JP2003066109A - Semiconductor testing apparatus and semiconductor testing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor testing apparatus and a semiconductor testing method capable of bringing all measurement terminals into contact with the terminal of a semiconductor device with a uniform contact pressure and capable of achieving reliable contact. SOLUTION: A plurality of semiconductor devices 1 are fitted to an XYZθ table 14 via an elastic body 40 having conductivity. A contactor 30 for testing has a measurement terminal 32 that is composed so that it is compressed to a terminal 1a of the plurality of semiconductor devices 1. The measurement terminal 32 is a projecting conductor formed on a measurement board 6, and a flat surface 32 is formed on the top.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor test apparatus, and more particularly to a semiconductor test apparatus and a semiconductor test method for making a test collectively by making electrical contact with a plurality of semiconductor devices using a contactor.

[0002]

2. Description of the Related Art In recent years, in the testing of semiconductor devices, a plurality of semiconductor devices formed on a wafer are individually mounted on a test device and collectively subjected to electrical contact for testing. Is being done. That is, by collectively testing a plurality of semiconductor devices, the test process is shortened and the cost related to the semiconductor test is reduced.

FIG. 1 is a view showing a state in which a semiconductor device to be tested is attached to a conventional semiconductor test device.

A plurality of semiconductor devices 1 are attached to an adhesive tape 3 stretched on a tape holding ring 2. The tape holding ring 2 has a flat ring shape, and the adhesive tape 3 is stretched over the inside of the ring with its adhesive surface 3a facing upward. The semiconductor device 1 is attached with the back surface attached to the adhesive surface 3a.

With the semiconductor device 1 attached to the adhesive tape 3, the adhesive tape 3 is placed on the XYZθ table 4 together with the tape holding ring 2. Then, the back surface of the adhesive tape 3 is sucked by the vacuum suction mechanism to fix the adhesive tape 3 on the XYZθ table 4. Therefore, the terminals (bumps) 1 a of the semiconductor device 1 face upward with the adhesive tape 3 fixed on the XYZθ table 4.

As described above, the plurality of semiconductor devices 1 are XYZ.
After being fixed on the θ table 4, the position of the terminal 1a of the semiconductor device 1 is detected by image recognition. Then, the terminals 1a of the semiconductor device 1 and the measurement terminals of the test device are brought into contact with each other based on the detected position information.

Above the XYZθ table 4, a measurement board 6 provided with measurement terminals 5 is arranged. The measurement substrate 6 is a flat substrate, and is arranged such that the measurement terminal 5 faces the terminal 1a of the semiconductor device 1 on the XYZθ table 4. The measuring terminal 5 is a so-called pogo pin, and the pins forming the measuring terminal 5 are arranged inside the socket 7, and the tip 5 a thereof is projected from the socket 7 by being biased by a coil spring. That is, the tip 5a of each pin can move up and down while being urged by the coil spring.

The XYZθ table 4 moves in the XYθ directions based on the position detection information so that the terminal 1a of the attached semiconductor device 1 coincides with the position of the measuring terminal 5.
Then, at the position where the terminal 1a of the semiconductor device 1 coincides with the position of the measurement terminal 5, the XYZθ table 4 moves upward (Z direction).
Then, the terminal 1a of the semiconductor device 1 contacts the tip 5a of the measuring terminal 5. At this time, variations in the manufacturing of the terminals 1a in the Z direction occur. Further, the position of the tip 5a of the measuring terminal 5 in the Z direction also varies. In order to absorb such variations, the measuring terminal 5 is of a pogo pin type, and the tip 5a is configured to be movable in the Z direction.

The semiconductor device 1 is tested with the tip 5a of the measuring terminal 5 in contact with the terminal 1a of the semiconductor device 1.

[0010]

In the conventional semiconductor test apparatus as shown in FIG. 1, since the area of the top surface of the terminal 1a of the semiconductor device 1 is very small, the tip 5a of the measuring terminal 5 has a sharp tip. It has a sharp shape. In the configuration in which the measurement terminals 5 are arranged corresponding to the plurality of semiconductor devices 1 and attached to the measurement substrate 6, an error may occur in the arrangement of the plurality of measurement terminals 5. Further, the semiconductor device 1 attached to the adhesive tape 3 may have a positional error.

