JP2007527629A5 - - Google Patents

Download PDF

Info

Publication number
JP2007527629A5
JP2007527629A5 JP2007502111A JP2007502111A JP2007527629A5 JP 2007527629 A5 JP2007527629 A5 JP 2007527629A5 JP 2007502111 A JP2007502111 A JP 2007502111A JP 2007502111 A JP2007502111 A JP 2007502111A JP 2007527629 A5 JP2007527629 A5 JP 2007527629A5
Authority
JP
Japan
Prior art keywords
polygon
substrate
conductive
gap
polygons
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007502111A
Other languages
English (en)
Japanese (ja)
Other versions
JP5784265B2 (ja
JP2007527629A (ja
Filing date
Publication date
Priority claimed from US10/794,491 external-priority patent/US6967282B2/en
Application filed filed Critical
Publication of JP2007527629A publication Critical patent/JP2007527629A/ja
Publication of JP2007527629A5 publication Critical patent/JP2007527629A5/ja
Application granted granted Critical
Publication of JP5784265B2 publication Critical patent/JP5784265B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2007502111A 2004-03-05 2005-03-04 周期的な電磁バンドギャップ構造を使用する改良されたフリップチップｍｍｃボード上性能 Expired - Fee Related JP5784265B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/794,491 US6967282B2 (en) 2004-03-05 2004-03-05 Flip chip MMIC on board performance using periodic electromagnetic bandgap structures
US10/794,491 2004-03-05
PCT/US2005/007530 WO2005088708A2 (en) 2004-03-05 2005-03-04 Improved flip chip mmic on board performance using periodic electromagnetic bandgap structures

Publications (3)

Publication Number Publication Date
JP2007527629A JP2007527629A (ja) 2007-09-27
JP2007527629A5 true JP2007527629A5 (https=) 2008-04-17
JP5784265B2 JP5784265B2 (ja) 2015-09-24

Family

ID=34912277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007502111A Expired - Fee Related JP5784265B2 (ja) 2004-03-05 2005-03-04 周期的な電磁バンドギャップ構造を使用する改良されたフリップチップｍｍｃボード上性能

Country Status (5)

