WO2021218417A1 - 一种显示基板及其制备方法和显示面板 - Google Patents

一种显示基板及其制备方法和显示面板 Download PDF

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Publication number
WO2021218417A1
WO2021218417A1 PCT/CN2021/079915 CN2021079915W WO2021218417A1 WO 2021218417 A1 WO2021218417 A1 WO 2021218417A1 CN 2021079915 W CN2021079915 W CN 2021079915W WO 2021218417 A1 WO2021218417 A1 WO 2021218417A1
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Prior art keywords
display
area
substrate
insulating layer
display area
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PCT/CN2021/079915
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English (en)
French (fr)
Inventor
张瑜
蒋志亮
赵攀
周桢力
王本莲
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京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Priority to US17/629,851 priority Critical patent/US20220278300A1/en
Publication of WO2021218417A1 publication Critical patent/WO2021218417A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Definitions

  • the embodiments of the present disclosure belong to the field of display technology, and specifically relate to a display substrate, a preparation method thereof, and a display panel.
  • AMOLED Active-matrix organic light-emitting diode, active matrix organic light-emitting diode or active matrix organic light-emitting diode
  • the embodiment of the present disclosure provides a display substrate, a preparation method thereof, and a display panel.
  • a display substrate including:
  • the substrate includes a display area and a peripheral area surrounding the display area;
  • An insulating layer covering the display area and at least part of the peripheral area
  • At least one encapsulation dam located in the peripheral area of the substrate and arranged around the display area;
  • An isolation structure is located on the substrate where the packaging dam is far from the display area, the isolation structure includes a plurality of substructures arranged at intervals, and the orthographic projection of the isolation structure on the substrate surrounds the display area It is provided that the isolation structure is configured to prevent cracks in the peripheral area from extending to the display area.
  • the substructure includes a groove opened in the substrate.
  • the substructure includes protrusions disposed on the substrate.
  • the substrate includes a first sublayer, a second sublayer, and a third sublayer that are sequentially stacked, the insulating layer is located on the third sublayer, and the insulating layer includes Multiple sub-layers;
  • the grooves are opened in the third sub-layer and are located on the side of the third sub-layer close to the insulating layer, and the grooves are sequentially arranged in a direction away from the display area.
  • the depth of the groove is less than the thickness of the third sublayer.
  • the insulating layer in the groove arrangement area, is intermittently disposed in the groove.
  • the isolation structure further includes a coating layer disposed on the substrate, and the coating layer covers the groove arrangement area.
  • the coating layer in a direction away from the display area, also covers a section of the insulating layer located on at least one side of the groove arrangement area.
  • the orthographic projection of the insulating layer on the substrate covers the peripheral area between the packaging dam and the isolation structure
  • the protrusion includes a plurality of first protrusions, and the first protrusions are sequentially arranged in a direction away from the display area.
  • a first protrusion close to the insulating layer covers a section of the insulating layer.
  • the distance between any two adjacent first protrusions is equal, and the distance ranges from 5 to 7 ⁇ m.
  • the total arrangement width of the plurality of first protrusions ranges from 50 ⁇ m to 70 ⁇ m.
  • the protrusions further include a plurality of second protrusions disposed on a side of the insulating layer of the encapsulation dam away from the display area away from the substrate, and the second protrusions are close to The section of the insulating layer is distributed, and the second protrusions are sequentially arranged in a direction away from the display area.
  • the first sub-layer and the third sub-layer are both made of organic resin materials
  • the second sub-layer is made of inorganic insulating materials
  • each of the sub-layers is made of inorganic insulating materials.
  • the peripheral area includes a pad area, the pad area is configured to provide signal routing and wire bonding ends, the pad area is located on one side edge of the substrate, and the isolation The structure is located on the edge of the substrate other than the edge where the pad area is located.
  • embodiments of the present disclosure provide a display panel including the above-mentioned display substrate.
  • embodiments of the present disclosure provide a method for manufacturing a display substrate, the display substrate including a base, the base including a display area and a peripheral area surrounding the display area, and the manufacturing method includes:
  • the insulating layer covers the display area and at least part of the peripheral area;
  • Preparing at least one encapsulation dam which is located in the peripheral area of the substrate and arranged around the display area;
  • An isolation structure is prepared; the isolation structure is located on the substrate where the encapsulation dam is away from the display area, and the preparation of the isolation structure includes preparing a plurality of substructures arranged at intervals, and the isolation structure is located on the substrate.
  • the projection is arranged around the display area, and the isolation structure is configured to prevent cracks in the peripheral area from extending to the display area.
  • FIG. 1 is a top view of the structure of an AMOLED display substrate
  • FIG. 2 is a cross-sectional view of the structure of the AMOLED display substrate in FIG. 1 along the CC section line;
  • FIG. 3 is a structural cross-sectional view of the AMOLED display substrate in FIG. 1 along a section line AA;
  • FIG. 4 is a top view of a structure of a display substrate in an embodiment of the disclosure.
  • FIG. 5 is a top view of another display substrate structure in an embodiment of the disclosure.
  • FIG. 6 is a cross-sectional view of the structure of the substrate taken along the BB section line shown in FIG. 4;
  • FIG. 7 is a cross-sectional view showing another structure of the substrate along the BB section line in FIG. 4;
  • FIG. 8 is a cross-sectional view of another structure of the substrate taken along the BB section line shown in FIG. 4; FIG.
  • FIG. 9 is a cross-sectional view showing another structure of the substrate along the BB section line in FIG. 4;
  • FIG. 10 is a cross-sectional view of another structure of the substrate taken along the BB section line shown in FIG. 4.
  • AMOLED products use organic self-luminous display technology
  • the luminescent materials are highly sensitive to water and oxygen.
  • the water and oxygen will be transmitted to the display area along the crack propagation path mentioned above, which will eventually cause black spots on the screen, which will seriously affect the quality of the product.
  • How to prevent the expansion of edge cracks has become an important issue for designers of AMOLED mobile phone screens and has important practical significance.
  • the AMOLED display substrate (that is, it can also be referred to as an array substrate) includes a display area 101 and a first edge area 103 and a second edge area 104 which are sequentially arranged peripherally around the display area 101.
