JP5396357B2 - レーザ加工装置及びその制御方法 - Google Patents
レーザ加工装置及びその制御方法 Download PDFInfo
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- JP5396357B2 JP5396357B2 JP2010205446A JP2010205446A JP5396357B2 JP 5396357 B2 JP5396357 B2 JP 5396357B2 JP 2010205446 A JP2010205446 A JP 2010205446A JP 2010205446 A JP2010205446 A JP 2010205446A JP 5396357 B2 JP5396357 B2 JP 5396357B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/102—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
- H01S3/104—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation in gas lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/041—Arrangements for thermal management for gas lasers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/0014—Monitoring arrangements not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/097—Processes or apparatus for excitation, e.g. pumping by gas discharge of a gas laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/22—Gases
- H01S3/223—Gases the active gas being polyatomic, i.e. containing two or more atoms
- H01S3/2232—Carbon dioxide (CO2) or monoxide [CO]
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
本実施形態では、特に省エネモードAでは、待機状態にてレーザ発振器7のベース放電停止とレーザガス圧低下によってレーザ発振器7の省エネルギ化している。この際、レーザ発振器7の省エネルギ化により発生熱量を抑え、これに関連して温調器9の省エネルギ化も達成できる。
9 温調器(冷却手段)
11 NC装置(制御手段)
11b スイッチ(スイッチ手段)
Claims (7)
- レーザ発振手段と、このレーザ発振手段を冷却する冷却手段と、前記レーザ発振手段及び前記冷却手段を制御する制御手段とを有し、前記制御手段は、前記レーザ発振手段がレーザ光の出射を停止させた状態からあらかじめ設定してある規定時間が経過した後に、前記レーザ発振手段のベース放電を停止させる制御部を備えていることを特徴とするレーザ加工装置。
- 前記制御部は、前記規定時間が経過した後に、前記レーザ発振手段に供給するレーザガスの供給量を低減させることを特徴とする請求項1に記載のレーザ加工装置。
- 前記制御部は、前記規定時間が経過した後に、前記冷却手段における冷却媒体の温度設定範囲を拡大させることを特徴とする請求項1または2に記載のレーザ加工装置。
- 前記レーザ発振手段がレーザ光の出射を停止させた後に、前記制御部を動作させるための操作部を設けたことを特徴とする請求項1ないし3のいずれか1項に記載のレーザ加工装置。
- レーザ発振手段がレーザ光の出射を停止させた状態からあらかじめ設定してある第1の規定時間経過後に、前記レーザ発振手段のベース放電を停止させることを特徴とするレーザ加工装置の制御方法。
- 前記ベース放電を停止させてからあらかじめ設定してある第2の規定時間経過後に、前記レーザ発振手段に供給するレーザガスの供給量を低減させることを特徴とする請求項5に記載のレーザ加工装置の制御方法。
- 前記ベース放電を停止させてからあらかじめ設定してある第2の規定時間経過後に、前記冷却手段における冷却媒体の温度設定範囲を拡大させることを特徴とする請求項5または6に記載のレーザ加工装置の制御方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010205446A JP5396357B2 (ja) | 2010-09-14 | 2010-09-14 | レーザ加工装置及びその制御方法 |
PCT/JP2011/070136 WO2012036008A1 (ja) | 2010-09-14 | 2011-09-05 | レーザ加工装置、及び、レーザ加工装置の制御方法 |
US13/816,614 US9362706B2 (en) | 2010-09-14 | 2011-09-05 | Laser machine and controlling method of laser machine |
CN201180044185.0A CN103098320B (zh) | 2010-09-14 | 2011-09-05 | 激光加工装置以及激光加工装置的控制方法 |
KR1020137003765A KR101414542B1 (ko) | 2010-09-14 | 2011-09-05 | 레이저 가공 장치, 및 레이저 가공 장치의 제어 방법 |
EP11825014.1A EP2618433B2 (en) | 2010-09-14 | 2011-09-05 | Laser processing device, and method for controlling laser processing device |
TW100132859A TWI436844B (zh) | 2010-09-14 | 2011-09-13 | Control method of laser processing device and laser processing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010205446A JP5396357B2 (ja) | 2010-09-14 | 2010-09-14 | レーザ加工装置及びその制御方法 |
Publications (2)
Publication Number | Publication Date |
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JP2012064636A JP2012064636A (ja) | 2012-03-29 |
JP5396357B2 true JP5396357B2 (ja) | 2014-01-22 |
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Family Applications (1)
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---|---|---|---|
JP2010205446A Active JP5396357B2 (ja) | 2010-09-14 | 2010-09-14 | レーザ加工装置及びその制御方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9362706B2 (ja) |
EP (1) | EP2618433B2 (ja) |
JP (1) | JP5396357B2 (ja) |
KR (1) | KR101414542B1 (ja) |
CN (1) | CN103098320B (ja) |
TW (1) | TWI436844B (ja) |
