JPS4980990A - - Google Patents

Info

Publication number
JPS4980990A
JPS4980990A JP47121376A JP12137672A JPS4980990A JP S4980990 A JPS4980990 A JP S4980990A JP 47121376 A JP47121376 A JP 47121376A JP 12137672 A JP12137672 A JP 12137672A JP S4980990 A JPS4980990 A JP S4980990A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47121376A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47121376A priority Critical patent/JPS4980990A/ja
Priority to DE2360308A priority patent/DE2360308A1/de
Priority to GB5621673A priority patent/GB1450908A/en
Publication of JPS4980990A publication Critical patent/JPS4980990A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Wire Bonding (AREA)
JP47121376A 1972-12-04 1972-12-04 Pending JPS4980990A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP47121376A JPS4980990A (ja) 1972-12-04 1972-12-04
DE2360308A DE2360308A1 (de) 1972-12-04 1973-12-04 Laserloetvorrichtung fuer miniaturloetstellen
GB5621673A GB1450908A (en) 1972-12-04 1973-12-04 Apparatus for soldering electric circuit elements by means of a laser beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47121376A JPS4980990A (ja) 1972-12-04 1972-12-04

Publications (1)

Publication Number Publication Date
JPS4980990A true JPS4980990A (ja) 1974-08-05

Family

ID=14809683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47121376A Pending JPS4980990A (ja) 1972-12-04 1972-12-04

Country Status (3)

Country Link
JP (1) JPS4980990A (ja)
DE (1) DE2360308A1 (ja)
GB (1) GB1450908A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5851591A (ja) * 1981-09-22 1983-03-26 富士通株式会社 ボンデイング装置
JPS63168084A (ja) * 1986-12-29 1988-07-12 株式会社東芝 電子部品の半田付け方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4327277A (en) * 1978-08-24 1982-04-27 Raytheon Company Method for laser soldering
US4278867A (en) * 1978-12-29 1981-07-14 International Business Machines Corporation System for chip joining by short wavelength radiation
JPS55155314A (en) * 1979-05-21 1980-12-03 Nippon Telegr & Teleph Corp <Ntt> Connecting method of optical fiber and its connector
JPS5641088A (en) * 1979-09-12 1981-04-17 Hitachi Ltd Monitoring device for laser light axis
DE3247338A1 (de) * 1982-12-21 1984-06-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zum laserloeten von flexiblen verdrahtungen
FR2618606B1 (fr) * 1987-07-24 1990-02-16 Thomson Composants Militaires Four de soudure de puces de circuit integre
FR2659886A1 (fr) * 1990-03-26 1991-09-27 Mafond Luc Procede et dispositif destines au chauffage d'une matiere de soudage.
JP5396357B2 (ja) 2010-09-14 2014-01-22 株式会社アマダ レーザ加工装置及びその制御方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5851591A (ja) * 1981-09-22 1983-03-26 富士通株式会社 ボンデイング装置
JPS63168084A (ja) * 1986-12-29 1988-07-12 株式会社東芝 電子部品の半田付け方法

Also Published As

Publication number Publication date
DE2360308A1 (de) 1974-06-12
GB1450908A (en) 1976-09-29

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