JP2007500087A - 開口部を備えたコンディショニングディスクを利用する真空補助パッドコンディショニングシステム及び方法 - Google Patents

開口部を備えたコンディショニングディスクを利用する真空補助パッドコンディショニングシステム及び方法 Download PDF

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Publication number
JP2007500087A
JP2007500087A JP2006533386A JP2006533386A JP2007500087A JP 2007500087 A JP2007500087 A JP 2007500087A JP 2006533386 A JP2006533386 A JP 2006533386A JP 2006533386 A JP2006533386 A JP 2006533386A JP 2007500087 A JP2007500087 A JP 2007500087A
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JP
Japan
Prior art keywords
conditioning
polishing
pad
disk
polishing pad
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2006533386A
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English (en)
Japanese (ja)
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JP2007500087A5 (https=
Inventor
ベナー，スティーブン，ジェー．
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ティービーダブリュ インダストリーズ，インコーポレーテッド
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Publication of JP2007500087A publication Critical patent/JP2007500087A/ja
Publication of JP2007500087A5 publication Critical patent/JP2007500087A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2006533386A 2003-05-29 2004-05-25 開口部を備えたコンディショニングディスクを利用する真空補助パッドコンディショニングシステム及び方法 Pending JP2007500087A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/447,373 US7052371B2 (en) 2003-05-29 2003-05-29 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
PCT/US2004/016353 WO2004112091A2 (en) 2003-05-29 2004-05-25 Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk

Publications (2)

Publication Number Publication Date
JP2007500087A true JP2007500087A (ja) 2007-01-11
JP2007500087A5 JP2007500087A5 (https=) 2007-07-12

Family

ID=33451205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006533386A Pending JP2007500087A (ja) 2003-05-29 2004-05-25 開口部を備えたコンディショニングディスクを利用する真空補助パッドコンディショニングシステム及び方法

Country Status (7)

Country Link
US (3) US7052371B2 (https=)
EP (1) EP1633527B1 (https=)
JP (1) JP2007500087A (https=)
KR (1) KR100750771B1 (https=)
CN (2) CN101444900A (https=)
DE (1) DE602004017170D1 (https=)
WO (1) WO2004112091A2 (https=)

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US8398463B2 (en) 2005-03-07 2013-03-19 Rajeev Bajaj Pad conditioner and method
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
US8142261B1 (en) * 2006-11-27 2012-03-27 Chien-Min Sung Methods for enhancing chemical mechanical polishing pad processes
US7749050B2 (en) * 2006-02-06 2010-07-06 Chien-Min Sung Pad conditioner dresser
US20080032609A1 (en) * 2006-03-08 2008-02-07 Benedict Jeffrey H Apparatus for reducing contaminants from a chemical mechanical polishing pad
US20080271384A1 (en) * 2006-09-22 2008-11-06 Saint-Gobain Ceramics & Plastics, Inc. Conditioning tools and techniques for chemical mechanical planarization
US7597608B2 (en) * 2006-10-30 2009-10-06 Applied Materials, Inc. Pad conditioning device with flexible media mount
US7658187B2 (en) * 2007-01-16 2010-02-09 John Budiac Adjustable stone cutting guide system
US20090127231A1 (en) * 2007-11-08 2009-05-21 Chien-Min Sung Methods of Forming Superhard Cutters and Superhard Cutters Formed Thereby
US8182315B2 (en) * 2008-03-24 2012-05-22 Phuong Van Nguyen Chemical mechanical polishing pad and dresser
US8337279B2 (en) 2008-06-23 2012-12-25 Applied Materials, Inc. Closed-loop control for effective pad conditioning
US8221193B2 (en) * 2008-08-07 2012-07-17 Applied Materials, Inc. Closed loop control of pad profile based on metrology feedback
US8197306B2 (en) * 2008-10-31 2012-06-12 Araca, Inc. Method and device for the injection of CMP slurry
US8845395B2 (en) 2008-10-31 2014-09-30 Araca Inc. Method and device for the injection of CMP slurry
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JP5511600B2 (ja) * 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
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US10065288B2 (en) * 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
CN102873640B (zh) * 2012-09-18 2017-07-25 上海集成电路研发中心有限公司 研磨垫修整器
US10226853B2 (en) 2013-01-18 2019-03-12 Applied Materials, Inc. Methods and apparatus for conditioning of chemical mechanical polishing pads
WO2014149676A1 (en) * 2013-03-15 2014-09-25 Applied Materials, Inc. Polishing pad cleaning with vacuum apparatus
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US10328549B2 (en) * 2013-12-11 2019-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing head, chemical-mechanical polishing system and method for polishing substrate
US9375825B2 (en) 2014-04-30 2016-06-28 Applied Materials, Inc. Polishing pad conditioning system including suction
US9312142B2 (en) * 2014-06-10 2016-04-12 Globalfoundries Inc. Chemical mechanical polishing method and apparatus
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CN105538047B (zh) * 2015-12-11 2017-09-22 中国航空工业集团公司北京航空材料研究院 一种航空有机透明制件的表面研抛方法
JP6842859B2 (ja) * 2016-08-12 2021-03-17 株式会社荏原製作所 ドレッシング装置、研磨装置、ホルダー、ハウジング及びドレッシング方法
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US10857651B2 (en) * 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
KR102037747B1 (ko) * 2018-01-08 2019-10-29 에스케이실트론 주식회사 웨이퍼 연마 장치
KR102561647B1 (ko) * 2018-05-28 2023-07-31 삼성전자주식회사 컨디셔너 및 이를 포함하는 화학 기계적 연마 장치
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CN111571341B (zh) * 2020-05-29 2020-12-22 杭州勒格智能设备有限公司 一种泵体叶轮制造自动化精加工设备
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US12017325B2 (en) * 2021-03-04 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for removing debris during chemical mechanical planarization
USD1051530S1 (en) * 2023-03-29 2024-11-12 Irobot Corporation Drip tray for use with a mobile cleaning robot
JP1770111S (ja) 2023-03-09 2024-05-10 移動型掃除ロボット用ドリップトレイ
JP1788034S (ja) 2023-03-15 2024-12-27 移動掃除ロボット用クリーニングパッド
USD1049528S1 (en) * 2023-03-29 2024-10-29 Irobot Corporation Cleaning pad for use in a mobile cleaning robot
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JPH09174428A (ja) * 1995-12-27 1997-07-08 Toshiba Corp ラップ加工方法
JPH1170459A (ja) * 1997-08-29 1999-03-16 Nec Corp 平面研磨装置
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Also Published As

Publication number Publication date
KR20060024781A (ko) 2006-03-17
US7575503B2 (en) 2009-08-18
US7052371B2 (en) 2006-05-30
EP1633527A2 (en) 2006-03-15
US20070281592A1 (en) 2007-12-06
US7258600B1 (en) 2007-08-21
CN101444900A (zh) 2009-06-03
WO2004112091A2 (en) 2004-12-23
DE602004017170D1 (de) 2008-11-27
CN1795074A (zh) 2006-06-28
WO2004112091A3 (en) 2005-03-24
CN100469528C (zh) 2009-03-18
KR100750771B1 (ko) 2007-08-20
EP1633527B1 (en) 2008-10-15
US20040241989A1 (en) 2004-12-02
EP1633527A4 (en) 2007-05-09

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