GB1450908A - Apparatus for soldering electric circuit elements by means of a laser beam - Google Patents

Apparatus for soldering electric circuit elements by means of a laser beam

Info

Publication number
GB1450908A
GB1450908A GB5621673A GB5621673A GB1450908A GB 1450908 A GB1450908 A GB 1450908A GB 5621673 A GB5621673 A GB 5621673A GB 5621673 A GB5621673 A GB 5621673A GB 1450908 A GB1450908 A GB 1450908A
Authority
GB
United Kingdom
Prior art keywords
mirror
laser
soldered
source
carriage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5621673A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mishima Kosan Co Ltd
Original Assignee
Mishima Kosan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mishima Kosan Co Ltd filed Critical Mishima Kosan Co Ltd
Publication of GB1450908A publication Critical patent/GB1450908A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Wire Bonding (AREA)

Abstract

1450908 Soldering MISHIMA KOSAN CO Ltd 4 Dec 1973 [4 Dec 1972] 56216/73 Heading B3R Apparatus for soldering electrical connections of electric circuit elements comprises a laser source 2, a first mirror 23 for reflecting a laser beam from the laser source to the connection to be soldered a light source 22 for illuminating the connection to be soldered, translating means for effecting relative movement between the circuit elements to be soldered and the first mirror, for moving the spot at which the laser beam is directed, and a second mirror 20 having a hole 21 therethrough for the passage of the laser beam, the arrangement being such that a light ray from the source 22 is reflected by the second mirror to be concentric with the beam and is reflected with the beam by the first mirror on to the connection to be soldered. In an embodiment the source 2 is a gas laser tube 3 with concave mirrors 4, 5 at its ends, the mirror 5 having an opening 5A, a water cooling jacket 6 and discharge electrodes 7, 8. Carbon dioxide or a mixture of carbon dioxide and nitrogen or helium is fed to the tube 3 from a source 10 via a flow rate regulator 11, a vacuum pump 12 being provided to exhaust the tube prior to the supply of gas from source 10. An electric power source 14 is connected to the electrodes 7, 8 through an on-off timer switch 15 and a voltage regulator 16. The mirror 20 as a disc is disposed so that its central aperture 21 allows the laser beam to pass to the mirror 23, a lamp 22 being arranged to cause a light ray to be reflected from the mirror 20 on to the mirror 23 to assist the operator to locate the laser beam. The mirror 23 reflects the light ray and the laser beam through a lens 32 on to the elements to be soldered carried on a carriage 30. The mirror 23 is mounted on a rack, driven by a pinion rotated by a motor 17 controlled by the switch 15, to move along the line of the beam and the carriage is mounted for movement in two directions at right angles to locate the elements to be soldered. The carriage may be moved, while the mirror 23 is stationary, by a motor driving a rack and pinion mechanism. In use the laser may be operated continuously or intermittently while the elements to be soldered are moved continuously beneath the mirror 23 or the mirror is moved continuously over the elements. The laser may be operated intermittently, the laser being off while the mirror 23 or carriage is moving and on when the mirror or carriage is stationary or the laser may be on only while an element is moving relatively to the beam. In modifications the mirror and carriage may be moved by lead screws or wires and a He-Ne laser, Ar laser, solid laser or semi-conductor laser may be used. The connections to be soldered may be carried on a metal, glass or resin base plate and to protect the base plate it may be masked.
GB5621673A 1972-12-04 1973-12-04 Apparatus for soldering electric circuit elements by means of a laser beam Expired GB1450908A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47121376A JPS4980990A (en) 1972-12-04 1972-12-04

Publications (1)

Publication Number Publication Date
GB1450908A true GB1450908A (en) 1976-09-29

Family

ID=14809683

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5621673A Expired GB1450908A (en) 1972-12-04 1973-12-04 Apparatus for soldering electric circuit elements by means of a laser beam

Country Status (3)

Country Link
JP (1) JPS4980990A (en)
DE (1) DE2360308A1 (en)
GB (1) GB1450908A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2618433A1 (en) * 2010-09-14 2013-07-24 Amada Company, Limited Laser processing device, and method for controlling laser processing device

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4327277A (en) * 1978-08-24 1982-04-27 Raytheon Company Method for laser soldering
US4278867A (en) * 1978-12-29 1981-07-14 International Business Machines Corporation System for chip joining by short wavelength radiation
JPS55155314A (en) * 1979-05-21 1980-12-03 Nippon Telegr & Teleph Corp <Ntt> Connecting method of optical fiber and its connector
JPS5641088A (en) * 1979-09-12 1981-04-17 Hitachi Ltd Monitoring device for laser light axis
JPS5851591A (en) * 1981-09-22 1983-03-26 富士通株式会社 Bonding device
DE3247338A1 (en) * 1982-12-21 1984-06-28 Siemens AG, 1000 Berlin und 8000 München METHOD FOR LASER SOLDERING FLEXIBLE WIRING
JPS63168084A (en) * 1986-12-29 1988-07-12 株式会社東芝 Method of soldering electronic parts
FR2618606B1 (en) * 1987-07-24 1990-02-16 Thomson Composants Militaires INTEGRATED CIRCUIT CHIP WELDING OVEN
FR2659886A1 (en) * 1990-03-26 1991-09-27 Mafond Luc METHOD AND DEVICE FOR HEATING A WELDING MATERIAL.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2618433A1 (en) * 2010-09-14 2013-07-24 Amada Company, Limited Laser processing device, and method for controlling laser processing device
EP2618433A4 (en) * 2010-09-14 2014-06-18 Amada Co Ltd Laser processing device, and method for controlling laser processing device
US9362706B2 (en) 2010-09-14 2016-06-07 Amada Company, Limited Laser machine and controlling method of laser machine

Also Published As

Publication number Publication date
DE2360308A1 (en) 1974-06-12
JPS4980990A (en) 1974-08-05

Similar Documents

Publication Publication Date Title
GB1450908A (en) Apparatus for soldering electric circuit elements by means of a laser beam
US3622743A (en) Laser eraser and microwelder
US3383491A (en) Laser welding machine
US3304403A (en) Laser welding of contacts
US3392259A (en) Portable beam generator
US4278867A (en) System for chip joining by short wavelength radiation
US5262613A (en) Laser retrofit for mechanical engravers
GB1478074A (en) Laser apparatus
JPS62272576A (en) Apparatus for combining laser beams
US3622740A (en) Apparatus for treating workpieces by laser energy
JPH0435267B2 (en)
GB1198227A (en) Resistor Manufacture
US3536879A (en) Welding system
GB1215400A (en) Apparatus for continuously welding an optical element to an end face of a tube
GB1418972A (en) Laser drilling apparatus
US3392261A (en) Portable beam generator
KR910002553A (en) Method and apparatus for joining metal conductors with a laser
US3500239A (en) Head for gaseous flux molecular laser
GB1081011A (en) Indirectly pumped high energy laser
CA1189576A (en) Laser cutting apparatus and method
GB1477211A (en) Mirror apparatus for focussing a laser beam
GB1419175A (en) Apparatuses for illuminating an operating zone which is observed by means of an observation mirror
US3392260A (en) Portable beam generator
US3467474A (en) Laser machining apparatus
CN218983556U (en) Coaxial laser welding equipment

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee