JP2007538408A5 - - Google Patents
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- JP2007538408A5 JP2007538408A5 JP2007527328A JP2007527328A JP2007538408A5 JP 2007538408 A5 JP2007538408 A5 JP 2007538408A5 JP 2007527328 A JP2007527328 A JP 2007527328A JP 2007527328 A JP2007527328 A JP 2007527328A JP 2007538408 A5 JP2007538408 A5 JP 2007538408A5
- Authority
- JP
- Japan
- Prior art keywords
- epitaxial semiconductor
- substrate
- mirror layer
- semiconductor structure
- mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/848,937 | 2004-05-18 | ||
| US10/848,937 US7332365B2 (en) | 2004-05-18 | 2004-05-18 | Method for fabricating group-III nitride devices and devices fabricated using method |
| PCT/US2005/016987 WO2005117152A1 (en) | 2004-05-18 | 2005-05-17 | Method for fabricating group iii nitride devices and devices fabricated using method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007538408A JP2007538408A (ja) | 2007-12-27 |
| JP2007538408A5 true JP2007538408A5 (enExample) | 2008-07-03 |
| JP5468203B2 JP5468203B2 (ja) | 2014-04-09 |
Family
ID=34970241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007527328A Expired - Lifetime JP5468203B2 (ja) | 2004-05-18 | 2005-05-17 | 第3族窒化物デバイスを製造する方法およびその方法を使用して製造されたデバイス |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7332365B2 (enExample) |
| EP (1) | EP1763900B1 (enExample) |
| JP (1) | JP5468203B2 (enExample) |
| KR (1) | KR20070013324A (enExample) |
| CN (1) | CN1957481A (enExample) |
| CA (1) | CA2564995A1 (enExample) |
| TW (1) | TWI390759B (enExample) |
| WO (1) | WO2005117152A1 (enExample) |
Families Citing this family (64)
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|---|---|---|---|---|
| US7115896B2 (en) * | 2002-12-04 | 2006-10-03 | Emcore Corporation | Semiconductor structures for gallium nitride-based devices |
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| JP4747516B2 (ja) * | 2004-06-08 | 2011-08-17 | 富士ゼロックス株式会社 | 垂直共振器型面発光半導体レーザ装置 |
| US8482663B2 (en) * | 2004-06-30 | 2013-07-09 | Osram Opto Semiconductors Gmbh | Light-emitting diode arrangement, optical recording device and method for the pulsed operation of at least one light-emitting diode |
| KR100576870B1 (ko) * | 2004-08-11 | 2006-05-10 | 삼성전기주식회사 | 질화물 반도체 발광소자 및 제조방법 |
| KR100682877B1 (ko) * | 2005-07-12 | 2007-02-15 | 삼성전기주식회사 | 발광다이오드 및 그 제조방법 |
| US20070019699A1 (en) * | 2005-07-22 | 2007-01-25 | Robbins Virginia M | Light emitting device and method of manufacture |
| JP2009530798A (ja) * | 2006-01-05 | 2009-08-27 | イルミテックス, インコーポレイテッド | Ledから光を導くための独立した光学デバイス |
| US8643195B2 (en) | 2006-06-30 | 2014-02-04 | Cree, Inc. | Nickel tin bonding system for semiconductor wafers and devices |
| US7910945B2 (en) * | 2006-06-30 | 2011-03-22 | Cree, Inc. | Nickel tin bonding system with barrier layer for semiconductor wafers and devices |
| TWI309481B (en) | 2006-07-28 | 2009-05-01 | Epistar Corp | A light emitting device having a patterned substrate and the method thereof |
| US7915624B2 (en) | 2006-08-06 | 2011-03-29 | Lightwave Photonics, Inc. | III-nitride light-emitting devices with one or more resonance reflectors and reflective engineered growth templates for such devices, and methods |
| US7855459B2 (en) | 2006-09-22 | 2010-12-21 | Cree, Inc. | Modified gold-tin system with increased melting temperature for wafer bonding |
| EP1906461B1 (de) * | 2006-09-26 | 2020-03-18 | OSRAM Opto Semiconductors GmbH | Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement |
| EP2070123A2 (en) | 2006-10-02 | 2009-06-17 | Illumitex, Inc. | Led system and method |
| US8941141B2 (en) * | 2006-10-17 | 2015-01-27 | Epistar Corporation | Light-emitting device |
| KR100826412B1 (ko) * | 2006-11-03 | 2008-04-29 | 삼성전기주식회사 | 질화물 반도체 발광 소자 및 제조방법 |
| US7928471B2 (en) * | 2006-12-04 | 2011-04-19 | The United States Of America As Represented By The Secretary Of The Navy | Group III-nitride growth on silicon or silicon germanium substrates and method and devices therefor |
| TWI533351B (zh) | 2006-12-11 | 2016-05-11 | 美國加利福尼亞大學董事會 | 高效能非極性第三族氮化物光學裝置之金屬有機化學氣相沈積生長 |
| TWI492411B (zh) * | 2006-12-11 | 2015-07-11 | Univ California | 非極性與半極性發光裝置 |
| US8409972B2 (en) * | 2007-04-11 | 2013-04-02 | Cree, Inc. | Light emitting diode having undoped and unintentionally doped nitride transition layer |
| US8368100B2 (en) | 2007-11-14 | 2013-02-05 | Cree, Inc. | Semiconductor light emitting diodes having reflective structures and methods of fabricating same |
| US7915629B2 (en) | 2008-12-08 | 2011-03-29 | Cree, Inc. | Composite high reflectivity layer |
| US9461201B2 (en) | 2007-11-14 | 2016-10-04 | Cree, Inc. | Light emitting diode dielectric mirror |
| DE102008006988A1 (de) | 2008-01-31 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| WO2009100358A1 (en) * | 2008-02-08 | 2009-08-13 | Illumitex, Inc. | System and method for emitter layer shaping |
| US7842939B2 (en) | 2008-02-25 | 2010-11-30 | Lightwave Photonics, Inc. | Current-injecting/tunneling light-emitting device and method |
| KR101308130B1 (ko) * | 2008-03-25 | 2013-09-12 | 서울옵토디바이스주식회사 | 발광 소자 및 그 제조 방법 |
| US8877524B2 (en) | 2008-03-31 | 2014-11-04 | Cree, Inc. | Emission tuning methods and devices fabricated utilizing methods |
| KR101449035B1 (ko) * | 2008-04-30 | 2014-10-08 | 엘지이노텍 주식회사 | 반도체 발광소자 |
| US9287469B2 (en) | 2008-05-02 | 2016-03-15 | Cree, Inc. | Encapsulation for phosphor-converted white light emitting diode |
| DE102008050538B4 (de) * | 2008-06-06 | 2022-10-06 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
| US8017963B2 (en) | 2008-12-08 | 2011-09-13 | Cree, Inc. | Light emitting diode with a dielectric mirror having a lateral configuration |
| TW201034256A (en) * | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
| US8096671B1 (en) | 2009-04-06 | 2012-01-17 | Nmera, Llc | Light emitting diode illumination system |
| US8529102B2 (en) | 2009-04-06 | 2013-09-10 | Cree, Inc. | Reflector system for lighting device |
| US8449128B2 (en) * | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
| US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
| US9362459B2 (en) * | 2009-09-02 | 2016-06-07 | United States Department Of Energy | High reflectivity mirrors and method for making same |
| KR101100681B1 (ko) * | 2009-09-10 | 2012-01-03 | 주식회사 에피밸리 | 반도체 발광소자 |
| US9435493B2 (en) * | 2009-10-27 | 2016-09-06 | Cree, Inc. | Hybrid reflector system for lighting device |
| US9105824B2 (en) | 2010-04-09 | 2015-08-11 | Cree, Inc. | High reflective board or substrate for LEDs |
| US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
| KR20110133241A (ko) | 2010-06-04 | 2011-12-12 | 서울옵토디바이스주식회사 | 발광 다이오드 제조 방법 |
| US8764224B2 (en) | 2010-08-12 | 2014-07-01 | Cree, Inc. | Luminaire with distributed LED sources |
| US8556469B2 (en) | 2010-12-06 | 2013-10-15 | Cree, Inc. | High efficiency total internal reflection optic for solid state lighting luminaires |
| US8680556B2 (en) | 2011-03-24 | 2014-03-25 | Cree, Inc. | Composite high reflectivity layer |
| CN102738332A (zh) * | 2011-04-13 | 2012-10-17 | 展晶科技(深圳)有限公司 | 发光二极管磊晶结构及制造方法 |
| US9728676B2 (en) | 2011-06-24 | 2017-08-08 | Cree, Inc. | High voltage monolithic LED chip |
| US8686429B2 (en) | 2011-06-24 | 2014-04-01 | Cree, Inc. | LED structure with enhanced mirror reflectivity |
| US10243121B2 (en) | 2011-06-24 | 2019-03-26 | Cree, Inc. | High voltage monolithic LED chip with improved reliability |
| TWI495163B (zh) * | 2011-12-09 | 2015-08-01 | 中華電信股份有限公司 | A method for manufacturing a resonant cavity light emitting diode |
| US9608145B2 (en) * | 2012-03-14 | 2017-03-28 | Robbie J. Jorgenson | Materials, structures, and methods for optical and electrical III-nitride semiconductor devices |
| TW201340405A (zh) * | 2012-03-30 | 2013-10-01 | Lextar Electronics Corp | 發光二極體 |