  • the edge area 103 and the second edge area 104 are bounded by an encapsulation dam 8.
  • the encapsulation dam 8 is enclosed on the periphery of the display area 101, and is usually connected to the pixel defining layer 9, the spacer layer 10, and the flat layer formed in the display area 101.
  • At least one film layer or two or more such film layers of 14 grades are prepared by the same preparation process, and one such film layer constitutes the encapsulation dam 8 or two or more such film layers are stacked on each other to constitute the encapsulation dam 8 , Used to prevent the organic film material in the encapsulation film layer from overflowing during inkjet printing.
  • the first edge area 103 is an edge area close to the display area 101, and circuit traces are arranged in the first edge area 103, and the circuit traces are used to provide electrical signals for lighting the light-emitting devices in the display area 101.
  • the second edge area 104 is an edge area farther from the display area 101 than the first edge area 103.
  • the second edge area 104 is usually no longer provided with circuit traces, and the second edge area 104 is usually provided with
  • the insulating film layer is an insulating film layer prepared in a single process, such as a substrate, other insulating film layers arranged on the substrate, etc.; the second edge area 104 is used for the pressing and mounting of the subsequent protective film layer, outer frame, etc. of the AMOLED display substrate .
  • the side of the second edge area 104 away from the display area 101 is the edge of the display panel.
  • the encapsulation film layer When encapsulating the AMOLED display substrate, the encapsulation film layer covers only the display area and the first edge area, and the second edge area is exposed to facilitate subsequent pressing and mounting of other film layers or outer frames.
  • AMOLED display substrates During the production and transportation of AMOLED display substrates, it is often easy to bump the edge of the AMOLED display substrate, causing cracks to occur in the insulating film layer (such as inorganic insulating layer) with a relatively brittle material in the second edge region. The expansion and transfer in the layer reach the display area, causing the luminescent material in the display area to be corroded by water and oxygen, which affects the quality of the AMOLED display substrate.
  • the insulating film layer such as inorganic insulating layer
  • the retaining wall 6 is usually prepared in a part of the insulating layer 2 in the second edge region 104 on the substrate 1, that is, the spacer wall 6 is formed by etching in the part of the insulating layer 2 to relieve the second edge region. 104
  • the crack propagates and propagates to the display area.
  • the material of the insulating layer 2 is relatively brittle, even if the retaining wall 6 is formed in a part of the insulating layer 2 in the second edge region 104, it is still unavoidable that the other insulating layers 2 in the second edge region 104 and the insulating layer 2 in the first edge region 103 Cracks and crack propagation are formed in the insulating layer 2.
  • embodiments of the present disclosure provide a display substrate, a preparation method thereof, and a display panel.
  • an embodiment of the present disclosure provides a display substrate, as shown in FIGS. 4-6, comprising a substrate 1, including a display area 101 and a peripheral area 102 surrounding the display area 101; an insulating layer 2, covering the display area 101 and At least part of the peripheral area 102; at least one encapsulation dam 8 located in the peripheral area 102 of the substrate 1 and arranged around the display area 101; isolation structure 7 located on the substrate 1 where the encapsulation dam 8 is away from the display area 101, the isolation structure 7 includes a plurality of spaces The orthographic projection of the isolation structure 7 on the substrate 1 is arranged around the display area 101, and the isolation structure 7 is configured to prevent cracks in the peripheral area 102 from extending to the display area 101.
  • the insulating layer 2 is usually a plurality of inorganic insulating layers stacked on each other.
  • the insulating layer 2 may also be a structure in which an inorganic insulating layer and an organic insulating layer are stacked on each other.
  • the inorganic insulating layer is prone to breakage when bumped.
  • the encapsulation dam 8 is arranged around the display area 101 in a closed manner. In this embodiment, one packaging dam 8 is provided, and two or more packaging dams 8 can also be provided.
  • the peripheral area 102 includes a pad area 105, the pad area 105 is configured to provide signal routing and wiring bonding ends, the pad area 105 is located on one side edge of the substrate 1, and the isolation structure 7 is located on the substrate 1. An edge other than the edge where the pad area 105 is located. That is, for example, the display substrate has four edges, the isolation structure 7 can only be provided in the peripheral area 102 on three sides of the display substrate. The isolation structure 7 is not provided in the peripheral area 102. It should be noted that the isolation structure 7 can also be arranged on one side of the pad area 105.
  • the isolation structure arranged on the side of the pad area 105 and the isolation structure 7 arranged on the other three sides of the peripheral area 102 of the display substrate can form a closed area. It is also possible to provide a separate isolation structure 7 on one side of the pad area 105, that is, the isolation structure 7 provided separately and the isolation structure 7 provided on the other three sides of the display substrate in the peripheral area 102 are independent of each other.
  • the isolation structure 7 may be continuously distributed in the three-side peripheral area 102 of the display substrate (as shown in FIG. 4), or may be intermittently distributed in the three-side peripheral area 102 of the display substrate (as shown in FIG. 5).
  • the isolation structure 7 By arranging the isolation structure 7 on the base 1 of the packaging dam 8 of the display substrate away from the display area 101, when the peripheral area 102 of the display substrate is impacted, the isolation structure 7 can absorb the energy of the impact, buffer the force of the impact, and improve the performance of the display substrate. Impact resistance, prevents the generation of cracks in the film and blocks the propagation and transmission path of cracks in the film, prevents edge cracks from being transmitted to the display area 101, thereby preventing external water and oxygen from entering the display area 101 and the display substrate through the cracks, and the reliability of the display substrate is poor. In turn, the quality of the display substrate is ensured.
  • the sub-structure includes grooves opened in the substrate 1.
  • the substrate 1 includes a first sub-layer 11, a second sub-layer 12, and a third sub-layer 13 stacked in sequence, and the insulating layer 2 is located on the third sub-layer 13; the insulating layer 2 includes mutually stacked A plurality of sub-layers; grooves are opened in the third sub-layer 13 and located on the side of the third sub-layer 13 close to the insulating layer 2, and the grooves are arranged in sequence along the direction away from the display area 101.
  • the first sub-layer 11 and the third sub-layer 13 are made of organic resin materials
  • the second sub-layer 12 is made of inorganic insulating materials
  • each sub-layer is made of inorganic insulating materials.
