CN101082463A - 烘干装置 - Google Patents

烘干装置 Download PDF

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Publication number
CN101082463A
CN101082463A CNA2007101073828A CN200710107382A CN101082463A CN 101082463 A CN101082463 A CN 101082463A CN A2007101073828 A CNA2007101073828 A CN A2007101073828A CN 200710107382 A CN200710107382 A CN 200710107382A CN 101082463 A CN101082463 A CN 101082463A
Authority
CN
China
Prior art keywords
substrate
board carrying
carrying machine
cooling end
mentioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101073828A
Other languages
English (en)
Chinese (zh)
Inventor
金相吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semes Co Ltd
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of CN101082463A publication Critical patent/CN101082463A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Drying Of Solid Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CNA2007101073828A 2006-06-02 2007-06-04 烘干装置 Pending CN101082463A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060049974 2006-06-02
KR1020060049974A KR20070115476A (ko) 2006-06-02 2006-06-02 베이크 장치

Publications (1)

Publication Number Publication Date
CN101082463A true CN101082463A (zh) 2007-12-05

Family

ID=38857064

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101073828A Pending CN101082463A (zh) 2006-06-02 2007-06-04 烘干装置

Country Status (4)

Country Link
JP (1) JP4612015B2 (ja)
KR (1) KR20070115476A (ja)
CN (1) CN101082463A (ja)
TW (1) TWI342384B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103302761A (zh) * 2013-05-31 2013-09-18 吉铨精密机械(苏州)有限公司 一种用于丝股铸带头的预热支架

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3305215B2 (ja) * 1996-11-01 2002-07-22 東京エレクトロン株式会社 ガス処理方法および装置
JP3517121B2 (ja) * 1998-08-12 2004-04-05 東京エレクトロン株式会社 処理装置
JP3445757B2 (ja) * 1999-05-06 2003-09-08 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP3818631B2 (ja) * 2000-02-16 2006-09-06 東京エレクトロン株式会社 基板処理装置
JP4194262B2 (ja) * 2001-09-27 2008-12-10 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103302761A (zh) * 2013-05-31 2013-09-18 吉铨精密机械(苏州)有限公司 一种用于丝股铸带头的预热支架

Also Published As

Publication number Publication date
JP4612015B2 (ja) 2011-01-12
JP2007324599A (ja) 2007-12-13
TW200834026A (en) 2008-08-16
KR20070115476A (ko) 2007-12-06
TWI342384B (en) 2011-05-21

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Open date: 20071205