JP2008068389A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008068389A5 JP2008068389A5 JP2006251785A JP2006251785A JP2008068389A5 JP 2008068389 A5 JP2008068389 A5 JP 2008068389A5 JP 2006251785 A JP2006251785 A JP 2006251785A JP 2006251785 A JP2006251785 A JP 2006251785A JP 2008068389 A5 JP2008068389 A5 JP 2008068389A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- pad
- slurry
- groove
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 466
- 239000002002 slurry Substances 0.000 claims description 350
- 239000006227 byproduct Substances 0.000 claims description 66
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 65
- 238000004140 cleaning Methods 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 41
- 230000007246 mechanism Effects 0.000 claims description 39
- 238000007517 polishing process Methods 0.000 claims description 23
- 230000009471 action Effects 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 230000002940 repellent Effects 0.000 claims description 10
- 239000005871 repellent Substances 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 97
- 238000003860 storage Methods 0.000 description 13
- 238000001035 drying Methods 0.000 description 12
- 238000012546 transfer Methods 0.000 description 12
- 238000000227 grinding Methods 0.000 description 11
- 230000008901 benefit Effects 0.000 description 10
- 230000032258 transport Effects 0.000 description 9
- 239000000126 substance Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006251785A JP5080769B2 (ja) | 2006-09-15 | 2006-09-15 | 研磨方法及び研磨装置 |
| DE102007020342A DE102007020342A1 (de) | 2006-09-15 | 2007-04-30 | Polierverfahren und Poliervorrichtung |
| TW096116567A TW200812749A (en) | 2006-09-15 | 2007-05-10 | Polishing method and polishing apparatus |
| US11/807,069 US7632169B2 (en) | 2006-09-15 | 2007-05-25 | Polishing method and polishing apparatus |
| KR1020070080185A KR20080025290A (ko) | 2006-09-15 | 2007-08-09 | 연마 방법 및 연마 장치 |
| US12/589,826 US20100120336A1 (en) | 2006-09-15 | 2009-10-29 | Polishing method and polishing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006251785A JP5080769B2 (ja) | 2006-09-15 | 2006-09-15 | 研磨方法及び研磨装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008068389A JP2008068389A (ja) | 2008-03-27 |
| JP2008068389A5 true JP2008068389A5 (https=) | 2008-08-14 |
| JP5080769B2 JP5080769B2 (ja) | 2012-11-21 |
Family
ID=39105213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006251785A Active JP5080769B2 (ja) | 2006-09-15 | 2006-09-15 | 研磨方法及び研磨装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7632169B2 (https=) |
| JP (1) | JP5080769B2 (https=) |
| KR (1) | KR20080025290A (https=) |
| DE (1) | DE102007020342A1 (https=) |
| TW (1) | TW200812749A (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD559066S1 (en) * | 2004-10-26 | 2008-01-08 | Jsr Corporation | Polishing pad |
| KR101493087B1 (ko) * | 2008-05-27 | 2015-02-24 | 엘지디스플레이 주식회사 | 플렉서블 표시장치의 제조 방법 |
| CN101758420B (zh) * | 2008-12-08 | 2016-04-20 | 香港科技大学 | 一种提供冷却的系统、装置及方法 |
