JP2007324599A - ベーク装置 - Google Patents
ベーク装置 Download PDFInfo
- Publication number
- JP2007324599A JP2007324599A JP2007145807A JP2007145807A JP2007324599A JP 2007324599 A JP2007324599 A JP 2007324599A JP 2007145807 A JP2007145807 A JP 2007145807A JP 2007145807 A JP2007145807 A JP 2007145807A JP 2007324599 A JP2007324599 A JP 2007324599A
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- Japan
- Prior art keywords
- substrate
- unit
- transport robot
- baking apparatus
- cooling unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Drying Of Solid Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
【解決手段】ベーク装置は、基板加熱部、基板冷却部、基板を基板加熱部及び/または基板冷却部に投入したり、そこから回収する第1基板運搬ロボットを含むが、基板加熱部、第1基板運搬ロボット、基板冷却部はL字状に配置されている。
【選択図】図1
Description
200 基板冷却部
300 バッファ部
400 第1基板運搬ロボット
500 第2基板運搬ロボット
600 メンテナンス部
700 ベーク装置
Claims (5)
- 基板加熱部と、
基板冷却部と、
基板を前記基板加熱部及び/または前記基板冷却部に投入したり、そこから回収する第1基板運搬ロボットとを含むが、
前記基板加熱部、前記第1基板運搬ロボット、及び前記基板冷却部はL字状に配置されているベーク装置。 - 前記基板冷却部を中心に前記第1基板運搬ロボットの反対側に配置された第2基板運搬ロボット、及び前記第2基板運搬ロボットの一側に配置されたバッファ部をさらに含むが、前記第2基板運搬ロボットは前記基板を前記基板冷却部及び/または前記バッファに投入したり、そこから回収する請求項1に記載のベーク装置。
- 前記基板冷却部、前記第2基板運搬ロボット及び前記バッファ部はL字状に配置されている請求項2に記載のベーク装置。
- 前記第1基板運搬ロボット及び/または前記第2基板運搬ロボットは底面に固定されており、水平面上で少なくとも180゜以上回転可能な請求項1乃至3いずれかに記載のベーク装置。
- 前記基板加熱部及び前記基板冷却部と接する空間に前記基板加熱部及び前記基板冷却部を保守及び/または点検するメンテナンス部をさらに含む請求項1に記載のベーク装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060049974A KR20070115476A (ko) | 2006-06-02 | 2006-06-02 | 베이크 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007324599A true JP2007324599A (ja) | 2007-12-13 |
JP4612015B2 JP4612015B2 (ja) | 2011-01-12 |
Family
ID=38857064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007145807A Active JP4612015B2 (ja) | 2006-06-02 | 2007-05-31 | ベーク装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4612015B2 (ja) |
KR (1) | KR20070115476A (ja) |
CN (1) | CN101082463A (ja) |
TW (1) | TWI342384B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103302761A (zh) * | 2013-05-31 | 2013-09-18 | 吉铨精密机械(苏州)有限公司 | 一种用于丝股铸带头的预热支架 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10135125A (ja) * | 1996-11-01 | 1998-05-22 | Tokyo Electron Ltd | ガス処理方法および装置 |
JP2000058438A (ja) * | 1998-08-12 | 2000-02-25 | Tokyo Electron Ltd | 処理装置 |
JP2000323370A (ja) * | 1999-05-06 | 2000-11-24 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
JP2001308005A (ja) * | 2000-02-16 | 2001-11-02 | Tokyo Electron Ltd | 基板処理方法及び基板処理装置 |
JP2003100621A (ja) * | 2001-09-27 | 2003-04-04 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
-
2006
- 2006-06-02 KR KR1020060049974A patent/KR20070115476A/ko not_active Application Discontinuation
-
2007
- 2007-05-31 JP JP2007145807A patent/JP4612015B2/ja active Active
- 2007-06-01 TW TW096119740A patent/TWI342384B/zh active
- 2007-06-04 CN CNA2007101073828A patent/CN101082463A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10135125A (ja) * | 1996-11-01 | 1998-05-22 | Tokyo Electron Ltd | ガス処理方法および装置 |
JP2000058438A (ja) * | 1998-08-12 | 2000-02-25 | Tokyo Electron Ltd | 処理装置 |
JP2000323370A (ja) * | 1999-05-06 | 2000-11-24 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
JP2001308005A (ja) * | 2000-02-16 | 2001-11-02 | Tokyo Electron Ltd | 基板処理方法及び基板処理装置 |
JP2003100621A (ja) * | 2001-09-27 | 2003-04-04 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101082463A (zh) | 2007-12-05 |
TW200834026A (en) | 2008-08-16 |
JP4612015B2 (ja) | 2011-01-12 |
TWI342384B (en) | 2011-05-21 |
KR20070115476A (ko) | 2007-12-06 |
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