TW202306855A - Cover tape for packaging electronic components and electronic components package - Google Patents

Abstract

A cover tape for packaging electronic components according to the invention comprises a base material layer (1), an intermediate layer (2), and a sealant layer (3), in that order, wherein the sealant layer (3) contains an adhesive resin (A), the glass transition temperature of the adhesive resin (A) is greater than 60°C but does not exceed 120°C, and the tack strength of the sealant layer at 60°C is at least 0 N/cm ²but not more than 5.0 N/cm ².

Description

Cover tape for electronic component packaging and electronic component package

The present invention relates to a cover tape for packaging electronic parts and a packaging body for electronic parts.

In the past, electronic components such as transistors, diodes, capacitors, piezoelectric element registers, etc. were stored in the manufacturing site of electronic equipment, (i) First, they were stored in a carrier tape formed by continuously forming bags capable of storing electronic components and sealed Heat-sealing treatment is performed on the package body composed of the cover tape of the above-mentioned carrier tape, (ii) Then, in the state of being wound on a paper or plastic reel, it is transported to the surface mounting operation of the electronic circuit board, etc. area. Then, the electronic components are removed from the bag formed on the carrier tape after peeling off the cover tape of the package in the work area, and are surface-mounted on an electronic circuit board or the like.

In particular, various studies have been made on the adhesiveness and peelability of the cover tape. For example, Patent Document 1 discloses a technique for making the peelability appropriate by paying attention to the peel resistance ratio α between the maximum value and the minimum value of the peel resistance between the carrier tape and the cover tape. [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2017-171393

[Problem to be Solved by the Invention]

In the step of peeling the cover tape from the carrier tape, if the strength required to peel the cover tape from the carrier tape, ie, the peel strength, is too high, the carrier tape vibrates when the cover tape is peeled off, and electronic parts may protrude from the storage bag. On the other hand, if the adhesive strength between the carrier tape and the cover tape is low, the cover tape may be peeled off during the conveyance of the package, and the packaged electronic component may drop. Therefore, the cover tape is required to have sufficient adhesive strength with respect to the carrier tape, and at the same time, peelability that can be smoothly peeled off from the carrier tape in the mounting step is required. Moreover, in the process of conveying the package body which consists of a carrier tape and a cover tape to the work area which performs surface mounting, it may become a high-temperature and high-humidity environment. In addition, since the package is wound on the reel, a certain pressure is applied to the carrier tape and the cover tape, and the carrier tape and the cover tape are in the state of being bonded even at the unheated portion. The problem that the cover tape cannot be peeled off smoothly. Therefore, the cover tape is required to have a property that the cover tape will not be bonded to the carrier tape even when a certain pressure is applied to the unheat-sealed portion of the carrier tape in a high-temperature and high-humidity environment.

One of the objects of the present invention is to provide a cover tape, which can be bonded to the carrier tape with moderate adhesive strength, and reduces the sticking of the carrier tape and the cover tape in the unheat-sealed part, that is, the "separation" between the carrier tape and the carrier tape. Good balance between "adhesion" and "adhesion resistance" to the carrier tape. [Technical means to solve the problem]

As a result of investigations by the present inventors, it was found that the above-mentioned problems can be solved by using a resin having a glass transition temperature in a specific range for the sealant layer of the cover tape. Then, the present invention was completed.

The present invention is as follows. A cover tape for electronic component packaging, which has in order: a base material layer; an intermediate layer; and a sealant layer, the sealant layer containing (A) adhesive resin, the (A) adhesive resin according to the following <glass transfer Measurement method of temperature> The measured glass transition temperature is greater than 60°C and less than 120°C, and the adhesive force of the sealant layer measured by the following <Measurement method of adhesion force> is 0 N/cm ² or more and 5.0 N/cm ² the following. <Measurement method of glass transition temperature> Using a differential scanning calorimeter (DSC), raise the glass transition temperature (°C) of the (A) adhesive resin to 0°C to 200°C at a temperature increase condition of 10°C/min, and heat it under nitrogen gas. measured under ambient conditions. <Measurement method of adhesive force> Press a stainless steel material with a contact area of 20mm ² against the sealant layer of the cover tape for electronic component packaging at a contact speed of 30mm/min, and hold for 20 seconds at a measurement temperature of 60°C and a contact load of 25N Then, the measured value of the load per unit area when peeled at a speed of 600 mm/min was defined as the adhesive force (N/cm ² ) at 60°C.

Also, the present invention is as follows. An electronic component packaging body, which has: a carrier tape containing electronic components in recesses; and The above-mentioned cover tape for packaging electronic parts, The sealant layer is side-bonded on the carrier tape to seal the electronic component. [Effect of Invention]

According to the present invention, there is provided a cover tape for electronic component packaging having a good balance between adhesiveness and adhesion resistance.

Hereinafter, embodiments of the present invention will be described using the drawings. In addition, in all drawings, the same code|symbol is attached|subjected to the same component, and description is abbreviate|omitted suitably. In addition, the figure is a schematic figure, and actual dimensional ratio does not match.

The expression "acrylic acid" in this specification shows the concept including both acrylic acid and methacrylic acid.

