KR20130050869A - Cover tapes for a career tape - Google Patents

Abstract

PURPOSE: A cover tape is provided to have a new structure with sufficiently storing sealing force without forming an adhesive layer on an antistatic layer, on front side. CONSTITUTION: An antistatic cover tape has a concavo-convex part on the surface portion contacted to an object being carried to the carrier tape. A sealing layer(400) is formed in a part where the product is not directly contacted. The concavo-convex part of the cover tape is formed by a step of forming a concavo-convex part with a 0.5-05 micron, on the surface of an adhesive improving layer(120); and a step of introducing organic or inorganic particle with 0.1-20 micron into an antistatic layer(200). The antistatic layer(300) including the concave-convex part has a net shape, rectangular shape, triangular shape, polygonal shape, circular shape, ellipse shape, or star shape.

Description

Cover tape for a career tape

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape used in a tape-reel (hereinafter referred to as carrier tape) for transporting a semiconductor IC chip. More specifically, the present invention relates to a carrier tape produced by providing unevenness on a surface portion contacting with an object to be transported on the carrier tape, and selectively forming only a necessary portion of the seal layer, not on the entire surface of the carrier tape.

A semiconductor integrated circuit chip is carried in a transport container called a tape-and-reel (hereinafter referred to as a carrier tape). The carrier tape is manufactured by slitting a base film produced by a triple extrusion method or a coating method to a predetermined size and then applying heat and pressure to form a pocket of a predetermined size. A semiconductor chip is placed in the pocket, And then wrapped on a reel.

In order to impart antistatic properties to the carrier tape, the carrier tape is mainly formed by a triple extrusion method or a coating method. For example, when a carrier tape is produced by a triple extrusion method using a styrene resin, a styrene polymer or an acrylonitrile-butadiene-styrene copolymer is mainly used as an intermediate layer, and a skin layer is formed of a carbon- Black to adjust the surface resistance to 10 ⁴ -10 ⁶ ohm / square. Apply heat and pressure to make pockets.

Carver tapes may be formed by forming a pressure-sensitive adhesive (PSA) type pressure-sensitive adhesive layer on a surface of a polymer film made of one layer or two layers and using a heat-sealing type pressure-sensitive adhesive layer or applying pressure thereto. Generally, in the case of a heat seal type, an adhesive layer is formed on the entire surface of the film and then slit to a certain width. PSA type carver tape is used by forming an adhesive layer only on the edge where sealing is performed.

Conventionally, in the transportation of semiconductor chips, it is common to manufacture semiconductor chips in all processes and to carry chips in a state in which piping is completed in a post-process. However, in some cases, (called "bare chips") to carry carrier tape.

There are a few caveats to bear in this way. First, because bare chips are not packaged, they are very light in weight, and if they are wrong during handling or transportation, they are very likely to stick to the wall of the shipping container. Or directly damaged by conductive foreign matter or static electricity.

Carbure tape adheres to carrier tape during aging test in consideration of the situation that when the carver tape is sealed after the chip is inserted into the carrier tape and the temperature rises after passing over the equator fat during transportation or when exposed to the sunlight for a long time, Lt; / RTI > This is because the adhesive layer of the existing carver tape directly contacts the surface of the carrier tape. In the case of a carrier tape for carrying a bare chip, the bare chip is much lighter.

Therefore, the carbar tape used for the carrier tape for carrying the bare chip as well as the chip in which the packaging is completed after the semiconductor chip is manufactured should not be exposed on the surface of the carbar tape, that is, the adhesive layer having a high probability of sticking to the bare chip, do. (Or peeling strength) of the sealing surface, the sealing strength of the conventional car-sealed tape must be higher than that of the conventional car-sealing tape. In this case, Since the carver tape is attached by applying pressure only at room temperature, the sealing force is relatively low, so that the carver tape may fall off during transportation and the chip may be disturbed.

