JP2007277501A5 - - Google Patents

Claims (10)

A laminated tape for a packaging material, in which a thermal adhesive layer containing a base polymer mainly composed of a polyolefin resin, a tackifying resin, and a polymer type antistatic agent is laminated on a supporting base material layer, The laminate for packaging materials, wherein the agent layer contains 1 to 20 parts by weight of a tackifying resin and 1 to 30 parts by weight of a polymer antistatic agent containing a polyether structure with respect to 100 parts by weight of the base polymer tape. Thermal adhesive layer, with respect to 100 parts by weight of the base polymer, 2-13 parts by weight of tackifying resin, the packaging material of claim 1, including 10 to 30 parts by weight of a polymeric antistatic agent containing a polyether structure Laminated tape. The laminated tape for packaging materials according to claim 1 or 2 , wherein the base polymer constituting the thermal adhesive layer contains at least an ethylene-α-olefin copolymer, and the content thereof is 50% by weight or less of the base polymer. . The laminated tape for packaging materials according to any one of claims 1 to 3 , wherein the polymer antistatic agent containing a polyether structure is a polymer antistatic agent containing a polyether ester amide. The laminated tape for packaging materials according to any one of claims 1 to 4 , wherein the thickness of the thermal adhesive layer is 5 to 50 µm, and the surface resistivity of the thermal adhesive layer is 10 ¹³ Ω / □ or less. Packaging laminate tape when the heat sealed at 190 ° C. in two different paper wrapping substrate, according to claim 5, wherein the difference in adhesive strength of the tape is within 2 times for each of the paper wrapping substrate Laminated tape for packaging materials. Peeling voltage (23 ° C x 65% RH, peel angle 180 °, peel off) generated in the adhesive layer when the laminated tape for packaging material is heat-sealed to the paper packaging substrate and then peeled off from the paper packaging substrate The laminated tape for a packaging material according to claim 5 or 6 , wherein the absolute value of a speed of 5000 mm / min and a distance of 5 mm between the electrode and the thermal adhesive layer is 200 V or less. The adhesive composition constituting the thermal adhesive layer has a moisture content of 0.5% or less when the adhesive composition is stored in a constant temperature and humidity machine under conditions of 35 ° C. × 80% RH for 24 hours. The laminated tape for packaging materials according to any one of claims 1 to 7 . The laminated tape for packaging materials according to any one of claims 1 to 8, which can be peeled off without fluffing the paper fibers on the surface of the paper packaging substrate after heat sealing to the paper packaging substrate. The laminated tape for packaging materials according to any one of claims 1 to 9, which is used as a laminated tape for packaging materials when a chip-type electronic component is conveyed.