JP2007523477A - アレイ状に配置された垂直型カーボン・ナノチューブ電界効果トランジスタを製造する方法、並びに、それによって形成された電界効果トランジスタ及びアレイ - Google Patents
アレイ状に配置された垂直型カーボン・ナノチューブ電界効果トランジスタを製造する方法、並びに、それによって形成された電界効果トランジスタ及びアレイ Download PDFInfo
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Abstract
【解決手段】 本方法は、ゲート電極層と、各々がソース/ドレイン・コンタクトと電気的に結合された触媒パッドとを含む積層構造体を形成することを含む。ゲート電極層は多数のゲート電極に分割され、少なくとも1つの半導体カーボン・ナノチューブが、化学気相堆積プロセスによって触媒パッドの各々の上に合成される。完成したデバイス構造体は、ゲート誘電体によって覆われた側壁を有するゲート電極と、該ゲート電極の該側壁に隣接する少なくとも1つの半導体カーボン・ナノチューブとを含む。ソース/ドレイン・コンタクトを半導体カーボン・ナノチューブの両端と電気的に結合することによって、デバイス構造体が完成する。多数のデバイス構造体は、メモリ回路又は論理回路のいずれかとして構成することができる。
【選択図】 図18
Description
Claims (33)
- 垂直側壁と、前記垂直側壁を覆うゲート誘電体とを含むゲート電極と、
前記ゲート電極の前記垂直側壁に隣接する位置において、対向する第1端部と第2端部との間に垂直に延びる少なくとも1つの半導体カーボン・ナノチューブと、
前記少なくとも1つの半導体カーボン・ナノチューブの前記第1端部と電気的に結合された第1コンタクトと、
前記少なくとも1つの半導体カーボン・ナノチューブの前記第2端部と電気的に結合された第2コンタクトと、
を備える半導体デバイス構造体。 - 前記半導体カーボン・ナノチューブを前記ゲート電極と電気的に結合し、前記半導体カーボン・ナノチューブの合成に関与する触媒パッドをさらに備える、請求項1に記載の半導体デバイス構造体。
- 前記少なくとも1つの半導体カーボン・ナノチューブは、単層半導体カーボン・ナノチューブである、請求項1又は請求項2に記載の半導体デバイス構造体。
- 前記ゲート電極の前記垂直側壁に隣接する位置において垂直に延びる複数の半導体カーボン・ナノチューブをさらに備える、請求項1〜3のいずれか一つの請求項に記載の半導体デバイス構造体。
- 前記第1コンタクトは、前記少なくとも1つの半導体カーボン・ナノチューブを成長させるのに有効な触媒物質であることを特徴とする触媒パッドを含む、請求項1〜4のいずれか一つの請求項に記載の半導体デバイス構造体。
- 前記少なくとも1つの半導体カーボン・ナノチューブの前記第1端部は、製造の際に前記触媒パッドから該第1端部に拡散する電気伝導率増加物質を組み込む、請求項5に記載の半導体デバイス構造体。
- 前記第1コンタクトを前記ゲート電極から電気的に分離するために、前記第1コンタクトと前記ゲート電極との間に配置された絶縁層をさらに備える、請求項1〜6のいずれか一つの請求項に記載の半導体デバイス構造体。
- 前記第2コンタクトを前記ゲート電極から電気的に分離するために、前記第2コンタクトと前記ゲート電極との間に配置された絶縁層をさらに備える、請求項1〜7のいずれか一つの請求項に記載の半導体デバイス構造体。
- 第3コンタクトと、前記ゲート電極を前記第3コンタクトと電気的に結合する少なくとも1つの導電性カーボン・ナノチューブとをさらに備える、請求項1〜8のいずれか一つの請求項に記載の半導体デバイス構造体。
- 前記第2コンタクトは、前記少なくとも1つの半導体カーボン・ナノチューブの前記第2端部と電気的に結合された、垂直に延びる金属ポストを含む、請求項1〜9のいずれか一つの請求項に記載の半導体デバイス構造体。
- 前記第2コンタクトは、前記触媒パッドを前記金属ポストと結合するように、前記ゲート電極の真下に水平に延びる導電層を含む、請求項10に記載の半導体デバイス構造体。
- 前記第2コンタクトは、前記少なくとも1つの半導体カーボン・ナノチューブの前記第2端部と電気的に結合された、少なくとも1つの垂直に延びる導電性カーボン・ナノチューブを含む、請求項1に記載の半導体デバイス構造体。
- 前記第2コンタクトは、前記触媒パッドを前記少なくとも1つの垂直に延びる導電性カーボン・ナノチューブと結合するように、前記ゲート電極の真下に水平に延びる導電層を含む、請求項12に記載の半導体デバイス構造体。
- 複数の行と複数の列を特徴とするアレイ状に配列された請求項1に記載の相互接続された複数の半導体デバイス構造体を備える回路。
- 前記複数の半導体デバイス構造体はメモリ回路として相互接続された、請求項14に記載の回路。
- 複数のワード線であって、その各々が、前記アレイにおける前記複数の行の対応する1つに位置する前記複数の半導体デバイス構造体の各々の前記ゲート電極を電気的に相互接続する、複数のワード線と、
複数のビット線であって、その各々が、前記アレイにおける前記複数の列の対応する1つに位置する前記複数の半導体デバイス構造体の各々の前記第2コンタクトを電気的に相互接続する、複数のビット線と、
をさらに備える、請求項15に記載の回路。 - 前記複数のワード線の各々は、前記複数の半導体デバイス構造体の前記ゲート電極を備える、請求項16に記載の回路。
- 前記複数のビット線の各々は、前記アレイにおける前記複数の行の対応する1つに位置する前記複数の半導体デバイス構造体の各々の前記第1コンタクトを電気的に結合する導電ストライプを備える、請求項16又は請求項17に記載の回路。