In order to solve the above problems, the present invention provides a method of manufacturing a carrier tape in which unevenness is formed on a surface portion contacting with an object to be conveyed on a carrier tape, and a new type of cover having a sufficient sealing force without forming an adhesive layer on the antistatic layer, Tape.

The present invention provides a new carver tape having a high sealing force or peel strength while eliminating the possibility that the chip is lighter due to light weight in case of carrying the bare chip in the carrier tape in the form of a bare chip.

 The problems to be solved by the present invention are not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.

In order to solve the above-described problems, the present invention provides an antistatic carrier tape for a carrier tape having a sealing layer, wherein the antistatic carrier tape is provided with projections and depressions on a surface portion contacting with an object to be carried on the carrier tape, And the sealing layer is formed only on a portion not directly contacting the product.

In the present invention, an antistatic layer containing unevenness is formed on a base film and a pressure sensitive adhesive layer formed on the antistatic layer is formed only at a sealing portion.

The antistatic carrier tape according to the present invention is characterized in that the unevenness of the car- bon tape makes unevenness in the range of 0.5 to 50 microns on the surface of the adhesion promoting layer or introduces organic or inorganic particles of the order of 0.1 to 20 microns into the antistatic layer, Forming an unevenness in the range of 0.5 to 50 microns on the surface of the adhesion promoting layer and introducing organic or inorganic particles of about 0.1 to 20 microns into the antistatic layer.

In the present invention, an antistatic layer containing an electroconductive polymer as an effective component may be formed on a surface of the substrate film having unevenness in the range of 0.5-50 microns on one side of the substrate film. In this case, Micro-irregularities can be provided by introducing organic or inorganic fine particles having a particle size in the range of 1 to 3 microns.

In a preferred embodiment of the present invention, a laminated film prepared by laminating two or more polymer films as a base film is used, and irregularities in the range of 0.5-50 microns are formed on one side of the base film; A permanent antistatic layer containing an electroconductive polymer as an effective component is formed on the surface of the base film on which the concavities and convexities are formed. At this time, organic or inorganic particles having an average particle diameter of 0.1 to 20 microns are introduced into the antistatic layer to form micro concavity and convexity on the surface .; A pressure-sensitive adhesive layer is formed on the antistatic layer formed by the fine irregularities. The pressure-sensitive adhesive layer has a sealable portion, that is, a portion of the sealant from the sealant portion of the carrier tape to the edge of the carrier tape, To be formed within a width of 10-90% of the width.

The carbar tape manufactured by the technique of the present invention is economical because it does not need to form an adhesive layer over an unnecessarily large area because a pressure-sensitive adhesive layer is formed only at a sealing portion, and in particular, Sealing force or peeling strength is high once sealed so that the bare chips contained in the pockets during transportation can be prevented from being detached from the carrier tape because it is a so-called heat sealing type which applies heat and pressure. In addition, since the chip is in contact with the uneven surface even when the chip touches the surface of the carver tape during the transportation of the bare chip, the contact area of the bare chip is reduced and chips are not attached to the surface of the carver tape.

By using the technique of the present invention, it is possible to fundamentally suppress the phenomenon that a light chip, which is generated by forming a heat sealing layer in an unnecessary portion, sticks to the heat sealing layer of the carver tape, Suitable.

Further, by using the technique of the present invention, it is not necessary to use the antistatic adhesive layer which is essentially used for the conventional heat-sealable car- bon tape, which is economically very effective.

1 to 3 are sectional views of a carver tape according to an embodiment of the present invention.
Figs. 4 and 5 are perspective views of a carver tape of the present invention used for carrier tape. Fig.

The layer structure of the carver tape 10 of the present invention is as shown in Figs. 1 and 2. Fig.

