WO2005081314A3 - Optimisation du nombre de sorties de puissance d’un circuit integre - Google Patents

Optimisation du nombre de sorties de puissance d’un circuit integre Download PDF

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Publication number
WO2005081314A3
WO2005081314A3 PCT/EP2005/000481 EP2005000481W WO2005081314A3 WO 2005081314 A3 WO2005081314 A3 WO 2005081314A3 EP 2005000481 W EP2005000481 W EP 2005000481W WO 2005081314 A3 WO2005081314 A3 WO 2005081314A3
Authority
WO
WIPO (PCT)
Prior art keywords
power outputs
integrated circuit
type
optimisation
circuit
Prior art date
Application number
PCT/EP2005/000481
Other languages
English (en)
Other versions
WO2005081314A2 (fr
Inventor
Philippe Avian
Original Assignee
Siemens Vdo Automotive
Philippe Avian
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Vdo Automotive, Philippe Avian filed Critical Siemens Vdo Automotive
Priority to US10/586,484 priority Critical patent/US7394662B2/en
Priority to JP2006550021A priority patent/JP2007519247A/ja
Publication of WO2005081314A2 publication Critical patent/WO2005081314A2/fr
Publication of WO2005081314A3 publication Critical patent/WO2005081314A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H01L27/11898—Input and output buffer/driver structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Structure Of Printed Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un procédé d'optimisation du nombre de sorties de puissance d'un dispositif de commande électronique du type circuit intégré à application spécifique (1) monté sur une carte de circuit imprimé (2), le nombre de sorties de puissance dépendant de l'application, caractérisé en ce qu'il consiste à monter dans deux boîtiers (4, 5) présentant des connectiques géométriquement identiques, respectivement un circuit intégré d'un premier type comprenant un premier nombre de sorties de puissance et un circuit intégré d'un second type comprenant un second nombre de sorties de puissance, de sorte à rendre lesdits deux circuits compatibles pour leur implantation sur la carte (2), et à prévoir au moins deux emplacements sur la carte pour l'implantation desdits boîtiers (4, 5), le nombre de sorties nécessaires à l'application étant obtenu en implantant audits emplacements au moins deux circuits choisis parmi ledit circuit du premier type et ledit circuit du second type.
PCT/EP2005/000481 2004-01-21 2005-01-19 Optimisation du nombre de sorties de puissance d’un circuit integre WO2005081314A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/586,484 US7394662B2 (en) 2004-01-21 2005-01-19 Optimization of the number of power outputs for an integrated circuit
JP2006550021A JP2007519247A (ja) 2004-01-21 2005-01-19 集積回路の出力個数の最適化

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0400525 2004-01-21
FR0400525A FR2865316B1 (fr) 2004-01-21 2004-01-21 Optimisation du nombre de sorties de puissance d'un circuit integre

Publications (2)

Publication Number Publication Date
WO2005081314A2 WO2005081314A2 (fr) 2005-09-01
WO2005081314A3 true WO2005081314A3 (fr) 2005-12-22

Family

ID=34707965

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/000481 WO2005081314A2 (fr) 2004-01-21 2005-01-19 Optimisation du nombre de sorties de puissance d’un circuit integre

Country Status (5)

Country Link
US (1) US7394662B2 (fr)
JP (1) JP2007519247A (fr)
KR (1) KR20060132695A (fr)
FR (1) FR2865316B1 (fr)
WO (1) WO2005081314A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8823411B2 (en) * 2010-02-08 2014-09-02 Freescale Semiconductor, Inc. Fatal failure diagnostics circuit and methodology
CN111918486A (zh) * 2020-09-21 2020-11-10 惠州市捷玛科技有限公司 一种合拼样板及生产方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1665071B1 (de) * 1966-09-06 1971-01-07 Masing & Co Kg Dr Anordnung zum wahlweisen Aufbau verschiedener Schaltungsanordnungen aus steckbaren Baueinheiten
DE19951916C1 (de) * 1999-10-28 2001-01-25 Brose Fahrzeugteile Elektronische Steuerungseinrichtung zur Ansteuerung elektrischer Aggregate von Kraftfahrzeugtüren mit unterschiedlicher Ausstattung
US6501633B1 (en) * 1999-02-02 2002-12-31 Fujitsu Limited Wiring board and electronic device having circuit board
US20030058628A1 (en) * 2001-09-25 2003-03-27 Jeffrey Boylan Power module adapter

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7819739B2 (en) * 1994-06-22 2010-10-26 Scientific Game International, Inc. Game apparatus
US20030005862A1 (en) 2001-05-23 2003-01-09 Halavais Richard Arthur Modular ecological shipping pallet
US7305020B2 (en) * 2002-02-04 2007-12-04 Vizionware, Inc. Method and system of reducing electromagnetic interference emissions
US6765408B2 (en) * 2002-02-11 2004-07-20 Lattice Semiconductor Corporation Device and method with generic logic blocks

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1665071B1 (de) * 1966-09-06 1971-01-07 Masing & Co Kg Dr Anordnung zum wahlweisen Aufbau verschiedener Schaltungsanordnungen aus steckbaren Baueinheiten
US6501633B1 (en) * 1999-02-02 2002-12-31 Fujitsu Limited Wiring board and electronic device having circuit board
DE19951916C1 (de) * 1999-10-28 2001-01-25 Brose Fahrzeugteile Elektronische Steuerungseinrichtung zur Ansteuerung elektrischer Aggregate von Kraftfahrzeugtüren mit unterschiedlicher Ausstattung
US20030058628A1 (en) * 2001-09-25 2003-03-27 Jeffrey Boylan Power module adapter

Also Published As

Publication number Publication date
US20070165364A1 (en) 2007-07-19
FR2865316B1 (fr) 2006-07-21
FR2865316A1 (fr) 2005-07-22
WO2005081314A2 (fr) 2005-09-01
JP2007519247A (ja) 2007-07-12
KR20060132695A (ko) 2006-12-21
US7394662B2 (en) 2008-07-01

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