As described above, when the tip 5a of the measuring terminal 5 is pressed against and brought into contact with the terminal 1a of the semiconductor device 1 in the state where the position error occurs, the tip 5a of the measuring terminal 5 is accurately the terminal 1a of the semiconductor device 1. Without touching the center of
It may shift around the terminal 1a. When the terminal 1a has a diameter of, for example, 300 μm, the flat portion is a region having a diameter of about 100 μm in the central portion, and the periphery is connected to the side portion with a curved surface.

Here, when the sharp tip 5a of the measuring terminal 5 abuts against the curved surface of the terminal 1a and is pressed, an appropriate contact pressure cannot be applied, which may cause a contact failure. Further, there is a problem that the tip 5a of the measuring terminal 5 moves while being in contact with the curved surface portion of the terminal 1a, so that the terminal 1a is easily damaged.

There is also a problem that peeling electrification occurs when the adhesive tape 3 is removed from the XYZθ table 4 in order to move the semiconductor device 1 for which the test is completed from the test device, and the semiconductor device 1 is adversely affected. .

The present invention has been made in view of the above points, and a semiconductor test apparatus capable of bringing all the measurement terminals into contact with the terminals of the semiconductor device with a uniform contact pressure and ensuring reliable contact. And to provide a semiconductor test method.

It is another object of the present invention to provide a semiconductor test apparatus capable of reducing peeling charge that occurs when the adhesive tape is removed from the XYZθ table.

[0016]

In order to solve the above problems, the present invention is characterized by taking the following means.

According to a first aspect of the present invention, there is provided a semiconductor testing device for performing an electrical test on a plurality of semiconductor devices, the mounting table having the plurality of semiconductor devices mounted thereon, and an elastic body provided on the mounting table. And a test contactor having a measuring terminal configured to be pressed into contact with the terminals of a plurality of semiconductor devices mounted on the mounting table via the elastic body.

According to the first aspect of the present invention, the elastic deformation of the elastic body reduces variations in the height of the terminals of the semiconductor device, variations in the dimensions of the measurement terminals, variations in the pressure contact force due to distortion of the test contactor, and the like. Therefore, it is possible to realize contact with a uniform pressure to the terminals of the plurality of semiconductor devices.

The invention according to claim 2 is the semiconductor test apparatus according to claim 1, wherein the test terminal is a projecting conductor formed on a substrate, and a flat surface is formed on the top. It is characterized by that.

According to the second aspect of the present invention, the terminals of the semiconductor device are pressed against the plane formed on the tops of the test terminals, so that the terminals of the semiconductor device are prevented from being damaged.

A third aspect of the present invention is the semiconductor test apparatus according to the first or second aspect, wherein the elastic body is made of a conductive silicone rubber foam.

According to the third aspect of the invention, since the elastic body has conductivity, it is possible to prevent peeling electrification when the semiconductor device is removed from the mounting table.

The invention according to claim 4 is the semiconductor test apparatus according to claim 1 or 2, wherein the elastic body is a bag containing a fluid, and the pressure of the fluid can be adjusted. It is a feature.

According to the fourth aspect of the invention, the elasticity of the elastic body can be changed by adjusting the pressure of the fluid contained in the bag body.

According to a fifth aspect of the present invention, there is provided a semiconductor test method for collectively testing a plurality of semiconductor devices, wherein an elastic body is mounted on a mounting table, and the plurality of semiconductor devices are mounted via the elastic body. It is characterized in that the terminals of the plurality of semiconductor devices are pressed into contact with the measurement terminals of the test contactor, and the electrical characteristic test of the plurality of semiconductor devices is performed via the measurement terminals.

According to the fifth aspect of the present invention, the elastic deformation of the elastic body reduces variations in the height of the terminals of the semiconductor device, variations in the dimensions of the measuring terminals, variations in the pressure contact force due to distortion of the test contactor, and the like. Therefore, it is possible to realize contact with a uniform pressure to the terminals of the plurality of semiconductor devices.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings.

First, the structure of the semiconductor test apparatus according to the embodiment of the present invention will be described with reference to FIG.
FIG. 2 is a diagram showing a schematic configuration of a semiconductor test apparatus according to an embodiment of the present invention.