WO (1) | WO2012036008A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5789527B2 (ja) | 2012-01-18 | 2015-10-07 | 株式会社アマダホールディングス | レーザ加工装置及びレーザ発振制御方法 |
JP5637160B2 (ja) * | 2012-03-12 | 2014-12-10 | パナソニック株式会社 | レーザ発振装置およびレーザ加工機 |
FR2991214B1 (fr) * | 2012-06-01 | 2014-06-13 | Snecma | Procede de percage d'une piece par impulsions laser |
WO2014038241A1 (ja) * | 2012-09-05 | 2014-03-13 | 三菱電機株式会社 | レーザ加工装置 |
JP5689495B2 (ja) | 2013-04-15 | 2015-03-25 | ファナック株式会社 | 消費電力の削減制御を行うレーザ加工装置 |
JP6227586B2 (ja) | 2015-03-31 | 2017-11-08 | ファナック株式会社 | 複数の運転モードで動作するレーザ加工システム |
US10794667B2 (en) * | 2017-01-04 | 2020-10-06 | Rolls-Royce Corporation | Optical thermal profile |
JP6871995B2 (ja) * | 2019-11-18 | 2021-05-19 | ギガフォトン株式会社 | レーザ装置及び非一過性のコンピュータ読み取り可能な記録媒体 |
Family Cites Families (19)
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JPS4980990A (ja) | 1972-12-04 | 1974-08-05 | ||
US4430739A (en) * | 1981-09-21 | 1984-02-07 | Mcmahan William H | Laser system with standby mode |
JPH02235588A (ja) | 1989-03-09 | 1990-09-18 | Fanuc Ltd | レーザ出力制御方式 |
JPH0428275A (ja) | 1990-05-24 | 1992-01-30 | Toshiba Corp | ガスレーザ装置 |
JPH04259277A (ja) * | 1991-02-14 | 1992-09-14 | Amada Co Ltd | 炭酸ガスレーザのシマー放電電力の制御方法 |
JP2712937B2 (ja) * | 1991-10-07 | 1998-02-16 | 松下電器産業株式会社 | ガスレーザ発振装置 |
JPH05220591A (ja) * | 1992-02-14 | 1993-08-31 | Amada Co Ltd | レーザ加工機の電気シャツタ方法 |
JP3824092B2 (ja) | 1993-12-24 | 2006-09-20 | 株式会社小松製作所 | エキシマレ−ザ装置のガス補給方法 |
JPH1094887A (ja) * | 1996-09-24 | 1998-04-14 | Amada Eng Center:Kk | レーザ加工システムの定温化方法 |
JP2000271767A (ja) * | 1999-03-29 | 2000-10-03 | Nippon Steel Corp | レーザ加工装置の運転方法 |
US6034978A (en) | 1999-05-12 | 2000-03-07 | Cymer, Inc. | Gas discharge laser with gas temperature control |
JP2002299730A (ja) * | 2001-04-02 | 2002-10-11 | Amada Eng Center Co Ltd | レーザ発振器 |
KR20060060672A (ko) † | 2003-09-30 | 2006-06-05 | 히다치 비아 메카닉스 가부시키가이샤 | 가스 레이저 시스템의 작동 방법 |
JP2005251855A (ja) | 2004-03-02 | 2005-09-15 | Fanuc Ltd | レーザ装置 |
JP2005268558A (ja) * | 2004-03-19 | 2005-09-29 | Fanuc Ltd | レーザ装置 |
DE102004040582A1 (de) * | 2004-08-21 | 2006-02-23 | Carl Baasel Lasertechnik Gmbh & Co. Kg | Laserbearbeitungsgerät, insbesondere Handschweißlaser |
JP5091413B2 (ja) * | 2006-03-08 | 2012-12-05 | 東京エレクトロン株式会社 | 基板処理装置および基板処理装置の制御方法 |
JP4855374B2 (ja) | 2007-11-08 | 2012-01-18 | ファナック株式会社 | ガス流路に流量調整弁を備えたガスレーザ装置 |
DE112011103513B9 (de) | 2010-10-19 | 2014-04-24 | Mitsubishi Electric Corp. | Steuervorrichtung und Steuerverfahren für eine Laserbearbeitungsmaschine |
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2010
- 2010-09-14 JP JP2010205446A patent/JP5396357B2/ja active Active
-
2011
- 2011-09-05 US US13/816,614 patent/US9362706B2/en active Active
- 2011-09-05 CN CN201180044185.0A patent/CN103098320B/zh active Active
- 2011-09-05 EP EP11825014.1A patent/EP2618433B2/en active Active
- 2011-09-05 WO PCT/JP2011/070136 patent/WO2012036008A1/ja active Application Filing
- 2011-09-05 KR KR1020137003765A patent/KR101414542B1/ko active IP Right Grant
- 2011-09-13 TW TW100132859A patent/TWI436844B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN103098320B (zh) | 2016-05-25 |
JP2012064636A (ja) | 2012-03-29 |
EP2618433B2 (en) | 2022-04-27 |
KR101414542B1 (ko) | 2014-07-02 |
US9362706B2 (en) | 2016-06-07 |
EP2618433A1 (en) | 2013-07-24 |
EP2618433B1 (en) | 2019-08-21 |
CN103098320A (zh) | 2013-05-08 |
TWI436844B (zh) | 2014-05-11 |
US20130170514A1 (en) | 2013-07-04 |
TW201210724A (en) | 2012-03-16 |
KR20130056285A (ko) | 2013-05-29 |
EP2618433A4 (en) | 2014-06-18 |
WO2012036008A1 (ja) | 2012-03-22 |
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