  • a partition wall 130 is formed between adjacent grooves; since the third sub-layer 13 is made of organic resin material, it has a certain flexibility.
  • the partition wall 130 is formed in the peripheral area of the display substrate.
  • the depth of the groove is less than the thickness of the third sub-layer 13. That is, the grooves in the third sub-layer 13 do not penetrate through its thickness.
  • This arrangement can prevent the second sub-layer 12 of inorganic insulating material from cracking when it is impacted by bumps, thereby preventing external water and oxygen from passing through the second sub-layer 12
  • the cracks enter the display area 101 and the display substrate causes reliability defects, which ensures the quality of the display substrate.
  • the height of the multiple isolation walls 130 may be the same or different.
  • the insulating layer 2 in the groove arrangement area, is intermittently disposed in the groove.
  • the insulating layer 2 is arranged in the groove, which can increase the strength of the arrangement area of the isolation wall 130 and enhance the impact resistance of the peripheral area 102.
  • the isolation structure 7 further includes a coating layer 3 disposed on the substrate 1, and the coating layer 3 covers the groove arrangement area.
  • the coating layer 3 adopts an organic resin material.
  • the covering layer 3 also covers the section of the insulating layer 2 located on at least one side of the groove arrangement area. Wherein, the covering layer 3 covers the cross-sections of the insulating layer 2 located on both sides of the arrangement area of the partition wall 130. Since there is usually a conductive metal film remaining on the cross section of the insulating layer 2 located on both sides of the partition wall 130 arrangement area, the remaining conductive metal film is exposed to the outside and is easily corroded by external water and oxygen to form black spots, so that the peripheral area 102 of the display substrate Black spots will appear, affecting the aesthetics of the display substrate.
  • the section of the insulating layer 2 located on both sides of the groove arrangement area is covered by the coating layer 3, which can prevent the conductive metal film remaining on the section of the insulating layer 2 from being exposed to the outside. It is corroded by external water and oxygen, so as to prevent black spots from appearing in the peripheral area 102 of the display substrate.
  • An organic electroluminescence device ie, an OLED device is also formed in the display area 101 of the display substrate to realize the organic electroluminescence display of the display substrate.
  • the display substrate includes a base, the base includes a display area and a peripheral area surrounding the display area, and the preparation method includes:
  • An insulating layer is prepared on the substrate; the insulating layer covers the display area and at least part of the peripheral area.
  • At least one encapsulation dam is prepared, which is located in the peripheral area of the substrate and arranged around the display area.
  • the isolation structure is prepared; the isolation structure is located on the base of the packaging dam away from the display area.
  • the preparation of the isolation structure includes preparing a plurality of spaced substructures.
  • the orthographic projection of the isolation structure on the base is arranged around the display area, and the isolation structure is configured to block the peripheral area. The crack extended to the display area.
  • Step S1 Prepare the first sublayer, the second sublayer and the third sublayer in sequence.
  • Step S2 Opening a groove in the third sub-layer of the peripheral area.
  • the grooves in the third sub-layer are formed by exposure and development methods.
  • Step S3 the insulating layer is prepared by a patterning process, and the part of the insulating layer corresponding to the part formed on the isolation wall is removed by a dry etching method, and the part of the insulating layer in the groove is retained.
  • the patterning process includes the steps of film formation, photoresist coating, exposure, development, and etching.
  • Step S4 preparing a coating layer.
  • the coating layer is formed by a method of coating, film formation, exposure, and development.
  • the embodiment of the present disclosure provides a display substrate.
  • the difference from the above-mentioned embodiment is that, as shown in FIG. 8, in the distribution area of the groove, the insulating layer 2 is not provided.
  • An isolation wall 130 is formed between adjacent grooves.
  • the insulating layer 2 is not provided in the isolation wall 130 arrangement area and the peripheral area 102 of the isolation wall 130 arrangement area away from the packaging dam 8.
  • the isolation structure only includes grooves formed in the third sublayer 13, and no coating layer is provided in the groove arrangement area.
  • the isolation structure By not providing the insulating layer 2 in the distribution area of the isolation structure, it can also prevent cracks from propagating along the insulating layer 2 when the peripheral area 102 of the display substrate is impacted by bumps, resulting in poor reliability of the display substrate;
  • An isolation structure is provided on the base 1 of the display area 101. When the peripheral area 102 of the display substrate is impacted, the isolation structure can absorb the energy of the impact, buffer the force of the impact, improve the impact resistance of the display substrate, and prevent the generation of cracks in the film layer.
  • the embodiment of the present disclosure also provides a method for manufacturing the display substrate.
  • the difference from the manufacturing method in the above embodiment is that the insulating layer is not provided in the distribution area of the isolation structure. .
  • the specific preparation process of the display substrate is:
  • Step S1 Prepare the first sublayer, the second sublayer and the third sublayer in sequence.
  • Step S2 Opening a groove in the third sub-layer of the peripheral area.
  • the grooves in the third sub-layer are formed by exposure and development methods.
  • Step S3 the insulating layer is prepared by a patterning process, and the part of the insulating layer corresponding to the groove arrangement area and the peripheral area of the groove arrangement area on the side away from the packaging dam is removed by a dry etching method.
  • the patterning process includes the steps of film formation, photoresist coating, exposure, development, and etching.
  • the embodiment of the present disclosure provides a display substrate.
  • the difference from the above-mentioned embodiment is that, as shown in FIG. 9, the substructure includes protrusions provided on the base 1.
  • the orthographic projection of the insulating layer 2 on the substrate 1 covers the peripheral area 102 between the packaging dam 8 and the isolation structure; the protrusions include a plurality of first protrusions 4, which are far away from the display area.
  • the directions of 101 are arranged in sequence. That is, the insulating layer 2 is not provided in the area where the first bump 4 is provided.
  • the first protrusion 4 can absorb the impact energy and buffer the force of the impact to avoid the peripheral area 102.
  • the insulating layer 2 of the slab is cracked under the impact of the impact, which ensures the quality of the display substrate.
  • a first protrusion 4 close to the insulating layer 2 covers a section of the insulating layer 2. Since there is usually a conductive metal film remaining on the cross-section of the insulating layer 2 in the peripheral area 102, the remaining conductive metal film is exposed to the outside and is easily corroded by external water and oxygen to form black spots, so that black spots appear in the peripheral area 102 of the display substrate. Influencing the aesthetics of the display substrate, the section of the insulating layer 2 located in the peripheral area 102 is covered by the first bump 4, which can prevent the conductive metal film remaining on the section of the insulating layer 2 from being exposed and corroded by external water and oxygen. Black spots appear in the peripheral area 102 of the display substrate.
  • the distance between any two adjacent first protrusions 4 is equal, and the distance ranges from 5 to 7 ⁇ m.
  • the height of the first protrusion 4 may be equal or unequal.
  • the distance between the first protrusions 4 is 6 ⁇ m. The setting of this distance range enables the first protrusion 4 to well absorb the impact energy of bumps, and prevents the impact of bumps from causing cracks in the insulating layer 2.
  • the total arrangement width of the plurality of first protrusions 4 ranges from 50 to 70 ⁇ m.
  • the overall arrangement width range is set, so that the first protrusion 4 can well absorb the impact energy of bumps, and prevent the impact of bumps from causing cracks in the insulating layer 2.
  • the protrusions further include a plurality of second protrusions 5 disposed on the side of the insulating layer 2 of the packaging dam 8 away from the display area 101 away from the substrate 1, and the second protrusions 5 are close to
  • the insulating layer 2 has a cross-sectional distribution, and the second protrusions 5 are sequentially arranged in a direction away from the display area 101.
  • the arrangement of the second protrusion 5 can absorb the impact energy and buffer the force of the impact, so as to further prevent the insulating layer 2 from cracking under the impact of bumps and ensure the quality of the display substrate.
  • the number of second protrusions 5, the total arrangement width range, and the distance between adjacent second protrusions 5 are not limited.
  • the height of the second protrusions 5 may be equal or different, as long as The second protrusion 5 can absorb the impact energy of the bump, so as to buffer the impact force.
  • both the first protrusion 4 and the second protrusion 5 are made of organic resin materials.
  • the organic resin material has a certain degree of flexibility, can well absorb the impact energy of bumps, and cushion the force of impact.
  • embodiments of the present disclosure also provide a method for manufacturing the display substrate.
  • the difference from the manufacturing method in the above embodiments is the specific manufacturing process of the display substrate.
  • the specific preparation process of the display substrate is:
