JP2008030064A - 無鉛はんだ合金 - Google Patents
無鉛はんだ合金 Download PDFInfo
- Publication number
- JP2008030064A JP2008030064A JP2006204029A JP2006204029A JP2008030064A JP 2008030064 A JP2008030064 A JP 2008030064A JP 2006204029 A JP2006204029 A JP 2006204029A JP 2006204029 A JP2006204029 A JP 2006204029A JP 2008030064 A JP2008030064 A JP 2008030064A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- weight
- dross
- lead
- solder alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【解決手段】Cuが0.1〜1.5重量%、Coが0.01重量%以上でかつ0.05重量%未満、Agが0.05〜0.5重量%と、Sbが0.01〜0.1重量%含有させ、残部をSnとするか、さらにGeを0.001〜0.008重量%含有させることによって、ドロスの形成を防止し、ツノ引き等のはんだ付け欠陥が発生する欠点を解消した。
【選択図】図1
Description
次に実施例を挙げて本発明を更に説明する。
500gのはんだを使用し、冷却法で融点〔固相温度/液相温度(℃)〕を測定した。
中心にφ3.0mmの銅回路とφ1.1mmのスルーホールを持った30mm×30mm×1.6mmtのガラスエポキシ基板にφ0.8mmの錫メッキ銅線を挿入し、はんだ付け面を約100℃に予備加熱した後に、260℃に加熱したはんだ槽に6秒間浸漬してはんだ付けを行い、クリープ試験片とした。このはんだ付けした試験片を架台にセットし、150℃の恒温槽内に入れ、試験片が所定の温度に達したら3kgfの荷重を負荷し、はんだ付け部が破断するまでの時間を測定した。
5×50×0.3mmの銅板を用い、浸漬深さ
2mm、浸漬速度 2.5mm/秒、浸漬時間 10秒の条件で濡れ性試験機を用いてゼロクロスタイム(秒)を測定した。尚、試験温度は255℃で行い、フラックスはRMAタイプのものを用いた。
2.5kgのはんだを磁性の皿に入れ、加熱溶解して255℃とした。幅20mm、厚さ1mmの銅板をφ60mmの攪拌羽根の先端に取り付けて、先端20mmを上記はんだ中に浸漬した。続いて、攪拌羽根を30rpmで30分間攪拌した。この場合のはんだ中の銅板の移動速度は約1m/分である。試験終了前後の銅板の重さを測定し、Cuのはんだ中への溶出量を測定した。
2.5kgのはんだを磁性の皿に入れ、加熱溶解して255℃とした。このはんだ表面に、φ60mmの攪拌羽根(3枚羽根)を浸漬して、60rpmで30分間表面を攪拌し、発生した酸化物を秤量し、これを酸化物発生量とした。また、スパチュラで回収した酸化物中に、ドロスが形成されているかどうかを肉眼で観察した。乾性の酸化物かドロスかは、ドロスがベタベタした感じでスパチュラに付着するので、肉眼で容易に識別できる。
Claims (3)
- Cuが0.1〜1.5重量%、Coが0.01重量%以上でかつ0.05重量%未満と、Agが0.05〜0.5重量%、Sbが0.01〜0.1重量%を含有し、残部がSnよりなることを特徴とする無鉛はんだ合金。
- 前記Sbが0.03〜0.1重量%である請求項1に記載の無鉛はんだ合金。
- さらに、Geを0.001〜0.008重量%含有する請求項1又は2に記載の無鉛はんだ合金。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006204029A JP4076182B2 (ja) | 2006-07-27 | 2006-07-27 | 無鉛はんだ合金 |
PCT/JP2007/064312 WO2008013104A1 (fr) | 2006-07-27 | 2007-07-20 | Alliage de brasage sans plomb |
CN2007800051209A CN101384395B (zh) | 2006-07-27 | 2007-07-20 | 无铅合金焊料 |
US12/305,794 US20100233018A1 (en) | 2006-07-27 | 2007-07-20 | Lead-free solder alloy |
EP07791050A EP1980355A4 (en) | 2006-07-27 | 2007-07-20 | LEAD FREE BRAZING ALLOY |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006204029A JP4076182B2 (ja) | 2006-07-27 | 2006-07-27 | 無鉛はんだ合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008030064A true JP2008030064A (ja) | 2008-02-14 |
JP4076182B2 JP4076182B2 (ja) | 2008-04-16 |
Family
ID=38981416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006204029A Active JP4076182B2 (ja) | 2006-07-27 | 2006-07-27 | 無鉛はんだ合金 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100233018A1 (ja) |
EP (1) | EP1980355A4 (ja) |
JP (1) | JP4076182B2 (ja) |
CN (1) | CN101384395B (ja) |
WO (1) | WO2008013104A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010087241A1 (ja) * | 2009-01-27 | 2010-08-05 | 株式会社日本フィラーメタルズ | 無鉛はんだ合金及び該はんだ合金を含む耐疲労性はんだ接合材並びに該接合材を使用した接合体 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8013444B2 (en) * | 2008-12-24 | 2011-09-06 | Intel Corporation | Solder joints with enhanced electromigration resistance |