First, the layer structure of the carver tape 10 of FIG. 1 will be described. To form an adhesion promoting layer 120 having unevenness 125 in a range of 0.5-50 microns on one surface of a single film 100, Respectively. The permanent antistatic layers 200 and 300 are formed on one side or both sides of the substrate film having the irregularities 125 by forming a coating film containing the conductive polymer as an effective component. At this time, when the conductive polymer layer 300 is coated on the surface facing the chip or the adhesion promoting layer 120 having the unevenness of the substrate film, the concave and convex portions 125 are formed to be well exposed. Thereafter, a heat sealable adhesive layer 400 having a constant width is formed on the surface of the antistatic layer to produce a carver tape.

2, a two-layer film (100, 110) in which two layers are used is used as an example of a base film in which two or more layers are used. At this time, an adhesion promoting layer 120 having unevenness 125 in the range of 0.5 to 50 microns is formed on the film 110 side. The permanent antistatic layers 200 and 300 are formed on one or both sides of the base film by forming a coating film using the conductive polymer as an effective component. When forming the antistatic layer 300 coated on the unevenness-formed layer 120, the organic particles are mixed together to form an antistatic layer made of the conductive polymer as an effective component, and a fine unevenness 350 is formed on the surface. . Thereafter, a heat sealable adhesive layer 400 having a constant width is formed on the surface of the antistatic layer to produce a carver tape.

The base film of the present invention can be used in a structure in which two or more polymer films are laminated. As shown in Fig. 1, the two films (100 and 110) may contain an ester group, a carbonate group, a styrene group, Various types of films such as a single layer film made of a polymer having a functional group such as an ether group, an olefin group, and a sulfone group, a film made of a blend or an alloy having two or more of these functional groups, or a laminated film can be used . The most widely used film is a polyester film having an ester group, and the thickness of the film is not particularly limited and can be used.

Adhesion promotion layer 120 is used for the purpose of improving the adhesion by being laminated with the base film, the material constituting the adhesion enhancement layer 120 is a styrene resin or copolymer, an amide resin or copolymer, or Olefin-based copolymers such as ultra low density polyethylene or ethylene vinyl acetate can be used. At this time, the thickness of the layer 130 need not be particularly limited, but is preferably in the range of 5-40 microns in consideration of the thickness of the entire carver tape is 15-50 microns. If the thickness of the layer 130 is 5 microns or less, the adhesion promoting effect is insignificant and disadvantageous. If the thickness of the layer 130 or more is greater than 40 microns, the sealing force becomes too large or the overall thickness of the carver tape becomes too thick. In addition, the surface of the layer 130 forms irregularities in the range of 0.5-50 microns for the purpose of preventing the bare chip from sticking to the surface of the cover tape and minimizing the generation of static electricity. If the surface roughness of the unevenness is less than 0.5 micron, the area in contact with the bare chip is relatively increased, and if the surface roughness is 50 microns or more, it is difficult to uniformly coat the antistatic layer or the sealing layer on the surface of the layer 130. Is disadvantageous.

The base film may have a single film or a combination of two or more films as shown in Figs. 1 and 2, and the number of layers can be determined as necessary.

Generally, when a film made of a single polymer is used, a so-called curl occurs, which is a disadvantage in that a film of a pressure-sensitive adhesive layer is formed only in a partial area, but is curled in a widthwise direction. In this case, two kinds of heterogeneous films can be bonded and used. For example, when a polyester film and a nylon film are laminated and used as a fabric, the curling phenomenon is suppressed and is effective.

Since the carrier tape of the present invention must carry a semiconductor chip or a bare chip, permanent antistatic property should be given to prevent static electricity damage during transportation or handling. This permanent antistatic property is formed by preparing a coating liquid composition containing an electroconductive polymer as an active ingredient, applying the coating liquid composition on the surface of the film, drying and curing the coating liquid composition.

A method for forming an antistatic layer containing an electroconductive polymer as an active ingredient is as follows. First, a conductive polymer and an organic binder are mixed in an appropriate ratio, and additives such as a thickener, a heat stabilizer, a conductivity enhancer, a leveling agent, and a defoaming agent are added to the mixture, followed by mixing with a solvent to prepare a conductive polymer coating composition. Using this composition, an antistatic layer is formed on the surface of the film by various methods such as a gravure method, a spray method, a slot die method, and a roll coating method.

