CN1845811A - 用于操作气体激光器系统的方法 - Google Patents

用于操作气体激光器系统的方法 Download PDF

Info

Publication number
CN1845811A
CN1845811A CNA2004800246788A CN200480024678A CN1845811A CN 1845811 A CN1845811 A CN 1845811A CN A2004800246788 A CNA2004800246788 A CN A2004800246788A CN 200480024678 A CN200480024678 A CN 200480024678A CN 1845811 A CN1845811 A CN 1845811A
Authority
CN
China
Prior art keywords
pulse
laser
high frequency
resonator
interval
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800246788A
Other languages
English (en)
Chinese (zh)
Inventor
亚历山大·希尔托
汉斯·J·梅尔
彼得拉·米青内克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of CN1845811A publication Critical patent/CN1845811A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09Processes or apparatus for excitation, e.g. pumping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Lasers (AREA)
CNA2004800246788A 2003-09-30 2004-04-16 用于操作气体激光器系统的方法 Pending CN1845811A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10345543.4 2003-09-30
DE10345543 2003-09-30

Publications (1)

Publication Number Publication Date
CN1845811A true CN1845811A (zh) 2006-10-11

Family

ID=34399125

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004800246788A Pending CN1845811A (zh) 2003-09-30 2004-04-16 用于操作气体激光器系统的方法

Country Status (4)

Country Link
JP (1) JP2007507870A (ko)
KR (1) KR20060060672A (ko)
CN (1) CN1845811A (ko)
WO (1) WO2005032758A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101578155B (zh) * 2007-01-05 2013-05-01 杰斯集团公司 用于多脉冲激光加工的系统和方法
CN108515278A (zh) * 2013-04-26 2018-09-11 维亚机械株式会社 激光加工方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5396357B2 (ja) 2010-09-14 2014-01-22 株式会社アマダ レーザ加工装置及びその制御方法
JP7153682B2 (ja) * 2020-03-11 2022-10-14 パナソニックホールディングス株式会社 切断装置および切断方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6784399B2 (en) * 2001-05-09 2004-08-31 Electro Scientific Industries, Inc. Micromachining with high-energy, intra-cavity Q-switched CO2 laser pulses
DE10145184B4 (de) * 2001-09-13 2005-03-10 Siemens Ag Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101578155B (zh) * 2007-01-05 2013-05-01 杰斯集团公司 用于多脉冲激光加工的系统和方法
CN108515278A (zh) * 2013-04-26 2018-09-11 维亚机械株式会社 激光加工方法

Also Published As

Publication number Publication date
JP2007507870A (ja) 2007-03-29
KR20060060672A (ko) 2006-06-05
WO2005032758A1 (de) 2005-04-14

Similar Documents

Publication Publication Date Title
US7599407B2 (en) Laser control method, laser apparatus, laser treatment method used for the same, laser treatment apparatus
CA2727985C (en) Digital laser pulse shaping module and system
US5197074A (en) Multi-function intra-resonator loss modulator and method of operating same
JP2015503856A (ja) 所定の出力パルスプロファイルを出射するパルスレーザ源のための方法及びシステム
CN101617448B (zh) 产生用于材料处理的脉冲列的方法和系统
US20100316072A1 (en) Methods for stabilizing the output of a pulsed laser system having pulse shaping capabilities
CN1845811A (zh) 用于操作气体激光器系统的方法
US20090296748A1 (en) Laser systems and material processing
JPH0471281A (ja) 固体レーザの発振装置
CN100454692C (zh) 用声光q电源抑制声光调q激光器首脉冲的方法
EP1180834A2 (en) Laser and method for material processing
JP2006026699A (ja) レーザ加工装置および方法
CN110035863A (zh) 激光脉冲切出装置及切出方法
JP2002359422A (ja) Qスイッチレーザ制御装置およびレーザ装置
JP3487404B2 (ja) 半導体レーザ励起qスイッチ発振固体レーザ装置
JPH0327885A (ja) レーザーによる加工方法
US6418153B1 (en) Method for operating a laser light source
JP2003347636A (ja) Qスイッチレーザ装置及びqスイッチ制御方法
WO2024024338A1 (ja) レーザ加工装置、制御方法、およびプログラム
CN114094432B (zh) 脉冲波形可调的固体激光器系统及脉冲波形调节方法
CN109088303A (zh) 调节脉冲激光器输出功率的方法、装置以及脉冲激光器
JP2003053564A (ja) レーザ加工制御方法及び装置
JP3800812B2 (ja) レーザ発振装置
JPH08321651A (ja) 固体レーザ装置
JPH0595156A (ja) 光フアイバ−増幅器

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1092104

Country of ref document: HK

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication
REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1092104

Country of ref document: HK