CN101780607B (zh) * | 2010-03-17 | 2012-05-09 | 华南理工大学 | 一种用于电子封装组装钎焊的无铅钎料及其制备方法 |
CN105140209A (zh) * | 2015-06-26 | 2015-12-09 | 江苏师范大学 | 一种用于3D封装芯片堆叠的In基互连材料 |
JP7041710B2 (ja) * | 2020-04-30 | 2022-03-24 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ball Grid Arrayおよびはんだ継手 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3684811B2 (ja) * | 1998-01-28 | 2005-08-17 | 株式会社村田製作所 | 半田および半田付け物品 |
JP3599101B2 (ja) * | 2000-12-11 | 2004-12-08 | 株式会社トッパンNecサーキットソリューションズ | はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法 |
ES2541439T3 (es) * | 2001-03-01 | 2015-07-20 | Senju Metal Industry Co., Ltd | Pasta de soldadura sin plomo |
JP2003001482A (ja) * | 2001-06-19 | 2003-01-08 | Tokyo Daiichi Shoko:Kk | 無鉛半田合金 |
TW592872B (en) * | 2001-06-28 | 2004-06-21 | Senju Metal Industry Co | Lead-free solder alloy |
JP2004141910A (ja) * | 2002-10-23 | 2004-05-20 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
JP3602529B1 (ja) * | 2003-01-22 | 2004-12-15 | 白光株式会社 | マニュアルソルダリング用またはフローソルダリング用鉛フリーはんだ及びそれを用いた電子部品 |
US7282175B2 (en) * | 2003-04-17 | 2007-10-16 | Senju Metal Industry Co., Ltd. | Lead-free solder |
JP3758090B2 (ja) * | 2003-05-09 | 2006-03-22 | トピー工業株式会社 | SnCu系無鉛はんだ合金 |
JP3761182B2 (ja) * | 2003-05-09 | 2006-03-29 | トピー工業株式会社 | SnAgCu系無鉛はんだ合金 |
JP4577888B2 (ja) * | 2004-02-04 | 2010-11-10 | 千住金属工業株式会社 | Fe喰われ防止用はんだ合金とFe喰われ防止方法 |
-
2006
- 2006-07-27 JP JP2006204029A patent/JP4076182B2/ja active Active
-
2007
- 2007-07-20 US US12/305,794 patent/US20100233018A1/en not_active Abandoned
- 2007-07-20 WO PCT/JP2007/064312 patent/WO2008013104A1/ja active Application Filing
- 2007-07-20 EP EP07791050A patent/EP1980355A4/en not_active Withdrawn
- 2007-07-20 CN CN2007800051209A patent/CN101384395B/zh active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010087241A1 (ja) * | 2009-01-27 | 2010-08-05 | 株式会社日本フィラーメタルズ | 無鉛はんだ合金及び該はんだ合金を含む耐疲労性はんだ接合材並びに該接合材を使用した接合体 |
JP2010172902A (ja) * | 2009-01-27 | 2010-08-12 | Nippon Firaa Metals:Kk | 無鉛はんだ合金及び該はんだ合金を含む耐疲労性はんだ接合材並びに該接合材を使用した接合体 |
JP4554713B2 (ja) * | 2009-01-27 | 2010-09-29 | 株式会社日本フィラーメタルズ | 無鉛はんだ合金及び該はんだ合金を含む耐疲労性はんだ接合材並びに該接合材を使用した接合体 |
CN102006967A (zh) * | 2009-01-27 | 2011-04-06 | 株式会社日本菲拉美达陆兹 | 无铅焊料合金和含有该焊料合金的耐疲劳性焊料接合材料以及使用该接合材料的接合体 |
Also Published As
Publication number | Publication date |
---|---|
US20100233018A1 (en) | 2010-09-16 |
CN101384395B (zh) | 2011-08-31 |
EP1980355A4 (en) | 2010-06-16 |
JP4076182B2 (ja) | 2008-04-16 |
CN101384395A (zh) | 2009-03-11 |
EP1980355A1 (en) | 2008-10-15 |
WO2008013104A1 (fr) | 2008-01-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0985486B1 (en) | Leadless solder | |
JP5147409B2 (ja) | はんだ合金 | |
CN100462183C (zh) | 无铅抗氧化含稀土SnZn合金焊料及其制备方法 | |
KR101738841B1 (ko) | Bi-Sn계 고온 땜납 합금으로 이루어진 고온 땜납 이음 | |
WO1997012719A1 (fr) | Soudure sans plomb | |
WO2015066155A1 (en) | Lead-free, silver-free solder alloys | |
US20070172381A1 (en) | Lead-free solder with low copper dissolution | |
JP2009506203A (ja) | 半田合金 | |
