JP2007317659A - 光導波路を照明するための間接照明装置 - Google Patents
光導波路を照明するための間接照明装置 Download PDFInfo
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
- G02B6/0031—Reflecting element, sheet or layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
- G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0008—Reflectors for light sources providing for indirect lighting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
- Light Guides In General And Applications Therefor (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
【解決手段】照明装置を開示する。照明装置の一実施形態は基板と発光素子とを含む。発光素子は基板に結合され、光出口面を通して光を放射する。光出口面は、基板に対して実質的に垂直である。照明装置の光出口面に対して垂直な向きの基板を備えた照明装置を提供することにより、照明装置は、異なるLEDからの光を良好に混合することが可能になる。この照明装置によれば、一般に、拡散パネル上のダークスポットの発生を最小限に抑えることができ、又は抑制することができる。また、この照明装置によれば、拡散パネル上に比較的均一な白色光を生成するための色の混合が可能になる。
【選択図】図3
Description
1.基板と、
前記基板に結合され、前記基板に対して実質的に垂直な光出口面を通して光を放射する発光素子と、
を含む照明装置。
2.前記基板に結合された反射器ブロックを更に含み、前記反射器ブロックは、前記発光素子からの光を前記光出口面に向けて反射させる反射器表面を有する、1に記載の照明装置。
3.前記反射器表面は、前記光を前記光出口面に向けて、前記光出口面に対して実質的に直交する方向に導くように構成された輪郭を有する、2に記載の照明装置。
4.前記光出口面に非平面光学レンズを更に含み、前記非平面光学レンズは、前記発光素子と前記反射器ブロックとの間の封止材に結合され、又は該封止材と一体に形成される、2に記載の照明装置。
5.前記発光素子を封止するための第1の封止材を更に含む、2に記載の照明装置。
6.前記第1の封止材の少なくとも一部を封止するための第2の封止材を更に含む、5に記載の照明装置。
7.前記発光素子は、発光ダイオード(LED)を含み、
前記第1の封止材は、前記光の少なくとも一部を第1の波長から第2の波長へと変換する波長変換材料を含む、5に記載の照明装置。
8.前記第1の封止材は、前記第1の封止材の中で前記光を散乱させる拡散粒子を含む、5に記載の照明装置。
9.前記基板に結合され、前記基板から熱を除去するためのヒートシンクを更に含み、前記基板は、折り畳まれた可撓性基板から構成され、該基板は、
上側熱伝導層と、
中間コア層によって前記上側熱伝導層から分離された下側熱伝導層と、
前記上側熱伝導層と前記下側熱伝導層とを熱的に結合するための、前記中間コア層を貫通する複数の放熱バイアと
を含む、1に記載の照明装置。
10.光導波路の中に光を送出する方法であって、
光出口面に対して実質的に垂直な基板を備えた照明装置を用意するステップと、
前記光出口面に対して実質的に平行な方向に光を放射するステップと、
前記光を反射器表面で光を反射させ、前記光出口面に向けて方向転換させるステップと、
からなる方法。
11.前記光出口面、及び透過境界を通して前記光を光導波路の中へと伝搬させるステップを更に含み、前記光導波路の透過境界は、前記光出口面に対して実質的に平行である、10に記載の方法。
12.前記照明装置と前記光導波路の透過境界との間に設けられた光学レンズを通して前記光を伝搬させるステップを更に含む10に記載の方法。
13.前記照明装置内の複数の封止材を通して前記光を伝搬させるステップを更に含む、10に記載の方法。
14.前記複数の封止材のうちの少なくとも1つが、該封止材の中で前記光を散乱させるための拡散粒子を含む、13に記載の方法。
15.蛍光体封止材を通して前記光を伝搬させるステップを更に含み、前記蛍光体封止材は、青色の光を白色光に変換するように構成される、10に記載の方法。
16.前記基板から熱を除去し、ヒートシンクへと移動させるステップを更に含む、10に記載の方法。
17.照明装置を製造する方法であって、
基板に結合された発光ダイオード(LED)チップを用意するステップと、
前記基板上のLEDチップを第1の封止材によって封止するステップと、
前記LEDチップからの光を前記基板に対して垂直な光出口面へと反射させるための反射器を設けるステップと
を含む方法。
18.前記第1の封止材と前記反射器との間に第2の封止材を設けるステップを更に含む、17に記載の方法。
19.前記反射器は、放物線状の反射器からなる、17に記載の方法。
20.前記基板から熱を除去するためのヒートシンクを前記基板に結合するステップを更に含み、前記基板は、上側熱伝導層と、中間コア層によって前記上側熱伝導層から分離された下側熱伝導層と、前記上側熱伝導層と前記下側熱伝導層とを熱的に結合するための、前記中間コア層を貫通する複数の放熱バイアとを含む折り畳まれた可撓性基板である、17に記載の方法。
102 基板
104 LEDチップ
106 反射器ブロック
108 反射器表面
120 光導波路
124 光出口面
172 光学レンズ
144、146 封止材
Claims (10)
- 基板(102)と、
前記基板(102)に結合され、前記基板(102)に対して実質的に垂直な光出口面(124)を通して光を放射する発光素子(104)と
を含む照明装置(100)。 - 前記基板(102)に結合された反射器ブロック(106)を更に含み、前記反射器ブロック(106)は、前記発光素子(104)からの光を前記光出口面(124)へ向けて反射する反射器表面(108)を有し、前記反射器表面(108)は、前記光出口面(124)へ向かう光を前記光出口面(124)に対して実質的に直交する方向に導くように構成された輪郭を有する、請求項1に記載の照明装置(100)。