- 前記複数の半導体デバイス構造体を支持する基板であって、該基板に垂直な方向に見られる表面積を特徴とする基板をさらに備え、該複数の半導体デバイス構造体は、該表面積の20パーセントから50パーセントまでの範囲の空間によって分離される、請求項14から請求項18のいずれか一つの請求項に記載の回路。
- 前記複数の半導体デバイス構造体は論理回路として相互接続された、請求項14に記載の回路。
- 半導体デバイス構造体のアレイを含む回路を製造するための方法であって、
導電層と、各々が前記導電層と電気的に結合された複数の第1触媒パッドと、ゲート電極層と、前記ゲート電極層を前記複数の第1触媒パッドから分離する絶縁層とを含む積層構造体を形成するステップと、
複数のゲート電極を前記ゲート電極層内に定めるように前記積層構造体を分割して、隣接するゲート電極が反応物質通路によって分離され、かつ、前記複数のゲート電極の対応する1つの垂直側壁に近い位置において前記複数の第1触媒パッドの各々の少なくとも一部が前記反応物質通路に露出した、アレイを定めるステップと、
化学気相堆積プロセスによって前記複数の第1触媒パッドの各々の上に反応物質から少なくとも1つの半導体カーボン・ナノチューブを合成するために、前記反応物質を前記反応物質通路によって前記複数の第1触媒パッドの各々に誘導するステップと、
を含む方法。 - 複数の第2触媒パッドを前記ゲート電極上に形成するステップと、
少なくとも1つの導電性カーボン・ナノチューブを前記複数の第2触媒パッドの各々の上に合成するステップと、
をさらに含む、請求項21に記載の方法。 - 前記複数の第1触媒パッドの各々の活性領域を定めるステップをさらに含む、請求項21又は請求項22に記載の方法。
- 活性領域を定める前記ステップは、
前記複数の第1触媒パッドの各々の第1の部分をマスクで覆うステップと、
前記第1の部分が前記活性領域を定めるように、前記マスクに対して選択的な前記複数の第1触媒パッドの各々の第2の部分をエッチングするステップと、
をさらに含む、請求項23に記載の方法。 - 前記マスクは、エッチング後に前記デバイス構造体から除去される一時的なスペーサである、請求項24に記載の方法。
- 前記複数の第1触媒パッドの対応する1つの上に合成された少なくとも1つの半導体カーボン・ナノチューブの第1端部と各々が電気的に結合された複数の第1コンタクトを形成するステップをさらに含む、請求項21から請求項25までのいずれか一つの請求項に記載の方法。
- 前記アレイは、複数の行と複数の列に配列された半導体デバイス構造体を有し、前記方法は、前記導電層をパターン形成して、前記アレイにおける前記複数の行の各々に位置するすべての半導体デバイス構造体の前記第1コンタクトを各々が電気的に相互接続する複数のビット線を定めるステップをさらに含む、請求項26に記載の方法。
- 前記アレイは、複数の行と複数の列に配列された半導体デバイス構造体を有し、前記複数のゲート電極の各々は、前記アレイにおける前記複数の列の対応する1つに位置する複数の半導体デバイス構造体についてのワード線を定める、請求項27に記載の方法。
- 前記複数の第1触媒パッドの対応する1つの上に合成された前記少なくとも1つの半導体カーボン・ナノチューブの第2端部と各々が電気的に結合された複数の第2コンタクトを形成するステップをさらに含む、請求項26から請求項28までのいずれか一つの請求項に記載の方法。
- 前記複数のゲート電極と、前記複数の第1コンタクトと、前記複数の第2コンタクトとを、論理回路として電気的に相互接続するステップをさらに含む、請求項29に記載の方法。
- 前記複数のゲート電極と、前記複数の第1コンタクトと、前記複数の第2コンタクトとを、メモリ回路として電気的に相互接続するステップをさらに含む、請求項29に記載の方法。
- 前記複数の第1触媒パッドの各々からその上にある前記少なくとも1つの半導体カーボン・ナノチューブの隣接する端部に電気伝導率増加物質を拡散させるステップをさらに含む、請求項21から請求項31までのいずれかの請求項に記載の方法。
- 電気伝導率増加物質を拡散させる前記ステップは、前記反応物質を前記反応物質通路によって前記複数の第1触媒パッドの各々に誘導した後に行われる、請求項32に記載の方法。
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007324600A (ja) * | 2006-06-02 | 2007-12-13 | Qimonda Ag | メモリデバイス、特にトランジスタを有する相変化ランダムアクセスメモリデバイス、およびメモリデバイスの形成方法 |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7374793B2 (en) | 2003-12-11 | 2008-05-20 | International Business Machines Corporation | Methods and structures for promoting stable synthesis of carbon nanotubes |
US7038299B2 (en) | 2003-12-11 | 2006-05-02 | International Business Machines Corporation | Selective synthesis of semiconducting carbon nanotubes |
US20050167655A1 (en) * | 2004-01-29 | 2005-08-04 | International Business Machines Corporation | Vertical nanotube semiconductor device structures and methods of forming the same |
US7211844B2 (en) | 2004-01-29 | 2007-05-01 | International Business Machines Corporation | Vertical field effect transistors incorporating semiconducting nanotubes grown in a spacer-defined passage |
US7109546B2 (en) | 2004-06-29 | 2006-09-19 | International Business Machines Corporation | Horizontal memory gain cells |
US7233071B2 (en) * | 2004-10-04 | 2007-06-19 | International Business Machines Corporation | Low-k dielectric layer based upon carbon nanostructures |
DE102004049453A1 (de) * | 2004-10-11 | 2006-04-20 | Infineon Technologies Ag | Elektrischer Schaltkreis mit einer Nanostruktur und Verfahren zum Herstellen einer Kontaktierung einer Nanostruktur |
TWI324773B (en) | 2005-05-09 | 2010-05-11 | Nantero Inc | Non-volatile shadow latch using a nanotube switch |
US7781862B2 (en) * | 2005-05-09 | 2010-08-24 | Nantero, Inc. | Two-terminal nanotube devices and systems and methods of making same |
US7479654B2 (en) | 2005-05-09 | 2009-01-20 | Nantero, Inc. | Memory arrays using nanotube articles with reprogrammable resistance |
WO2007092770A2 (en) * | 2006-02-02 | 2007-08-16 | William Marsh Rice University | Fabrication de dispositifs electriques par façonnage de nanotubes |
WO2007092835A2 (en) * | 2006-02-07 | 2007-08-16 | William Marsh Rice University | Production de reseaux verticaux de nanotubes de carbone a petit diametre et paroi simple |
US20070183189A1 (en) * | 2006-02-08 | 2007-08-09 | Thomas Nirschl | Memory having nanotube transistor access device |
WO2008051316A2 (en) * | 2006-06-12 | 2008-05-02 | President And Fellows Of Harvard College | Nanosensors and related technologies |
KR100803690B1 (ko) * | 2006-08-10 | 2008-02-20 | 삼성전자주식회사 | 전기적- 기계적 비휘발성 메모리 장치 및 그 제조 방법. |
KR100781972B1 (ko) * | 2006-09-18 | 2007-12-06 | 삼성전자주식회사 | 메모리 소자 및 그의 제조방법 |
WO2009023304A2 (en) * | 2007-05-02 | 2009-02-19 | Atomate Corporation | High density nanotube devices |
KR101478540B1 (ko) * | 2007-09-17 | 2015-01-02 | 삼성전자 주식회사 | 트랜지스터의 채널로 나노 물질을 이용하는 바이오 센서 및그 제조 방법 |
US7892956B2 (en) * | 2007-09-24 | 2011-02-22 | International Business Machines Corporation | Methods of manufacture of vertical nanowire FET devices |
WO2009064842A1 (en) * | 2007-11-13 | 2009-05-22 | William Marsh Rice Unvirsity | Vertically-stacked electronic devices having conductive carbon films |
JP5256850B2 (ja) * | 2008-05-29 | 2013-08-07 | ミツミ電機株式会社 | 電界効果トランジスタ及びその製造方法 |
US8350360B1 (en) | 2009-08-28 | 2013-01-08 | Lockheed Martin Corporation | Four-terminal carbon nanotube capacitors |