EP1971699A2 (en) | Lead-free solder with low copper dissolution | |
TW202045291A (zh) | 無鉛焊錫合金及焊錫接合部 | |
JP4076182B2 (ja) | 無鉛はんだ合金 | |
JP4554713B2 (ja) | 無鉛はんだ合金及び該はんだ合金を含む耐疲労性はんだ接合材並びに該接合材を使用した接合体 | |
JP2009082986A (ja) | マニュアルソルダリング用無鉛はんだ合金 | |
EP1557235A1 (en) | Lead-free solder and soldered article | |
JP4453473B2 (ja) | 鉛フリーはんだ合金と、それを用いたはんだ材料及びはんだ接合部 | |
JP3758090B2 (ja) | SnCu系無鉛はんだ合金 | |
JP5080946B2 (ja) | マニュアルソルダリング用無鉛はんだ合金 | |
JP5051633B2 (ja) | はんだ合金 | |
JP2004330260A (ja) | SnAgCu系無鉛はんだ合金 | |
KR20070082061A (ko) | 무연 솔더 조성물과 이를 이용한 전자기기 및 인쇄회로기판 | |
TW200529963A (en) | Solder alloy for preventing Fe erosion and method for preventing Fe erosion | |
KR100574878B1 (ko) | 무연 납땜 합금 | |
JP2004122227A (ja) | 無鉛はんだ合金 | |
KR20070082058A (ko) | 무연 솔더 조성물과 이를 이용한 전자기기 및 인쇄회로기판 | |
JP2002346788A (ja) | 錫−銀系ハンダ合金 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071116 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20071120 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20071221 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080123 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080125 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4076182 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110208 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110208 Year of fee payment: 3 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110208 Year of fee payment: 3 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R371 | Transfer withdrawn |
Free format text: JAPANESE INTERMEDIATE CODE: R371 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110208 Year of fee payment: 3 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110208 Year of fee payment: 3 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110208 Year of fee payment: 3 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R371 | Transfer withdrawn |
Free format text: JAPANESE INTERMEDIATE CODE: R371 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110208 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110208 Year of fee payment: 3 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110208 Year of fee payment: 3 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110208 Year of fee payment: 3 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R371 | Transfer withdrawn |
Free format text: JAPANESE INTERMEDIATE CODE: R371 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110208 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110208 Year of fee payment: 3 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110208 Year of fee payment: 3 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R371 | Transfer withdrawn |
Free format text: JAPANESE INTERMEDIATE CODE: R371 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110208 Year of fee payment: 3 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110208 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140208 Year of fee payment: 6 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |