED chip by moving the LED chip mounted on the seating member 21.

The first correction unit 5 corrects the state of the LED chip seated on the seating member 21 positioned at the first correction position CP1 between the loading position LP and the test position TP. Can be. In this case, the seating members 21 may be simultaneously positioned at least one at the loading position LP, the first correction position CP1, the test position TP, and the unloading position ULP. It may be installed on the rotating member (22). The rotary unit 33 sequentially positions the seating members 21 at each of the loading position LP, the first correction position CP1, the test position TP, and the unloading position ULP. The rotating member 22 can be rotated so as to.

The first correction unit 5 may include a first correction mechanism 51 and a first operating mechanism 52. The first correction mechanism 51 includes a first correction member 511 and a second correction member 512.

The first compensation member 511 is in contact with one side of the LED chip when the state in which the LED chip is seated on the seating member 21 is corrected. The first compensating member 511 may be moved closer to or farther from the second compensating member 512 by the first operating mechanism 52.

When the first correcting member 511 is moved closer to the second correcting member 512 by the first operating mechanism 52, the first correcting member 511 is seated on the seating member 21. One side of the LED chip is in contact, and one side of the LED chip may be pushed and moved until the other side of the LED chip is in contact with the second correction member 512.

The second correction member 512 is in contact with the other side of the LED chip when the state in which the LED chip is seated on the seating member 21 is corrected. The second compensating member 512 may be moved closer to or farther from the first compensating member 511 by the first operating mechanism 52.

When the second correcting member 512 is moved closer to the first correcting member 511 by the first operating mechanism 52, the second correcting member 512 is seated on the seating member 21. The other side of the LED chip is brought into contact with each other, and the other side of the LED chip may be pushed and moved until one side of the LED chip is in contact with the first compensating member 511.

The first compensating member 511 and the second compensating member 512 are based on an LED chip positioned at the first compensating position CP1, and the first compensating member 511 is formed of the LED chip. It may be located inside, and the second correction member 512 may be located outside the LED chip. That is, as shown in FIG. 46, the first compensation member 511 may be moved closer to or farther from the second compensation member 512 in a state located inside the LED chip. The member 512 may be moved near or away from the first compensating member 511 in a state located outside the LED chip.

Accordingly, when the first correcting member 511 and the second correcting member 512 are moved away from each other, even if the seating members 21 are rotated according to the rotation of the rotating member 22, the first correction is performed. The possibility of collision between the member 511 and the second compensating member 512 and the LED chip can be reduced.

The first correcting member 511 and the second correcting member 512 may be movably coupled to the first correcting body 51a in a first direction (N arrow direction).

The first operating mechanism 52 includes the first compensating member 511 and the second compensating member 512 such that the first compensating member 511 and the second compensating member 512 are closer to or farther away from the LED chip. Move). The LED chip is mounted on a seating member 21 positioned at the first correction position CP1.

The first operating mechanism 52 may be configured such that the first compensation member 511 is in contact with the first compensation member 511 until the first compensation member 511 contacts one side of the LED chip and the second compensation member 512 contacts the other side of the LED chip. 511 and the second correction member 512 may be moved. When the first compensating member 511 is in contact with one side of the LED chip and the second compensating member 512 is in contact with the other side of the LED chip, the LED chips have pads P1 and P2 at the contact pins 321. It can be corrected to a state that can be contacted. In this process, the LED chip can be rotated and moved in a state seated on the seating member 21.

The first operating mechanism 52 is a direction perpendicular to the first direction from the first motor 521, the first cam member 522 rotated by the first motor 521, and the first correction body 51a. It may include a first moving body 523 which is movably coupled in the direction (O arrow). The first moving body 523 may include a first cam surface 5231 to which the first correction member 511 contacts and a second cam surface 5252 to which the second correction member 512 contacts. The first cam surface 5231 and the second cam surface 5252 may be formed to be inclined in opposite directions to each other.

When the first motor 521 rotates the first cam member 522, the first moving body 523 is perpendicular to the first direction according to the angle at which the first cam member 522 is rotated. Direction (O arrow direction). As the first moving body 523 is moved, the first compensating member 511 may be moved along the first cam surface 5251, and the second compensating member 512 may be moved to the second cam surface ( 5232).

When the first moving body 523 is moved toward the direction in which the first correcting mechanism 51 is installed, as shown in FIG. 48, the first correcting member 511 and the second correcting member 512 are mutually opposite. It can be moved closer. That is, the first compensating member 511 and the second compensating member 512 may be moved closer to the LED chip.

When the first moving body 523 is moved in a direction opposite to the direction in which the first correcting mechanism 51 is installed, as shown in FIG. 47, the first correcting member 511 and the second correcting member ( 512 may be moved away from each other. That is, the first compensating member 511 and the second compensating member 512 may be moved away from the LED chip.

The first operating mechanism 52 is the first correction member 511 so that the first correction member 511 and the second correction member 512 away from each other when the rotating member 22 is rotated. And the second correction member 512 may be moved. Accordingly, the possibility that the LED chip or the mounting member 21 collides with the first compensation member 511 and the second compensation member 512 can be reduced.

Although not shown, the first correction unit 5 may be lifted by the first lift device. The first elevating device may raise the first correction unit 5 when the rotating member 22 is rotated. Accordingly, when the rotating member 22 is rotated, it is possible to reduce the possibility that the LED chip or the mounting member 21 collides with the first correction mechanism 51. The first elevating device may lower the first correcting unit 5 when the rotating member 22 is stopped and the seating member 21 is positioned at the first correcting position CP1.

In this case, regardless of the position where the first correction member 511 and the second correction member 512 are installed, when the rotary member 22 is rotated, the LED chip or seating member 21 is the first It is possible not to collide with the correction mechanism 51. That is, even if the first correction member 511 and the second correction member 512 are installed to be positioned on the path in which the seating members 21 are moved in accordance with the rotation of the rotating member 22, the LED chip or It is possible to prevent the seating member 21 from colliding with the first correction mechanism 51.

The first elevating device may elevate the first correction unit 5 using a hydraulic cylinder or a pneumatic cylinder. The first elevating device may elevate the first correcting unit 5 by using a motor and a coupling mechanism coupled to the motor and the first correcting unit 5, respectively. The connecting mechanism may include a pulley and a belt, a ball screw, a cam member, and the like.

Here, when the first correction member 511 and the second correction member 512 are located on the path in which the seating members 21 are moved, the LED chip is rotated when the rotating member 22 is rotated. In order not to collide with the first correcting mechanism 51, the first correcting unit 5 should be raised by the first lifting device. In order for the first correction unit 5 to correct the state of the LED chip, the first correction unit 5 should be lowered by the first elevating device.

In order to eliminate the additional work time caused by the addition of this operation, the first correction member 511 and the second correction member 512, as described above, is located in the first correction position (CP1) Based on the LED chip, the first compensation member 511 may be located inside the LED chip, and the second compensation member 512 may be located outside the LED chip.

Accordingly, when the first correcting member 511 and the second correcting member 512 are moved away from each other without incurring additional working time, the seating member (according to the rotation of the rotating member 22) 21, the first compensation member 511 and the second compensation member 512 do not collide with the LED chip. In addition, since the first lifting device is not provided, it is possible to reduce the manufacturing cost.

1 to 48, the LED chip sorting apparatus 10 according to the present invention may selectively include any one of the first compensating member 511 and the contact rotating mechanism 345. 1 may include both the correction member 511 and the contact rotating mechanism 345.

In the above, the configuration in which the first correcting member 511 and the second correcting member 512 are brought closer to the LED chip at the same time by the first cam member 522 or at the same time away from the LED chip has been described. It is not limited to the example. That is, although not shown, the first correction member 511 and the second correction member 512 may be moved separately by the operating mechanism.

For example, two motors are provided in the first operating mechanism 52, one of the two motors is connected to the first compensating member 511, and the other is the second compensating member 512. It is also possible to connect to. According to such a configuration, the first correction member 511 and the second correction member 512 can be driven independently of each other.

In this case, when the position of the LED chip is corrected, the first correcting member 511 and the second correcting member 512 move in the direction of the center of the rotating member 22, that is, the direction toward the rotation axis, and then the first correcting. It is possible for the member 511 and the second correction member 512 to move in an outer direction of the rotary member 22, that is, in a direction from the rotation axis of the rotary member 22 toward the radially outer side. On the contrary, when the position of the LED chip is corrected, the first compensating member 511 and the second compensating member 512 move outwardly of the rotating member 22, respectively, and then the first compensating member 511 and the first compensating member are moved. It is also possible for the two correction members 512 to move toward the center of the rotation member 22, respectively. That is, the first actuating mechanism 52 moves the first compensating member 511 while the LED chip is not in contact with the second compensating member 512 but only in contact with the first compensating member 511. The state in which the second correction member 512 is moved while being in contact with only the second correction member 512 without being in contact with the first correction member 511 is switched.

When the correction is made in this manner, the reliability of the correction can be further improved as compared with the case where both the first correction member 511 and the second correction member 512 move until they are in contact with one side and the other side of the LED chip. have. That is, when both of the first correcting member 511 and the second correcting member 512 move until they are in contact with one side and the other side of the LED chip, the first correcting member 511 and the second correcting member 512 are moved. The both sides of the LED chip may be damaged or the LED chip may bounce off at the moment of contacting both the one side and the other side of the LED chip. However, as described above, the first and

second correction members

511 and 512 are separated. If only one member of the LED chip is in contact with the LED chip to correct the position of the LED chip, the side of the LED chip is not damaged or the LED chip bounces during the correction.

<2nd correction unit>

Next, a second correction unit that is an embodiment of the LED chip position correction unit will be described with reference to FIGS. 49 to 52.

FIG. 49 is a perspective view of the second correction unit, FIG. 50 is an exploded perspective view of the second correction mechanism of the second correction unit, FIG. 51 is an enlarged perspective view of the third correction member, and FIG. 52 is a front view showing an operation relationship of the second correction unit. to be.

The LED chip sorting apparatus 10 according to the present invention may further include a second correction unit 5A in place of the first correction unit 5. The second correction unit 5A is installed between the loading unit 4 and the test unit 3 like the first correction unit 5, and an LED chip can be tested at the test position TP. The state of the LED chip seated on the seating member 21 is corrected to be seated on the seating member 21 in a state. In other words, the second correction unit 5A has the same function as the first correction unit 5.

The LED chip includes pads P1 and P2. Electrical characteristics may be tested and light may be emitted only when the contact pins 321 are in contact with the pads P1 and P2. The second correction unit 5A may correct the state of the LED chip so that the pads P1 and P2 are positioned at positions where the pads P1 and P2 may contact the contact pins 321. That is, the second correction unit 5A may correct the position state of the LED chip by rotating or moving the LED chip mounted on the seating member 21.

In this case, the seating members 21 may be simultaneously positioned at least one at the loading position LP, the first correction position CP1, the test position TP, and the unloading position ULP. It may be installed on the rotating member (22). The rotary unit 33 sequentially positions the seating members 21 at each of the loading position LP, the first correction position CP1, the test position TP, and the unloading position ULP. The rotating member 22 can be rotated so as to.

As shown in FIG. 49, the second correction unit 5A may include a second correction mechanism 53 and a second operating mechanism 54.

The second correction mechanism 53 is in contact with the side surface of the LED chip seated on the mounting member 21 to move the LED chip forward (arrow FW direction) and rearward (arrow BW direction). The second correction mechanism 53 is movably coupled to the lower surface of the second operating mechanism 54.

The second actuator 54 includes a first actuator frame 541 and a first actuator housing 542. The first actuator frame 541 may be fixedly installed on another member, for example, a separate lifting device to be described later. An upper end of the first implement frame 541 is covered by a first implement housing 542, inside which a component for movement of the second compensator 53, eg a motor and a transducer connected to the motor, is provided. The back is located.

The second actuator 54 may comprise a linear motor. By connecting the second correction mechanism 53 to the linear motor, the second correction mechanism 53 can move forward and backward. Alternatively, the second actuating mechanism 54 may comprise a rotary motor and a transducer mechanism connected to the rotary motor. The converter mechanism is a mechanism for converting the rotational motion of the rotary motor into a linear motion and transmitting it to the second correction mechanism 53. For example, the transducer may be any one of a pulley and a belt, a rack-pinion gear, a ball screw, and a cam member. .

Referring to FIG. 50, the second correction mechanism 53 may include a first correction member holder 531 and a third correction member 532.

The first compensating member holder 531 includes an upper first flat plate 5311 and a first vertical plate 5312 extending downward from one end of the first flat plate 5311. The first flat plate 5311 and the first vertical plate 5312 may be integrally formed. The first flat plate 5311 is provided with a screw coupling groove 5315, and may be coupled to a motor (not shown) or a converter mechanism connected to the motor through the screw coupling groove 5315.

A first guide member 5313 may be provided on an inner surface of the first vertical plate 5312, and the first guide member 5313 may be slidably connected to a guide rail or the like not shown, thereby providing a second correction mechanism ( It is possible to prevent the second correction mechanism 53 from vibrating or departing from the predetermined trajectory when the 53 is moved forward and backward. The first vertical plate 5312 is provided with a screw coupling groove 5314 for fixedly coupling with the third correction member 532.

The third correction member 532 is integrally coupled to the first upper member 5321 and the lower surface of the first upper member 5321, which are coupled to the first vertical plate 5312 of the first correction member holder 531. It comprises a first lower member (5322).

Referring to FIG. 51, the first upper member 5321 is provided with a screw coupling groove 5323 for engaging with the first correction member holder 531. That is, by screwing the screw coupling groove 5323 of the third correction member 532 and the screw coupling groove 5314 of the first correction member holder 531, the first correction member holder 531 and the third correction member. 532 is fixedly coupled.

Meanwhile, a first LED chip accommodating groove 532a is provided in the first lower member 5322 such that the LED chip seated on the seating member 21 is positioned therebetween. In addition, the first lower member 5322 may include a first contact surface 5324 contacting one side of the LED chip to be positioned in the first LED chip receiving groove 532a and a first contact surface 5324 and the first LED chip receiving groove 532a. A second contact surface 5325 is provided to contact the other side of the LED chip. The first contact surface 5324 and the second contact surface 5325 are provided to face the two side surfaces of the LED chip, respectively, and a space formed between the first contact surface 5324 and the second contact surface 5325 is the first LED chip. It is a receiving groove 532a. Since the LED chip must be located in the first LED chip receiving groove 532a, the distance between the first contact surface 5324 and the second contact surface 5325, that is, the size of the first LED chip receiving groove 532a is It must be greater than the distance between the two sides of the LED chip. Therefore, in order to correct the position of the LED chip, when the second correction mechanism 53 moves forward (arrow FW), one side of the LED chip is in contact with the first contact surface 5324, and the other side of the LED chip is It is not in contact with the second contact surface 5325. On the contrary, when the second correction mechanism 53 moves backward (arrow BW), the other side of the LED chip is in contact with the second contact surface 5325, and one side of the LED chip is not in contact with the first contact surface 5324. Will not. As the second correction mechanism 53 moves forward and backward, the LED chip moves to a position where the pads P1 and P2 may contact the contact pins 321. In this process, the LED chip may be rotated or moved while seated on the seating member 21.