Examples of the conductive polymer that can be used in the present invention include modified conductive polymers made of or modified from functional groups such as aniline, pyrrole, and thiophene, and examples thereof include polyaniline, polypyrrole, polythiophene, and poly , 4-ethylenedioxythiophene), and derivatives thereof.

At this time, an adhesion promoting layer and a primer layer may be formed on the surface of the film or corona treatment may be performed to enhance the interlaminar adhesive strength in order to improve the adhesion between the film surface and the antistatic layer made of the conductive polymer.

At this time, the surface resistance of the antistatic layer containing the conductive polymer as an active ingredient is in the range of 10 ⁴ -10 ¹⁰ ohm / area. The antistatic layer is not necessarily formed on both surfaces of the film. However, in order to effectively control the static electricity generated in the space between the chip and the carver tape during transportation or the static electricity generated from the outside after packaging, the conductive polymer is effective It is advantageous to form an antistatic layer composed of the antistatic layer.

As described above, the carver tape of the present invention reduces the contact area with the chip by providing concave and convex on one surface of the base film, suppressing the generation of static electricity and preventing the chip from sticking to the carver tape. For the same purpose, the surface of the antistatic layer of the present invention is coated with inorganic or organic particles having a diameter of 0.1 to 20 microns to give fine unevenness.

For this purpose, it is advantageous for the fine unevenness of the antistatic layer to have a protruding height of about 0.1 to 20 microns. If the protruding height is less than 0.1 micron, the effect of the surface irregularities is small. If the protruding height is 20 microns or more, when the chip moves up and down due to movement during transportation, there is a fear of damaging the chip due to contact with the protruding object.

3, the antistatic layer 300 is formed on the adhesion promoting layer 120 without the irregularities 125 in the layer structure of FIG. 2, and the antistatic layer 300 is formed on the antistatic layer 300 Fine irregularities 350 were formed to protrude by introducing the particles.

The organic or inorganic particles used in the present composition are organic beads made of styrene, acryl or the like or inorganic particles such as silica, titanium oxide, talc, calcium carbonate, alumina, zirconia and the like. These particles may be used alone or in combination of one or more particles. The amount of the organic or inorganic particles is preferably in the range of 1 to 100 parts by weight based on 100 parts by weight of the conductive polymer. When the amount is less than 1 part by weight, sufficient unevenness is hardly formed in the antistatic layer, It is difficult to form uniform irregularities.

The antistatic layer containing the conductive polymer as an active ingredient is applied onto the base film in a conventional coating method such as gravure, reverse gravure, spray, offset, slot die, spin coating, inkjet, screen, However, if it is not preferable to form an antistatic layer on the entire surface of the carver tape, it is effective to form an antistatic layer using a conductive polymer in a mesh form by using a gravure coating method. That is, a groove having a constant width may be formed on the surface of the gravure roll at a negative angle, and then a composition comprising the conductive polymer may be filled in the groove and then transferred to the film surface to form a mesh-shaped antistatic layer on the film surface. In this case, the portion of the antistatic layer may have various shapes such as a mesh shape, a square shape, and a triangular shape.

The sealing layer of the present invention is preferably a heat sealing type adhesive layer adhered by heat and pressure, and the sealing layer is preferably formed on the antistatic layer. The sealing layer is mainly composed of a pressure sensitive adhesive which can be easily adhered to the carrier tape when heat and pressure are applied. As the pressure sensitive adhesive, urethane, acrylic and silicone pressure sensitive adhesives, EVA pressure sensitive adhesives or rubber pressure sensitive adhesives are used. Examples of the rubber adhesives include natural rubber, butadiene rubber, ionomer rubber, styrene-butadiene (SBR), styrene-isoprene, styrene-butadiene-styrene (SBS), styrene- Styrene (SEBS), and it is particularly preferable to use a styrenic copolymer including styrene, butadiene, ethylene, butylene, and acrylonitrile.

