JP2007507870A - ガスレーザー装置の動作方法 - Google Patents

ガスレーザー装置の動作方法 Download PDF

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Publication number
JP2007507870A
JP2007507870A JP2006530165A JP2006530165A JP2007507870A JP 2007507870 A JP2007507870 A JP 2007507870A JP 2006530165 A JP2006530165 A JP 2006530165A JP 2006530165 A JP2006530165 A JP 2006530165A JP 2007507870 A JP2007507870 A JP 2007507870A
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JP
Japan
Prior art keywords
pulse
laser
resonator
during
phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006530165A
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English (en)
Japanese (ja)
Inventor
キルタウ アレクサンダー
ユルゲン マイヤー ハンス
ミツィネック ペトラ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of JP2007507870A publication Critical patent/JP2007507870A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
JP2006530165A 2003-09-30 2004-04-16 ガスレーザー装置の動作方法 Pending JP2007507870A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10345543 2003-09-30
PCT/EP2004/050555 WO2005032758A1 (de) 2003-09-30 2004-04-16 Verfahren zum betrieb eines gaslasersystems

Publications (1)

Publication Number Publication Date
JP2007507870A true JP2007507870A (ja) 2007-03-29

Family

ID=34399125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006530165A Pending JP2007507870A (ja) 2003-09-30 2004-04-16 ガスレーザー装置の動作方法

Country Status (4)

Country Link
JP (1) JP2007507870A (ko)
KR (1) KR20060060672A (ko)
CN (1) CN1845811A (ko)
WO (1) WO2005032758A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021182515A1 (ja) * 2020-03-11 2021-09-16 パナソニック株式会社 切断装置および切断方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2114614A1 (en) * 2007-01-05 2009-11-11 GSI Group Corporation System and method for multi-pulse laser processing
JP5396357B2 (ja) 2010-09-14 2014-01-22 株式会社アマダ レーザ加工装置及びその制御方法
JP6362130B2 (ja) * 2013-04-26 2018-07-25 ビアメカニクス株式会社 レーザ加工方法及びレーザ加工装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6784399B2 (en) * 2001-05-09 2004-08-31 Electro Scientific Industries, Inc. Micromachining with high-energy, intra-cavity Q-switched CO2 laser pulses
DE10145184B4 (de) * 2001-09-13 2005-03-10 Siemens Ag Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021182515A1 (ja) * 2020-03-11 2021-09-16 パナソニック株式会社 切断装置および切断方法
JP2021144824A (ja) * 2020-03-11 2021-09-24 パナソニック株式会社 切断装置および切断方法
JP7153682B2 (ja) 2020-03-11 2022-10-14 パナソニックホールディングス株式会社 切断装置および切断方法

Also Published As

Publication number Publication date
CN1845811A (zh) 2006-10-11
KR20060060672A (ko) 2006-06-05
WO2005032758A1 (de) 2005-04-14

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