An upper edge of the first contact surface 5324 is connected to the first correcting member inclined surface 5326, and an upper edge of the second contact surface 5325 is connected to the second correcting member inclined surface 5327. The first correction member inclined surface 5326 and the second correction member inclined surface 5327 extend to an upper surface of the first lower member 5322 of the third correction member 532. As a result, the upper space of the first LED chip accommodating groove 532a is extended toward the upper side. The first sensing unit 6 (not shown) to be described later may be installed on the third correction member 532. The first sensing unit may identify a position where the LED chip is seated on the seating member at the first corrected position through the first LED chip receiving groove 532a and the enlarged space thereon.

52 is a view showing the operating relationship of the second correction unit 5A. Referring to this, the seating member 21 is installed on the support frame 221 of the rotating member 22, and the LED chip to be tested is placed on the top surface of the seating member 21. The third correcting member 532 of the second correcting unit 5A is positioned above the seating member 21 at the first correcting position, whereby the first LED chip accommodating groove 532a of the third correcting member 532 is located. The LED chip is placed in between.

When the lower surface of the third correction member 532 is completely in contact with the seating member 21, there is a risk of damaging the surface of the seating member 21 when the third correcting member 532 moves forward and backward, and thus, the third correcting member 532. The first contact surface 5324 and the second contact surface 5325 of the third correction member 532 are led when the lower and lower surfaces of the third correction member 532 move forward and backward without contacting the upper surface of the seating member 21. It is preferable that the third correction member 532 is positioned at such a height as to be in contact with the side surface of the chip.

Between the first LED chip receiving grooves 532a, the third correction member 532 moves forward (arrow FW direction) and then back (arrow BW direction). Through this process, the position of the LED chip is moved to an appropriate position, that is, the position where the LED chip can be correctly tested. As described above, while the third compensation member 532 is moving forward (arrow FW), one side of the LED chip is in contact with the first contact surface 5324, and the other side of the LED chip is in contact with the second contact surface 5325. No contact. On the contrary, while the third correction member 532 is moved backwards (arrow BW), the other side of the LED chip is in contact with the second contact surface 5325, and one side of the LED chip is not in contact with the first contact surface 5324. do.

Meanwhile, in the above, the case in which the LED chip is moved between the first LED chip accommodating grooves 532a and then moved forward is moved to the rear, but the LED chip is placed between the first LED chip accommodating grooves 532a. It is also possible to correct the position of the LED chip by moving backward in the front and then forward. In addition, the third correction member 532 may move forward only when the LED chip is placed between the first LED chip accommodating grooves 532a, and conversely, the LED chip is interposed between the first LED chip accommodating grooves 532a. It is also possible for the third correction member 532 to move rearward in this laid state. In addition, the third correction member 532 may repeatedly move forward and backward several times while the LED chip is placed between the first LED chip receiving grooves 532a.

Here, the front means a direction toward the center of the rotating member 22, that is, the rotation axis, and the rear means the opposite direction. As such, when the first contact surface 5324 and the second contact surface 5325 of the third correction member 532 are positioned in a direction parallel to the rotation direction of the rotation member 22 (see FIG. 51), the rotation member 22 When the c) rotates, the possibility that the LED chip or the mounting member 21 collides with the third compensation member 532 may be reduced.

Although not shown, the second correction unit 5A may be lifted up and down by the second lifting device. The second elevating device may raise the second correcting unit 5A when the rotating member 22 is rotated. Accordingly, when the rotating member 22 is rotated, it is possible to reduce the possibility that the LED chip or the seating member 21 collides with the second correction mechanism 53. The second elevating device may lower the second correcting unit 5A when the rotating member 22 is stopped and the seating member 21 is positioned at the first correcting position CP1.

As a result, the LED chip or the mounting member 21 does not collide with the second correcting mechanism 53 when the rotating member 22 is rotated.

The second elevating device may elevate the second correction unit 5A by using a hydraulic cylinder or a pneumatic cylinder. The second lifting device may lift and lower the second correction unit 5A by using a motor and a coupling mechanism coupled to the motor and the second correction unit 5A, respectively. The connecting mechanism may include a pulley and a belt, a ball screw, a cam member, and the like.

46 to 48, the LED chip sorting apparatus 10 according to the present invention may further include a first sensing unit 6.

The first sensing unit 6 checks a state in which the LED chip is seated on the seating member 21 positioned at the first correction position CP1. The first sensing unit 6 may check the position where the LED chip is seated on the seating member 21. A CCD camera may be used as the first sensing unit 6.

The first sensing unit 6 is installed to be positioned above the first correction mechanism 51, and the LED chip corrected by the first correction mechanism 51 is seated on the seating member 21. You can check it. The first sensing unit 6 may be installed in the first correction body 51a.

1 to 48, the contact movement mechanism 344 is a position where the contact pin 321 may contact the LED chip from the state information of the LED chip acquired by the first sensing unit 6. The contact unit 32 can be moved. Accordingly, the LED chip sorting apparatus 10 according to the present invention can accurately test the performance of the LED chip. The contact unit 32 may be moved in the X-axis direction and the Y-axis direction by the contact movement mechanism 344 so that the contact pin 321 may be in contact with the LED chip. The contact unit 32 may be rotated by the contact movement mechanism 344 so that the contact pin 321 may be in contact with the LED chip.

Although not shown, the first sensing unit 6 has an LED chip seated on a seating member 21 positioned at a first sensing position between a first calibration position CP1 and the test position TP. You can check.

In this case, the rotary unit 33 is seated at each of the loading position LP, the first correction position CP1, the first sensing position, the test position TP, and the unloading position ULP. The rotating member 22 may be rotated to sequentially position the members 21.

The seating members 21 may be simultaneously positioned at least one at the loading position LP, the first correction position CP1, the first sensing position, the test position TP, and the unloading position ULP. It may be installed on the rotating member 22 to be.

In the meantime, only the case where the first sensing unit 6 is positioned on the first correction mechanism 51 has been described. However, the first sensing unit 6 may be installed on the second correction mechanism 53. .

<3rd correction unit>

Referring to FIGS. 34 and 46, the LED chip is mounted on the seating member in the process of being tested by the test unit 3 or in the process of moving from the test position TP to the unloading position ULP after completion of the test. The state settled in 21 may be changed. In this case, the LED chip sorting apparatus 10 according to the present invention may allow the unloading unit 9 to accurately unload the LED chip from the seating member 21 positioned at the unloading position ULP. It may further include a correction unit. This third correction unit is an example of the LED chip position correction unit.

FIG. 53 is a schematic plan view of a supply unit according to a modified embodiment of the present invention, and FIGS. 54 and 55 are schematic perspective views showing an operation relationship of the third correction unit.

34 and 53 to 55, the third correction unit 7 is installed between the test unit 3 and the unloading unit 9, and an LED chip is placed in the unloading position ULP. The state of the LED chip seated on the seating member 21 is corrected to be seated on the seating member 21 in a state that can be unloaded. Accordingly, the unloading part 9 can accurately unload the LED chip from the seating member 21.

The third correction unit 7 may correct the state of the LED chip by rotating the LED chip mounted on the seating member 21. The third correction unit 7 may correct the state of the LED chip by moving the LED chip mounted on the seating member 21.

The third correction unit 7 corrects the state of the LED chip seated on the seating member 21 positioned at the second correction position CP2 between the test position TP and the unloading position ULP. can do. In this case, the seating members 21 may have the loading position LP, the first correction position CP1, the test position TP, the second correction position CP2, and the unloading position ULP. It may be installed on the rotating member 22 so that at least one at a time at the same time. The rotating unit 33 may be disposed at each of the loading position LP, the first correction position CP1, the test position TP, the second correction position CP2, and the unloading position ULP. The rotating member 22 may be rotated so that the seating members 21 may be sequentially positioned.

The third correction unit 7 may include a third correction mechanism 71 and a third operating mechanism 72. The third correction mechanism 71 includes a fourth correction member 711 and a fifth correction member 712.

The fourth correcting member 711 is in contact with one side of the LED chip when the state in which the LED chip is seated on the seating member 21 is corrected. The fourth correcting member 711 may be moved closer to or farther from the fifth correcting member 712 by the third operating mechanism 72.

When the fourth correcting member 711 is moved closer to the fifth correcting member 712 by the third operating mechanism 72, the fourth correcting member 711 is seated on the seating member 21. One side of the LED chip is brought into contact with each other, and one side of the LED chip may be pushed and moved until the other side of the LED chip contacts the fifth compensation member 712.

The fifth correcting member 712 is in contact with the other side of the LED chip when the state in which the LED chip is seated on the seating member 21 is corrected. The fifth correcting member 712 may be moved closer to or farther from the fourth correcting member 711 by the third operating mechanism 72.

When the fifth correcting member 712 is moved closer to the fourth correcting member 711 by the third operating mechanism 72, the fifth correcting member 712 is seated on the seating member 21. The other side of the LED chip is brought into contact with each other, and the other side of the LED chip may be pushed and moved until one side of the LED chip contacts the fourth compensation member 711.

The fourth correcting member 711 and the fifth correcting member 712 are based on the LED chip positioned at the second correcting position CP2, and the fourth correcting member 711 is formed of the LED chip. The fourth compensation member 512 may be located outside the LED chip. That is, as shown in FIG. 53, the fourth compensation member 711 may be moved closer to or farther from the fifth compensation member 712 in a state located inside the LED chip. The member 712 may be moved near or away from the fourth compensation member 711 in a state located outside the LED chip.

Accordingly, when the fourth correcting member 711 and the fifth correcting member 712 are moved away from each other, even if the seating members 21 are rotated according to the rotation of the rotating member 22, the fourth correcting member. The possibility that the member 711 and the fifth compensating member 712 and the LED chip collide with each other can be reduced.

The fourth correcting member 711 and the fifth correcting member 712 may be movably coupled to the second correcting body 71a in a second direction (P arrow direction).

The third operating mechanism 72 has the fourth compensation member 711 and the fifth compensation member 712 so that the fourth compensation member 711 and the fifth compensation member 712 are closer to or farther away from the LED chip. Move). The LED chip is mounted on a seating member 21 positioned at the second correction position CP2.

The third operating mechanism 72 may be configured such that the fourth correcting member 711 is in contact with the fourth correcting member 711 until the fourth correcting member 711 contacts one side of the LED chip and the fifth correcting member 712 contacts the other side of the LED chip. 711 and the fifth correction member 712 may be moved. When the fourth compensation member 711 is in contact with one side of the LED chip and the fifth compensation member 712 is in contact with the other side of the LED chip, the LED chip can be unloaded by the unloading unit 9 accurately. Can be corrected. In this process, the LED chip can be rotated and moved in a state seated on the seating member 21.

The third actuating mechanism 72 is a direction perpendicular to the second direction in the second motor 721, the second cam member 722 rotated by the second motor 721, and the second correction body 71a. It may include a second moving body 723 is movably coupled in the (Q arrow direction). The second moving body 723 may include a third cam surface 7221 to which the fourth correcting member 711 is in contact, and a fourth cam surface 7222 to which the fifth correcting member 712 is in contact. The third cam surface 7221 and the fourth cam surface 7222 may be formed to be inclined in directions opposite to each other.

When the second motor 721 rotates the second cam member 722, the second moving body 723 is perpendicular to the second direction according to the angle at which the second cam member 722 is rotated. Direction (Q arrow direction). As the second moving body 723 is moved, the fourth correcting member 711 may be moved along the third cam surface 7171, and the fifth correcting member 712 may be moved on the fourth cam surface ( 7232).

When the second moving body 723 is moved toward the direction in which the third correcting mechanism 71 is installed, as shown in FIG. 55, the fourth correcting member 711 and the fifth correcting member 712 are mutually opposite. It can be moved closer. That is, the fourth compensation member 711 and the fifth compensation member 712 may be moved closer to the LED chip.

When the second moving body 723 is moved in a direction opposite to the direction in which the third correcting mechanism 71 is installed, as shown in FIG. 54, the fourth correcting member 711 and the fifth correcting member ( 712 may be moved away from each other. That is, the fourth compensation member 711 and the fifth compensation member 712 may be moved away from the LED chip.

The third operating mechanism 72 is the fourth correcting member 711 such that the fourth correcting member 711 and the fifth correcting member 712 are separated from each other when the rotating member 22 is rotated. And the fifth correction member 712 may be moved. Accordingly, the possibility that the LED chip or the mounting member 21 collides with the fourth compensation member 711 and the fifth compensation member 712 can be reduced.

Although not shown, the third correction unit 7 may be lifted up and down by the third lifting device. The third lifting device may raise the third correction unit 7 when the rotating member 22 is rotated. Accordingly, when the rotating member 22 is rotated, it is possible to reduce the possibility that the LED chip or the mounting member 21 collides with the third correction mechanism 71. The third lifting device may lower the third correction unit 7 when the rotating member 22 is stopped and the seating member 21 is positioned at the second correction position CP2.

The third elevating device may elevate the third correction unit 7 by using a hydraulic cylinder or a pneumatic cylinder. The third lifting device may lift and lower the third correction unit 7 by using a motor and a coupling mechanism coupled to the motor and the third correction unit 7, respectively. The connecting mechanism may include a pulley and a belt, a ball screw, a cam member, and the like.

In this case, regardless of the position where the fourth correcting member 711 and the fifth correcting member 712 are installed, when the rotating member 22 is rotated, the LED chip or the seating member 21 is connected to the third. The collision with the correction mechanism 71 can be prevented. That is, even if the fourth correcting member 711 and the fifth correcting member 712 are installed to be positioned on a path along which the seating members 21 move according to the rotation of the rotating member 22, the LED chip or It is possible to prevent the seating member 21 from colliding with the third correction mechanism 71.

Here, when the fourth correction member 711 and the fifth correction member 712 is located on the path where the seating members 21 are moved, the LED chip is rotated when the rotating member 22 is rotated. In order not to collide with the third correcting mechanism 71, the third correcting unit 7 must be raised by the third lifting device. In addition, in order for the third correction unit 7 to correct the state of the LED chip, the third correction unit 7 should be lowered by the third elevating device.