Also, in order to further improve the sealing force or peeling force of the sealing layer made of the rubber adhesive, a tackifier having a carbon number of 8 or less may be used in a range of 10 parts by weight or less based on 100 parts by weight of the styrenic copolymer have. If the content of the tackifier is 10 parts by weight or more, the sealing power becomes too high or the peeling strength is greatly changed during the aging test, which is rather disadvantageous.

In order to improve the aging characteristics of the sealing layer made of the rubber-based pressure-sensitive adhesive, organic or inorganic particles may be used in a range of 0.5 to 10 parts by weight based on 100 parts by weight of the rubber-based pressure-sensitive adhesive. Examples of the organic or inorganic particles include crosslinked styrene or acrylic microbeads, silica, titanium oxide, talc, calcium carbonate, alumina, and zirconia particles. If the content of the organic or inorganic particles is less than 0.5 part by weight based on 100 parts by weight of the rubber adhesive, the sealing force may become too high after the aging test, and if it is more than 10 parts by weight, the peeling force may be significantly deteriorated.

As described above, the carbide tape of the present invention is a technique of first forming an antistatic layer containing a conductive polymer and forming a sealing layer thereon. Therefore, the sealing layer must not only be excellent in adhesion to the carrier tape but also have good adhesion to the antistatic layer containing the conductive polymer. To this end, the styrenic copolymer includes steric functional groups such as maleic acid or maleic anhydride to provide excellent adhesion strength to the antistatic layer containing the conductive polymer.

These rubber adhesives are prepared by dissolving in an appropriate solvent, that is, an organic solvent such as toluene, ethyl acetate, methyl ether ketone, acetone, methyl isobutyl ketone, or xylene. If necessary, a small amount of additives such as a wetting agent, a leveling agent, and a thickener may be mixed and used.

The solid content of these solutions need not be particularly limited, and may be selected in consideration of the thickness of the adhesive layer, the manufacturing process, and the environment. In addition, the kind and content of the other additives are not particularly limited, and may be carried out using known techniques applied to existing coating techniques.

Further, the sealing layer 120 is not formed on the entire surface of the antistatic layer but is formed to have a constant width as shown in Figs. 4 and 5. In the present invention, the sealing layer is formed on a portion of the article not to be contacted with the carrier tape. 4 shows a process of joining the carbur tape 10 of the present invention onto a carrier container 20 having a pocket 21 in which a storage article is accommodated and a sealing portion 22 to which the sealing layer 400 is attached The bonded state is also shown in Fig. As a preferred example, the width of the sealing layer is formed within the width of 10-90% of the portion of the sealing wall to the edge of the carrier tape and the pocket wall of the carrier tape embossed on the carrier tape except for the part with the sprocket hole. do. The reason for defining the constant width between the pocket wall surface of the carrier tape and the sprocket hole is that if the pressure sensitive adhesive layer of the heat seal layer is located inside the pocket, the possibility of the bear chip sticking to the heat seal layer is completely eliminated .

The sealing layer may be formed using a conventionally known coating technique. Gravure, reverse gravure, slot die, screen printing, offset printing, and other coating methods may be used to form a sealing layer having a constant width .

The thickness of the sealing layer is preferably from 1 to 20 microns. If the thickness of the sealing layer is as thin as 1 micron or less, the sealing ability is low. If the sealing layer is thick as 20 micron or more, the sealing ability is too high.

The above-mentioned contents will be described in more detail using comparative examples and examples. However, the scope of the present invention is not limited to the base film used in the present invention and the present invention.