US8405189B1 (en) * | 2010-02-08 | 2013-03-26 | Lockheed Martin Corporation | Carbon nanotube (CNT) capacitors and devices integrated with CNT capacitors |
EP2363958A1 (en) * | 2010-03-04 | 2011-09-07 | Thomson Licensing | Field programmable gate array |
US8455365B2 (en) * | 2011-05-19 | 2013-06-04 | Dechao Guo | Self-aligned carbon electronics with embedded gate electrode |
US8772782B2 (en) | 2011-11-23 | 2014-07-08 | International Business Machines Corporation | Transistor employing vertically stacked self-aligned carbon nanotubes |
CN104576321A (zh) * | 2015-01-30 | 2015-04-29 | 京东方科技集团股份有限公司 | 一种电极结构、其制作方法、显示基板及显示装置 |
CN107572504B (zh) * | 2016-07-05 | 2020-07-10 | 中国科学院金属研究所 | 一种柔性薄层碳覆盖碳纳米管垂直阵列的制备方法 |
CN206067049U (zh) | 2016-07-29 | 2017-04-05 | 合肥鑫晟光电科技有限公司 | 膜材以及撕膜装置 |
US11417729B2 (en) * | 2019-08-29 | 2022-08-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Transistors with channels formed of low-dimensional materials and method forming same |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07321228A (ja) * | 1994-05-26 | 1995-12-08 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JP2002110977A (ja) * | 2000-06-27 | 2002-04-12 | Samsung Electronics Co Ltd | 炭素ナノチューブを用いたナノサイズ垂直トランジスタ及びその製造方法 |
JP2003086796A (ja) * | 2001-09-11 | 2003-03-20 | Fujitsu Ltd | 円筒状多層構造体による半導体装置 |
US20030132461A1 (en) * | 2000-07-28 | 2003-07-17 | Wolfgang Roesner | Field-effect transistor, circuit configuration and method of fabricating a field-effect transistor |
JP2004040080A (ja) * | 2002-07-02 | 2004-02-05 | Ind Technol Res Inst | 垂直型ナノチューブトランジスタおよびその製造方法 |
JP2004165297A (ja) * | 2002-11-11 | 2004-06-10 | Fujitsu Ltd | 半導体装置 |
JP2005159332A (ja) * | 2003-10-28 | 2005-06-16 | Semiconductor Energy Lab Co Ltd | 半導体装置、及びその作製方法 |
JP2006504278A (ja) * | 2002-10-31 | 2006-02-02 | インフィネオン テクノロジーズ アクチエンゲゼルシャフト | 不揮発性メモリーセル、メモリーセルアレイおよび不揮発性メモリーセルの製造方法 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5514879A (en) * | 1990-11-20 | 1996-05-07 | Semiconductor Energy Laboratory Co., Ltd. | Gate insulated field effect transistors and method of manufacturing the same |
US5796573A (en) | 1997-05-29 | 1998-08-18 | International Business Machines Corporation | Overhanging separator for self-defining stacked capacitor |
US6250984B1 (en) | 1999-01-25 | 2001-06-26 | Agere Systems Guardian Corp. | Article comprising enhanced nanotube emitter structure and process for fabricating article |
JP3730476B2 (ja) * | 2000-03-31 | 2006-01-05 | 株式会社東芝 | 電界放出型冷陰極及びその製造方法 |
SE520109C2 (sv) * | 2000-05-17 | 2003-05-27 | Ericsson Telefon Ab L M | Effekttransistorer för radiofrekvenser |