In order to eliminate the additional work time caused by the addition of the work, the fourth correction member 711 and the fifth correction member 712, as described above, is located in the second correction position (CP2) Based on the LED chip, the fourth compensation member 711 may be located inside the LED chip, and the fifth compensation member 712 may be located outside the LED chip.

Accordingly, when the fourth correcting member 711 and the fifth correcting member 712 are moved away from each other without incurring additional working time, the seating member (according to the rotation of the rotating member 22) is moved. Even if the 21 parts are rotated, the LED chip may not collide with the fourth compensation member 711 and the fifth compensation member 712. In addition, since the third lifting device is not provided, it is possible to reduce the manufacturing cost.

In the above description, a configuration in which the fourth compensation member 711 and the fifth compensation member 712 are brought closer to the LED chip by the second cam member 722 or away from the LED chip at the same time has been described. It is not limited to the example. That is, although not shown, it is also possible for the fourth and

fifth correction members

711 and 712 to be moved separately by the operating mechanism.

For example, two motors are provided in the third operating mechanism 72, one of the two motors is connected to the fourth compensating member 711, and the other is the fifth compensating member 712. It is also possible to connect to. According to such a configuration, the fourth correction member 711 and the fifth correction member 712 can be driven independently of each other.

In this case, when the position of the LED chip is corrected, the fourth correcting member 711 and the fifth correcting member 712 move in the center direction of the rotating member 22, that is, the direction toward the rotation axis, and then the fourth correcting. It is possible for the member 711 and the fifth correcting member 712 to move in an outer direction of the rotating member 22, that is, in a direction from the rotation axis of the rotating member 22 to the radially outer side. On the contrary, when the position of the LED chip is corrected, the fourth correcting member 711 and the fifth correcting member 712 move outwardly of the rotating member 22, respectively, and then the fourth correcting member 711 and the first correcting member are moved. It is also possible for the 5 correction members 712 to move toward the center of the rotation member 22, respectively. That is, the third operating mechanism 72 moves the fourth correcting member 711 while the LED chip is not in contact with the fifth correcting member 712 but only in contact with the fourth correcting member 711, and the LED chip. The state in which the fifth correcting member 712 is moved while being in contact with the fourth correcting member 712 without being in contact with the fourth correcting member 711 is switched.

When the correction is made in this manner, the reliability of the correction may be further improved as compared with the case where both the fourth and

fifth correction members

711 and 712 move until they come into contact with one side and the other side of the LED chip. have. That is, when both the fourth correcting member 711 and the fifth correcting member 712 move until they are in contact with one side and the other side of the LED chip, the fourth correcting member 711 and the fifth correcting member 712 are moved. When both sides of the LED chip are in contact with one side and the other side, the side of the LED chip may be damaged or the LED chip may bounce. On the other hand, as described above, the fourth compensation member 711 and the fifth compensation member 712 may occur. If only one member of the LED chip is in contact with the LED chip to correct the position of the LED chip, the side of the LED chip is not damaged or the LED chip bounces during the correction.

<4th correction unit>

Next, a fourth correction unit that is an embodiment of the LED chip position correction unit will be described with reference to FIGS. 56 to 59.

FIG. 56 is a perspective view of a fourth correction unit, FIG. 57 is an exploded perspective view of a fourth correction mechanism of the fourth correction unit, FIG. 58 is an enlarged perspective view of the sixth correction member, and FIG. 59 is a front view showing an operation relationship of the fourth correction unit. to be.

The LED chip sorting apparatus 10 according to the present invention may further include a fourth correction unit 7A in place of the third correction unit 7. The fourth correction unit 7A is installed between the test unit 3 and the unloading unit 9 similarly to the third correction unit 7, and an LED chip is unloaded at the unloading position ULP. The state of the LED chip seated on the seating member 21 is corrected to be seated on the seating member 21 in a possible state. That is, the fourth correction unit 7A has the same function as the third correction unit 7.

The fourth correction unit 7A corrects the state of the LED chip seated on the seating member 21 positioned at the second correction position CP2 between the test position TP and the unloading position ULP. can do. In this case, the seating members 21 may have the loading position LP, the first correction position CP1, the test position TP, the second correction position CP2, and the unloading position ULP. It may be installed on the rotating member 22 so that at least one at a time at the same time. The rotating unit 33 may be disposed at each of the loading position LP, the first correction position CP1, the test position TP, the second correction position CP2, and the unloading position ULP. The rotating member 22 may be rotated so that the seating members 21 may be sequentially positioned.

As shown in FIG. 56, the fourth correction unit 7A may include a fourth correction mechanism 73 and a fourth operating mechanism 74.

The fourth correction mechanism 73 contacts the side surface of the LED chip seated on the seating member 21 and moves the LED chip forward (arrow FW direction) and rearward (arrow BW direction). The fourth correction mechanism 73 is movably coupled to the lower surface of the fourth operating mechanism 74.

The fourth actuator 74 includes a second actuator frame 741 and a second actuator housing 742. The second actuator frame 741 may be fixedly installed on another member, for example, a separate lifting device to be described later. An upper end of the second actuator frame 741 is covered by a second actuator housing 742, inside which a component for movement of the fourth compensation mechanism 73, such as a motor and a transducer connected to the motor, is provided. The back is located.

The fourth actuator 74 may comprise a linear motor. The fourth correction mechanism 73 is connected to the linear motor so that the fourth correction mechanism 73 can move forward and backward. Alternatively, the fourth actuating mechanism 74 may comprise a rotary motor and a transducer mechanism connected to the rotary motor. The converter mechanism is a mechanism for converting the rotational motion of the rotary motor into linear motion and transmitting it to the fourth correction mechanism 73. For example, the transducer may be any one of a pulley and a belt, a rack-pinion gear, a ball screw, and a cam member. .

Referring to FIG. 57, the fourth correction mechanism 73 may include a second correction member holder 731 and a sixth correction member 732.

The second correction member holder 731 includes an upper second flat plate 7311 and a second vertical plate 7312 extending downward from one end of the second flat plate 7311. The second flat plate 7311 and the second vertical plate 7312 may be integrally formed. The second flat plate 7311 is provided with a screw coupling groove 7315, and may be coupled to a motor (not shown) or a converter mechanism connected to the motor through the screw coupling groove 7315.

A second guide member 7313 may be provided on an inner side surface of the second vertical plate 7312, and the second guide member 7313 may be slidably connected to a guide rail or the like not shown, thereby providing a fourth correction mechanism ( When the 73 moves forward and backward, the fourth correcting mechanism 73 can be prevented from vibrating or deviating from a predetermined trajectory. The second vertical plate 7312 is provided with a screw coupling groove 7314 for fixedly coupling with the sixth correction member 732.

The sixth correcting member 732 is integrally coupled to the second upper member 7321 and the lower surface of the second upper member 7321 to be coupled to the second vertical plate 7312 of the second correcting member holder 731. It includes a second lower member 7322 that is.

Referring to FIG. 58, the second upper member 7321 is provided with a screw coupling groove 7323 for engaging with the second correction member holder 731. That is, by screwing the screw coupling groove 7323 of the sixth correction member 732 and the screw coupling groove 7314 of the second correction member holder 731, the second correction member holder 731 and the sixth correction member. 732 is fixedly coupled.

On the other hand, the second lower member 7322 is provided with a second LED chip receiving groove 732a so that the LED chip seated on the seating member 21 is located therebetween. In addition, the second lower member 7322 includes a third contact surface 7324 contacting one side of the LED chip to be positioned in the second LED chip receiving groove 732a and a second LED chip receiving groove 732a. A fourth contact surface 7325 is provided to contact the other side of the LED chip to be formed. The third contact surface 7324 and the fourth contact surface 7325 are provided to face the two side surfaces of the LED chip, respectively, and a space formed between the third contact surface 7324 and the fourth contact surface 7325 is the second LED chip. It is a receiving groove 732a. Since the LED chip must be located in the second LED chip receiving groove 732a, the distance between the third contact surface 7324 and the fourth contact surface 7325, that is, the size of the second LED chip receiving groove 732a is It must be greater than the distance between the two sides of the LED chip. Therefore, in order to correct the position of the LED chip, when the fourth correction mechanism 73 is moved forward (arrow FW), one side of the LED chip is in contact with the third contact surface 7324, and the other side of the LED chip is It is not in contact with the fourth contact surface 7325. On the contrary, when the fourth correcting mechanism 73 moves backward (arrow BW), the other side of the LED chip is in contact with the fourth contact surface 7325, and one side of the LED chip is not in contact with the third contact surface 7324. Will not. As the fourth compensation mechanism 73 moves forward and backward, the LED chip is moved to an appropriate position for unloading. In this process, the LED chip may be rotated or moved while seated on the seating member 21.

An upper edge of the third contact surface 7324 is connected to the third correcting member inclined surface 7326, and an upper edge of the fourth contact surface 7325 is connected to the fourth correcting member inclined surface 7325. The third correcting member inclined surface 7326 and the fourth correcting member inclined surface 7327 extend to an upper surface of the second lower member 7322 of the sixth correcting member 732. As a result, the upper space of the second LED chip accommodating groove 732a is extended toward the upper side. The second sensing unit 8 (not shown) to be described later may be installed on the sixth correcting member 732. The second sensing unit may identify a position where the LED chip is seated on the seating member at the second correcting position through the second LED chip receiving groove 732a and the enlarged space thereon.

Fig. 59 is a view showing the operation relationship of the fourth correction unit 7A. Referring to this, the seating member 21 is installed on the support frame 221 of the rotating member 22, the LED chip is completed is placed on the upper surface of the seating member 21. The sixth correction member 732 of the fourth correction unit 7A is positioned above the seating member 21 at the second correction position, whereby the second LED chip accommodating groove 732a of the sixth correction member 732 is located. The LED chip is placed in between.

When the bottom surface of the sixth correcting member 732 is completely in contact with the seating member 21, there is a risk that the surface of the seating member 21 may be damaged when the sixth correcting member 732 moves forward and backward. ), The third contact surface 7324 and the fourth contact surface 7325 of the sixth correction member 732 are led when the sixth correction member 732 moves forward and backward without contacting the upper surface of the seating member 21. It is preferable that the sixth correction member 732 be positioned at such a height as to be in contact with the side surface of the chip.

In the state where the LED chip is placed between the second LED chip receiving grooves 732a, the sixth compensating member 732 moves forward (arrow FW direction), and then back (arrow BW direction). Through this process, the position of the LED chip is moved to an appropriate position, that is, the position where the LED chip can be unloaded correctly. As described above, while the sixth compensation member 732 is moving forward (arrow FW), one side of the LED chip is in contact with the third contact surface 7324, and the other side of the LED chip is in contact with the fourth contact surface 7325. No contact. On the contrary, while the sixth compensation member 732 is moved backward (arrow BW), the other side of the LED chip is in contact with the fourth contact surface 7325, and one side of the LED chip is not in contact with the third contact surface 7324. do.

Meanwhile, in the above, the case in which the LED chip is moved between the second LED chip accommodating grooves 732a and moved forward is moved to the rear, but the LED chip is placed between the second LED chip accommodating grooves 732a. It is also possible to correct the position of the LED chip by moving backward in the front and then forward. In addition, the sixth compensation member 732 may move forward only when the LED chip is placed between the second LED chip receiving grooves 732a, and conversely, the LED chip is provided between the second LED chip receiving grooves 732a. In this laid state, it is also possible for the sixth correction member 732 to move rearward only. In addition, the sixth compensation member 732 may repeatedly move forward and backward several times while the LED chip is placed between the second LED chip receiving grooves 732a.

Here, the front means a direction toward the center of the rotating member 22, that is, the rotation axis, and the rear means the opposite direction. As such, when the third contact surface 7324 and the fourth contact surface 7325 of the sixth correction member 732 are positioned in a direction parallel to the rotation direction of the rotation member 22 (see FIG. 58), the rotation member 22 When the c) rotates, the possibility of the LED chip or the mounting member 21 colliding with the sixth compensation member 732 may be reduced.

Although not shown, the fourth correction unit 7A may be lifted up and down by the fourth lifting device. The fourth elevating device may raise the fourth correcting unit 7A when the rotating member 22 is rotated. Accordingly, when the rotating member 22 is rotated, it is possible to reduce the possibility that the LED chip or the mounting member 21 collides with the fourth correcting mechanism 73. The fourth elevating device may lower the fourth correcting unit 7A when the rotating member 22 is stopped and the seating member 21 is positioned at the second correcting position CP2.

As a result, the LED chip or the seating member 21 does not collide with the fourth correcting mechanism 73 when the rotating member 22 is rotated.

The fourth lifting device can lift the fourth correction unit 7A by using a hydraulic cylinder or a pneumatic cylinder. The fourth lifting device may lift and lower the fourth correction unit 7A by using a motor and a coupling mechanism coupled to the motor and the fourth correction unit 7A, respectively. The connecting mechanism may include a pulley and a belt, a ball screw, a cam member, and the like.

Referring back to FIGS. 34 and 53 to 55, the LED chip sorting apparatus 10 according to the present invention may further include a second sensing unit 8.

The second sensing unit 8 checks a state in which the LED chip is seated on the seating member 21 positioned at the second correction position CP2. The second sensing unit 8 may check the position and the degree of rotation of the LED chip is seated on the seating member 21. A CCD camera may be used as the second sensing unit 8.

The second sensing unit 8 is installed so as to be positioned on the third correction mechanism 71, and the LED chip corrected by the third correction mechanism 71 is seated on the seating member 21. You can check it. The second sensing unit 8 may be installed in the second correction body 71a.

When the LED chip sorting apparatus 10 according to the present invention includes the second sensing unit 8, the unloading unit 9 uses the state information of the chip obtained by the second sensing unit 8. The LED chip can be accurately unloaded from the mounting member 21 positioned at the unloading position ULP.

Although not shown, the second sensing unit 8 has an LED chip seated on a seating member 21 positioned at a second sensing position between a second calibration position CP2 and the unloading position ULP. You can check the status. The second sensing unit 8 may check the position and the degree of rotation of the LED chip is seated on the seating member 21.

In this case, the rotation unit 33 includes the loading position LP, the first correction position CP1, the first detection position, the test position TP, the second correction position CP2, and the second. The rotating member 22 may be rotated such that the seating members 21 are sequentially positioned at the sensing position and the unloading position ULP, respectively.