The semiconductor testing apparatus 10 shown in FIG.
1, a position correction device 12, a testing device 13, CCD cameras 17, 18A, 18B, 20 and the like.

The position correction device 12 is provided on the base 11 so as to be movable in the directions of the arrows X1 and X2 in the figure, and together with the position recognition CCD cameras 18A and 18B, position recognition processing and position detection are performed using image processing technology. It has a function of performing a correction process. The position correction device 12 includes an XYZθ including a suction fixing mechanism.
It is composed of a table 14, a lifting mechanism 15, and a horizontal movement mechanism 16. The XYZθ table 14 is a mounting table on which the semiconductor device 1 to be tested is mounted.
It is movable in the Y and Z directions and the rotation direction (θ direction).

The suction fixing mechanism of the XYZθ table 14 is
X the adhesive tape 3 to which the plurality of semiconductor devices 1 are attached.
It is fixed by suction on the YZθ table 14. The tape holding ring 2 is provided with a positioning pin (not shown),
By fitting the positioning pin into a positioning recess (not shown) provided on the XYZθ table 14, the tape holding ring 2 can be placed at a predetermined position on the XYZθ table 14.

The XYZθ table 14 is a horizontal movement mechanism 1
6 allows movement in the horizontal direction (X direction and Y direction), and elevation mechanism 15 enables movement in the vertical direction (Z direction). Further, the XYZθ table 14 can be rotated about the central axis A by the horizontal moving mechanism 16.

By raising the XYZθ table 14 by the elevating mechanism 15 described above, the XYZθ table 14 is moved.
The terminal 1a of the semiconductor device 1 attached to the test contactor 30 is pressed against the test contactor 30.

CCD cameras 18A, 18B for position recognition
Is attached to the base member 19, and each semiconductor device 1 attached to the tape holding ring 2 attached to the position correction device 12 can be individually imaged. In this embodiment, the position of each semiconductor device 1 is recognized by identifying the side of the outer circumference 2, so that two position recognition CCD cameras 18A and 18B are provided. However, the number of CCD cameras for position recognition is not limited to two, and the number of CCD cameras can be appropriately determined according to the method of recognizing the position of the semiconductor device 1.

At the position where the semiconductor device 1 mounted on the tape holding ring 2 mounted on the position correction device 12 can be imaged, the CCD camera 17 for appearance test is provided together with the CCD cameras 18A and 18B for position recognition described above. It is arranged. The appearance test CCD camera 17 is provided to confirm whether or not damage such as cracks has occurred on the outer periphery of the semiconductor device 1.

A CCD camera 20 for contactor confirmation is arranged on the side of the position correction device 12. In the CCD camera 20 for confirming the contactor, the position correction device 12 has X1,
When moving in the X2 direction, X1, together with the position correction device 12,
Move in the X2 direction. Further, the contactor confirmation CCD camera 20 is arranged so as to capture an image of the upper side, and when the position correction device 12 moves to a predetermined position below the test contactor 30 in the test process, It has the function of position recognition.

Further, a bar code reader 23 is arranged above the position correction device 12. The bar code reading device 23 reads a bar code (serial number of each tape holding member) imprinted on the tape holding member, and uses the electric characteristic test result as an ID when saving the file.

The above-mentioned XYZθ table 14 and lifting mechanism 1
5, horizontal movement mechanism 16, CCD cameras 17, 18A, 1
The 8B, 20 and the bar code printer 23 are connected to a central controller (not shown) and are collectively controlled. The central controller is each CCD camera 17, 18A, 1
Of the semiconductor device 1 judged by the electrical characteristic test device 13; an image processing unit for image-processing the imaged data captured by 8B and 20; a position recognition data storage unit for storing the position recognition data processed by the image processing unit; It is configured to include a pass / fail judgment data storage unit that stores pass / fail judgment data, an appearance test data storage unit that stores appearance test data obtained by performing an appearance test, and the like.

The central control unit can be composed of a personal computer or the like. Further, by providing a monitor device (not shown), each CCD camera 1
The images captured by 7, 18A, 18B, and 20 may be displayed. Further, the program used for the semiconductor test stored in the central control device and various data may be displayed on the monitor device.

The electrical characteristic testing device 13 is mainly used in the electrical testing process. The electrical test apparatus 13 includes a test apparatus body 21 and a test contactor 30. The test apparatus main body 21 stores a test program of an electrical characteristic test performed on the semiconductor device 1, and a test signal is supplied to each semiconductor device 1 via the test contactor 30 according to the test program.
The quality of the semiconductor device 1 is determined.

The test contactor 30 is constructed so that the semiconductor device 1 whose position is corrected by the position correcting device 12 is brought into pressure contact with the test contactor 30. As a result, the test contactor 3
0 and the semiconductor device 1 are electrically connected.
Further, since the test contactor 30 is connected to the test apparatus main body 21, the semiconductor device 1 is connected to the test contactor 30.
The semiconductor element in each semiconductor device 1 is brought into a state of being connected to the test apparatus main body 21 by being pressed against. As a result, the test apparatus body 21 can perform an electrical characteristic test on the semiconductor element.

Next, the semiconductor test apparatus according to the embodiment of the present invention will be described in more detail with reference to FIG. FIG. 3 is a diagram showing a state in which a tape holding ring 2 having a plurality of semiconductor devices 1 attached thereto is attached to a semiconductor test device according to an embodiment of the present invention.

The plurality of semiconductor devices 1 are aligned and attached to the adhesive surface 3a of the adhesive tape 3 with the terminals 1a facing upward. The adhesive tape 3 is, for example, an ultraviolet curable adhesive (U
V adhesive material) is a plastic tape provided on the adhesive surface 3a, and the adhesive force is reduced by irradiating the adhesive material on the adhesive surface 3a with ultraviolet rays, and the semiconductor device 1 can be easily peeled off.

The semiconductor device 1 is attached to the adhesive surface 3a while the adhesive tape 3 is stretched on the tape holding ring 2 as a tape holding member. Therefore, the adhesive tape 3 can be moved while supporting the tape holding ring 2. The tape holding ring 2 with the semiconductor device 1 attached to the adhesive tape 3 is mounted on the XYZθ table 14. At this time, in the present embodiment, the elastic body 40 is arranged between the adhesive tape 3 and the XYZθ table 14. The elastic body 40 is made of, for example, a silicon rubber having a thickness of about 5 mm, and the test contactor 30 is the semiconductor device 1.
It is configured to be elastically deformed when pressed against.

Here, the test contactor 30 of the semiconductor test apparatus according to the present embodiment comprises a measurement substrate 6 and a plurality of measurement terminals 32 formed on the measurement substrate 6. The measuring terminal 32 is made of a projecting conductor and is not provided with a mechanism that moves vertically like a pogo pin. That is, the measurement terminal 32 is formed on the measurement substrate 6 as a mere protruding conductor. A flat portion 32a is formed at the tip of the measurement terminal 32, and the flat portion 32a is configured to be pressed against the terminal 1a of the semiconductor device 1. In the present embodiment, since the tip of the measuring terminal 32 does not move in the vertical direction, variations in the height of the terminal 1a of the semiconductor device, warpage of the test contactor 30 and variations in the height of the measuring terminal are absorbed by the measuring terminal 32. No, but instead,
The above-mentioned variation is absorbed by elastic deformation of the elastic body 40 arranged under the adhesive tape 3.

In the present embodiment, the elastic body 40 is formed of a conductive silicone rubber foam (silicon sponge). Since the silicon sponge has a small elastic coefficient, it can have a large elastic deformation amount. Therefore, variations in the height of the terminals 1a of the semiconductor device, warpage of the test contactor 30 and variations in the height of the measurement terminals are effectively absorbed, and the plurality of measurement terminals 32 are compared with the corresponding terminals 1a of the semiconductor device 1. And can be pressed with a substantially uniform pressure. Thereby, a highly reliable test can be performed. Further, by using an elastic body having a small elastic coefficient, it becomes possible to press-contact a large number of semiconductor devices 1 with a small pressing force. Therefore, a large number of semiconductor devices 1 can be simultaneously contacted, and the number of simultaneous measurements can be increased.

