JP2007519247A - 集積回路の出力個数の最適化 - Google Patents
集積回路の出力個数の最適化 Download PDFInfo
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- JP2007519247A JP2007519247A JP2006550021A JP2006550021A JP2007519247A JP 2007519247 A JP2007519247 A JP 2007519247A JP 2006550021 A JP2006550021 A JP 2006550021A JP 2006550021 A JP2006550021 A JP 2006550021A JP 2007519247 A JP2007519247 A JP 2007519247A
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- 238000000034 method Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 5
- 238000009434 installation Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/118—Masterslice integrated circuits
- H01L27/11898—Input and output buffer/driver structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Structure Of Printed Boards (AREA)
- Semiconductor Integrated Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
図2は、本発明による広範囲の用途に対する出力個数の最適な分割を図解するため、第1のタイプの集積回路と第2のタイプの集積回路の組合せを概略的に示したものである。
Claims (9)
- 必要とされる出力の個数が用途に依存しているプリント回路基板(2)上に取り付けられた特定用途向け集積回路タイプの電子制御装置(1)の出力の個数を最適化する方法において、
第1の個数の出力を有する第1のタイプの集積回路と第2の個数の出力を有する第2のタイプの集積回路の前記プリント回路基板(2)への取付けが両立するように、幾何学的に同一の接続構成を有する2つのパッケージ(4,5)の中に前記2つの回路をそれぞれ取り付け、前記2つのパッケージ(4,5)の取付けのために前記基板上に少なくとも2つの位置が設けられるようにし、
第1のタイプの集積回路と第2のタイプの集積回路とから選んだ少なくとも2つの回路を前記位置に取り付けることにより、用途に必要な出力の個数が得られるようにする、ことを特徴とする特定用途向け集積回路タイプの電子制御装置(1)の出力の個数を最適化する方法。 - 第1のタイプの集積回路と第2のタイプの集積回路は出力の個数が2個だけ異なるように設計されている、請求項1記載の方法。
- 第1のタイプの集積回路と第2のタイプの集積回路をPQFNタイプのパッケージの中にカプセル化する、請求項1又は2記載の方法。
- 第1のタイプの集積回路と第2のタイプの集積回路をQFNタイプのパッケージの中にカプセル化する、請求項1から3のいずれか1項記載の方法。
- プリント回路基板(2)上に取り付けられた特定用途向け集積回路タイプの電子制御装置(1)であって、目標とする用途に依存する個数の出力を備えた段(3)を有している形式の電子制御装置において、
前記出力段は少なくとも2つの回路を有しており、該回路上には必要な個数の出力が分配されており、
前記2つの回路は、第1の個数の出力を有する第1のタイプの集積回路と第2の個数の出力を有する第2のタイプの集積回路とから選ばれたものであり、
前記第1のタイプ及び第2のタイプの集積回路は、これら2つの集積回路の前記プリント回路基板への取付けが両立するように、幾何学的に同一の接続構成を有する2つのパッケージ(4,5)の中にそれぞれ取り付けられている、ことを特徴とする特定用途向け集積回路タイプの電子制御装置(1)。 - 第1のタイプの集積回路は6個の出力を有している、請求項5記載の装置。
- 第2のタイプの集積回路は8個の出力を有している、請求項5又は6記載の装置。
- 第1のタイプの集積回路は1つの8アンプ出力と3つの3アンプ出力と2つの1アンプ出力を有している、請求5から7のいずれか1項記載の装置。
- 第2のタイプの集積回路は1つの8アンプ出力と4つの3アンプ出力と3つの1アンプ出力を有している、請求項5から8のいずれか1項記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0400525A FR2865316B1 (fr) | 2004-01-21 | 2004-01-21 | Optimisation du nombre de sorties de puissance d'un circuit integre |
PCT/EP2005/000481 WO2005081314A2 (fr) | 2004-01-21 | 2005-01-19 | Optimisation du nombre de sorties de puissance d’un circuit integre |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007519247A true JP2007519247A (ja) | 2007-07-12 |
Family
ID=34707965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006550021A Ceased JP2007519247A (ja) | 2004-01-21 | 2005-01-19 | 集積回路の出力個数の最適化 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7394662B2 (ja) |
JP (1) | JP2007519247A (ja) |
KR (1) | KR20060132695A (ja) |
FR (1) | FR2865316B1 (ja) |
WO (1) | WO2005081314A2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8823411B2 (en) * | 2010-02-08 | 2014-09-02 | Freescale Semiconductor, Inc. | Fatal failure diagnostics circuit and methodology |
CN111918486A (zh) * | 2020-09-21 | 2020-11-10 | 惠州市捷玛科技有限公司 | 一种合拼样板及生产方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003324344A (ja) * | 2002-02-11 | 2003-11-14 | Lattice Semiconductor Corp | プログラマブルロジック装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1665071B1 (de) * | 1966-09-06 | 1971-01-07 | Masing & Co Kg Dr | Anordnung zum wahlweisen Aufbau verschiedener Schaltungsanordnungen aus steckbaren Baueinheiten |
US7819739B2 (en) * | 1994-06-22 | 2010-10-26 | Scientific Game International, Inc. | Game apparatus |
JP2000222283A (ja) * | 1999-02-02 | 2000-08-11 | Fujitsu Ltd | 配線基板及び配線基板を備えた電子機器 |
DE19951916C1 (de) * | 1999-10-28 | 2001-01-25 | Brose Fahrzeugteile | Elektronische Steuerungseinrichtung zur Ansteuerung elektrischer Aggregate von Kraftfahrzeugtüren mit unterschiedlicher Ausstattung |
US20030005862A1 (en) | 2001-05-23 | 2003-01-09 | Halavais Richard Arthur | Modular ecological shipping pallet |
US6778405B2 (en) * | 2001-09-25 | 2004-08-17 | Innoveta Technologies | Power module adapter |
US7305020B2 (en) * | 2002-02-04 | 2007-12-04 | Vizionware, Inc. | Method and system of reducing electromagnetic interference emissions |
-
2004
- 2004-01-21 FR FR0400525A patent/FR2865316B1/fr not_active Expired - Fee Related
-
2005
- 2005-01-19 KR KR1020067016352A patent/KR20060132695A/ko not_active Application Discontinuation
- 2005-01-19 JP JP2006550021A patent/JP2007519247A/ja not_active Ceased
- 2005-01-19 WO PCT/EP2005/000481 patent/WO2005081314A2/fr active Application Filing
- 2005-01-19 US US10/586,484 patent/US7394662B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003324344A (ja) * | 2002-02-11 | 2003-11-14 | Lattice Semiconductor Corp | プログラマブルロジック装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20060132695A (ko) | 2006-12-21 |
WO2005081314A3 (fr) | 2005-12-22 |
FR2865316A1 (fr) | 2005-07-22 |
WO2005081314A2 (fr) | 2005-09-01 |
FR2865316B1 (fr) | 2006-07-21 |
US7394662B2 (en) | 2008-07-01 |
US20070165364A1 (en) | 2007-07-19 |
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