≪ Example 1 >

A composite film produced by laminating 12 micron thick polyethylene terephthalate (PET) and 12 micron thick nylon was used. For the purpose of enhancing adhesion, an ethylene vinyl acetate (EVA) layer having a thickness of 20 microns was formed on the PET surface of the composite film by extrusion coating, and a carvar tape base film composed of Nylon / PET / EVA was prepared. Thereby forming irregularities having a surface roughness of about 6 microns.

Thereafter, an antistatic coating liquid prepared by mixing poly (3,4-ethylenedioxythiophene) (PEDOT) and an acrylic binder on both sides of the film was applied by a gravure coating method and dried to obtain a surface resistance of 10 ⁶ ohms / An antistatic layer was formed.

The adhesive solution for forming the sealing layer was prepared by dissolving a styrene-ethylene-butylene-styrene copolymer (SEBS, styrene content: 30%) in toluene so that the solid content was 15% by weight. The adhesive solution was coated on the antistatic layer having surface irregularities formed by using the slot die coating method and dried to form a sealing layer having a thickness of about 5 microns and a width of 2 mm.

An antistatic carrier tape (width: 21 mm) having a sealing layer (width: 1 mm) formed only at the sealing site by cutting the film to a constant width was produced.

The carbur tape was sealed by applying heat and pressure to a polycarbonate carrier tape (width: 24 mm) having an antistatic layer so as to have a surface resistance of 10 ⁵ ohm / square using a urethane binder and a conductive polymer PEDOT as main components, The peel strength of the carbar tape was measured by peeling it again. The sealing conditions were 170 ° C, 0.34 MPa, and a sealing time of about 0.5 sec. The peeling force was measured at a peeling speed of 300 mm / min.

In addition, a bare chip having an appropriate size was inserted into the pocket of the carrier tape, and the bare chip was shaken strongly to contact the surface of the carver tape from the pocket.

The peel strength of the carbor tape manufactured by the above technique was measured to be 57 grams, and the bare chip did not adhere to the surface of the carbur tape even after shaking after putting the bare chip into the pocket.

In addition, after sealing the carver tape to the carrier tape and left for 72 hours at a temperature of 60 degrees Celsius, the sealing site was observed, and the portion bonded between the carver tape and the carrier tape other than the sealing site was not observed. The peeling force after the aging test was measured to be 81 grams.

<Example 2>

In Example 2, silica particles having an average particle size of about 2 microns were mixed and mixed in an antistatic coating solution applied on the side of the EVA in the same manner as in Example 1, with PEDOT and 5 weight percent of the acrylic binder solid content, And the other matters are the same as those of the first embodiment. The average surface roughness (Ra) was measured to be about 1.5 microns.

The peel strength of the carbor tape manufactured by the above technique was measured to be 56 grams, and the bare chip did not adhere to the surface of the carbur tape even after shaking after putting the bear chip in the pocket.

Further, after sealing the carrier tape with the carrier tape, the carrier tape was left for 72 hours at a temperature of 60 degrees Celsius, and then the sealing portion was observed. As a result, no part adhered between the carrier tape and the carrier tape was observed. The peeling force after the aging test was measured to be 78 grams.

&Lt; Comparative Example 1 &

In Comparative Example 1, silica particles were not included in the antistatic layer containing the conductive polymer as an active ingredient, and the composition of the adhesive solution for forming the sealing layer was the same as that in Example 1, but was applied over the antistatic layer by gravure coating The same procedure as in Example 1 was carried out except that a carver tape was produced by drying. That is, in the case of Example 1, the sealing layer was coated only on a certain portion of the car- bon tape, while in the case of Comparative Example 1, the sealing layer was coated on the entire surface.

The peeling force of the carbor tape was 55 grams, which was similar to that of Example 1, but a phenomenon that a part of the bare chip adhered to the surface of the carbor tape was observed. Further, after the carrier tape was sealed on the carrier tape and left at 60 degrees for 72 hours, the sealing portion was observed, and it was observed that portions other than the sealing portion were adhered to each other. As a result of measuring the peeling force after the aging test, it was found that the peeling force was greatly increased by about 180 grams.