- 前記光出口面(124)に非平面レンズ(172)を更に含み、前記非平面レンズ(174)は、前記発光素子(104)と前記反射器ブロック(106)との間に配置された封止材(146)に結合され、又は、該封止材(146)と一体に形成される、請求項2に記載の照明装置(100)。
- 前記発光素子(104)を封止するための第1の封止材(144)であって、該第1の封止材(144)の内部で光を散乱させる拡散粒子を含む第1の封止材(144)と、
前記第1の封止材(144)の少なくとも一部を封止するための第2の封止材(146)と
を更に含む、請求項2に記載の照明装置(100)。 - 前記発光素子(104)は、発光ダイオード(LED)を含み、
前記第1の封止材(144)は、前記光の少なくとも一部を第1の波長から第2の波長へと変換するための波長変換材料を含む、請求項4に記載の照明装置(100)。 - 光導波路(120)の中に光を送出する方法(200)であって、
光出口面(124)に対して実質的に垂直な基板(102)を備えた照明装置(100)を用意するステップ(202)と、
前記光出口面(124)に対して実質的に平行な方向に光を放射するステップ(204)と、
前記光を反射器表面(108)で反射させ、前記光出口面(124)へ向けて方向転換させるステップ(206)と
を含む方法。 - 前記光を前記光出口面(124)、及び透過境界(122)を通して光導波路(120)の中へ伝搬させるステップ(208)を更に含み、前記光導波路(120)の透過境界(122)は、前記光出口面(124)に対して実質的に平行である、請求項6に記載の方法(200)。
- 前記照明装置(100)と、前記光導波路(120)の透過境界(122)との間に設けられた光学レンズ(172)を通して前記光を伝搬させるステップと、
蛍光体封止材(144)を通して前記光を伝搬させるステップと
を更に含み、前記蛍光体封止材(144)は、青色の光を白色光に変換するように構成される、請求項6に記載の方法(200)。 - 前記照明装置(100)の中の複数の封止材(144,146)を通して前記光を伝搬させるステップを更に含み、前記複数の封止材(144,146)のうちの少なくとも1つは、該封止材(144,146)の中で前記光を散乱させる拡散粒子を含む、請求項6に記載の方法(200)。
- 前記基板(102)から熱を除去し、ヒートシンク(132)へと移動させるステップを更に含む、請求項6に記載の方法(200)。
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Application Number | Priority Date | Filing Date | Title |
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US11/441,503 US7736044B2 (en) | 2006-05-26 | 2006-05-26 | Indirect lighting device for light guide illumination |
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JP2007317659A true JP2007317659A (ja) | 2007-12-06 |
JP4635027B2 JP4635027B2 (ja) | 2011-02-16 |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
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Cited By (11)
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JP2009193869A (ja) * | 2008-02-15 | 2009-08-27 | Sugatsune Ind Co Ltd | 照明器具及び照明器具用反射部材 |
WO2011078217A1 (ja) * | 2009-12-25 | 2011-06-30 | 株式会社小糸製作所 | 光源ユニット及び車輌用灯具 |
JP2011134677A (ja) * | 2009-12-25 | 2011-07-07 | Koito Mfg Co Ltd | 光源ユニット及び車輌用灯具 |
KR20150043451A (ko) | 2012-08-28 | 2015-04-22 | 스미토모 오사카 세멘토 가부시키가이샤 | 광반도체 발광장치, 조명기구, 및 표시장치 |
JP2015028997A (ja) * | 2013-07-30 | 2015-02-12 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
WO2016147505A1 (ja) * | 2015-03-13 | 2016-09-22 | ソニー株式会社 | 発光装置、表示装置および照明装置 |
JP2017168228A (ja) * | 2016-03-14 | 2017-09-21 | オムロン株式会社 | 面光源装置、表示装置、電子機器、及び光源 |
WO2017163608A1 (ja) * | 2016-03-24 | 2017-09-28 | ソニー株式会社 | 発光装置、表示装置および照明装置 |
US10151449B2 (en) | 2016-07-12 | 2018-12-11 | Panasonic Intellectual Property Management Co., Ltd. | Lighting apparatus |
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US11757063B2 (en) | 2019-12-27 | 2023-09-12 | Nichia Corporation | Method for manufacturing linear light source |
Also Published As
Publication number | Publication date |
---|---|
US20070274096A1 (en) | 2007-11-29 |
KR20070114045A (ko) | 2007-11-29 |
US7736044B2 (en) | 2010-06-15 |
JP4635027B2 (ja) | 2011-02-16 |
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