The mounting members 21 may include the loading position LP, the first correction position CP1, the first sensing position, the test position TP, the second correction position CP2, the second sensing position, And at least one of the rotating members 22 in the unloading position ULP at the same time.

In the meantime, only the case where the second sensing unit 8 is positioned on the third correction mechanism 71 has been described. However, the second sensing unit 8 may be installed on the fourth correction mechanism 73. .

<1st removal unit>

As described above, the LED chip is seated on the seating member 21 located at the loading position LP, moved to the test position TP and tested, and then moved to the unloading position ULP to freeze. Can be loaded. The mounting member 21 that has passed the unloading position ULP is moved to the loading position LP again, and a new LED chip is loaded on the mounting member 21 at the loading position LP.

By the way, when the LED chip is not normally unloaded from the seating member 21 in the unloading position (ULP), it passes through the unloading position (ULP) to the seating member (21) moved to the loading position (LP) Since the LED chip remains, the new LED chip cannot be loaded normally. Further, since the LED chip is not normally loaded in the seating member 21 moved to the test position TP, the new LED chip cannot be tested normally.

In order to prevent this, the LED chip sorting apparatus 10 according to the present invention is a first removal unit for removing the LED chip remaining in the seating member 21 past the unloading position (ULP) from the seating member 21. And (11). Therefore, since the LED chip sorting apparatus 10 according to the present invention can stably perform the operation of loading the LED chip and the test of the LED chip, it is possible to improve the accuracy of the test for the LED chip.

Referring to FIG. 60, the first removal unit 11 is installed between the unloading position ULP and the loading position LP, so that the first removal unit 11 remains in the seating member 21 past the unloading position ULP. You can remove the LED chip. When the LED chip is removed, foreign matters remaining in the seating member 21 may be removed together.

The first removal unit 11 may remove the LED chip from the mounting member 21 positioned at the first removal position (F). The first removal position F is located between the unloading position ULP and the loading position LP. The mounting unit 21 sequentially positions the loading unit LP, the test position TP, the unloading position ULP, and the first removal position F, respectively. The rotating member 22 can be rotated so as to. That is, when the rotary unit 23 positions the mounting members 21 in each of the loading position LP, the test position TP, and the unloading position ULP, the first removal position F In the unloading position (ULP) in the seating member 21 is located. The mounting member 21 may be positioned at least one at a time at the test position TP, the loading position LP, the unloading position ULP, and the first removal position F at the same time. 22 may be provided in plurality.

Accordingly, the LED chip sorting apparatus 10 according to the present invention rotates and stops the rotating member 22 separately to remove the LED chip remaining in the seating member 21 passing through the unloading position ULP. Work time can be prevented from being lost. In addition, in the LED chip sorting apparatus 10 according to the present invention, an LED chip is loaded at the loading position LP, an LED chip is tested at the test position TP, and an LED chip at the unloading position ULP. During this unloading operation, the LED chip remaining in the seating member 21 can be removed at the first removal position F, thereby removing the LED chip remaining in the seating member 21 without additional work time. Can be removed.

The first removal unit 11 may include an injection unit (not shown) for injecting a fluid for removing the LED chip toward the seating member 21 located at the first removal position (F). The injection unit (not shown) is positioned between the seating member 21 positioned at the first removal position F and the rotation shaft 22a of the rotating member 22, thereby being positioned at the first removal position F. FIG. The fluid may be injected toward the seating member 21. Accordingly, the LED chip may be removed to the outside of the rotating member 22. Since the LED chip is removed to the outside of the rotating member 22, jams, shorts, and the like can be prevented from occurring.

60 to 63, the first removal unit 11 may include a body 111 positioned at the first removal position F. Referring to FIGS.

The body 111 has a passage groove 1111 through which the seating member 21 can pass when the rotating member 22 is rotated. When the LED chip is positioned at the first removal position F, the LED chip is positioned in the through groove 1111 formed in the body 111. Accordingly, when the rotating member 22 is rotated, the mounting member 21 does not collide with the body 111 without being moved to the first removal position F without moving the body 111. You can do that.

One side 111a of the body 111 has a first connection hole 1112 formed in communication with the passage groove 1111. An injection unit (not shown) for injecting a fluid for removing the LED chip positioned at the first removal position F may be connected to one side 111a of the body 111. The fluid sprayed by the injection unit (not shown) is transferred to the passage groove 1111 through the first connection hole 1112, thereby leading the LED from the seating member 21 positioned at the first removal position (F). The chip can be removed.

Although not shown, the injection unit is connected to connect the injection device and one side 111a of the body 111 so that the injection device for injecting fluid and the fluid injected by the injection device are delivered to the passage groove 1111. It may include a unit. A hose may be used as the connection unit.

A second connection hole 1113 is formed on the other side 111b of the body 111 so as to communicate with the passage groove 1111. On the other side 111b of the body 111, an LED chip removed from the seating member 21 positioned at the first removal position F is moved from the passage groove 1111 to the second connection hole 1113. An intake unit (not shown) for sucking fluid may be connected. The intake unit (not shown) sucks fluid in a direction from the passage groove 1111 toward the second connection hole 1113, so that an LED chip is connected to the second connection hole 1113 in the passage groove 1111. Can be moved to.

Although not shown, the intake unit may include a suction device for sucking fluid and a connection unit connecting the suction device and the other side 111b of the body 111. A hose may be used as the connection unit.

When an injection unit is connected to one side 111a of the body 111 and an intake unit is connected to the other side 111b of the body 111, the fluid injected from the injection unit is the first connection hole 1112. It is transmitted to the through groove 1111 through, and is sucked by the intake unit may be moved from the through groove 1111 to the second connecting hole (1113). That is, the fluid may move from the first connection hole 1112 to the second connection hole 1113 through the passage groove 1111, and in the process, the fluid may be seated at the first removal position F. The LED chip can be removed from the member 21.

Based on the seating member 21 positioned at the first removal position F, one side 111a of the body 111 may be located inside the rotating member 22 and the body 111. The other side 111b of the rotating member 22 may be located outside. One side 111a of the body 111 may be located between the seating member 21 positioned at the first removal position F and the rotation shaft 22a of the rotating member 22. Accordingly, the LED chip may be removed to the outside of the rotating member 22. Therefore, since the LED chip is removed to the outside of the rotating member 22, it is possible to prevent the occurrence of jams, shorts, and the like.

Referring to FIG. 60, the first removal unit 11 may further include a storage member 112 and a connection member 113.

The storage member 112 may store the LED chip removed from the seating member 21 located at the first removal position (F). Therefore, regardless of the direction in which the body 111 is installed, the removed LED chips can be moved to another configuration such as the rotating member 22 to prevent the occurrence of jams, shorts, and the like. By reloading the LED chips stored in the storage member 112 to the seating member 21, it is also possible to classify by grade according to the test results.

The storage member 112 may be formed in a shape capable of storing the LED chips removed therein. For example, the storage member 112 may be formed in a hollow cylindrical shape as a whole.

The connection member 113 connects the body 111 and the storage member 112. The LED chip removed from the seating member 21 positioned at the first removal position F may be moved to the storage member 112 through the second connecting hole 1113 and the connecting member 113. . A hose may be used as the connection member 113.

<2nd removal unit>

The LED chip may be supplied as attached to the adhesive tape such as blue tape. In this case, the LED chip may be loaded on the seating member 21 positioned at the loading position LP in a state in which the adhesive material is buried, and may be attached to the seating member 21 due to the adhesive material. Accordingly, the LED chip may not be normally unloaded at the unloading position ULP.

As such, the LED chip remaining in the seating member 21 without being normally unloaded at the unloading position ULP may be removed by the first removal unit 11. However, even when the LED chip is removed by the first removal unit 11, the adhesive material may remain in the mounting member 21 as it is. Such adhesive material may contaminate the new LED chip loaded at the loading position LP, and as the cumulative work continues, the LED chip which is not normally unloaded at the unloading position ULP may increase. . In order to remove the adhesive substance, the LED chip sorting apparatus 10 according to the present invention may include a second removing unit 12.

Referring to FIG. 64, the second removal unit 12 is installed between the unloading position ULP and the loading position LP, so that the second removal unit 12 remains in the seating member 21 past the unloading position ULP. It can remove the sticky substance. The second removal unit 12 may be installed next to the first removal unit 11.

The second removal unit 12 may remove the adhesive substance remaining on the seating member 21 positioned at the second removal position G. The second removal position G is located between the first removal position F and the loading position LP.

The rotary unit 23 is located at each of the loading position LP, the test position TP, the unloading position ULP, the first removal position F, and the second removal position G. The rotating member 22 may be rotated so that the seating members 21 may be sequentially positioned. That is, when the rotary unit 23 places the mounting members 21 in each of the loading position LP, the test position TP, the unloading position ULP, and the first removal position F, The mounting member 21 passing through the unloading position ULP is positioned at the second removal position G. The seating member 21 is at least one of the test position TP, the loading position LP, the unloading position ULP, the first removal position F, and the second removal position G. A plurality of rotating members 22 may be installed to be located at the same time.

Therefore, the LED chip sorting apparatus 10 according to the present invention is rotated and stopped separately by the rotating member 22 to remove the adhesive material remaining in the seating member 21 past the unloading position (ULP). Work time can be prevented from being lost. In addition, in the LED chip sorting apparatus 10 according to the present invention, an LED chip is loaded at the loading position LP, an LED chip is tested at the test position TP, and an LED chip at the unloading position ULP. Since the unloaded and the LED chip is removed at the first removal position (F), the adhesive substance remaining on the seating member 21 at the second removal position (G) can be removed. The LED chip remaining in the seating member 21 can be removed without additional working time, and the adhesive substance remaining in the seating member 21 can be removed for a sufficient time.

The second removal unit 12 is in contact with the upper surface of the mounting member 21 past the unloading position (ULP) to remove the adhesive material remaining on the upper surface of the mounting member 21 (121) It may include. The second removal unit 12 may include at least one contact member 121.

The contact member 121 may include at least one of a fabric, a brush, and a leather material to remove the adhesive material remaining on the upper surface of the seating member 21. The contact member 121 may further include an adhesive material that may be adhered to the adhesive material remaining on the seating member 21 with a significant adhesive force. The adhesive material provided on the contact member 121 may be adhered to the adhesive material remaining on the seating member 21 with an adhesive force greater than that between the adhesive material remaining on the seating member 21 and the seating member 21. It is preferable that there is.

The contact member 121 may remove the adhesive material remaining on the upper surface of the seating member 21 by rubbing the upper surface of the seating member 21 by rotating the rotating member 22. The contact member 121 may be rotated or linearly moved by another configuration to be described below to remove the adhesive material remaining on the upper surface of the seating member 21.

64 and 65, the second removal unit 12 may further include a support member 122 to which the contact member 121 is coupled.

The contact member 121 may be rotatably coupled to the support member 122. Accordingly, when the rotating member 22 is rotated, the contact member 121 is rotated by friction in contact with the upper surface of the seating member 21 while remaining on the upper surface of the seating member 21. The material can be removed. The contact member 121 may be rotated about the rotation shaft 121a and may be formed in a cylindrical shape as a whole. When the second removal unit 12 includes a plurality of contact members 121, the contact members 121 may be rotatably coupled to the support member 122, respectively.

Referring to FIG. 66, the second removal unit 12 according to the modified embodiment of the present invention may further include a driving unit 123 for rotating the contact member 121. The contact member 121 may be rotated about a rotation shaft 121a (shown in FIG. 65), and may be formed in a cylindrical shape as a whole.

The driving unit 123 may rotate the contact member 121 in a state in which the contact member 121 is in contact with the upper surface of the seating member 21. Accordingly, the contact member 121 may remove the adhesive material remaining on the upper surface of the seating member 21. Due to the driving unit 123, the contact member 121 can remove the adhesive material remaining on the upper surface of the seating member 21 even when the rotating member 22 is stopped.

The driving unit 123 may be coupled to the support member 122, and may rotate the contact member 121 clockwise or counterclockwise about the rotation shaft 121a. The driving unit 123 may include a motor 1231. The motor 1231 may be directly coupled to the rotation shaft 121a to rotate the contact member 121, and may be coupled to a shaft (not shown) coupled to the rotation shaft 121a to connect the contact member 121. It can also be rotated. When the motor is installed at a position spaced apart from the shaft (not shown) by a predetermined distance, the drive unit may further include a pulley and a belt connecting the motor and the shaft (not shown).

Referring to FIG. 67, the second removal unit 12 according to the modified embodiment of the present invention may further include a moving unit (not shown) for moving the support member 122. The contact member 121 may move together with the support member 122 as the support member 122 is moved, and may be formed in a rectangular shape as a whole. The contact member 121 may be formed in other forms such as a cylindrical shape in addition to the rectangular shape as long as it may be in contact with the top surface of the seating member 21.

The moving unit may be coupled to the support member 122, and the support member 122 may be linearly moved in a state in which the contact member 121 is in contact with the upper surface of the seating member 21. Accordingly, the contact member 121 may remove the adhesive material remaining on the upper surface of the seating member 21. Due to the mobile unit, the contact member 121 can remove the adhesive material remaining on the upper surface of the seating member 21 even when the rotating member 22 is stopped.

The mobile unit may move the support member 122 by using a hydraulic cylinder or a pneumatic cylinder. The mobile unit may move the support member 122 by using a motor and a converter for converting the rotational motion of the motor into a linear motion. The converter mechanism may be a pulley and a belt, a rack-pinion gear, a ball screw, a cam member, or the like. The transducer tool may be coupled to the motor and the support member 122, respectively.

Although not shown, the LED chip sorting apparatus 10 may further include a lifting unit for lifting up and down the second removal unit 12.

The elevating unit may be coupled to the second removing unit 12, and may elevate the second removing unit 12 so that the contact member 121 is positioned at the first position or the second position. . When the contact member 121 is located in the first position, the contact member 121 is in contact with the upper surface of the seating member 21 passing through the unloading position (ULP). When the contact member 121 is positioned in the second position, the contact member 121 is spaced apart from an upper surface of the seating member 21 passing through the unloading position (ULP).

The elevating unit may raise the second removing unit 12 so that the contact member 121 is positioned at the second position when the rotating unit 23 rotates the rotating member 22. have. The lifting unit may lower the second removal unit 12 so that the contact member 121 is positioned at the first position when the rotation unit 23 stops the rotation member 22. . Accordingly, the LED chip sorting apparatus 10 according to the present invention can reduce the possibility that the seating member 21 collides with the contact member 121 when the rotating member 22 is rotated.