EP1662575B1 (en) | 2000-11-01 | 2007-10-17 | Japan Science and Technology Agency | A NOT circuit |
US6423583B1 (en) | 2001-01-03 | 2002-07-23 | International Business Machines Corporation | Methodology for electrically induced selective breakdown of nanotubes |
US6440763B1 (en) * | 2001-03-22 | 2002-08-27 | The United States Of America As Represented By The Secretary Of The Navy | Methods for manufacture of self-aligned integrally gated nanofilament field emitter cell and array |
US7084507B2 (en) | 2001-05-02 | 2006-08-01 | Fujitsu Limited | Integrated circuit device and method of producing the same |
US6525453B2 (en) * | 2001-05-02 | 2003-02-25 | Huang Chung Cheng | Field emitting display |
WO2003063208A2 (en) | 2002-01-18 | 2003-07-31 | California Institute Of Technology | Array-based architecture for molecular electronics |
JP5165828B2 (ja) | 2002-02-09 | 2013-03-21 | 三星電子株式会社 | 炭素ナノチューブを用いるメモリ素子及びその製造方法 |
EP1341183B1 (en) * | 2002-02-25 | 2008-12-03 | STMicroelectronics S.r.l. | Optically readable molecular memory obtained using carbon nanotubes, and method for storing information in said molecular memory |
US6515325B1 (en) | 2002-03-06 | 2003-02-04 | Micron Technology, Inc. | Nanotube semiconductor devices and methods for making the same |
US6891227B2 (en) | 2002-03-20 | 2005-05-10 | International Business Machines Corporation | Self-aligned nanotube field effect transistor and method of fabricating same |
US20030211724A1 (en) * | 2002-05-10 | 2003-11-13 | Texas Instruments Incorporated | Providing electrical conductivity between an active region and a conductive layer in a semiconductor device using carbon nanotubes |
JP4416376B2 (ja) * | 2002-05-13 | 2010-02-17 | 富士通株式会社 | 半導体装置及びその製造方法 |
US6979947B2 (en) | 2002-07-09 | 2005-12-27 | Si Diamond Technology, Inc. | Nanotriode utilizing carbon nanotubes and fibers |
CN1472814A (zh) * | 2002-08-01 | 2004-02-04 | 中国科学院物理研究所 | 基于碳纳米管单电子晶体管设计的单电子存储器及制法 |
DE10250984A1 (de) | 2002-10-29 | 2004-05-19 | Hahn-Meitner-Institut Berlin Gmbh | Feldeffekttransistor sowie Verfahren zu seiner Herstellung |
DE10250830B4 (de) | 2002-10-31 | 2015-02-26 | Qimonda Ag | Verfahren zum Herstellung eines Schaltkreis-Arrays |
KR100790859B1 (ko) | 2002-11-15 | 2008-01-03 | 삼성전자주식회사 | 수직 나노튜브를 이용한 비휘발성 메모리 소자 |
KR100493166B1 (ko) | 2002-12-30 | 2005-06-02 | 삼성전자주식회사 | 수직나노튜브를 이용한 메모리 |
US6933222B2 (en) | 2003-01-02 | 2005-08-23 | Intel Corporation | Microcircuit fabrication and interconnection |
