CN1845811A - 用于操作气体激光器系统的方法 - Google Patents
用于操作气体激光器系统的方法 Download PDFInfo
- Publication number
- CN1845811A CN1845811A CNA2004800246788A CN200480024678A CN1845811A CN 1845811 A CN1845811 A CN 1845811A CN A2004800246788 A CNA2004800246788 A CN A2004800246788A CN 200480024678 A CN200480024678 A CN 200480024678A CN 1845811 A CN1845811 A CN 1845811A
- Authority
- CN
- China
- Prior art keywords
- pulse
- laser
- high frequency
- resonator
- interval
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Lasers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10345543.4 | 2003-09-30 | ||
DE10345543 | 2003-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1845811A true CN1845811A (zh) | 2006-10-11 |
Family
ID=34399125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2004800246788A Pending CN1845811A (zh) | 2003-09-30 | 2004-04-16 | 用于操作气体激光器系统的方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2007507870A (ko) |
KR (1) | KR20060060672A (ko) |
CN (1) | CN1845811A (ko) |
WO (1) | WO2005032758A1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101578155B (zh) * | 2007-01-05 | 2013-05-01 | 杰斯集团公司 | 用于多脉冲激光加工的系统和方法 |
CN108515278A (zh) * | 2013-04-26 | 2018-09-11 | 维亚机械株式会社 | 激光加工方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5396357B2 (ja) | 2010-09-14 | 2014-01-22 | 株式会社アマダ | レーザ加工装置及びその制御方法 |
JP7153682B2 (ja) * | 2020-03-11 | 2022-10-14 | パナソニックホールディングス株式会社 | 切断装置および切断方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6784399B2 (en) * | 2001-05-09 | 2004-08-31 | Electro Scientific Industries, Inc. | Micromachining with high-energy, intra-cavity Q-switched CO2 laser pulses |
DE10145184B4 (de) * | 2001-09-13 | 2005-03-10 | Siemens Ag | Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske |
-
2004
- 2004-04-16 CN CNA2004800246788A patent/CN1845811A/zh active Pending
- 2004-04-16 JP JP2006530165A patent/JP2007507870A/ja active Pending
- 2004-04-16 KR KR1020067002455A patent/KR20060060672A/ko not_active Application Discontinuation
- 2004-04-16 WO PCT/EP2004/050555 patent/WO2005032758A1/de active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101578155B (zh) * | 2007-01-05 | 2013-05-01 | 杰斯集团公司 | 用于多脉冲激光加工的系统和方法 |
CN108515278A (zh) * | 2013-04-26 | 2018-09-11 | 维亚机械株式会社 | 激光加工方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2007507870A (ja) | 2007-03-29 |
KR20060060672A (ko) | 2006-06-05 |
WO2005032758A1 (de) | 2005-04-14 |
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