<Example 3>

Example 3 was prepared by dissolving a styrene-ethylene-butylene-styrene copolymer (SEBS, styrene content: 30%) as an adhesive solution for forming a sealing layer in toluene to have a solid content of 15% by weight and adding crosslinked polystyrene Was prepared by mixing 3 parts by weight of microbeads (diameter: 5 microns) based on 100 parts by weight of SEBS.

The peel strength was measured to be 53 grams after sealing the carbor tape to the polycarbonate carrier tape at 170 degrees. The bare chip did not adhere to the surface of the carbur tape even after shaking after putting the bear chip in the pocket.

Further, after sealing the carrier tape with the carrier tape, the carrier tape was left at a temperature of 60 degrees Celsius for 72 hours, and then the sealing portion was observed. As a result, no part adhered between the carrier tape and the carrier tape was observed except for the sealing portion, The peel strength was 58 grams, confirming that the peel strength did not change significantly.

<Example 4>

Embodiment 4 is the same as Embodiment 2 except that a carrier tape made of a polystyrene-based polymer is used, a semiconductor chip having been subjected to passaging is used instead of a bare chip, and the width of the carrier tape is 25.4 mm.

This embodiment a polystyrene-based carrier tape of polystyrene-based polymer the main component by using the polymer compound in the intermediate layer material, polystyrene for resin mixed with conductive carbon black, about 30% percent by weight of a surface resistance of 10 ⁴ ohm / square in the middle layer Which is made of a conductive layer made of a skin layer made of embossed fabric.

The peel strength of the carrier tape produced by the technique of Example 2 was 68 grams. Also, when the semiconductor chip was pushed into the pocket and strongly shaken, the semiconductor chip did not stick to the surface of the carbur tape.

<Example 5>

A composite film prepared by laminating 12 micron thick polyethylene terephthalate (PET) and 12 micron thick nylon was used as a base film. A 20 micron thick ethylene vinyl acetate (EVA) adhesion promoting layer was formed on the PET surface of the base film by extrusion coating to produce a film composed of Nylon / PET / EVA.

Thereafter, an antistatic coating liquid prepared by mixing poly (3,4-ethylenedioxythiophene) (PEDOT) and an acrylic binder on both sides of the film was applied by a gravure coating method and dried to obtain a surface resistance of 10 ⁶ ohms / An antistatic layer was formed. At this time, the antistatic coating solution applied on the EVA side was prepared by mixing silica particles having an average particle size of about 2 microns with PEDOT and 5 weight percent of the acrylic binder solid content, so that surface irregularities were formed in the antistatic layer, (Ra) of about 1.5 microns.

The adhesive solution for forming the sealing layer was prepared by dissolving a styrene-ethylene-butylene-styrene copolymer (SEBS, styrene content: 30%) in toluene so that the solid content was 15% by weight. The adhesive solution was coated on the antistatic layer having surface irregularities formed by using the slot die coating method and dried to form a sealing layer having a thickness of about 5 microns and a width of 2 mm.

An antistatic carrier tape (width: 21 mm) having a sealing layer (width: 1 mm) formed only at the sealing site by cutting the film to a constant width was produced.

The carbur tape was sealed by applying heat and pressure to a polycarbonate carrier tape (width: 24 mm) having an antistatic layer so as to have a surface resistance of 10 ⁵ ohm / square using a urethane binder and a conductive polymer PEDOT as main components, The peel strength of the carbar tape was measured by peeling it again. The sealing conditions were 170 ° C, 0.34 MPa, and a sealing time of about 0.5 sec. The peeling force was measured at a peeling speed of 300 mm / min.

In addition, an appropriately sized bare chip was placed inside the pocket of the carrier tape and shaken vigorously to allow the bare chip to touch the surface of the cover tape.

