JP2007515781A - 広範囲温度チャック装置 - Google Patents

広範囲温度チャック装置 Download PDF

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Publication number
JP2007515781A
JP2007515781A JP2006532812A JP2006532812A JP2007515781A JP 2007515781 A JP2007515781 A JP 2007515781A JP 2006532812 A JP2006532812 A JP 2006532812A JP 2006532812 A JP2006532812 A JP 2006532812A JP 2007515781 A JP2007515781 A JP 2007515781A
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JP
Japan
Prior art keywords
chuck
temperature
workpiece
heat transfer
hot
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Pending
Application number
JP2006532812A
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English (en)
Japanese (ja)
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JP2007515781A5 (https=
Inventor
アルバート ワング，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axcelis Technologies Inc
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Axcelis Technologies Inc
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Filing date
Publication date
Application filed by Axcelis Technologies Inc filed Critical Axcelis Technologies Inc
Publication of JP2007515781A publication Critical patent/JP2007515781A/ja
Publication of JP2007515781A5 publication Critical patent/JP2007515781A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
JP2006532812A 2003-05-07 2004-05-06 広範囲温度チャック装置 Pending JP2007515781A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46905003P 2003-05-07 2003-05-07
PCT/US2004/014093 WO2004102640A1 (en) 2003-05-07 2004-05-06 Wide temperature range chuck system

Publications (2)

Publication Number Publication Date
JP2007515781A true JP2007515781A (ja) 2007-06-14
JP2007515781A5 JP2007515781A5 (https=) 2007-07-26

Family

ID=33452253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006532812A Pending JP2007515781A (ja) 2003-05-07 2004-05-06 広範囲温度チャック装置

Country Status (8)

Country Link
US (1) US20050008983A1 (https=)
EP (1) EP1623452B1 (https=)
JP (1) JP2007515781A (https=)
KR (1) KR20060038925A (https=)
CN (1) CN100444308C (https=)
DE (1) DE602004003365T2 (https=)
TW (1) TW200428468A (https=)
WO (1) WO2004102640A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010040947A (ja) * 2008-08-07 2010-02-18 Sinfonia Technology Co Ltd 真空処理装置
JP2010251748A (ja) * 2009-04-13 2010-11-04 Asml Netherlands Bv 冷却デバイス、冷却配置、および冷却配置を含むリソグラフィ装置
JP2013513946A (ja) * 2009-12-11 2013-04-22 ノベルス・システムズ・インコーポレーテッド シリコン損失を非常に低く抑えた高ドーズインプラントストリップ
US9514954B2 (en) 2014-06-10 2016-12-06 Lam Research Corporation Peroxide-vapor treatment for enhancing photoresist-strip performance and modifying organic films
US9613825B2 (en) 2011-08-26 2017-04-04 Novellus Systems, Inc. Photoresist strip processes for improved device integrity
US9941108B2 (en) 2004-12-13 2018-04-10 Novellus Systems, Inc. High dose implantation strip (HDIS) in H2 base chemistry

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100459788B1 (ko) * 2002-01-14 2004-12-04 주성엔지니어링(주) 2단 웨이퍼 리프트 핀
JP5040913B2 (ja) * 2006-03-31 2012-10-03 富士通セミコンダクター株式会社 半導体装置の製造方法
US20080121821A1 (en) * 2006-11-27 2008-05-29 Varian Semiconductor Equipment Associates Inc. Techniques for low-temperature ion implantation
US7528391B2 (en) 2006-12-22 2009-05-05 Varian Semiconductor Equipment Associates, Inc. Techniques for reducing contamination during ion implantation
JP2008235315A (ja) * 2007-03-16 2008-10-02 Tokyo Electron Ltd 基板処理装置、基板処理方法および記録媒体
JP4949091B2 (ja) * 2007-03-16 2012-06-06 東京エレクトロン株式会社 基板処理装置、基板処理方法および記録媒体
NL2004242A (en) 2009-04-13 2010-10-14 Asml Netherlands Bv Detector module, cooling arrangement and lithographic apparatus comprising a detector module.
JP5570938B2 (ja) * 2009-12-11 2014-08-13 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
FR2960816B1 (fr) * 2010-06-02 2012-07-13 Sidel Participations Four pour le conditionnement thermique de preformes et procede de commande d'un dispositif de refroidissement par air equipant un tel four
CN103426793B (zh) * 2012-05-24 2016-02-03 沈阳芯源微电子设备有限公司 基板冷热处理装置
US12255123B2 (en) 2015-09-30 2025-03-18 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for semiconductor devices, and methods for using and making such arrays, plates, and systems
JP6614933B2 (ja) * 2015-11-11 2019-12-04 東京エレクトロン株式会社 基板載置機構および基板処理装置
CN108698898A (zh) * 2016-01-28 2018-10-23 康宁股份有限公司 采用流体传导对玻璃进行热强化的工艺
JP6997108B2 (ja) * 2016-06-02 2022-01-17 アクセリス テクノロジーズ， インコーポレイテッド ウェハ冷却方法
US12420314B2 (en) 2019-10-18 2025-09-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor cleaning apparatus and method
CN110911320B (zh) * 2019-12-09 2023-08-18 北京北方华创微电子装备有限公司 冷却装置及其控制方法、半导体加工设备
US10866036B1 (en) 2020-05-18 2020-12-15 Envertic Thermal Systems, Llc Thermal switch