  • Step S1 Prepare the first sublayer, the second sublayer and the third sublayer in sequence.
  • Step S2 the insulating layer is prepared by a patterning process, and a part of the insulating layer corresponding to the peripheral area formed on the side of the isolation structure away from the packaging dam is removed by a dry etching method.
  • the patterning process includes the steps of film formation, photoresist coating, exposure, development, and etching.
  • Step S3 preparing the first protrusion and the second protrusion.
  • the patterns of the first protrusions and the second protrusions are formed by the methods of film coating, exposure, and development.
  • the isolation structure By arranging the isolation structure on the base of the packaging dam of the display substrate away from the display area, when the peripheral area of the display substrate is impacted, the isolation structure can absorb the energy of the impact, buffer the force of the impact, improve the impact resistance of the display substrate, and prevent the film
  • the generation of cracks in the layer blocks the propagation and transmission path of the cracks in the film layer, prevents edge cracks from being transmitted to the display area, thereby preventing external water and oxygen from entering the display area through the cracks and poor reliability of the display substrate, thereby ensuring the quality of the display substrate.
  • embodiments of the present disclosure also provide a display panel, including the display substrate in any of the above embodiments.
  • the display panel further includes an encapsulation layer, the encapsulation layer is coupled to the display substrate, and the encapsulation layer covers the display area of the display substrate, and the flexible isolation structure in the display substrate is exposed.
  • the reliability defects of the display panel are improved, and the quality of the display panel is ensured.
  • the display panel provided by the embodiment of the present disclosure may be any product or component with a display function, such as an OLED panel, an OLED TV, a display, a mobile phone, and a navigator.

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Abstract

一种显示基板，包括：基底（1），包括显示区（101）和围绕所述显示区（101）的周边区（102）；绝缘层（2），覆盖所述显示区（101）和至少部分所述周边区（102）；至少一个封装坝（8），位于所述基底（1）的周边区（102）且围绕所述显示区（101）设置；隔离结构（7），位于所述封装坝（8）远离所述显示区（101）的所述基底（1）上，所述隔离结构（8）包括多个间隔设置的子结构，且所述隔离结构（8）在所述基底（1）上的正投影围绕所述显示区（101）设置，所述隔离结构（8）被配置为阻止所述周边区（102）的裂纹扩展至所述显示区（101）。

Description

一种显示基板及其制备方法和显示面板 技术领域
本公开实施例属于显示技术领域，具体涉及一种显示基板及其制备方法和显示面板。
背景技术
随着手机市场对显示屏幕提出薄，能弯折，对比度高、色域广等方面的要求。AMOLED(Active-matrix organic light-emitting diode，有源矩阵有机发光二极体或主动矩阵有机发光二极体)产品孕育而生。虽然这类手机屏幕能够实现柔性弯折，然而在该类产品的手机实际生产过程中，往往显示面板在切割以及运送等过程中容易产生裂纹，严重的裂纹有的会直接贯穿至显示区域，有些裂纹则是在后续的压合制备工艺过程中产生，并延伸扩展到显示区域。
发明内容
本公开实施例提供一种显示基板及其制备方法和显示面板。
第一方面，本公开实施例提供一种显示基板，包括：
基底，包括显示区和围绕所述显示区的周边区；
绝缘层，覆盖所述显示区和至少部分所述周边区；
至少一个封装坝，位于所述基底的周边区且围绕所述显示区设置；
隔离结构，位于所述封装坝远离所述显示区的所述基底上，所述隔离结构包括多个间隔设置的子结构，且所述隔离结构在所述基底上的正投影围绕所述显示区设置，所述隔离结构被配置为阻止所述周边区的裂纹扩展至所述显示区。
在一些实施例中，所述子结构包括开设在所述基底中的凹槽。