Further, since the measuring terminal 32 of the test contactor 30 according to the present embodiment has the flat surface portion 32a formed at the tip, it may damage the terminal 1a when pressed by the terminal 1a of the semiconductor device 1. Therefore, it is possible to prevent the generation of defective products such as scratches on the terminals due to the semiconductor test.
Furthermore, by providing the elastic body 40 with conductivity, peeling-off charging when the adhesive tape 3 is removed from the XYZθ table 14 can be prevented.

FIG. 4 is a view showing another example of the elastic body shown in FIG. The elastic body 42 shown in FIG. 4 is obtained by accommodating a fluid in a bag body 44 having elasticity. As the fluid to be stored, a compressible gas such as air or a liquid such as water can be used. By adjusting the pressure of the fluid in the bag body 44 via the tube 46 connected to the bag body 44, the elasticity of the elastic body 40 can be appropriately changed and an appropriate elasticity can be achieved.

Next, a semiconductor test method using the semiconductor test apparatus according to this embodiment will be described with reference to FIG. FIG. 5 is a processing flowchart of a semiconductor test method performed using the semiconductor test apparatus shown in FIG.

First, in step S10, a plurality of semiconductor devices 1 are attached in a predetermined arrangement to the adhesive surface 3a of the adhesive tape 3 stretched on the tape holding ring 2. This attaching step is performed by dicing the semiconductor device 1 into individual pieces.
May be mounted on the adhesive tape 3 in the same arrangement, or the semiconductor device 1 attached to the adhesive tape 3 in a wafer state may be diced into individual pieces. .

Next, the tape holding ring 2 in which the semiconductor device 1 is attached to the adhesive tape 3 is attached to the position correcting device 12 of the semiconductor testing device 10. Prior to this mounting step, the elastic body 40 is moved to XY in step S11.
Mount on the Zθ table 14. Then, step S12
At, the tape holding ring 2 is placed on the elastic body 40 so that the back surface of the adhesive tape 3 is placed, and is fixed by the suction fixing mechanism.

Subsequently, in step 13, position recognition processing of the semiconductor device 1 on the XYZθ table 14 is performed based on the image data taken by the position recognition CCD cameras 18A and 18B. When the position recognition processing in step S13 ends, in step S14, the appearance test C is performed on the semiconductor device 1 for which the position recognition processing has been performed.
An appearance test is performed using the CD camera 17. This appearance test is achieved by the central controller performing image processing based on the image data taken by the appearance test CCD camera 17.

Steps S13 and S14 described above
By executing step S15, the processing of step 5 is performed on all the semiconductor devices 1 attached to the tape holding ring 2. Step S13 to Step S1
When the position recognition data and the appearance test data of all the semiconductor devices 1 are taken into the central control device by the processing of 5,
Subsequently, a position correction process is performed in step S16.

In step S16, first, the position correction device 1
2 moves in the direction indicated by arrow X1 in FIG. As described above, the position correcting device 12 is provided with the contactor confirmation CCD camera 20, and the position of the test contactor 30 is detected by the contactor confirmation CCD camera 20. Then, based on the position recognition data previously captured,
Position correction processing for aligning the positions of the test contactor 30 and the semiconductor device 1 to be tested is performed. This position correction process is performed by the horizontal movement mechanism 16 in the XYZθ table 1.
4 is moved in the horizontal direction (X, Y directions) and rotated about the central axis A.

When the position correction processing in step S16 is completed, next, in step S17, the terminal 1a of the semiconductor device 1 is pressed against the measurement terminal 32 of the test contactor 30. That is, by driving the elevating mechanism 15 and moving the XYZθ table 14 upward, the terminal 1a of the semiconductor device 1 is pressed against the measurement terminal 32 of the test contactor 30 to obtain electrical contact. At this time, the XYZθ table 14
Since the elastic body 40 is disposed between the adhesive tape 3 and the adhesive tape 3, the terminals 1a of all the semiconductor devices 1 can be pressed against the measurement terminals 32 of the test contactor 30 with a substantially uniform pressure.

Thereafter, in step S18, the electrical characteristic test device 13 tests the electrical characteristic of the semiconductor device 1. The electrical characteristic test is all performed on the semiconductor device 1 by performing step S19.