The lifting unit may lift up and down the second removal unit 12 by using a hydraulic cylinder or a pneumatic cylinder. The lifting unit may raise and lower the second removal unit 12 by using a converter mechanism for converting a rotational motion of the motor and the motor into a linear motion. The converter mechanism may be a pulley and a belt, a rack-pinion gear, a ball screw, a cam member, or the like. The transducer tool may be coupled to the motor and the second removal unit 12, respectively.

34 and 46, the unloading unit 9 unloads an LED chip from the mounting member 21 positioned at the unloading position ULP. Here, the LED chip classification apparatus according to the present invention includes an unloading unit 9 largely divided into three embodiments, which will be described sequentially with reference to the accompanying drawings for each embodiment.

FIG. 68 is a schematic perspective view of the unloading unit, FIG. 69 is a schematic perspective view of the first housing and the first storage unit, FIG. 70 is a schematic perspective view of the second storage unit, and FIG. 71 is a schematic view of the second transfer unit. Perspective view.

34, 46, and 68 to 71, the unloading unit 9 may include a buffer unit 91 installed next to the test unit 3.

The buffer unit 91 may use a first receiving device 200 supporting a plurality of tested LED chips.

The first accommodating device 200 includes a first housing 201 having a hollow portion (not shown) and a first accommodating member 202 on which the tested LED chips are located and coupled to the first housing 201. It may include. The first receiving member 202 may be a tape having an adhesive material. The tested LED chips may be attached to an upper surface of the first receiving member 202. The first accommodating member 202 may be a blue tape.

The first housing 201 may be formed in a rectangular shape as a whole. The first housing 201 may include the hollow part (not shown) formed in a rectangular shape as a whole. Although not shown, the first housing 201 and the hollow part (not shown) may be formed in a disc shape. The first housing 201 and the hollow portion (not shown) may also be formed in other shapes such as an elliptical disc shape.

Although not shown, the buffer unit 91 may use the first accommodating mechanism 200 in which a plurality of accommodating grooves in which the tested LED chip is accommodated are formed.

34, 46, and 68 to 71, the buffer unit 91 is unloading unit 911, the first storage unit 912, the second storage unit 913, and the second transfer Unit 914 may be included.

The unloading unit 911 performs an unloading process of picking up the tested LED chip from the seating member 21 located at the unloading position ULP and transferring it to the first accommodating device 200.

The unloading unit 911 may include an unloading rotary arm 9111 and an unloading driving unit 9112.

The unloading rotary arm 9111 is provided with an unloading picker 9111a capable of absorbing the tested LED chip. The unloading rotary arm 9111 may be lifted up and down by lifting means (not shown).

The unloading rotary arm 9111 is rotated by the unloading driving unit 9112 to reciprocate the unloading picker 9111a to be positioned on the unloading position ULP and the first receiving device 200. Can be moved. The unloading picker 9111a may be positioned on the first receiving device 200 positioned in the first receiving unit 912.

The unloading unit 911 may include one unloading rotary arm 9111 and one unloading picker 9111a. In FIG. 68, the unloading rotary arm 9111 and the unloading picker 9111a are illustrated as three, but this is for indicating a reciprocating movement path of the unloading rotary arm 9111.

The unloading rotary arm 9111 is coupled to the unloading driving unit 9112. The unloading driving unit 9112 may rotate the unloading rotary arm 9111 such that the unloading picker 9111a is positioned on the unloading position ULP or the first receiving device 200.

Although not shown, the unloading unit 911 may include a plurality of unloading rotary arms 9111 and a plurality of unloading pickers 9111a respectively coupled to the unloading rotary arms 9111. The unloading driving unit 9112 rotates the unloading rotary arms 9111 about a rotation axis (not shown), and any one of the unloading pickers 9111a is positioned at the unloading position ULP. One of the unloading pickers 9111a may be positioned on the first receiving device 200. The unloading driving unit 9112 may sequentially position the unloading pickers 9111a on the unloading position ULP and the first receiving device 200.

The unloading driving unit 9112 may include a motor, and may further include a pulley and a belt if the motor and the unloading rotary arm 9111 are spaced apart by a predetermined distance.

The unloading unit 911 is configured to mount the tested LED chips to the seating member 21 such that the LED chips are positioned in the first storage device 200 in the same arrangement as that of the LED chips. At may be transferred to the first receiving device 200.

34, 46, and 68 to 71, the first accommodating unit 912 is the first accommodating device 200 in a position where the unloading unit 911 can place the tested LED chip. ) Moves the first receiving device 200 to be positioned.

The first accommodating unit 912 may include a first accommodating body 9121, a second alignment unit 9922, and a second moving unit 9223.

The first accommodating body 9121 supports the bottom surface of the first accommodating mechanism 200. The first accommodating body 9121 may be moved in the X-axis direction and the Y-axis direction by the second moving unit 9223. As the first accommodating body 9121 moves, the first accommodating mechanism 200 may be moved to a position where the unloading unit 911 may place the tested LED chip.

The first accommodating body 9121 may be moved in the X-axis direction and the Y-axis direction by the second moving unit 9223, and may be rotated. As the first accommodating body 9121 moves and rotates, the unloading unit 911 may be placed in the first accommodating device 200 such that all of the tested LED chips face the same direction.

A second support device 9121a may be installed on the first accommodating body 9121. The first accommodating body 9121 may include a first accommodating space 9121b on which the second supporting device 9121a may be installed. The second support device 9121a may support the bottom surface of the tested LED chip placed by the unloading unit 22 on the first receiving device 200. The second support device 9121a may support a bottom surface of the first accommodating member 202 under the first accommodating mechanism 200. The second support device 9121a may be lifted up and down by lifting means (not shown).

The first accommodating body 9121 may include a first accommodating groove 9121c. The first receiving through groove 9121c may be formed by recessing a predetermined depth from an upper surface of the first receiving body 9121. The first accommodating body 9121 may include a plurality of first accommodating through holes 9121c. The second transfer unit 914 may pass through the first receiving through groove 9121c to position the first receiving device 200 in the first receiving body 9121.

34, 46, and 68 to 71, the second alignment unit 9222 aligns the position of the first accommodation mechanism 200 supported by the first accommodation body 9121. The second alignment unit 9222 includes a second fixing member 9922a, a second moving member 9922b, a second moving mechanism 9922c, and a second lifting mechanism 9922d.

The second fixing member 9222a is installed in the first accommodating body 9121 and determines the position of the first accommodating mechanism 200. The second fixing member 9222a may be coupled to the first receiving body 9121 so as to protrude a predetermined length upward from an upper surface of the first receiving body 9121. The first receiving device 200 may be aligned in contact with the second fixing member 9922a. The second alignment unit 9222 may include a plurality of second fixing members 9922a.

The second moving member 9222b may be coupled to the second moving mechanism 9222c and moved by the second moving mechanism 9922c. The second moving member 9222b may be coupled to the second moving mechanism 9922c to protrude a predetermined length upward from an upper surface of the first accommodating body 9121. The second moving member 9222b may be positioned at a position opposite to the position where the second fixing member 9222a is installed in the first accommodating body 9121. The second alignment unit 9922 may include a plurality of second moving members 9922b.

The second moving member 9222b may be moved closer to or away from the second fixing member 9922a by the second moving mechanism 9922c. When the second moving member 9222b is moved closer to the second fixing member 9922a, the first receiving mechanism 200 is pushed by the second moving member 9922b to allow the second fixing member 9922a to be moved. ) May be contacted. Accordingly, the first receiving device 200 may be aligned in position.

The second moving mechanism 9222c may be coupled to the first accommodating body 9121 and move the second moving member 9222b. The second moving mechanism 9222c may move the second moving member 9222b until the first receiving device 200 contacts the second fixing member 9922a. The second moving mechanism 9222c may move the second moving member 9922b by using a hydraulic cylinder or a pneumatic cylinder. The second moving mechanism 9922c may move the second moving member 9222b by a method using a pulley and a belt, a method using a ball screw, or a method using a cam member.

The second elevating mechanism 9222d may be coupled to the second moving mechanism 9922c. The second moving member 9222b may be coupled to the second elevating mechanism 9222d. Accordingly, the second elevating mechanism 9222d may be moved in the Y-axis direction by the second moving mechanism 9222c, and the second moving member 9922b may be raised and lowered.

When the second transfer unit 914 is moved toward the first receiving body 9121 to position the first receiving device 200 on the first receiving body 9121, the second lifting mechanism ( 9122d may lower the second moving member 9922b. Accordingly, the first receiving device 200 or the second transfer unit 914 may not collide with the second moving member 9922b.

When the first accommodating mechanism 200 is positioned in the first accommodating body 9121, the second elevating mechanism 9222d may raise the second moving member 9922b. Thereafter, the second moving member 9222b may be moved by the second moving mechanism 9922c to align the position of the first receiving device 200.

When the second transfer unit 914 transfers the first accommodating mechanism 200 supporting the tested LED chips from the first accommodating body 9121 to the second storage unit 913, the second win The lowering mechanism 9922d may lower the second moving member 9922b. Accordingly, the first receiving device 200 or the second transfer unit 914 may not collide with the second moving member 9922b.

34, 46, and 68 to 71, the second mobile unit 9223 is located in the position where the unloading unit 911 can place the tested LED chip. ) May move the first receiving body (9121). The second moving unit 9123 may move the first receiving body 9121 in the X-axis direction and the Y-axis direction.

The second moving unit 9223 has a second upper member 9223a to which the first receiving body 9121 is movably coupled, and a second lower member to which the second upper member 9123a is movably coupled. 9123b).

The first accommodating body 9121 and the second upper member 9123a may be moved in a direction perpendicular to each other. When the second upper member 9123a is movably coupled to the second lower member 9123b in the X-axis direction, the first accommodating body 9121 may be connected to the second upper member 9123a in the Y-axis direction. It can be movably coupled. When the second upper member 9123a is movably coupled to the second lower member 9123b in the Y-axis direction, the first accommodating body 9121 may be attached to the second upper member 9323a in the X-axis direction. It can be movably coupled.

The second moving unit 9223 is the first housing body 9121 and the cylinder by using a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member The second upper member 9123a may be moved.

The second moving unit 9123 may rotate the first accommodating body 9121. The second moving unit 9123 rotates the first accommodating body 9121 so that the unloading unit 911 can be placed on the first accommodating device 200 such that all of the tested LED chips face the same direction. You can.

34, 46, and 68 to 71, the second storage unit 913 includes a second storage mechanism 9131 capable of storing a plurality of the first accommodation mechanisms 200.

The second storage mechanism 9131 may include a plurality of second storage members 9131a capable of supporting both bottom surfaces of the first accommodation mechanism 200. The second storage members 9131a may be formed in plurality in a vertical distance (Z-axis direction) at a predetermined distance. The first storage device 200 may be inserted into a space in which the second storage members 9131a are spaced apart from each other, into the second storage groove 9913b.

34, 46, and 68 to 71, the second transfer unit 914 moves the first receiving device 200 from the second storage device 9131 to the first receiving body 9121. The first housing 200 may be transferred from the first housing body 9121 to the second storage mechanism 9131.

The second transfer unit 914 may transfer the empty first receiving device 200 from the second storage device 9131 to the first receiving body 9121. When the first accommodating device 200 positioned in the first accommodating body 9121 is filled with the tested LED chips, the second transfer unit 914 stores the first accommodating device 200 in the first accommodating body. The body 9121 may be transferred to the second storage mechanism 9131.

Therefore, since the LED chip sorting apparatus 10 according to the present invention can automatically supply the first accommodating devices 200 on which the LED chips tested are placed on the first accommodating body 9121, the unloading process is continuously performed. It can be used to eliminate the loss of work time caused by manual work.

The second transfer unit 914 may transfer the first receiving device 200 between the first receiving unit 912 and the second storage device 9131. The second transfer unit 914 includes a second transfer member 9141 and a second transfer mechanism 9142.

The second transfer member 9141 may grip the first receiving device 200. The second transfer member 9141 corresponds to each of the first holding member 2411, the second holding member 2412, the first driving mechanism 2413, and the first connecting body 2414. Since the description is made to include the approximately matching configuration, the description of these configurations will be omitted in order not to obscure the subject matter of the present invention.

The second transfer mechanism 9142 moves the second transfer member 9141 between the second storage mechanism 9131 and the first accommodation unit 912. The second transfer mechanism 9142 moves the second transfer member 9141 so that the empty first accommodation mechanism 200 is transferred from the second storage mechanism 9131 to the first receiving body 9121. You can. The second transfer mechanism 9142 is configured to transfer the first receiving mechanism 200 filled with the tested LED chips from the first receiving body 9121 to the second storage mechanism 9131. 9141) can be moved.

The second transfer mechanism 9142 may be configured to use the second transfer member 9141 by a method using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. You can move it.

The second transfer mechanism 9142 may be coupled to the second gantry 9143. The second transfer member 9141 may move in the Y-axis direction along the second gantry 9143.

The first storage device 200 may be stacked and stored in the vertical direction (Z-axis direction) in the second storage device 9131. In this case, the second storage unit 913 may further include a second storage lift mechanism 9332.

The second storage raising and lowering mechanism 9332 may raise and lower the second storage mechanism 9131. The second storage elevating mechanism 9332 stores the second storage member 200 so that the first accommodation mechanism 200 is positioned at a position where the second transfer member 9141 can hold the first storage mechanism 200. The mechanism 9131 can be raised and lowered. The second storage raising and lowering mechanism 9332 lifts and lowers the second storage mechanism 9131 so that the second transfer member 9141 can store the first receiving mechanism 200 in the storage mechanism 231. You can.

The second storage raising and lowering mechanism (9132) is the second storage mechanism (9131) by using a cylinder such as a hydraulic cylinder or pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. ) Can be raised and lowered.

In addition to the manner in which the second storage mechanism 9131 is raised and lowered by the second storage raising and lowering mechanism 9332, the second transfer member 9141 may be raised and lowered, and the second transfer member 9141 may be elevated. And both of the second storage devices 9131 may be elevated.

The second storage raising and lowering mechanism 9332 may include a second vertical body 9332a and a second lifting body 9332b. The second lifting body 9332b is coupled to the second vertical body 9332a to be capable of lifting up and down.

The second storage mechanism 9131 may be detachably coupled to the second lifting body 9332b. Accordingly, when only the first storage devices 200 filled with the tested LED chips are stored in the second storage device 9131, the second storage device 9131 may be filled with empty first storage devices 200. It may be replaced with a new second storage device 9131 that is stored. Therefore, the replacement operation is easy and the time taken for the replacement operation can be reduced, thereby preventing the loss of working time due to the replacement operation.