| TWI419070B (zh) * | 2011-01-11 | 2013-12-11 | Nat Univ Tsing Hua | 相關性變數篩選系統及其篩選方法 |
| KR101249856B1 (ko) * | 2011-07-15 | 2013-04-03 | 주식회사 엘지실트론 | 웨이퍼 에지 연마 장치 |
| JP5723740B2 (ja) * | 2011-10-11 | 2015-05-27 | 株式会社東京精密 | ダイシング装置のブレード潤滑機構及びブレード潤滑方法 |
| US9570311B2 (en) * | 2012-02-10 | 2017-02-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Modular grinding apparatuses and methods for wafer thinning |
| US10293462B2 (en) * | 2013-07-23 | 2019-05-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pad conditioner and method of reconditioning planarization pad |
| JP2015150635A (ja) * | 2014-02-13 | 2015-08-24 | 株式会社東芝 | 研磨布および研磨布の製造方法 |
| JP6304118B2 (ja) * | 2015-05-01 | 2018-04-04 | 信越半導体株式会社 | ワイヤソー装置 |
| KR102401388B1 (ko) * | 2016-06-24 | 2022-05-24 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학적 기계적 연마를 위한 슬러리 분배 디바이스 |
| JP6923342B2 (ja) * | 2017-04-11 | 2021-08-18 | 株式会社荏原製作所 | 研磨装置、及び、研磨方法 |
| JP7108450B2 (ja) * | 2018-04-13 | 2022-07-28 | 株式会社ディスコ | 研磨装置 |
| CN110103119A (zh) * | 2018-09-20 | 2019-08-09 | 杭州众硅电子科技有限公司 | 一种抛光装卸部件模块 |
| CN114473856B (zh) * | 2020-11-11 | 2023-09-22 | 中国科学院微电子研究所 | 一种cmp研磨垫及cmp研磨装置 |
| US20250108477A1 (en) * | 2023-09-28 | 2025-04-03 | Applied Materials, Inc. | Chemical mechanical polishing edge control with pad recesses |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2628915B2 (ja) * | 1989-06-05 | 1997-07-09 | 三菱マテリアル株式会社 | 研磨布のドレッシング装置 |
| US5308438A (en) * | 1992-01-30 | 1994-05-03 | International Business Machines Corporation | Endpoint detection apparatus and method for chemical/mechanical polishing |
| US5709593A (en) * | 1995-10-27 | 1998-01-20 | Applied Materials, Inc. | Apparatus and method for distribution of slurry in a chemical mechanical polishing system |
| US5928062A (en) * | 1997-04-30 | 1999-07-27 | International Business Machines Corporation | Vertical polishing device and method |
| US6139406A (en) * | 1997-06-24 | 2000-10-31 | Applied Materials, Inc. | Combined slurry dispenser and rinse arm and method of operation |
| JPH1148129A (ja) * | 1997-08-07 | 1999-02-23 | Asahi Glass Co Ltd | 研磨パッド及び板状材の研磨方法 |
| US5916010A (en) * | 1997-10-30 | 1999-06-29 | International Business Machines Corporation | CMP pad maintenance apparatus and method |
| US6135868A (en) * | 1998-02-11 | 2000-10-24 | Applied Materials, Inc. | Groove cleaning device for chemical-mechanical polishing |
| JPH11277411A (ja) * | 1998-03-25 | 1999-10-12 | Ebara Corp | 基板の研磨装置 |
| US6429131B2 (en) * | 1999-03-18 | 2002-08-06 | Infineon Technologies Ag | CMP uniformity |
| US6193587B1 (en) * | 1999-10-01 | 2001-02-27 | Taiwan Semicondutor Manufacturing Co., Ltd | Apparatus and method for cleansing a polishing pad |
| US6712678B1 (en) * | 1999-12-07 | 2004-03-30 | Ebara Corporation | Polishing-product discharging device and polishing device |
| US6375791B1 (en) * | 1999-12-20 | 2002-04-23 | Lsi Logic Corporation | Method and apparatus for detecting presence of residual polishing slurry subsequent to polishing of a semiconductor wafer |