在一些实施例中，所述子结构包括设置于所述基底上的凸起。
在一些实施例中，所述基底包括依次叠置的第一子层、第二子层和第 三子层，所述绝缘层位于所述第三子层上，所述绝缘层包括相互叠置的多个子膜层；
所述凹槽开设于所述第三子层中，且位于所述第三子层的靠近所述绝缘层的一侧，所述凹槽沿远离所述显示区的方向依次排布。
在一些实施例中，所述凹槽的深度小于所述第三子层的厚度。
在一些实施例中，在所述凹槽排布区域，所述绝缘层间断设置于所述凹槽内。
在一些实施例中，所述隔离结构还包括包覆层，所述包覆层设置于所述基底上，且所述包覆层覆盖所述凹槽排布区域。
在一些实施例中，沿远离所述显示区的方向，所述包覆层还包覆位于所述凹槽排布区域至少一侧的所述绝缘层的断面。
在一些实施例中，所述绝缘层在所述基底上的正投影覆盖所述封装坝与所述隔离结构之间的所述周边区；
所述凸起包括多个第一凸起，所述第一凸起沿远离所述显示区的方向依次排布。
在一些实施例中，靠近所述绝缘层的一所述第一凸起包覆所述绝缘层的断面。
在一些实施例中，任意相邻两个所述第一凸起之间的间距相等，所述间距范围为5～7μm。
在一些实施例中，沿远离所述显示区的方向，多个所述第一凸起的总排布宽度范围为50～70μm。
在一些实施例中，所述凸起还包括设置于所述封装坝远离所述显示区的所述绝缘层背离所述基底一侧的多个第二凸起，且所述第二凸起靠近所述绝缘层的断面分布，所述第二凸起沿远离所述显示区的方向依次排布。
在一些实施例中，所述第一子层和所述第三子层均采用有机树脂材料，所述第二子层采用无机绝缘材料；各所述子膜层均采用无机绝缘材料。
在一些实施例中，所述周边区包括焊盘区，所述焊盘区被配置为设置信号走线和接线绑定端，所述焊盘区位于所述基底的一侧边缘，所述隔离结构位于所述基底的所述焊盘区所在边缘以外的边缘。
第二方面，本公开实施例提供一种显示面板，包括上述显示基板。
第三方面，本公开实施例提供一种显示基板的制备方法，所述显示基板包括基底，所述基底包括显示区和围绕所述显示区的周边区，所述制备方法包括：
制备基底；
在所述基底上制备绝缘层；所述绝缘层覆盖所述显示区和至少部分所述周边区；
制备至少一个封装坝，位于所述基底的周边区且围绕所述显示区设置；
制备隔离结构；所述隔离结构位于所述封装坝远离所述显示区的所述基底上，制备所述隔离结构包括制备多个间隔设置的子结构，所述隔离结构在所述基底上的正投影围绕所述显示区设置，所述隔离结构被配置为阻止所述周边区的裂纹扩展至所述显示区。
附图说明
附图用来提供对本公开实施例的进一步理解，并且构成说明书的一部分，与本公开实施例一起用于解释本公开，并不构成对本公开的限制。通过参考附图对详细示例实施例进行描述，以上和其它特征和优点对本领域技术人员将变得更加显而易见，在附图中：
图1为AMOLED显示基板的结构俯视图；
图2为图1中AMOLED显示基板沿CC剖切线的结构剖视图；
图3为图1中AMOLED显示基板沿AA剖切线的结构剖视图；
图4为本公开实施例中一种显示基板的结构俯视图；
图5为本公开实施例中另一种显示基板的结构俯视图；
图6为图4中显示基板沿BB剖切线的结构剖视图；
图7为图4中显示基板沿BB剖切线的另一种结构剖视图；
图8为图4中显示基板沿BB剖切线的又一种结构剖视图；
图9为图4中显示基板沿BB剖切线的又一种结构剖视图；
图10为图4中显示基板沿BB剖切线的又一种结构剖视图。
具体实施方式
为使本领域技术人员更好地理解本公开实施例的技术方案，下面结合附图和具体实施方式对本公开实施例提供的一种显示基板及其制备方法和显示面板作进一步详细描述。
在下文中将参考附图更充分地描述本公开实施例，但是所示的实施例可以以不同形式来体现，且不应当被解释为限于本公开阐述的实施例。反之，提供这些实施例的目的在于使本公开透彻和完整，并将使本领域技术人员充分理解本公开的范围。
本公开实施例不限于附图中所示的实施例，而是包括基于制造工艺而形成的配置的修改。因此，附图中例示的区具有示意性属性，并且图中所示区的形状例示了区的具体形状，但并不是旨在限制性的。
由于AMOLED产品采用的是有机自发光显示技术，而发光材料则是对水氧高度的敏感。水氧会沿着上述的裂纹扩展路径传递到显示区，最终使屏幕产生黑斑，严重的影响产品的品质。如何防止边缘裂纹的扩展，就成为AMOLED手机屏设计者的重要课题，有着重要的现实意义。
如图1-图3所示，AMOLED显示基板(即也可称作阵列基板)包括显示区101和依次向外围设在显示区101周围的第一边缘区103和第二边缘区104，第一边缘区103和第二边缘区104由封装坝8分界，封装坝8封闭地围设于显示区101外围，通常与形成于显示区101的如像素界定层9、隔垫物层10、平坦层14等的至少一个膜层或者两个以上这样的膜层采用同一制备工艺制备而成，且由一个这样的膜层构成封装坝8或者由两个以上这样 的膜层相互叠置构成封装坝8，用于防止封装膜层中有机膜材料在喷墨打印时外溢。其中，第一边缘区103为靠近显示区101的边缘区，第一边缘区103内设置有电路走线，电路走线用于为显示区101内的发光器件点亮提供电信号。第二边缘区104为相比第一边缘区103较远离显示区101的边缘区，第二边缘区104内通常不再设置电路走线，第二边缘区104内通常设置有与显示区101内绝缘膜层在一次工艺中制备形成的绝缘膜层，如基底，设置在基底上的其他绝缘膜层等；第二边缘区104用于AMOLED显示基板后续保护膜层、外框等的压合安装。第二边缘区104的远离显示区101的一侧即为显示面板的边缘。
在对AMOLED显示基板进行封装时，封装膜层只对显示区和第一边缘区进行盖合封装，第二边缘区则裸露在外，便于后续其他膜层或外框的压合安装。
在AMOLED显示基板的生产和运送过程中，常常容易对AMOLED显示基板的边缘造成磕碰，致使第二边缘区材质较脆的绝缘膜层(如无机绝缘层)中产生裂纹，该裂纹容易在绝缘膜层中扩展传递，到达显示区，使显示区内的发光材料遭受水氧侵蚀，影响AMOLED显示基板的品质。
公开的技术中，通常在基底1上第二边缘区104内的部分绝缘层2中制备挡墙6，即在部分绝缘层2中刻蚀形成间隔分布的挡墙6，以缓解第二边缘区104裂纹向显示区扩展传递。但由于绝缘层2材质较脆，即使在第二边缘区104内的部分绝缘层2中形成挡墙6，仍然无法避免第二边缘区104内的其他绝缘层2和第一边缘区103内的绝缘层2中形成裂纹和裂纹扩展。
针对上述的边缘裂纹扩展传递到显示区，影响产品的品质的问题，本公开实施例提供一种显示基板及其制备方法和显示面板。
第一方面，本公开实施例提供一种显示基板，如图4-图6所示，包括 基底1，包括显示区101和围绕显示区101的周边区102；绝缘层2，覆盖显示区101和至少部分周边区102；至少一个封装坝8，位于基底1的周边区102且围绕显示区101设置；隔离结构7，位于封装坝8远离显示区101的基底1上，隔离结构7包括多个间隔设置的子结构，且隔离结构7在基底1上的正投影围绕显示区101设置，隔离结构7被配置为阻止周边区102的裂纹扩展至显示区101。
其中，绝缘层2通常为多个相互叠置的无机绝缘层，当然，绝缘层2也可以是无机绝缘层和有机绝缘层相互叠置的结构。无机绝缘层容易在受到磕碰的情况下发生断裂。封装坝8封闭地围绕显示区101设置。本实施例中，封装坝8设置有一个，封装坝8也可以设置两个或两个以上。