| US8896008B2 (en) | 2013-04-23 | 2014-11-25 | Cree, Inc. | Light emitting diodes having group III nitride surface features defined by a mask and crystal planes |
| JP6500342B2 (ja) * | 2013-04-27 | 2019-04-17 | 日亜化学工業株式会社 | 半導体レーザ装置の製造方法並びにサブマウントの製造方法 |
| US10658546B2 (en) | 2015-01-21 | 2020-05-19 | Cree, Inc. | High efficiency LEDs and methods of manufacturing |
| KR102380825B1 (ko) * | 2015-05-29 | 2022-04-01 | 삼성전자주식회사 | 반도체 발광다이오드 칩 및 이를 구비한 발광장치 |
| US10263144B2 (en) | 2015-10-16 | 2019-04-16 | Robbie J. Jorgenson | System and method for light-emitting devices on lattice-matched metal substrates |
| WO2017205815A2 (en) | 2016-05-26 | 2017-11-30 | Robbie Jorgenson | Group iiia nitride growth system and method |
| SG11202004949XA (en) * | 2017-12-21 | 2020-06-29 | Agency Science Tech & Res | Optical device and method of forming the same |
| TWI781742B (zh) | 2021-08-26 | 2022-10-21 | 隆達電子股份有限公司 | 發光二極體 |
| DE102022120161A1 (de) * | 2022-08-10 | 2024-02-15 | Ams-Osram International Gmbh | Optoelektronisches halbleiterbauelement mit epitaktisch gewachsener schicht und verfahren zur herstellung des optoelektronischen halbleiterbauelements |
| CN117913017B (zh) * | 2024-01-19 | 2024-10-22 | 江苏宜兴德融科技有限公司 | 一种薄膜半导体芯片制备方法和薄膜半导体芯片制备结构 |
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| JPS6159886A (ja) | 1984-08-31 | 1986-03-27 | Fujitsu Ltd | 光半導体装置の製造方法 |
| US4865685A (en) * | 1987-11-03 | 1989-09-12 | North Carolina State University | Dry etching of silicon carbide |
| JPH0770755B2 (ja) * | 1988-01-21 | 1995-07-31 | 三菱化学株式会社 | 高輝度led用エピタキシャル基板及びその製造方法 |
| US4912532A (en) * | 1988-08-26 | 1990-03-27 | Hewlett-Packard Company | Electro-optical device with inverted transparent substrate and method for making same |
| US5103271A (en) * | 1989-09-28 | 1992-04-07 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and method of fabricating the same |
| JPH04249384A (ja) * | 1991-02-05 | 1992-09-04 | Nec Corp | 半導体発光素子の製造方法 |
| FR2679253B1 (fr) * | 1991-07-15 | 1994-09-02 | Pasteur Institut | Proteines de resistance a la cycloheximide. utilisation comme marqueur de selection par exemple pour controler le transfert d'acides nucleiques. |
| US5376580A (en) * | 1993-03-19 | 1994-12-27 | Hewlett-Packard Company | Wafer bonding of light emitting diode layers |
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| JP2000232258A (ja) * | 1999-02-10 | 2000-08-22 | Nippon Telegr & Teleph Corp <Ntt> | 2次元半導体光結晶素子およびその製造方法 |
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| FR2835096B1 (fr) * | 2002-01-22 | 2005-02-18 | Procede de fabrication d'un substrat auto-porte en materiau semi-conducteur monocristallin | |
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| US6806112B1 (en) * | 2003-09-22 | 2004-10-19 | National Chung-Hsing University | High brightness light emitting diode |
| JP2005210066A (ja) * | 2003-12-25 | 2005-08-04 | Kyocera Corp | 薄膜発光素子およびその製造方法 |
| US7115908B2 (en) * | 2004-01-30 | 2006-10-03 | Philips Lumileds Lighting Company, Llc | III-nitride light emitting device with reduced polarization fields |
| US7825006B2 (en) * | 2004-05-06 | 2010-11-02 | Cree, Inc. | Lift-off process for GaN films formed on SiC substrates and devices fabricated using the method |
-
2004
- 2004-05-18 US US10/848,937 patent/US7332365B2/en not_active Expired - Lifetime
-
2005
- 2005-05-17 WO PCT/US2005/016987 patent/WO2005117152A1/en not_active Ceased
- 2005-05-17 JP JP2007527328A patent/JP5468203B2/ja not_active Expired - Lifetime
- 2005-05-17 CA CA002564995A patent/CA2564995A1/en not_active Abandoned
- 2005-05-17 KR KR1020067025952A patent/KR20070013324A/ko not_active Withdrawn
- 2005-05-17 CN CNA2005800158033A patent/CN1957481A/zh active Pending
- 2005-05-17 EP EP05751127.1A patent/EP1763900B1/en not_active Expired - Lifetime
- 2005-05-18 TW TW094116021A patent/TWI390759B/zh not_active IP Right Cessation
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