When the processes of steps S16 to S19 are completed, the tape holding ring 2 is removed from the XYZθ table 14 in step S20, and the semiconductor device 1 is carried out to the place where the next process is performed. At this time, since the elastic body 40 has conductivity, peeling charging when the adhesive tape 3 is removed from the elastic body 40 is prevented, and the influence of charging on the semiconductor device 1 is prevented.

As described above, according to the present invention, various effects described below can be realized. According to the first aspect of the present invention, it is possible to realize contact with terminals of a plurality of semiconductor devices by uniform pressure, thereby improving the reliability of the semiconductor test.

According to the second aspect of the present invention, it is possible to prevent the terminals of the semiconductor device from being scratched, thereby reducing the occurrence of defects in the semiconductor device due to the semiconductor test.

According to the third aspect of the invention, it is possible to prevent peeling electrification when the semiconductor device is removed from the mounting table, and it is possible to protect the semiconductor device from peeling electrification.

According to the invention described in claim 4, the elasticity of the elastic body can be changed, and an appropriate elastic deformation can be obtained when the terminals of the semiconductor device are pressed against the test contactor.

According to the fifth aspect of the present invention, it is possible to realize uniform pressure contact with the terminals of the plurality of semiconductor devices, thereby improving the reliability of the semiconductor test.

[Brief description of drawings]

FIG. 1 is a diagram showing a state in which a semiconductor device used for a test is attached to a conventional semiconductor test device.

FIG. 2 is a diagram showing a schematic configuration of a semiconductor test device according to an embodiment of the present invention.

FIG. 3 is a diagram showing a state in which a tape holding ring having a plurality of semiconductor devices attached thereto is attached to a semiconductor test device according to an embodiment of the present invention.

FIG. 4 is a diagram showing another example of the elastic body shown in FIG.

5 is a process flowchart of a semiconductor test method performed using the semiconductor test device shown in FIG.

[Explanation of symbols]

1 Semiconductor device 1a terminal 2 tape retaining ring 3 adhesive tape 3a Adhesive surface 10 Semiconductor test equipment 11 bases 12 Position correction device 13 Electrical characteristics test equipment 14 XYZθ table 15 Lifting mechanism 16 Horizontal movement mechanism 17 CCD camera for appearance test 18A, 18B CCD camera for position recognition 20 CCD camera for contactor confirmation 21 Test equipment body 30 test contactor 32 measuring terminals 32a plane part 40,42 elastic body 44 bags 46 tubes

Continued front page    (72) Inventor Ryoichi Sueyoshi             5950 Soeda, Iriki-cho, Satsuma-gun, Kagoshima             Company Kyushu Fujitsu Electronics inside F-term (reference) 2G003 AA10 AB00 AF06 AG01 AH05                 2G011 AA01 AB08 AC14 AC31 AE03                 2G132 AA01 AB01 AF06 AL03                 4M106 AA02 BA01 CA70 DD05 DD06                       DD13 DJ02 DJ04 DJ05 DJ06                       DJ21 DJ23

Claims (5)

[Claims] 1. A semiconductor testing device for performing an electrical test on a plurality of semiconductor devices, comprising: a mounting table on which the plurality of semiconductor devices are mounted; an elastic body provided on the mounting table; A semiconductor testing device, comprising: a test contactor having a measuring terminal configured to be pressed into contact with the terminals of a plurality of semiconductor devices mounted via the elastic body. 2. The semiconductor test apparatus according to claim 1, wherein the test terminal is a projecting conductor formed on a substrate, and a flat surface is formed on the top. Test equipment. 3. The semiconductor test apparatus according to claim 1, wherein the elastic body is made of a conductive silicone rubber foam. 4. The semiconductor testing device according to claim 1, wherein the elastic body is a bag containing a fluid, and the elasticity of the elastic body is changed by adjusting the pressure of the fluid. Semiconductor test equipment characterized by being capable of 5. A semiconductor test method for collectively testing a plurality of semiconductor devices, comprising: mounting an elastic body on a mounting table; mounting a plurality of semiconductor devices on the mounting table via the elastic body; 2. A semiconductor test method, comprising: pressing a terminal of the semiconductor device to a measurement terminal of a test contactor, and conducting an electrical characteristic test of the plurality of semiconductor devices via the measurement terminal.