在一些实施例中，周边区102包括焊盘区105，焊盘区105被配置为设置信号走线和接线绑定端，焊盘区105位于基底1的一侧边缘，隔离结构7位于基底1的焊盘区105所在边缘以外的边缘。即例如显示基板有四个边缘，隔离结构7可以仅设置于显示基板的三侧周边区102，显示基板未设置隔离结构7的另外一侧周边区102用于设置其他结构，所以显示基板有一侧周边区102不设置隔离结构7。需要说明的是，隔离结构7也可以设置在焊盘区105的一侧，如设置在焊盘区105一侧的隔离结构与设置在显示基板其他三侧周边区102的隔离结构7可以构成封闭的环形；也可以在焊盘区105的一侧单独设置一隔离结构7，即该单独设置的隔离结构7与设置在显示基板其他三侧周边区102的隔离结构7相互独立。另外，隔离结构7可以连续地分布于显示基板的三侧周边区102(如图4所示)，也可以间断地分布于显示基板的三侧周边区102(如图5所示)。
通过在显示基板的封装坝8远离显示区101的基底1上设置隔离结构7，在显示基板周边区102受到冲击时，隔离结构7能吸收冲击的能量，缓冲冲击的作用力，提升显示基板的抗冲击性能，阻止膜层中裂纹的产生并阻断膜层中裂纹的扩展传递路径，防止边缘裂纹传递到显示区101，从而防止 外界水氧通过裂纹进入显示区101和显示基板信赖性不良，进而确保了显示基板的品质。
在一些实施例中，子结构包括开设在基底1中的凹槽。
在一些实施例中，基底1包括依次叠置的第一子层11、第二子层12和第三子层13，绝缘层2位于第三子层13上；绝缘层2包括相互叠置的多个子膜层；凹槽开设于第三子层13中，且位于第三子层13的靠近绝缘层2的一侧，凹槽沿远离显示区101的方向依次排布。其中，第一子层11和第三子层13均采用有机树脂材料，第二子层12采用无机绝缘材料；各子膜层均采用无机绝缘材料。如此设置，相邻的凹槽之间形成隔离墙130；由于第三子层13采用有机树脂材料，所以具有一定的柔性，通过在第三子层13中形成隔离墙130，在显示基板周边区102受到冲击时，隔离墙130能吸收冲击的能量，缓冲冲击的作用力，提升显示基板的抗冲击性能。
在一些实施例中，凹槽的深度小于第三子层13的厚度。即第三子层13中凹槽并未贯穿其厚度，如此设置，能够避免无机绝缘材料的第二子层12在受到磕碰冲击时产生裂纹，从而避免外界水氧通过第二子层12中的裂纹进入显示区101和显示基板出现信赖性不良，确保了显示基板的品质。
需要说明的是，多个隔离墙130的高度可以相同，也可以不同。
在一些实施例中，在凹槽排布区域，绝缘层2间断设置于凹槽内。凹槽内设置绝缘层2，能够增大隔离墙130排布区域的强度，增强周边区102的抗冲击性能。通过在凹槽的分布区域，绝缘层2间断设置，且间断设置的绝缘层2与凹槽相互交替排布，能够防止显示基板的周边区102受到磕碰冲击时裂纹沿绝缘层2扩展，导致显示基板的信赖性不良。
在一些实施例中，隔离结构7还包括包覆层3，包覆层3设置于基底1上，且包覆层3覆盖凹槽排布区域。其中，包覆层3采用有机树脂材料。通过在隔离墙130排布区域覆盖包覆层3，不仅能够进一步增强隔离墙130排布区域的强度，增强周边区102的抗冲击性能，而且能够进一步增强隔 离墙130排布区域的防止水氧入侵的性能。
在一些实施例中，如图7所示，沿远离显示区101的方向，包覆层3还包覆位于凹槽排布区域至少一侧的绝缘层2的断面。其中，包覆层3包覆位于隔离墙130排布区域两侧的绝缘层2的断面。由于位于隔离墙130排布区域两侧的绝缘层2的断面上通常会有导电金属膜层残留，残留导电金属膜层暴露在外容易被外界水氧腐蚀形成黑点，以致显示基板的周边区102会出现黑点，影响显示基板的美观度，通过包覆层3将位于凹槽排布区域两侧的绝缘层2的断面包覆，能够避免绝缘层2断面上残留的导电金属膜层暴露在外被外界水氧腐蚀，从而避免显示基板的周边区102出现黑点。
该显示基板的显示区101内还形成有有机电致发光器件(即OLED器件)，以实现该显示基板的有机电致发光显示。
基于显示基板的上述结构，本公开实施例还提供一种该显示基板的制备方法，显示基板包括基底，基底包括显示区和围绕显示区的周边区，制备方法包括：
制备基底。
在基底上制备绝缘层；绝缘层覆盖显示区和至少部分周边区。
制备至少一个封装坝，位于基底的周边区且围绕显示区设置。
制备隔离结构；隔离结构位于封装坝远离显示区的基底上，制备隔离结构包括制备多个间隔设置的子结构，隔离结构在基底上的正投影围绕显示区设置，隔离结构被配置为阻止周边区的裂纹扩展至显示区。
其中，该显示基板的具体制备过程为：
步骤S1：依次制备第一子层、第二子层和第三子层。
步骤S2：在周边区的第三子层中开设凹槽。
该步骤中，通过曝光、显影的方法形成第三子层中的凹槽。
步骤S3：采用构图工艺制备绝缘层，通过干刻的方法去除绝缘层的对应形成于隔离墙上的部分，保留凹槽中的绝缘层部分。
该步骤中，构图工艺包括成膜、光刻胶涂敷、曝光、显影、刻蚀等步骤。
步骤S4：制备包覆层。
该步骤中，通过涂敷成膜、曝光、显影的方法形成包覆层。
本公开实施例提供一种显示基板，与上述实施例中不同的是，如图8所示，在凹槽的分布区域，绝缘层2未设置。相邻的凹槽之间形成隔离墙130。
在一些实施例中，在隔离墙130排布区域和隔离墙130排布区域的远离封装坝8一侧的周边区102，绝缘层2未设置。
在本实施例中，隔离结构只包括形成于第三子层13中的凹槽，在凹槽排布区域，未设置包覆层。
通过在隔离结构的分布区域，绝缘层2未设置，同样能够防止显示基板的周边区102受到磕碰冲击时裂纹沿绝缘层2扩展，导致显示基板的信赖性不良；通过在显示基板的封装坝远离显示区101的基底1上设置隔离结构，在显示基板周边区102受到冲击时，隔离结构能吸收冲击的能量，缓冲冲击的作用力，提升显示基板的抗冲击性能，阻止膜层中裂纹的产生并阻断膜层中裂纹的扩展传递路径，防止边缘裂纹传递到显示区101，从而防止外界水氧通过裂纹进入显示区101和显示基板信赖性不良，进而确保了显示基板的品质。
本实施例中显示基板的其他结构与上述实施例中相同，此处不再赘述。
基于本公开实施例中显示基板的上述结构，本公开实施例还提供一种该显示基板的制备方法，与上述实施例中的制备方法不同的是，在隔离结构的分布区域，绝缘层未设置。
该显示基板的具体制备过程为：
步骤S1：依次制备第一子层、第二子层和第三子层。
步骤S2：在周边区的第三子层中开设凹槽。
该步骤中，通过曝光、显影的方法形成第三子层中的凹槽。
步骤S3：采用构图工艺制备绝缘层，通过干刻的方法去除绝缘层的对应形成于凹槽排布区域和凹槽排布区域的远离封装坝一侧的周边区的部分。
该步骤中，构图工艺包括成膜、光刻胶涂敷、曝光、显影、刻蚀等步骤。
本公开实施例提供一种显示基板，与上述实施例不同的是，如图9所示，子结构包括设置于基底1上的凸起。
在一些实施例中，绝缘层2在基底1上的正投影覆盖封装坝8与隔离结构之间的周边区102；凸起包括多个第一凸起4，第一凸起4沿远离显示区101的方向依次排布。即第一凸起4的设置区域，未设置绝缘层2。
其中，从而防止显示基板的在封装坝8远离显示区101一侧的周边区102受到磕碰冲击时，第一凸起4能够对冲击能量进行吸收，缓冲冲击的作用力，以避免周边区102内的绝缘层2在磕碰冲击作用下产生裂纹，确保了显示基板的品质。