When only the empty supply mechanisms 100 are stored in the first storage mechanism 231 as the loading process is completed, the first storage mechanism 231 may be used as the second storage mechanism 9131. Do.

Second Embodiment

72 is a schematic perspective view of an LED chip sorting apparatus including an unloading unit according to a modified embodiment of the present invention, FIG. 73 is a plan view of FIG. 72, and FIGS. 74 and 75 are views of a modified embodiment of the present invention. 2 is a schematic perspective view of the storage unit, FIG. 76 is a schematic perspective view of the second transfer unit and a third transfer unit, FIG. 77 is a schematic perspective view of the first receiving device and the second supply unit, FIG. 78 is a side view of FIG. 79 is a schematic perspective view of a second supply body, a second supply support device, and a sorting unit, FIG. 80 is a schematic enlarged side cross-sectional view of a portion T of FIG. 79, FIG. 81 is a schematic perspective view of a sorting unit, FIG. 82 Is a schematic perspective view of a second supply body, a second supply support, a sorting unit, and a second cooling unit, FIGS. 83-85 are U of FIG. 82 for a first cooling unit according to a modified embodiment of the present invention; 86 is a schematic enlarged side view of a portion, FIG. 86 shows a second housing and a second housing unit; A schematic perspective view, FIG. 87 is a perspective view schematically illustrating a third storage unit, 88 is a schematic perspective view of a fourth transfer unit.

72 to 88, the unloading part 9 according to the modified embodiment of the present invention includes a sorting part 92 installed next to the buffer part 91.

The sorting unit 92 may use a second receiving device 300 that supports a plurality of tested LED chips.

Referring to FIGS. 77 and 78, the second housing 300 may include a second housing 301 in which a hollow part (not shown) is formed, and the tested LED chips are located in the second housing 301. It may include a second receiving member 302 is coupled. The second receiving member 302 may be a tape having an adhesive material. The tested LED chips may be attached to an upper surface of the second receiving member 302. The second receiving member 302 may be a blue tape.

As shown in FIG. 77, the second housing 301 may have a rectangular shape as a whole. The second housing 301 may include the hollow part (not shown) which is formed in a rectangular shape as a whole. Although not shown, the second housing 301 and the hollow part (not shown) may be formed in other shapes, such as a disc shape, an elliptical disc shape, and the like.

Although not shown, the sorting unit 92 may use the second receiving device 300 having a plurality of receiving grooves in which the tested LED chip is stored.

72 to 88, the sorting unit 92 classifies the tested LED chips supported by the first storage device 200 through the buffer unit 91 by grade according to a test result. 2 can be transferred to the storage device (300). The tested LED chip may be transferred to the second receiving device 300 corresponding to the grade.

The sorting unit 92 may include a third transfer unit 921, a second supply unit 922, a sorting unit 923, a second storage unit 924, a third storage unit 925, and a fourth transfer unit. 926 may include.

72 to 77, when the unloading unit 9 according to the present invention includes the sorting unit 92, the second storage unit 913 may further include a mobile device 9133. have.

The moving device 9133 may move the second storage mechanism 9131 between the first position R and the second position S. FIG. The second storage mechanism 9131 may be movably coupled to the moving device 9133.

In the first position R, the second transfer unit 914 inserts the first storage device 200 into the second storage device 9131 or receives the first storage device from the second storage device 9131. It is a position where the mechanism 200 can be taken out.

In the second position S, the third transfer unit 921 inserts the first storage device 200 into the second storage device 9131 or receives the first storage device from the second storage device 9131. It is a position where the mechanism 200 can be taken out.

Accordingly, the LED chip sorting apparatus 10 according to the present invention utilizes the second storage unit 913 to support the first storage device 200 on which the LED chip tested through the buffer unit 91 is supported. May be automatically transferred to the sorting unit 91.

Although not shown, the first storage device 200 on which the tested LED chip is supported through the buffer unit 91 is manually transferred to the sorting unit 91 or automatically by using a separate transfer means. It can also be implemented to be transported. In contrast to this method, the method of utilizing the second storage unit 913 including the mobile device 9133 as described above has advantages in many aspects, such as material cost and shortening waiting time.

The moving device 9133 may move the second storage mechanism 9131 by using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. Can be. The second storage elevating mechanism 9332 may be coupled to the moving device 9133. The moving device 9133 may move the second storage mechanism 9131 by moving the second storage raising and lowering mechanism 9332.

Here, the sorting unit 92 is based on the second receiving device 300 located in the second receiving unit 924, only the LED chips of a specific grade to be transferred to the second receiving device 300. First of all, the first storage device 200 may be transferred to the second storage device 300. When only the LED chips other than the LED chip of the specific grade remain in the first housing 200 located in the second supply unit 922, the sorting unit 92 may move the first housing 200. After the transfer to the second storage device (9131), the other first storage device 200 is transferred to the second supply unit 922 and then only the LED chip of the specific grade continues to the first housing 200 ) May be transferred to the second receiving device 300.

That is, until the second housing 300 is filled with LED chips of a specific grade, the sorting unit 92 may remove the first housings 200 stored in the second storage mechanism 9131. The second supply unit 922 may be sequentially located.

The sorting unit 92 is based on the first storage device 200 located in the second supply unit 922, and the third storage unit 925 until the first storage device 200 becomes empty. The second storage device 300 stored in the) may be sequentially placed in the second storage unit 924.

In the above operation, the operation of transferring the first receiving device 200 between the second storage device 9131 and the second supply unit 922 may be performed by the third transfer unit 921. have.

The third transfer unit 921 may transfer the first receiving device 200 on which the tested LED chips are supported from the second storage device 9131 to the second supply unit 922. The third transfer unit 921, when the work on the first receiving device 200 located in the second supply unit 922 is completed, the first receiving device 200, the second supply unit ( In 922, the second storage device 9131 may be transferred to the second storage device 9131.

As described above, the sorting unit 92 classifies the tested LED chips supported on the first receiving device 200 through the buffer unit 91 by grade according to a test result to form the second receiving device ( 300). Each of the tested LED chips may be transferred to the second receiver 300 corresponding to the grade.

The third transfer unit 921 may transfer the first receiving device 200 between the second storage device 9131 and the second supply unit 922. The third transfer unit 921 may transfer the first storage device 200 from the second storage device 9131 to the second supply unit 922, and the second supply unit 922 may transfer the first storage device 200. The first storage device 200 may be transferred to the second storage device 9131. The third transfer unit 921 includes a third transfer member 9211 and a third transfer mechanism 9212.

The third transfer member 9211 may grip the first receiving device 200. The third transfer member 9211 corresponds to each of the first holding member 2411, the second holding member 2412, the first driving mechanism 2413, and the first connecting body 2414. Since the description is made to include the approximately matching configuration, the description of these configurations will be omitted in order not to obscure the subject matter of the present invention.

The third transfer mechanism 9212 moves the third transfer member 9211 between the second storage mechanism 9131 and the second supply unit 922.

The third transfer mechanism 9212 may move the third transfer member 9211 so that the first receiving mechanism 200 is transferred from the second storage mechanism 9131 to the second supply unit 922. Can be. The third transfer mechanism 9212 may move the third transfer member 9211 so that the first accommodation mechanism 200 is transferred from the second supply unit 922 to the second storage mechanism 9131. Can be.

The third transfer mechanism 9212 is a method using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member or the like. You can move it.

The third transfer mechanism 9212 may be coupled to the third gantry 9213. The third transfer member 9211 may move along the third gantry 9213 in the Y-axis direction. As illustrated in FIG. 76, the third gantry 9213 and the second gantry 9143 may be integrally formed. The third transfer mechanism 9212 and the second transfer mechanism 9142 may be installed to face each other.

72 to 81, the second supply unit 922 has the tested LED chip at a position where the sorting unit 923 can pick up the LED chip tested at the first receiving device 200. The first accommodating device 200 is moved so as to. 77 and 78, although the first receiving device 200 is shown in a disk shape, as described above, the first receiving device 200 formed in another shape such as a rectangular shape may be used.

The second supply unit 922 may include a second supply body 9221, a second supply support device 9222, a third alignment unit 9223, and a third moving unit 9224.

The second supply body 9221 supports the bottom of the first receiving device 200. The second supply body 9221 may be moved in the X-axis direction and the Y-axis direction by the third moving unit 9224. As the second supply body 9221 moves, the first receiving device 200 may be moved to a position where the tested LED chip can be picked up by the sorting unit 923.

The second supply body 9221 may be moved in the X-axis direction and the Y-axis direction by the third moving unit 9224, and may be rotated. In response to the movement and rotation of the second supply body 9221, when the sorting unit 923 picks up the tested LED chip, the first accommodating device 200 has the tested LED chip facing the same direction. It may be moved to be picked up. Accordingly, the sorting unit 923 may be transferred to the second housing 300 while directing all of the tested LED chips to the same direction.

The second supply body 9221 may include a second supply space 9221 a in which the second supply support device 9222 may be installed. The second supply body 9221 may include a second supply passage groove 9221b. The second supply passage groove 9121b may be formed by recessing a predetermined depth from an upper surface of the second supply body 9221. The second supply body 9221 may include a plurality of second supply passage grooves 9221b. The third transfer unit 921 may pass through the second supply passage groove 9121b to position the first receiving device 200 on the second supply body 9221.

The second supply support device 9222 may support the bottom surface of the tested LED chip picked up by the sorting unit 923. The first housing 200 has the first housing 201 is supported by the second supply body (9221), the first housing member 202 is supported by the second supply support device (9222). Can be. The second supply support device 9222 may support the bottom surface of the first accommodating member 202 under the second pickup position PP2. The second pick-up position PP2 is a position at which the sorting unit 923 can pick up the tested LED chip from the first housing 200. The second supply support device 9222 may be installed to be located in the second supply space 9121a.

The second supply support device 9222 may include a second lifting member 9222a, a second lifting device 9222b, a second support pin 9222c, and a second pin lifting device 9222d. .

The second elevating member 9222a may support a bottom surface of the first accommodating member 202 under the second pickup position PP2. The second elevating member 9222a may be coupled to the second elevating device 9222b and may be elevated by the second elevating device 9222b. The second elevating member 9222a may be elongated in the vertical direction (Z-axis direction), and may be formed in a cylindrical rod shape as a whole.

The second support pin 9222c is coupled to the inner side of the second elevating member 9222a so as to be elevated. A second through hole 9222e through which the second support pin 9222c can pass is formed in the second elevating member 9222a to allow the second support pin 9222c to protrude upward. have.

The second elevating device 9222b may elevate the second elevating member 9222a. The second lifting device when the first receiving device 200 is positioned on the second supply body 9221 or when the first receiving device 200 is removed from the second supply body 9221. 9222b may lower the second elevating member 9222a. When the second elevating device 9222b lowers the second elevating member 9222a, the second elevating member 9222a may be spaced apart from the first accommodating member 202. When the first receiving device 200 is positioned on the second supply body 9221, the second elevating device 9222b may raise the second elevating member 9222a. When the second elevating device 9222b raises the second elevating member 9222a, the second elevating member 9222a may support the bottom surface of the first accommodating member 202.

The second elevating device 9222b is the second elevating member 9222a by using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. ) Can be raised and lowered.

The second support pin 9222c may be coupled to the inner side of the second elevating member 9222a to be elevated and lowered by the second pin elevating device 9222d. The second support pin 9222c may be coupled to the second pin elevating device 9222d. The second support pin 9222c may be elongated in the vertical direction (Z-axis direction), and may be formed in a conical shape as a whole.

The second pin elevating device 9222d may raise and lower the second support pin 9222c. The second pin lift device 9222d may raise the second support pin 9222c when the sorting unit 923 picks up the LED chip located at the second pickup position PP2. Accordingly, the second support pin 9222c may protrude upward from the second elevating member 9222a through the second through hole 9222e and is led by the sorting unit 923. Can be pushed upwards. Therefore, the sorting unit 923 can be easily picked up the tested LED chip. When the sorting unit 923 picks up the tested LED chip, the second pin elevating device 9222d may have the second support pin 9222c positioned inside the second elevating member 9222a. The support pin 9222c can be lowered.

The second pin elevating device 9222d is a second support pin 9222c by a method using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. Can be raised and lowered.

Here, the first accommodating member 202 may include a tape having an adhesive material such as blue tape. In this case, the first accommodating member 202 may not be maintained in a horizontal state due to thermal expansion in a high temperature environment higher than room temperature, and thus the LED chip tested according to the degree of thermal expansion of the first accommodating member 202. The location of this can be changed. Accordingly, the sorting unit 923 may not accurately pick up the tested LED chip from the first accommodating member 202.

In a modified embodiment of the present invention, the sorting unit 923 can accurately pick up the tested LED chip from the first accommodating member 202 regardless of the degree of thermal expansion of the first accommodating member 202. Accordingly, the second supply support device 9222 may include a support mechanism 9222f and a support lift device 9222g.

The support mechanism 9222f is coupled to the support lift device 9222g. The support mechanism 9222f may be installed on the second supply body 9221 to be positioned below the first accommodation mechanism 200. The second supply support device 9222 may include a plurality of support mechanisms 9222f, and may include at least two support mechanisms 9222f.

The support mechanisms 9222f are lifted up and down by the support lifting device 9222g, and may push upwards the outer side of the area where the LED chips tested in the first accommodating member 202 are located. The support mechanism 9222f may be elongated in the vertical direction (Z-axis direction), and may be formed in a 'b' shape as a whole.

The support raising and lowering device 9222g can raise and lower the support mechanism 9222f. The second supply support device 9222 may include a plurality of support lift devices 9222g, and may include the same number of support lift devices 9222g as the support mechanism 9222f. The support mechanisms 9222f may be coupled to the support elevating devices 9222g, respectively. The support elevating device 9222g may raise and lower the support mechanism 9222f such that the first accommodating member 202 protrudes above the supply body 9221.

When the support elevating device 9222g raises the support mechanism 9222f, the support mechanism 9222f may push upward the outer side of the area where the LED chips tested by the first accommodating member 202 are located. Accordingly, the first accommodating member 202 may be pulled by the support mechanisms 9222f while protruding upward from the supply body 9221, and a predetermined tension acts on the first accommodating member 202. While the area of the LED chip tested in the first receiving member 202 can be maintained in a horizontal state. Therefore, regardless of the degree of thermal expansion of the first accommodating member 202, the sorting picker 923 may accurately pick up the tested LED chip from the first accommodating mechanism 200.

When the support elevating device 9222g lowers the support mechanism 9222f, the support mechanism 9222f may be spaced apart from the first accommodating member 202. Accordingly, the third transfer unit 921 may position the first receiving device 200 on the second supply body 9221 without being disturbed by the support mechanism 9222f, and the second The first receiving device 200 may be removed from the supply body 9221.