The peel strength of the carbor tape manufactured by the above technique was measured to be 56 grams, and the bare chip did not adhere to the surface of the carbur tape even after shaking after putting the bear chip in the pocket.

In addition, after sealing the carver tape to the carrier tape and left for 72 hours at a temperature of 60 degrees Celsius, the sealing site was observed, and the portion bonded between the carver tape and the carrier tape other than the sealing site was not observed. The peeling force after the aging test was measured to be 78 grams.

100, 110: film,
120: adhesion strength enhancement layer
200: antistatic layer,
300: Antistatic layer on which surface irregularities are formed
400: sealing layer

Claims (11)

An antistatic carrier tape for a carrier tape having a sealing layer,
The antistatic carver tape is provided with irregularities on the surface portion in contact with the object carried on the carrier tape, and
The sealing layer is formed only in a portion which is not in direct contact with the product,
Antistatic carver tape, characterized in that. The method of claim 1,
Irregularities of the carver tape,
Make irregularities in the range of 0.5 to 50 microns on the surface of the adhesion promoting layer,
Introducing 0.1-20 micron organic or inorganic particles into the antistatic layer, or
By forming irregularities in the range of 0.5 to 50 microns on the surface of the adhesion promoting layer and introducing 0.1-20 organic or inorganic particles into the antistatic layer,
Antistatic carver tape, characterized in that formed. The method as claimed in claim 2,
The surface of the adhesion promoting layer is formed by pressing with a roll having concave and convex portions,
The particles contained in the antistatic layer include inorganic beads containing styrene and acrylic and inorganic particles including silica, titanium oxide, talc, calcium carbonate, alumina and zirconia in a range of 1 to 100 parts by weight per 100 parts by weight of the conductive polymer For example,
Wherein the antistatic car- The method of claim 3,
The antistatic carver tape, characterized in that the antistatic layer including the irregularities are formed only on a part of the surface of the film in a shape of a predetermined shape including a mesh shape, a square shape, a triangular shape, a polygonal shape, a circular shape, an oval shape, and a star shape. The method of claim 3,
Wherein the sealing layer comprises a rubber adhesive agent as an active ingredient and the rubber adhesive agent is selected from the group consisting of natural rubber, butadiene rubber, ionomer rubber, styrene-butadiene (SBR), styrene-isoprene, styrene-butadiene- (SIS), and styrene-ethylene-butylene-styrene (SEBS). The method of claim 3,
Wherein the sealing layer comprises 0.5 to 10 parts by weight of organic or inorganic particles comprising crosslinked styrene or acrylic microbeads, silica, titanium oxide, talc, calcium carbonate, alumina and zirconia particles, based on 100 parts by weight of the rubber- Antistatic carbur tape. 7. The method according to any one of claims 1 to 6,
Wherein the sealing layer is formed within a width of 10-90% of a width of a sealing portion excluding a portion where a sprocket hole is present in a sealing portion from a pocket wall surface of the carrier tape to an edge of the carrier tape. . The method of claim 7, wherein
The base film is a transparent or translucent base film, and a polymer having a functional group including an ester group, a carbonate group, a styrene group, an amide group, an imide group, an ether group, an olefin group, or a sulfone group or two or more of these functional groups are mixed An antistatic carver tape, characterized in that the blended or alloyed polymer is a laminated film of one or more layers. The method of claim 7, wherein
The base film is an antistatic carver tape, characterized in that consisting of a laminated film of two layers laminated two kinds of different films in order to prevent curl phenomenon. The method of claim 7, wherein
The adhesion promoting layer is an antistatic carver tape, characterized in that formed of styrene-based resin or copolymer, amide-based resin or copolymer, or an olefin-based copolymer such as ultra low density polyethylene or ethylene vinyl acetate. The method of claim 7, wherein
Wherein the antistatic layer is formed of a conductive polymer containing a functional group such as aniline, pyrrole, or thiophene or a derivative thereof as an effective component.

Images