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0997830A (ja) * 1995-07-21 1997-04-08 Fuji Electric Co Ltd 静電チャックホールダ、ウエハ保持機構ならびにその使用方法
JPH10294275A (ja) * 1997-04-17 1998-11-04 Dainippon Screen Mfg Co Ltd 熱処理装置および熱処理方法
JP2987085B2 (ja) * 1995-06-28 1999-12-06 日本碍子株式会社 半導体ウエハー保持装置、その製造方法およびその使用方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
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US3602687A (en) * 1969-06-23 1971-08-31 Battelle Development Corp Arc length control
US4609037A (en) * 1985-10-09 1986-09-02 Tencor Instruments Apparatus for heating and cooling articles
US6111225A (en) * 1996-02-23 2000-08-29 Tokyo Electron Limited Wafer processing apparatus with a processing vessel, upper and lower separately sealed heating vessels, and means for maintaining the vessels at predetermined pressures
DE69842191D1 (de) * 1997-11-05 2011-05-05 Tokyo Electron Ltd Halbleiterscheibenhaltevorrichtung
US6072163A (en) * 1998-03-05 2000-06-06 Fsi International Inc. Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate
US6203657B1 (en) * 1998-03-31 2001-03-20 Lam Research Corporation Inductively coupled plasma downstream strip module
AU5448200A (en) * 1999-05-27 2000-12-18 Matrix Integrated Systems, Inc. Rapid heating and cooling of workpiece chucks
JP2001139379A (ja) * 1999-11-09 2001-05-22 Toshiba Ceramics Co Ltd 高熱伝導性窒化アルミニウム焼結体の製造方法
US6409932B2 (en) * 2000-04-03 2002-06-25 Matrix Integrated Systems, Inc. Method and apparatus for increased workpiece throughput
US6495802B1 (en) * 2001-05-31 2002-12-17 Motorola, Inc. Temperature-controlled chuck and method for controlling the temperature of a substantially flat object
US6506291B2 (en) * 2001-06-14 2003-01-14 Applied Materials, Inc. Substrate support with multilevel heat transfer mechanism
US6490145B1 (en) * 2001-07-18 2002-12-03 Applied Materials, Inc. Substrate support pedestal
US6771086B2 (en) * 2002-02-19 2004-08-03 Lucas/Signatone Corporation Semiconductor wafer electrical testing with a mobile chiller plate for rapid and precise test temperature control

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2987085B2 (ja) * 1995-06-28 1999-12-06 日本碍子株式会社 半導体ウエハー保持装置、その製造方法およびその使用方法
JPH0997830A (ja) * 1995-07-21 1997-04-08 Fuji Electric Co Ltd 静電チャックホールダ、ウエハ保持機構ならびにその使用方法
JPH10294275A (ja) * 1997-04-17 1998-11-04 Dainippon Screen Mfg Co Ltd 熱処理装置および熱処理方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9941108B2 (en) 2004-12-13 2018-04-10 Novellus Systems, Inc. High dose implantation strip (HDIS) in H2 base chemistry
JP2010040947A (ja) * 2008-08-07 2010-02-18 Sinfonia Technology Co Ltd 真空処理装置
JP2010251748A (ja) * 2009-04-13 2010-11-04 Asml Netherlands Bv 冷却デバイス、冷却配置、および冷却配置を含むリソグラフィ装置
JP2013513946A (ja) * 2009-12-11 2013-04-22 ノベルス・システムズ・インコーポレーテッド シリコン損失を非常に低く抑えた高ドーズインプラントストリップ
US9613825B2 (en) 2011-08-26 2017-04-04 Novellus Systems, Inc. Photoresist strip processes for improved device integrity
US9514954B2 (en) 2014-06-10 2016-12-06 Lam Research Corporation Peroxide-vapor treatment for enhancing photoresist-strip performance and modifying organic films

Also Published As

Publication number Publication date
US20050008983A1 (en) 2005-01-13
KR20060038925A (ko) 2006-05-04
CN100444308C (zh) 2008-12-17
DE602004003365T2 (de) 2007-09-13
DE602004003365D1 (de) 2007-01-04
CN1784765A (zh) 2006-06-07
EP1623452A1 (en) 2006-02-08
WO2004102640A1 (en) 2004-11-25
EP1623452B1 (en) 2006-11-22
TW200428468A (en) 2004-12-16

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