WO2004105140A1 (ja) | 2003-05-22 | 2004-12-02 | Fujitsu Limited | 電界効果トランジスタ及びその製造方法 |
US7374793B2 (en) | 2003-12-11 | 2008-05-20 | International Business Machines Corporation | Methods and structures for promoting stable synthesis of carbon nanotubes |
US7038299B2 (en) | 2003-12-11 | 2006-05-02 | International Business Machines Corporation | Selective synthesis of semiconducting carbon nanotubes |
US20050167655A1 (en) | 2004-01-29 | 2005-08-04 | International Business Machines Corporation | Vertical nanotube semiconductor device structures and methods of forming the same |
US7211844B2 (en) | 2004-01-29 | 2007-05-01 | International Business Machines Corporation | Vertical field effect transistors incorporating semiconducting nanotubes grown in a spacer-defined passage |
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Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07321228A (ja) * | 1994-05-26 | 1995-12-08 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JP2002110977A (ja) * | 2000-06-27 | 2002-04-12 | Samsung Electronics Co Ltd | 炭素ナノチューブを用いたナノサイズ垂直トランジスタ及びその製造方法 |
US20030132461A1 (en) * | 2000-07-28 | 2003-07-17 | Wolfgang Roesner | Field-effect transistor, circuit configuration and method of fabricating a field-effect transistor |
JP2003086796A (ja) * | 2001-09-11 | 2003-03-20 | Fujitsu Ltd | 円筒状多層構造体による半導体装置 |
JP2004040080A (ja) * | 2002-07-02 | 2004-02-05 | Ind Technol Res Inst | 垂直型ナノチューブトランジスタおよびその製造方法 |
JP2006504278A (ja) * | 2002-10-31 | 2006-02-02 | インフィネオン テクノロジーズ アクチエンゲゼルシャフト | 不揮発性メモリーセル、メモリーセルアレイおよび不揮発性メモリーセルの製造方法 |
JP2004165297A (ja) * | 2002-11-11 | 2004-06-10 | Fujitsu Ltd | 半導体装置 |
JP2005159332A (ja) * | 2003-10-28 | 2005-06-16 | Semiconductor Energy Lab Co Ltd | 半導体装置、及びその作製方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007324600A (ja) * | 2006-06-02 | 2007-12-13 | Qimonda Ag | メモリデバイス、特にトランジスタを有する相変化ランダムアクセスメモリデバイス、およびメモリデバイスの形成方法 |
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TW200535896A (en) | 2005-11-01 |
EP1714330B1 (en) | 2011-04-06 |
ATE504946T1 (de) | 2011-04-15 |
KR100992296B1 (ko) | 2010-11-08 |
US20050179029A1 (en) | 2005-08-18 |
US7820502B2 (en) | 2010-10-26 |
KR20060130154A (ko) | 2006-12-18 |
JP5089174B2 (ja) | 2012-12-05 |
US20080044954A1 (en) | 2008-02-21 |
CN1943055A (zh) | 2007-04-04 |
DE602005027316D1 (de) | 2011-05-19 |
TWI344662B (en) | 2011-07-01 |
WO2005078819A1 (en) | 2005-08-25 |
EP1714330A1 (en) | 2006-10-25 |
US7829883B2 (en) | 2010-11-09 |
CN1943055B (zh) | 2011-02-23 |
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