| US6533645B2 (en) * | 2000-01-18 | 2003-03-18 | Applied Materials, Inc. | Substrate polishing article |
| US6626743B1 (en) * | 2000-03-31 | 2003-09-30 | Lam Research Corporation | Method and apparatus for conditioning a polishing pad |
| KR100443770B1 (ko) * | 2001-03-26 | 2004-08-09 | 삼성전자주식회사 | 기판의 연마 방법 및 연마 장치 |
| US6887132B2 (en) * | 2001-09-10 | 2005-05-03 | Multi Planar Technologies Incorporated | Slurry distributor for chemical mechanical polishing apparatus and method of using the same |
| JP2003188125A (ja) * | 2001-12-18 | 2003-07-04 | Ebara Corp | ポリッシング装置 |
| JP2004063888A (ja) | 2002-07-30 | 2004-02-26 | Applied Materials Inc | 化学機械研磨装置用のスラリ供給装置 |
| US7018274B2 (en) * | 2003-11-13 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Polishing pad having slurry utilization enhancing grooves |
| JP4625252B2 (ja) | 2003-12-19 | 2011-02-02 | 東洋ゴム工業株式会社 | Ｃｍｐ用研磨パッド、及びそれを用いた研磨方法 |
| JP2006147773A (ja) * | 2004-11-18 | 2006-06-08 | Ebara Corp | 研磨装置および研磨方法 |
| US20070087672A1 (en) * | 2005-10-19 | 2007-04-19 | Tbw Industries, Inc. | Apertured conditioning brush for chemical mechanical planarization systems |
-
2006
- 2006-09-15 JP JP2006251785A patent/JP5080769B2/ja active Active
-
2007
- 2007-04-30 DE DE102007020342A patent/DE102007020342A1/de not_active Withdrawn
- 2007-05-10 TW TW096116567A patent/TW200812749A/zh unknown
- 2007-05-25 US US11/807,069 patent/US7632169B2/en not_active Expired - Fee Related
- 2007-08-09 KR KR1020070080185A patent/KR20080025290A/ko not_active Withdrawn
-
2009
- 2009-10-29 US US12/589,826 patent/US20100120336A1/en not_active Abandoned
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20080025290A (ko) | 연마 방법 및 연마 장치 | |
| US8043140B2 (en) | Wafer polishing apparatus and wafer polishing method | |
| JP2008068389A5 (https=) | ||
| EP0764478B1 (en) | Method of and apparatus for cleaning workpiece | |
| US7270597B2 (en) | Method and system for chemical mechanical polishing pad cleaning | |
| JP2002103201A (ja) | ポリッシング装置 | |
| CN107107304A (zh) | 用于cmp期间的原位副产物移除及台板冷却的系统及工艺 | |
| CN101879700A (zh) | 化学机械研磨元件、晶圆的研磨方法及晶圆研磨系统 | |
| US10734254B2 (en) | Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method | |
| JP2005271111A (ja) | 基板研磨装置及び基板研磨方法 | |
| KR20160024797A (ko) | 버프 처리 장치 및 기판 처리 장치 | |
| JP2003211355A (ja) | ポリッシング装置及びドレッシング方法 | |
| CN106233432B (zh) | 用于化学机械平面化后的基板清洁的系统、方法及设备 | |
| JP2005501411A (ja) | 一定ｐＨでの研磨及びスクラブ | |
| JP2016111265A (ja) | バフ処理装置、および、基板処理装置 | |
| TWI443000B (zh) | 化學機械研磨系統 | |
| JP3708740B2 (ja) | 研磨装置および研磨方法 | |
| JP2015044250A (ja) | ポリッシング方法 | |
| JP4702641B2 (ja) | 研磨パッド表面への研磨液供給装置及び研磨パッド表面への研磨液供給方法 | |
| JP2015044251A (ja) | ポリッシング方法 | |
| JP2016119368A (ja) | コンディショニング装置、バフ処理装置、基板処理装置、ドレッサ、および、コンディショニング方法 | |
| JP6346541B2 (ja) | バフ処理装置、および、基板処理装置 | |
| JP2001127022A (ja) | 研磨方法及び研磨装置 | |
| KR20060130321A (ko) | 화학적 기계적 연마장비 | |
| JP2007221072A (ja) | ウェーハ洗浄乾燥装置及びウェーハ洗浄乾燥方法 |