在一些实施例中，靠近绝缘层2的一第一凸起4包覆绝缘层2的断面。由于位于周边区102的绝缘层2的断面上通常会有导电金属膜层残留，残留导电金属膜层暴露在外容易被外界水氧腐蚀形成黑点，以致显示基板的周边区102会出现黑点，影响显示基板的美观度，通过第一凸起4将位于周边区102的绝缘层2的断面包覆，能够避免绝缘层2断面上残留的导电金属膜层暴露在外被外界水氧腐蚀，从而避免显示基板的周边区102出现黑点。
在一些实施例中，任意相邻两个第一凸起4之间的间距相等，间距范围为5～7μm。第一凸起4的高度可以相等，也可以不相等。如第一凸起4 之间的间距为6μm。该间距范围设置，能够使第一凸起4很好地对磕碰冲击能量进行吸收，防止磕碰冲击使绝缘层2产生裂纹。
在一些实施例中，沿远离显示区101的方向，多个第一凸起4的总排布宽度范围为50～70μm。该总排布宽度范围设置，能够使第一凸起4很好地对磕碰冲击能量进行吸收，防止磕碰冲击使绝缘层2产生裂纹。
在一些实施例中，如图10所示，凸起还包括设置于封装坝8远离显示区101的绝缘层2背离基底1一侧的多个第二凸起5，且第二凸起5靠近绝缘层2的断面分布，第二凸起5沿远离显示区101的方向依次排布。第二凸起5的设置，能够对冲击能量进行吸收，缓冲冲击的作用力，从而进一步防止绝缘层2在磕碰冲击作用下产生裂纹，确保了显示基板的品质。
其中，对第二凸起5的设置个数，总排布宽度范围以及相邻第二凸起5之间的间距不做限定，第二凸起5的高度可以相等，也可以不等，只要第二凸起5能够对磕碰冲击能量进行吸收，缓冲冲击作用力即可。
在一些实施例中，第一凸起4和第二凸起5均采用有机树脂材料。有机树脂材料具有一定的柔性，能够很好地对磕碰冲击能量进行吸收，缓冲冲击的作用力。
本实施例中显示基板的其他结构与上述实施例中相同，此处不再赘述。
基于显示基板的上述结构，本公开实施例还提供一种该显示基板的制备方法，与上述实施例中的制备方法不同的是，该显示基板的具体制备过程。
该显示基板的具体制备过程为：
步骤S1：依次制备第一子层、第二子层和第三子层。
步骤S2：采用构图工艺制备绝缘层，通过干刻的方法去除绝缘层的对应形成于隔离结构远离封装坝一侧的周边区的部分。
该步骤中，构图工艺包括成膜、光刻胶涂敷、曝光、显影、刻蚀等步骤。
步骤S3：制备第一凸起和第二凸起。
该步骤中，通过膜层涂布、曝光、显影的方法形成第一凸起和第二凸起的图形。
上述公开实施例中所提供的显示基板，
通过在显示基板的封装坝远离显示区的基底上设置隔离结构，在显示基板周边区受到冲击时，隔离结构能吸收冲击的能量，缓冲冲击的作用力，提升显示基板的抗冲击性能，阻止膜层中裂纹的产生并阻断膜层中裂纹的扩展传递路径，防止边缘裂纹传递到显示区，从而防止外界水氧通过裂纹进入显示区和显示基板信赖性不良，进而确保了显示基板的品质。
第二方面，本公开实施例还提供一种显示面板，包括上述任一实施例中的显示基板。
在一些实施例中，显示面板还包括封装层，封装层与显示基板对合，且封装层覆盖显示基板的显示区，所述显示基板中的柔性隔离结构暴露。
通过采用上述任一实施例中的显示基板，改善了显示面板的信赖性不良，确保了显示面板的品质。
本公开实施例所提供的显示面板可以为OLED面板、OLED电视、显示器、手机、导航仪等任何具有显示功能的产品或部件。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (17)

  1. 一种显示基板，其中，包括：
    基底，包括显示区和围绕所述显示区的周边区；
    绝缘层，覆盖所述显示区和至少部分所述周边区；
    至少一个封装坝，位于所述基底的周边区且围绕所述显示区设置；
    隔离结构，位于所述封装坝远离所述显示区的所述基底上，所述隔离结构包括多个间隔设置的子结构，且所述隔离结构在所述基底上的正投影围绕所述显示区设置，所述隔离结构被配置为阻止所述周边区的裂纹扩展至所述显示区。
  2. 根据权利要求1所述的显示基板，其中，所述子结构包括开设在所述基底中的凹槽。
  3. 根据权利要求1所述的显示基板，其中，所述子结构包括设置于所述基底上的凸起。
  4. 根据权利要求2所述的显示基板，其中，所述基底包括依次叠置的第一子层、第二子层和第三子层，所述绝缘层位于所述第三子层上，所述绝缘层包括相互叠置的多个子膜层；
    所述凹槽开设于所述第三子层中，且位于所述第三子层的靠近所述绝缘层的一侧，所述凹槽沿远离所述显示区的方向依次排布。
  5. 根据权利要求4所述的显示基板，其中，所述凹槽的深度小于所述第三子层的厚度。
  6. 根据权利要求4所述的显示基板，其中，在所述凹槽排布区域，所述绝缘层间断设置于所述凹槽内。
  7. 根据权利要求6所述的显示基板，其中，所述隔离结构还包括包覆层，所述包覆层设置于所述基底上，且所述包覆层覆盖所述凹槽排布区域。
  8. 根据权利要求7所述的显示基板，其中，沿远离所述显示区的方向，所述包覆层还包覆位于所述凹槽排布区域至少一侧的所述绝缘层的断面。
  9. 根据权利要求3所述的显示基板，其中，所述绝缘层在所述基底上的正投影覆盖所述封装坝与所述隔离结构之间的所述周边区；
    所述凸起包括多个第一凸起，所述第一凸起沿远离所述显示区的方向依次排布。
  10. 根据权利要求9所述的显示基板，其中，靠近所述绝缘层的一所述第一凸起包覆所述绝缘层的断面。
  11. 根据权利要求9所述的显示基板，其中，任意相邻两个所述第一凸起之间的间距相等，所述间距范围为5～7μm。
  12. 根据权利要求9所述的显示基板，其中，沿远离所述显示区的方向，多个所述第一凸起的总排布宽度范围为50～70μm。
  13. 根据权利要求10所述的显示基板，其中，所述凸起还包括设置于所述封装坝远离所述显示区的所述绝缘层背离所述基底一侧的多个第二凸起，且所述第二凸起靠近所述绝缘层的断面分布，所述第二凸起沿远离所 述显示区的方向依次排布。
  14. 根据权利要求4所述的显示基板，其中，所述第一子层和所述第三子层均采用有机树脂材料，所述第二子层采用无机绝缘材料；各所述子膜层均采用无机绝缘材料。
  15. 根据权利要求1所述的显示基板，其中，所述周边区包括焊盘区，所述焊盘区被配置为设置信号走线和接线绑定端，所述焊盘区位于所述基底的一侧边缘，所述隔离结构位于所述基底的所述焊盘区所在边缘以外的边缘。
  16. 一种显示面板，其中，包括权利要求1-15任意一项所述的显示基板。
  17. 一种显示基板的制备方法，所述显示基板包括基底，所述基底包括显示区和围绕所述显示区的周边区，所述制备方法包括：
    制备基底；
    在所述基底上制备绝缘层；所述绝缘层覆盖所述显示区和至少部分所述周边区；
    制备至少一个封装坝，位于所述基底的周边区且围绕所述显示区设置；
    制备隔离结构；所述隔离结构位于所述封装坝远离所述显示区的所述基底上，制备所述隔离结构包括制备多个间隔设置的子结构，所述隔离结构在所述基底上的正投影围绕所述显示区设置，所述隔离结构被配置为阻止所述周边区的裂纹扩展至所述显示区。
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