JP2007300173A5 - - Google Patents

Download PDF

Info

Publication number
JP2007300173A5
JP2007300173A5 JP2006123958A JP2006123958A JP2007300173A5 JP 2007300173 A5 JP2007300173 A5 JP 2007300173A5 JP 2006123958 A JP2006123958 A JP 2006123958A JP 2006123958 A JP2006123958 A JP 2006123958A JP 2007300173 A5 JP2007300173 A5 JP 2007300173A5
Authority
JP
Japan
Prior art keywords
electronic device
bonding
package
electrode
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006123958A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007300173A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006123958A priority Critical patent/JP2007300173A/ja
Priority claimed from JP2006123958A external-priority patent/JP2007300173A/ja
Publication of JP2007300173A publication Critical patent/JP2007300173A/ja
Publication of JP2007300173A5 publication Critical patent/JP2007300173A5/ja
Pending legal-status Critical Current

Links

JP2006123958A 2006-04-27 2006-04-27 電子デバイス用パッケージ、及び電子デバイス Pending JP2007300173A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006123958A JP2007300173A (ja) 2006-04-27 2006-04-27 電子デバイス用パッケージ、及び電子デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006123958A JP2007300173A (ja) 2006-04-27 2006-04-27 電子デバイス用パッケージ、及び電子デバイス

Publications (2)

Publication Number Publication Date
JP2007300173A JP2007300173A (ja) 2007-11-15
JP2007300173A5 true JP2007300173A5 (enExample) 2009-06-18

Family

ID=38769330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006123958A Pending JP2007300173A (ja) 2006-04-27 2006-04-27 電子デバイス用パッケージ、及び電子デバイス

Country Status (1)

Country Link
JP (1) JP2007300173A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5098668B2 (ja) * 2008-01-25 2012-12-12 株式会社大真空 表面実装型圧電発振器
JP5611784B2 (ja) * 2010-11-18 2014-10-22 日本電波工業株式会社 圧電発振器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3125732B2 (ja) * 1997-11-04 2001-01-22 日本電気株式会社 圧電振動子発振器
JP3063723B2 (ja) * 1998-01-06 2000-07-12 日本電気株式会社 半導体装置
AU7958700A (en) * 1999-10-29 2001-05-14 Nikko Company Package for high-frequency device
JP3832335B2 (ja) * 2001-12-21 2006-10-11 株式会社村田製作所 混載型電子回路装置の製造方法

Similar Documents

Publication Publication Date Title
JP2007149977A5 (enExample)
TW200711068A (en) Semiconductor device and method for making the same, circuit board and method for making the same
JP2009117611A5 (enExample)
JP2009225093A5 (enExample)
JP2007514320A5 (enExample)
JP2007267113A5 (enExample)
ATE454713T1 (de) Flip-chip-verbindung über chip-durchgangswege
JP2009141169A5 (enExample)
JP2004103843A5 (enExample)
JP2006507688A5 (enExample)
ATE470571T1 (de) Biegsame druckkopfleiterplatte
TW200620502A (en) Semiconductor device, circuit board, electro-optic device, electronic device
JP2007012850A5 (enExample)
WO2006135537A3 (en) Voltage controlled surface acoustic wave oscillator module
JP2012074807A5 (enExample)
JP2009188374A5 (enExample)
JP2018152827A5 (enExample)
JP2007300173A5 (enExample)
JP2008041953A5 (enExample)
JP2007214307A5 (enExample)
JP2006101276A5 (enExample)
JP2007243536A5 (enExample)
JP2010093674A5 (enExample)
JP2004031432A5 (enExample)
TW200605295A (en) Semiconductor device