The support elevating device 9922g can raise and lower the support mechanism 9222f by a method using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. Can be.

72 to 81, the third alignment unit 9223 aligns positions of the first receiving device 200 supported by the second supply body 9221. The third alignment unit 9223 is substantially coincident with each of the second fixing member 9222a, the second moving member 9922b, the second moving mechanism 9922c, and the second lifting mechanism 9922d. Since the configuration is made to include, the description of these components will be omitted in order not to obscure the subject matter of the present invention.

72 to 81, the third moving unit 9224 has the second supply body 9221 so that the tested LED chip is positioned at a position where the sorting unit 923 can pick up the tested LED chip. ) Can be moved. The third moving unit 9224 may move the second supply body 9221 in the X-axis direction and the Y-axis direction.

The third moving unit 9224 has a third upper member 9223a to which the second supply body 9221 is movably coupled and a third lower member to which the third upper member 9223a is movably coupled. 9223b).

The second supply body 9221 and the third upper member 9223a may be moved in a direction perpendicular to each other. When the third upper member 9223a is movably coupled to the third lower member 9223b in the X-axis direction, the second supply body 9221 is in the Y-axis direction with the third upper member 9223a. It can be movably coupled. When the third upper member 9223a is movably coupled to the third lower member 9223b in the Y-axis direction, the second supply body 9221 is connected to the third upper member 9223a in the X-axis direction. It can be movably coupled.

The third moving unit 9224 may include the second supply body 9121 and the cylinder by a hydraulic cylinder or a pneumatic cylinder, a pulley and a belt, a ball screw, or a cam member. The third upper member 9223a may be moved.

The third moving unit 9224 may rotate the second supply body 9221. The third moving unit 9224 can rotate the second supply body 9221 so that the sorting unit 923 can pick up the tested LED chips facing the same direction.

72 to 81, the sorting unit 923 transfers the tested LED chip from the first accommodating device 200 to the second accommodating device 300.

The sorting unit 923 picks up the tested LED chip from the first storage device 200 located in the second supply body 9221 and the LED tested with the second storage device 300 corresponding to the grade. The chip can be transported.

The sorting unit 923 may include a sorting rotary arm 9231 and a sorting driving unit 9232.

The sorting rotary arm 9231 is provided with a sorting picker 9231a capable of absorbing the tested LED chip. The sorting rotary arm 9231 may be lifted up and down by lifting means (not shown). The sorting rotary arm 9231 is rotated by the sorting driving unit 9232 so that the sorting picker 9231a is reciprocated to be positioned on the first receiving device 200 and on the second receiving device 300. Can be. The sorting picker 9231a may be positioned on the first receiving device 200 positioned on the second supply body 9221 and on the second receiving device 300 located on the second receiving unit 924. have.

The sorting unit 923 may include one sorting rotary arm 9231 and one sorting picker 9231a. Although the sorting rotary arm 9231 and the sorting picker 9231a are illustrated in FIG. 31, this is to indicate a reciprocating movement path of the sorting rotary arm 9231.

The sorting rotary arm 9231 is coupled to the sorting driving unit 9232. The sorting driving unit 9232 may rotate the sorting rotary arm 9231 such that the sorting picker 9231a is positioned on the first receiving device 200 and on the second receiving device 300.

Although not shown, the sorting unit 923 may include a plurality of sorting rotary arms 9231 and a plurality of sorting pickers 9231a respectively coupled to the sorting rotary arms 9231. The sorting driving unit 9232 rotates the sorting rotary arm 9231 about an axis of rotation (not shown), and any one of the sorting pickers 9231a is positioned on the second supply body 9121. Located on the first storage device 200, one of the sorting pickers 9231a may be positioned on the second storage device 300 positioned on the second storage unit 924. The sorting driving unit 9232 may sequentially position the sorting pickers 9231a on the first receiving device 200 and on the second receiving device 300.

The sorting driving unit 9232 may include a motor, and may further include a pulley and a belt if the motor and the sorting rotary arm 9231 are spaced apart by a predetermined distance.

72 to 81, the sorting unit 923 may further include a sorting vision unit 9333.

The sorting vision unit 9333 may be installed to be positioned above the second pick-up position PP2, and may check the state of the LED chip located at the second pick-up position PP2. The sorting vision unit 9333 may check whether the tested LED chip is positioned at the second pickup position PP2, and the degree of rotation of the LED chip positioned at the second pickup position PP2 is rotated. The third mobile unit 9224 is configured such that the LED chip positioned at the second pickup position PP2 is accurately picked up by the sorting unit 923 from the state information of the LED chip acquired by the sorting vision unit 9233. The second supply body 9221 can be moved. A CCD camera may be used as the sorting vision unit 9333.

72 to 81, when the sorting unit 923 includes the sorting vision unit 9333, the sorting rotary arm 9231 may further include a second penetrating member 9231b.

The second transmissive member 9231b may be coupled to the sorting picker 9231a and formed of a material having high transparency. For example, the second transmission member 9231a may be formed of glass. As illustrated in FIG. 80, a second intake hole 9231c is formed in the sorting picker 9231a to allow the LED chip to be adsorbed. The second intake hole 9231c may be formed through the sorting picker 9231a. The second transmission member 9231b may be coupled to the sorting picker 9231a at one side of the second intake hole 9231c and thus may seal one side of the second intake hole 9231c. Therefore, the LED chip may be adsorbed to the sorting picker 9231 a. Although not shown, the second intake hole 9231c may be connected to the intake apparatus.

The second transmission member 9231b may pass light passing through the second intake hole 9231c. Accordingly, even when the sorting picker 9231a is positioned at the second pick-up position PP2, the sorting vision unit 9333 can check the state of the LED chip located at the second pick-up position PP2. Make sure The sorting vision unit 9333 may check the state of the LED chip positioned at the second pickup position PP2 through the second transmission member 9231b and the second intake hole 9231c. Accordingly, in the third mobile unit 9224, the LED chip positioned at the second pick-up position PP2 from the state information of the LED chip acquired by the sorting vision unit 9233 can be accurately aligned with the sorting unit 923. The second supply body 9221 may be moved to be picked up.

The second transmission member 9231b may also be used to align the positions of the second support pin 9222c, the sorting picker 9231a, and the sorting vision unit 9333. Even when the sorting picker 9231a is positioned at the second pick-up position PP2, the sorting vision unit 9333 is configured to pass through the second penetrating member 9231b and the second intake hole 9231c. 2 can confirm the position of the support pin (9222c). Accordingly, the sorting vision unit 9333, the second support pin 9222c, and the sorting are performed so that the sorting picker 9231a can pick up the LED chip positioned at the second pick-up position PP2 accurately. The position of the picker 9231a can be easily aligned. The sorting vision unit 9333, the second support pin 9222c, and the sorting picker 9231a may be aligned to be positioned on the same vertical line.

72 to 85, the sorting unit 92 according to a modified embodiment of the present invention may further include a second cooling unit 927.

The second cooling unit 927 may cool the first receiving device 200. The second cooling unit 927 may cool the first accommodating device 200 such that the first accommodating device 200 is at room temperature or lower than room temperature, and the first accommodating device 200 is approximately The first receiving device 200 may be cooled to be 20 ° C. or less.

As described above, the LED chip may be supplied while attached to the first accommodating member 202 including a tape having an adhesive material such as blue tape. In this case, the LED chip may be picked up from the first accommodating device 200 in a state in which the adhesive material is buried in a high temperature environment higher than room temperature. Due to the adhesive material, the LED chip may be attached to the second receiving device 300 with a strong adhesive force. The second cooling unit 927 may cool the first accommodating member 202, thereby cooling the adhesive material in the first accommodating member 202. Accordingly, the second cooling unit 927 may allow the LED chip to be picked up at the second pick-up position PP2 without the adhesive material on the LED chip.

The second cooling unit 927 may include a second injection unit 9927 for injecting cooling gas. The second injection unit 9927 may inject a cooling gas toward the first receiving device 200 supported by the second supply unit 922. The second injection unit 9927 may receive a cooling gas from a cooling gas supply system (not shown). The second cooling unit 927 may include a plurality of second injection units 9927.

As illustrated in FIG. 83, the second injection unit 9927 may be installed in the sorting unit 923 so as to be positioned on the first receiving device 200. The second injection unit 9927 may be installed in the sorting vision unit 9333 to be positioned on the second supply unit 922. The sorting vision unit 9333 may include a sorting illumination device 9333a for irradiating light to the second pick-up position PP2, and the second injection unit 9131 may include the sorting illumination device ( 9233a). The second injection unit 9927 may cool the first accommodating device 200 by spraying a cooling gas onto the first accommodating device 200 from the first accommodating device 200. The second injection unit 9927 may cool the second accommodation member 202 by injecting a cooling gas toward the first accommodation member 202. The second injection unit 9927 may inject cooling gas toward the second pickup position PP2.

As illustrated in FIG. 84, the second injection unit 9927 may be installed in the second supply unit 922 to be positioned below the first receiving device 200. The second injection unit 9191 may be installed on the second supply support device 9222 to be positioned below the second supply body 9221. The second injection unit 9191 may be installed on the second elevating member 9222a. The second injection unit 9927 may cool the first accommodating device 200 by spraying a cooling gas from the first accommodating device 200 toward the first accommodating device 200. The second injection unit 9927 may cool the first accommodating member 202 by spraying a cooling gas toward the first accommodating member 202. The second injector unit 9191 is configured to inject a cooling gas into a portion of the first accommodating member 202 around a portion where the LED chip is picked up by the sorting unit 923. The sorting unit 923 may cool the portion where the LED chip to be picked up in the next order.

As illustrated in FIG. 85, the second cooling unit 927 is installed on the sorting vision unit 9333 so as to be positioned on the second supply unit 922, and the second upper injection unit 9331a and the second upper injection unit 9331 are installed on the sorting vision unit 9233. It may include a second lower injection unit (9271b) installed in the second supply support device (9222) to be positioned below the supply body (9221).

The second upper injection unit 9191a may cool the first accommodating device 200 by spraying a cooling gas onto the first accommodating device 200 from the first accommodating device 200. The second upper injection unit 9927a may cool the first accommodating member 202 by spraying a cooling gas toward the first accommodating member 202. The second upper injection unit 451 may spray a cooling gas toward the second pickup position PP2.

The second lower injection unit 9927b may cool the first accommodating mechanism 200 by spraying a cooling gas under the first accommodating mechanism 200 toward the first accommodating mechanism 200. The second lower injection unit 9927b may cool the first accommodating member 202 by spraying a cooling gas toward the first accommodating member 202. The second lower injection unit (9271b) injects a cooling gas around a portion where the LED chip is picked up by the sorting unit (923) from the first receiving member (202), thereby the first receiving member (202) In the sorting unit 923, it is possible to cool the portion where the LED chip to be picked up in the next order.

Although not shown, the second cooling unit 927 according to the modified embodiment of the present invention has a second supply support device 9222 contacting the first receiving device 200 at the second pickup position PP2. By cooling the first storage mechanism 100 in contact with the second supply support device 9222 can be cooled.

The second cooling unit 927 cools the second elevating member 9222a to cool the first accommodating member 202 in contact with the second elevating member 9222a. The second cooling unit 927 may cool the second elevating member 9222a by circulating a cooling fluid into the second elevating member 9222a. In this case, the second elevating member 9222a may include a flow path through which the cooling fluid is moved. The second cooling unit 927 may cool the second elevating member 9222a by using a thermoelectric element.

72 to 86, the second accommodating unit 924 supports the second accommodating mechanism 300 and the second accommodating unit 923 is positioned at the position where the LED chip tested can be placed. The second receiving device 300 is moved so that the receiving device 300 is positioned.

The second accommodating unit 924 includes a second accommodating body 9191, a fourth alignment unit 9924, and a fourth moving unit 9243.

The second accommodating body 9191 includes substantially coinciding elements corresponding to the first accommodating body 9121 described above. The second housing body 9191 may be moved in the X-axis direction and the Y-axis direction by the fourth moving unit 9241, and may be rotated. According to the movement and rotation of the second accommodating body 9191, the sorting unit 923 may be placed on the second accommodating mechanism 300 such that all of the tested LED chips face the same direction. The fourth alignment unit 9924 is substantially coincident with each of the second fixing member 9222a, the second moving member 9922b, the second moving mechanism 9922c, and the second lifting mechanism 9922d. It consists of including the configuration. The fourth mobile unit 9243 includes substantially identical components corresponding to the second mobile unit 9223 described above. Therefore, description of these configurations will be omitted in order not to obscure the subject matter of the present invention.

72 to 87, the third storage unit 925 includes a third storage mechanism 9151 capable of storing a plurality of the second accommodation mechanisms 300.

The third storage mechanism 9151 may include a plurality of third storage members 9501a that may support both bottom surfaces of the second storage mechanism 300. The third storage members 9151a may be formed in a plurality of spaced apart from each other by a predetermined distance in a vertical direction (Z-axis direction). A space where the third storage members 9501a are spaced apart from each other may be a third storage groove 9501b, and the second receiving devices 300 may be inserted.

The second storage device 300 may be stacked and stored in the vertical direction (Z-axis direction) in the third storage device 9151. In this case, the third storage unit 925 may further include a third storage raising and lowering mechanism (9252).

The third storage raising and lowering mechanism 9502 may raise and lower the third storage mechanism 9501. The third storage raising and lowering mechanism 9152 stores the third storage mechanism 300 so that the second storage mechanism 300 is positioned at a position where the fourth transporting unit 926 may hold the second storage mechanism 300. The mechanism 9501 can be raised and lowered. The third storage raising and lowering mechanism 9922 lifts and lowers the third storage mechanism 9151 so that the fourth transfer unit 926 can store the second receiving mechanism 300 in the storage mechanism 231. You can.

The third storage raising and lowering mechanism (9252) is the third storage mechanism (9251) by using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. ) Can be raised and lowered.

In addition to the manner in which the third storage mechanism 9151 is raised and lowered by the third storage raising and lowering mechanism 9252, the fourth transfer unit 926 may be raised and lowered, and the fourth transfer unit 926 may be elevated. And both the third storage mechanism (9251) may be raised and lowered.

The third storage raising and lowering mechanism 9252 may include a third vertical body 9502a and a third lifting body 9922b. The third lifting body 9252b is coupled to the third vertical body 9152a to be able to move up and down.