Country Link
US (2) US6967282B2 (https=)
EP (1) EP1721497B1 (https=)
JP (1) JP5784265B2 (https=)
NO (1) NO337499B1 (https=)
WO (1) WO2005088708A2 (https=)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7091124B2 (en) 2003-11-13 2006-08-15 Micron Technology, Inc. Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
US8084866B2 (en) 2003-12-10 2011-12-27 Micron Technology, Inc. Microelectronic devices and methods for filling vias in microelectronic devices
JP4322638B2 (ja) * 2003-11-20 2009-09-02 株式会社日立製作所 ストレージ装置、及びストレージ装置の遮蔽方法
WO2005096350A2 (en) * 2004-03-11 2005-10-13 Raytheon Company Electromagnetic bandgap structure for suppressing electromagnetic coupling in microstrip and flip chip on board applications
US20050247894A1 (en) 2004-05-05 2005-11-10 Watkins Charles M Systems and methods for forming apertures in microfeature workpieces
US7232754B2 (en) 2004-06-29 2007-06-19 Micron Technology, Inc. Microelectronic devices and methods for forming interconnects in microelectronic devices
US7307596B1 (en) * 2004-07-15 2007-12-11 Rockwell Collins, Inc. Low-cost one-dimensional electromagnetic band gap waveguide phase shifter based ESA horn antenna
US7295161B2 (en) * 2004-08-06 2007-11-13 International Business Machines Corporation Apparatus and methods for constructing antennas using wire bonds as radiating elements
US7425499B2 (en) 2004-08-24 2008-09-16 Micron Technology, Inc. Methods for forming interconnects in vias and microelectronic workpieces including such interconnects
SG120200A1 (en) 2004-08-27 2006-03-28 Micron Technology Inc Slanted vias for electrical circuits on circuit boards and other substrates
US7300857B2 (en) 2004-09-02 2007-11-27 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
US7253788B2 (en) * 2004-09-08 2007-08-07 Georgia Tech Research Corp. Mixed-signal systems with alternating impedance electromagnetic bandgap (AI-EBG) structures for noise suppression/isolation
CN101032198B (zh) * 2004-09-29 2010-05-12 新田株式会社 电磁波吸收体
US7271482B2 (en) 2004-12-30 2007-09-18 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US7795134B2 (en) 2005-06-28 2010-09-14 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
US7262134B2 (en) 2005-09-01 2007-08-28 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7863187B2 (en) 2005-09-01 2011-01-04 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7622377B2 (en) 2005-09-01 2009-11-24 Micron Technology, Inc. Microfeature workpiece substrates having through-substrate vias, and associated methods of formation
US8633577B2 (en) * 2006-01-24 2014-01-21 Renesas Electronics Corporation Integrated circuit device
US7749899B2 (en) 2006-06-01 2010-07-06 Micron Technology, Inc. Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces
JP2008010859A (ja) * 2006-06-02 2008-01-17 Renesas Technology Corp 半導体装置
US8171191B2 (en) * 2006-08-04 2012-05-01 Arm Limited Bus interconnect device and a data processing apparatus including such a bus interconnect device
US7629249B2 (en) 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
US7902643B2 (en) 2006-08-31 2011-03-08 Micron Technology, Inc. Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
KR101259535B1 (ko) * 2006-09-27 2013-05-06 타이코에이엠피(유) 커넥터
US8159413B2 (en) * 2006-11-01 2012-04-17 Agency For Science, Technology And Research Double-stacked EBG structure
EP1928056A1 (en) * 2006-11-28 2008-06-04 Saab AB Method for designing array antennas
US8514036B2 (en) * 2007-08-14 2013-08-20 Wemtec, Inc. Apparatus and method for mode suppression in microwave and millimeterwave packages
US9000869B2 (en) 2007-08-14 2015-04-07 Wemtec, Inc. Apparatus and method for broadband electromagnetic mode suppression in microwave and millimeterwave packages
US8816798B2 (en) * 2007-08-14 2014-08-26 Wemtec, Inc. Apparatus and method for electromagnetic mode suppression in microwave and millimeterwave packages
SG150410A1 (en) 2007-08-31 2009-03-30 Micron Technology Inc Partitioned through-layer via and associated systems and methods
SG152086A1 (en) * 2007-10-23 2009-05-29 Micron Technology Inc Packaged semiconductor assemblies and associated systems and methods
TWI375499B (en) * 2007-11-27 2012-10-21 Asustek Comp Inc Improvement method for ebg structures and multi-layer board applying the same
US7884015B2 (en) 2007-12-06 2011-02-08 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US8077000B2 (en) * 2008-01-21 2011-12-13 Samsung Electro-Mechanics Co., Ltd. Electromagnetic bandgap structure and printed circuit board
US20090321861A1 (en) * 2008-06-26 2009-12-31 Micron Technology, Inc. Microelectronic imagers with stacked lens assemblies and processes for wafer-level packaging of microelectronic imagers
US20100060527A1 (en) * 2008-09-10 2010-03-11 International Business Machines Corporation Electromagnetic band gap tuning using undulating branches
US8288660B2 (en) * 2008-10-03 2012-10-16 International Business Machines Corporation Preserving stopband characteristics of electromagnetic bandgap structures in circuit boards
KR101018785B1 (ko) * 2008-11-28 2011-03-03 삼성전기주식회사 전자기 밴드갭 구조물 및 회로 기판
KR101018796B1 (ko) * 2008-12-02 2011-03-03 삼성전기주식회사 전자기 밴드갭 구조물 및 회로 기판
KR101018807B1 (ko) * 2008-12-02 2011-03-03 삼성전기주식회사 전자기 밴드갭 구조물 및 회로 기판
KR101072591B1 (ko) * 2009-08-10 2011-10-11 삼성전기주식회사 Ｅｍｉ 노이즈 저감 인쇄회로기판
KR101021551B1 (ko) * 2009-09-22 2011-03-16 삼성전기주식회사 전자기 밴드갭 구조를 구비하는 인쇄회로기판
KR101023541B1 (ko) * 2009-09-22 2011-03-21 삼성전기주식회사 Ｅｍｉ 노이즈 저감 인쇄회로기판
JPWO2011058688A1 (ja) * 2009-11-10 2013-03-28 日本電気株式会社 半導体装置及びノイズ抑制方法
WO2011070736A1 (ja) * 2009-12-08 2011-06-16 日本電気株式会社 ノイズ抑制テープ
US9220180B2 (en) * 2010-12-09 2015-12-22 Richard Anthony Dunn, JR. System and methods for scalable parallel data processing and process control
JP5539077B2 (ja) * 2010-07-09 2014-07-02 ローム株式会社 半導体装置
JP5831450B2 (ja) * 2010-07-12 2015-12-09 日本電気株式会社 電子機器
US8339790B2 (en) 2010-09-10 2012-12-25 Raytheon Company Monolithic microwave integrated circuit
US9386688B2 (en) 2010-11-12 2016-07-05 Freescale Semiconductor, Inc. Integrated antenna package
US9553371B2 (en) 2010-11-12 2017-01-24 Nxp Usa, Inc. Radar module
US9112254B2 (en) 2013-01-10 2015-08-18 Raytheon Company Switched path transmission line phase shifter including an off-set twin lead line arrangement
JP2015103764A (ja) * 2013-11-28 2015-06-04 株式会社日立製作所 マルチチップモジュール
US9654060B1 (en) * 2015-11-13 2017-05-16 International Business Machines Corporation Signal amplification using a reference plane with alternating impedance
US12038549B2 (en) * 2016-12-30 2024-07-16 Halliburton Energy Services, Inc. Tools and methods for reduced mechanical ringing
US11476387B2 (en) 2019-11-22 2022-10-18 Tectus Corporation Ultra-dense array of LEDs with half cavities and reflective sidewalls, and hybrid bonding methods
US11127881B2 (en) 2019-11-22 2021-09-21 Tectus Corporation Ultra-dense array of LEDs with half cavities and reflective sidewalls
CN113178692A (zh) * 2021-05-13 2021-07-27 上海大学 一种倒置蘑菇钉结构小型化天线
CN113178693A (zh) * 2021-05-13 2021-07-27 上海大学 一种倒置蘑菇钉结构圆极化小型天线
CN113727512A (zh) * 2021-07-23 2021-11-30 苏州浪潮智能科技有限公司 一种印刷电路板及服务器