The third storage mechanism 9151 may be detachably coupled to the third lifting body 9152b. Accordingly, not only the operation of replacing the third storage device 9501 is easy, but also other components may be continuously operated during the replacement of the third storage device 9501, and thus, the operation may be performed due to the replacement operation. The loss of time can be prevented.

72 to 88, the fourth transfer unit 926 may transfer the second accommodation mechanism 300 from the third storage mechanism 9151 to the second accommodation body 9191. The second housing 300 may be transferred from the housing body 9031 to the third storage device 9151.

As described above, the sorting unit 92 has a specific grade to be transferred to the second storage device 300 based on the second storage device 300 positioned in the second storage unit 924. Only LED chips may be preferentially transferred from the first accommodating device 200 to the second accommodating device 300. When only the LED chips other than the LED chip of the specific grade remain in the first housing 200 located in the second supply unit 922, the sorting unit 92 may move the first housing 200. After the transfer to the second storage device (9131), the other first storage device 200 is transferred to the second supply unit 922 and then only the LED chip of the specific grade continues to the first housing 200 ) May be transferred to the second receiving device 300.

That is, the sorting unit 92 is stored in the second storage mechanism 9131 until the second housing 300 is filled with LED chips of a specific grade to be transferred thereto. Instruments 200 may be sequentially placed in the second supply unit 922.

The sorting unit 92 is based on the first storage device 200 positioned in the second supply unit 922, and the third storage device 9151 is until the first storage device 200 is empty. The second storage device 300 stored in the) may be sequentially placed in the second storage unit 924.

In the above operation, the operation of transferring the second storage device 300 between the third storage device 9151 and the second storage unit 924 may be performed by the fourth transport unit 926. have.

The fourth transfer unit 926 may transfer the second accommodation mechanism 300 between the second accommodation unit 924 and the third storage mechanism 9151. The fourth transfer unit 926 includes a fourth transfer member 9231 and a fourth transfer mechanism 9252.

The fourth conveying member 9221 may grasp the second receiving device 300. The fourth transfer member 9221 corresponds to each of the first holding member 2411, the second holding member 2412, the first driving mechanism 2413, and the first connecting body 2414. It is to be understood that the description of these components will be omitted so as not to obscure the subject matter of the present invention.

The fourth transfer mechanism 9252 moves the fourth transfer member 9201 between the third storage mechanism 9151 and the second accommodation unit 924. The fourth transfer mechanism 9302 is configured to use the fourth transfer unit 926 by a cylinder, such as a hydraulic cylinder or a pneumatic cylinder, a pulley and a belt, a ball screw, or a cam member. You can move it. The fourth transfer mechanism 9302 may be coupled to the fourth gantry 9203. The fourth transfer member 9231 may move in the Y-axis direction along the fourth gantry 9203.

Third Embodiment

89 is a perspective view schematically illustrating a part of an LED chip sorting apparatus including an unloading unit according to a modified embodiment of the present invention, and FIG. 90 is a plan view of FIG. 89.

72, 73, 89, and 90, the unloading unit 9 according to the modified embodiment of the present invention may include a sorting unit 93 installed next to the test unit 3. Can be. Some components shown in FIGS. 72 and 73 are omitted in FIGS. 89 and 90, but the LED chip sorting apparatus 10 has the same configuration except for the buffer unit 91 and the sorting unit 92. It may include.

The classifier 93 may classify the tested LED chips positioned at the unloading position ULP by grades according to test results. In this respect, there is a difference from the unloading section 9 including the buffer section 91 and the sorting section 92 as described above. According to the third embodiment, there is an advantage that the overall size of the equipment can be reduced compared to the first and second embodiments described above.

The classification unit 93 may include a classification unit 931 and a classification mechanism 932.

The sorting unit 931 transfers the tested LED chip from the seating member 21 positioned at the unloading position ULP to the sorting mechanism 932. The sorting unit 931 may include a sorting rotary arm 9311 and a first driving device 9312.

The sorting rotary arm 9311 is provided with a sorting picker 9311a capable of absorbing the tested LED chip. The sorting rotary arm 9311 is rotated by the driving device 9312, and the sorting picker 9311a may be reciprocated to be positioned on the unloading position ULP and the sorting mechanism 932. The split rotary arm 9311 may be lifted up and down by lifting means (not shown).

The sorting unit 931 may include one sorting rotary arm 9311 and one sorting picker 9311a. 89 and 90, the classification rotary arm 9311 and the classification picker 9311a are illustrated as four, but this is for indicating the reciprocating movement path of the classification rotary arm 9311.

The dividing rotary arm 9311 is coupled to the driving device 9312. The driving device 9312 may rotate the sorting rotary arm 9311 such that the sorting picker 9311a is positioned on the unloading position ULP and the sorting mechanism 932. The driving unit 9312 may rotate the split rotary arm 9311 in a 180 ° range, and may rotate the split rotary arm 9311 in a clockwise or counterclockwise direction.

Although not shown, the sorting unit 931 may include a plurality of sorting rotary arms 9311 and a plurality of sorting pickers 9311a coupled to the sorting rotary arms 9311 respectively. The driving device 9312 rotates the classification rotary arm 9311 about a rotation axis (not shown), and one of the classification pickers 9311a is positioned at the unloading position ULP, and the classification is performed. At least one of the pickers 9311a may be positioned above the classifier 932. The driving device 9312 may sequentially position the sorting pickers 9311a on the unloading position ULP and the sorting mechanism 932.

The driving unit 9312 may include a motor, and may further include a pulley and a belt if the motor and the jet rotating arm 9311 are spaced apart from each other by a predetermined distance.

The sorting mechanism 932 includes a moving plate 9321, an empty block 9922, and an operating device 9323.

A plurality of empty blocks 9922 are installed in the movable plate 9321. The movable plate 9321 may be moved in the X-axis direction and the Y-axis direction by the operating device 9323.

In the empty block 9322, the LED chips tested by the classification unit 931 are placed by grade. The bin block 9322 may be installed in the movable plate 9321 in a number corresponding to the number of ratings desired by the user.

The operating device 9323 moves the bin block 9322 so that the bin block is positioned at a sorting position (not shown) in which the sorting unit 931 can put the tested LED chip. The actuator 9223 moves the movable plate 9321 so that the bin block 9322 corresponding to the class of the tested LED chip picked up by the sorting unit 931 is positioned at the sorting position (not shown). Can be. The sorting position may be below a path in which the first sorting picker 9311a is rotated by the first driving device 9312. The operating device 9323 can move the movable plate 9321 by a method using a cylinder such as a hydraulic cylinder or a pneumatic cylinder, a method using a pulley and a belt, a method using a ball screw, or a method using a cam member. .

The sorting unit 93 may include a plurality of sorting units 931 and the sorting mechanism 932. The classifying unit 931 and the classifying apparatus 932 may classify the tested LED chips belonging to different class ranges, respectively.

Accordingly, a relatively small number of empty blocks 9322 may be installed in the movable plates 9321 provided in the sorting mechanisms 932, respectively. Accordingly, the movable plate 9321 is provided so that each of the actuators 9323 has a bin block 9322 corresponding to the class of the LED chip picked up by the sorting unit 931 at the sorting position (not shown). Distance and the time taken for this operation can be reduced.

In this case, the rotating unit 33 may rotate the rotating member 32 such that the seating members 21 are sequentially positioned in the plurality of unloading positions ULP. As shown in FIG. 36, the rotating unit 33 moves the rotating member 32 such that the seating member 21 is positioned at the first unloading position ULP1 and the second unloading position ULP2, respectively. Can be rotated.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and it is common in the art that various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.

The present invention can accurately classify and classify the performance of the LED chip, thereby preventing the loss of the material cost, process cost, etc. by preventing the LED chip that is unnecessarily undergoing the packaging process and the test process, Provided is an LED chip sorting apparatus that can lower the manufacturing cost.

Claims

In the LED chip sorting apparatus for classifying the LED chip by measuring the characteristics of the LED chip,

And a seating member on which the LED chip is seated, a loading position at which the LED chip is loaded on the seating member, a test position at which the LED chip is tested, and an unloading position at which the LED chip is unloaded from the seating member. Supply unit for rotating the seating member;

A loading unit installed beside the supply unit and supplying an LED chip to be tested to the seating member in the loading position;

A test unit installed beside the supply unit and measuring a characteristic of the LED chip at the test position; And

And an unloading unit installed next to the supply unit and collecting the tested LED chip from the seating member in the unloading position.
The method of claim 1, wherein all or part of the seating member is made of a material including any one of sapphire, quartz, glass, iron alloy, copper alloy, aluminum alloy, stainless steel, cemented carbide, gold, platinum LED chip sorting device.
The LED chip sorting apparatus according to claim 1, wherein all or part of the seating member is Teflon coated, mirror coated, gold plated, or platinum plated.
The LED chip sorting apparatus of claim 1, wherein the supply unit includes a plurality of support frames extending radially about a rotation axis, and the seating members are respectively provided at end portions of the plurality of support frames. .
The LED chip sorting apparatus of claim 1, wherein the unloading unit is positioned on an opposite side of the loading unit with respect to the supply unit.
The apparatus of claim 1, further comprising a correction unit installed between the loading unit and the test unit, or between the test unit and the unloading unit and correcting a position of the LED chip seated on the seating member.

The correction unit,

A correction mechanism capable of contacting the side of the LED chip, and

And an actuating mechanism connected to the calibrating mechanism, the actuating mechanism for changing the position of the LED chip seated on the seating member by moving the calibrating mechanism.
The LED chip sorting apparatus of claim 6, wherein the correcting mechanism comprises a first correcting member in contact with one side of the LED chip, and a second correcting member in contact with the other side of the LED chip.
The method of claim 7, wherein the operating mechanism is to move the first compensation member and the second compensation member in a direction approaching or away from the LED chip located between the first compensation member and the second compensation member. LED chip sorting device characterized in that.
The method of claim 6, wherein the correction mechanism is provided between the first contact surface in contact with one side of the LED chip, the second contact surface in contact with the other side of the LED chip, and is provided between the first contact surface and the second contact surface LED chip sorting apparatus comprising a third correction member having an LED chip receiving groove in which the LED chip is located.
The method of claim 9,

The actuating mechanism includes a state in which the LED chip moves the third correction member while not touching the second contact surface but only in contact with the first contact surface, and the LED chip does not contact the first contact surface, without contacting the second contact surface. The LED chip sorting apparatus which switches between the states which move a 3rd correction member, keeping only a contact surface.
The LED chip sorting apparatus of claim 6, further comprising a sensing unit installed on the correction mechanism to identify a position where the LED chip is seated on the seating member.
2. The method of claim 1, further comprising a first removal unit installed at a first removal position located between the unloading position and the loading position and removing residues remaining on the seating member past the unloading position. LED chip sorting device characterized in that.
The method of claim 12, wherein the first removal unit,

Body; And

LED chip sorting device is connected to one side of the body, the injection unit for injecting a fluid for removing the residue from the seating member in the first removal position.
The LED chip sorting apparatus of claim 13, wherein the first removal unit further comprises an intake unit connected to the other side of the body and sucking the fluid injected from the injection unit.
The apparatus of claim 1, further comprising a second removal unit installed at a second removal position located between the unloading position and the loading position and removing the adhesive substance remaining on the seating member passing through the unloading position. LED chip sorting device characterized in that.
The method of claim 15, wherein the second removal unit,

At least one contact member contacting an upper surface of the seating member passing through the unloading position;

A support member rotatably coupled to the contact member; And

LED chip sorting apparatus comprising a drive unit coupled to the support member for rotating the contact member.
The method of claim 15, wherein the second removal unit,

At least one contact member contacting an upper surface of the seating member passing through the unloading position;

A support member coupled to the contact member; And

LED chip sorting apparatus comprising a moving unit coupled to the support member for moving the support member.
The method of claim 1, wherein the loading unit,

A supply mechanism for supplying a plurality of LED chips to be tested,

A loading unit which picks up the LED chip to be tested in the supply mechanism and seats the seating chip positioned at the loading position;

And a first supply unit to move the supply mechanism to position the LED chip to be tested at a first pick-up position at which the loading unit can pick up the LED chip to be tested.
19. The LED chip sorting apparatus of claim 18, wherein the loading unit further comprises a first cooling unit for cooling the supply mechanism.
20. The LED chip sorting apparatus according to claim 19, wherein the first cooling unit includes a first injection unit for injecting a cooling gas toward the supply mechanism supported by the first supply unit.
The method of claim 18, wherein the loading unit,

A loading vision unit installed to be positioned above the first pickup position;

A loading picker positioned below the loading vision unit and having a first intake hole for adsorbing an LED chip positioned at the first pickup position; And

And a first transmission member coupled to the loading picker at one side of the first intake hole and configured to pass light passing through the first intake hole.
The apparatus of claim 1, wherein the unloading unit includes a buffer unit installed next to the test unit, and a sorting unit installed next to the buffer unit.

The buffer unit may include an unloading unit configured to perform an unloading process of picking up the tested LED chip from the seating member located at the unloading position and transferring the LED chip to the first storage device.

The sorting unit may include a sorting unit configured to transfer the tested LED chip to a second storage device corresponding to a grade of the LED chip tested by the first storage device, the first storage device, and the sorting unit configured to support the first storage device. And a second supply unit which moves the first housing so that the tested LED chip is positioned at a second pickup position capable of picking up the tested LED chip in the housing.
The LED chip sorting apparatus of claim 22, wherein the sorting unit further comprises a second cooling unit configured to cool the first accommodation mechanism.
24. The LED chip sorting apparatus according to claim 23, wherein the second cooling unit includes a second injection unit for injecting a cooling gas toward the first receiving mechanism supported by the second supply unit.
The method of claim 22, wherein the sorting unit,

A sorting vision unit installed to be positioned above the second pickup position;

A sorting picker positioned under the sorting vision unit and having a second intake hole for adsorbing an LED chip positioned at the second pick-up position; And

And a second transmission member coupled to the sorting picker at one side of the second intake hole and configured to pass light passing through the second intake hole.
The method of claim 1, wherein the unloading unit includes a classification unit installed next to the test unit,

And the sorting unit includes a sorting device on which the tested LED chips are placed, and a sorting unit for transferring the tested LED chip from the seating member positioned at the unloading position to the sorting device.
The method of claim 26,

The sorting device may be configured such that the bin block is positioned at a sorting position where a plurality of bin blocks on which the tested LED chips are placed by grade, a moving plate on which the bin blocks are installed, and a sorting unit on which the sorting unit can place the tested LED chips. An actuator for moving the bin block;

And said operating device moves said moving plate such that a bin block corresponding to the class of the tested LED chip picked up by said sorting unit is located at said sorting position.