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT389053B (de) * 1986-02-17 1989-10-10 Andrae Franz Einrichtung zur abschirmung gegen ein elektromagnetisches feld
US4932755A (en) * 1988-10-12 1990-06-12 Swedlow, Inc. Optical transparency having an electromagnetic pulse shield
US5017419A (en) * 1989-04-13 1991-05-21 Chomerics, Inc. Non-moire shielded window
US5455117A (en) * 1992-10-27 1995-10-03 Kansai Paint Co., Ltd. Electromagnetic wave reflection-preventing material and electromagnetic wave reflection-preventing method
US5455116A (en) * 1992-10-27 1995-10-03 Kansai Paint Co., Ltd. Electromagnetic wave reflection-preventing material and electromagnetic wave reflection-preventing method
US6147302A (en) * 1997-02-05 2000-11-14 Nippon Paint Co., Ltd. Frequency selective electromagnetic wave shielding material and a method for using the same
US6262495B1 (en) * 1998-03-30 2001-07-17 The Regents Of The University Of California Circuit and method for eliminating surface currents on metals
JP3282608B2 (ja) * 1999-03-23 2002-05-20 日本電気株式会社 多層基板
US6483481B1 (en) * 2000-11-14 2002-11-19 Hrl Laboratories, Llc Textured surface having high electromagnetic impedance in multiple frequency bands
US6599681B2 (en) * 2001-07-13 2003-07-29 Shielding Express Electromagnetic filter for display screens
US6739028B2 (en) * 2001-07-13 2004-05-25 Hrl Laboratories, Llc Molded high impedance surface and a method of making same
TW526706B (en) * 2002-06-28 2003-04-01 Ponwei Hou Materials for electromagnetic wave shielding film
TWM244562U (en) * 2003-07-21 2004-09-21 Via Tech Inc Ground shield structure

Similar Documents

Publication Publication Date Title
JP2007527629A5 (https=)
WO2005088708A3 (en) Improved flip chip mmic on board performance using periodic electromagnetic bandgap structures
US8421696B2 (en) Dual polarization antenna structure, radome and design method thereof
JP5527316B2 (ja) 共振器アンテナ
JP5725013B2 (ja) 構造体、配線基板および配線基板の製造方法
JP2004514364A (ja) 多重周波数帯域における電磁インピーダンスの大きいテクスチャ化表面
JP2012235013A5 (https=)
CN110247188B (zh) 一种天线及基站
JP2021520743A (ja) キャビティバックアンテナエレメント及びアレイアンテナ装置
JP2014527366A5 (https=)
JP2010532090A5 (https=)
JP2010506234A5 (https=)
US9386689B2 (en) Circuit board
JP2007194663A5 (https=)
TWI749987B (zh) 天線結構及陣列天線模組
JP2012503866A5 (https=)
US11509062B2 (en) Broadband wire antenna with resistive patterns having variable resistance
JP2011187863A5 (https=)
CN105428518B (zh) 基于局域共振体的声子晶体结构及其制作方法
US11715883B2 (en) Frequency selective surface
WO2021218417A1 (zh) 一种显示基板及其制备方法和显示面板
JP2011028829A5 (https=)
JP2014233053A (ja) Ｅｂｇ構造
KR101910556B1 (ko) 질화갈륨 기판을 갖는 발광 다이오드
US20130050043A1 (en) Artificial magnetic conductor using complementary tilings