<Cover Tape for Packaging Electronic Components> FIG. 1 is a diagram schematically showing an example of the cover tape for packaging electronic components according to this embodiment. The cover tape for electronic component packaging of this embodiment includes a base material layer 1, an intermediate layer 2, and a sealant layer 3 in this order. In the cover tape 10 for packaging electronic components, usually, the sealant layer 3 is bonded to the carrier tape. In other words, generally, the upper surface side in FIG. 1 is bonded to the carrier tape. Moreover, each layer may consist of several layers. Moreover, the sealing compound layer 3 contains (A) adhesive resin, and the glass transition temperature of (A) adhesive resin measured by a predetermined method is more than 60 degreeC and 120 degreeC or less. Furthermore, the adhesive force of the sealant layer 3 measured by a predetermined method is not less than 0 N/cm ² and not more than 5.0 N/cm ² . Thereby, in the cover tape for electronic component packaging of this embodiment, the balance of the adhesiveness and adhesion resistance of a cover tape and a carrier tape can be made favorable.

The details of the mechanism for the excellent balance between adhesiveness and adhesion resistance of the cover tape 10 for electronic component packaging are not clear, but by using (A) adhesive resin with a glass transition temperature higher than 60°C, the cover tape and the carrier tape are bonded together. Bonded to form a package, the resin is in a glass state even in a normal temperature environment or a transported environment, so it is considered that the adhesiveness can be suppressed and the adhesion resistance can be improved. In addition, by using (A) an adhesive resin having a glass transition temperature of 120° C. or lower, the resin softens near the heat sealing temperature, and therefore it is considered that good adhesiveness between the cover tape and the carrier tape can be imparted. In addition, the upper limit of the glass transition temperature is preferably at most 118°C, more preferably at most 116°C, further preferably at most 114°C.

＜Other layers＞ In the cover tape 10 for packaging electronic components, an adhesive layer (not shown) may be provided between layers. According to this adhesive layer, the adhesiveness between each layer can be improved. Examples of materials for forming the adhesive layer include urethane-based adhesive resins for dry lamination or adhesive resins for tack coats. Preferable examples include combinations of polyester compositions such as polyester polyol and polyether polyol, and isocyanate compounds. In addition, as other layers, layers other than the adhesive layer may be provided. As other layers, for example, a layer for increasing the strength of the entire film, a water vapor barrier layer, and the like may be provided.

＜Substrate layer＞ As long as the base material layer 1 has mechanical strength capable of withstanding external force applied during processing of the cover tape 10 for packaging electronic components, during heat sealing with the carrier tape, during use, etc., and heat resistance during heat sealing, then It can be used to process films of various materials.

Specific examples of the material constituting the base layer 1 include ester-based resins, amide-based resins, olefin-based resins, acrylate-based resins, methacrylate-based resins, imide-based resins, and carbonate-based resins. , ABS resin, etc. Among them, ester-based resins and olefin-based resins are preferable as materials constituting the base material layer 1 . In particular, polyethylene terephthalate and polyethylene which can improve mechanical strength are preferable. Also, when an amide-based resin is selected as the material constituting the base material layer 1, it is preferable to use nylon which improves mechanical strength and flexibility.

As a form of the film for forming the base material layer 1, it may be a stretched film, and may be a film stretched in a uniaxial direction or a biaxial direction. From the viewpoint of improving the mechanical strength of the cover tape for packaging electronic components, a film stretched in a uniaxial direction or a biaxial direction is preferable.

The base material layer 1 may be formed of a single-layer film containing the above materials, or may be formed using a multilayer film containing the above materials in each layer. From the standpoint of reducing the amount of static electricity associated with the peeling of the carrier tape, the substrate layer 1 may contain an antistatic agent, or an antistatic agent may be provided on the surface of the substrate layer 1 opposite to the surface on which the intermediate layer 2 is provided. The electrostatic layer serves as one of the substrate layers. When storing and transporting electronic components in a package composed of a carrier tape and a cover tape 10 for packaging electronic components, in the case of stacking and transporting a plurality of packages, the antistatic agent-containing base layer 1 or antistatic layer The surface has the possibility of coming into contact with the underside of the carrier tape of the package stacked above.

The thickness of the base material layer 1 is, for example, 6 μm or more, preferably 7 μm or more, and more preferably 8 μm or more. Moreover, the thickness of the base material layer 1 is, for example, 35 μm or less, preferably 33 μm or less, more preferably 30 μm or less. If the thickness of the base material layer 1 is below the above-mentioned upper limit, the rigidity of the cover tape for packaging electronic components will not become too high, and even if torsional stress is applied to the carrier tape after sealing, the cover tape for packaging electronic components can be reduced. 10 Possibility of stripping following the deformation of the carrier tape. Also, if the thickness of the base material layer 1 is more than the above-mentioned lower limit, the mechanical strength of the cover tape 10 for packaging electronic components is appropriate, and even when the cover tape 10 for packaging electronic components is peeled off from the carrier tape at a high speed, it can be reduced. Possibility of breakage of the cover tape 10 for packaging electronic components. In addition, the base material layer 1 may also have a two-layer structure of a first base material layer and a second base material layer, or a structure of three or more layers having more layers. In this case, the material used for the base material layer 1 can be used, for example. Moreover, it is preferable that the total thickness of the 1st base material layer, the 2nd base material layer, etc. becomes "the thickness of the base material layer 1".

＜Middle layer＞ The intermediate layer 2 is a layer provided for the purpose of imparting cushioning properties to the cover tape 10 for packaging electronic components of this embodiment. Thereby, the adhesiveness of the cover tape 10 for packaging electronic components and a carrier tape at the time of sealing can be improved.

The material of the intermediate layer 2 is not particularly limited as long as it can impart cushioning properties to the cover tape 10 for packaging electronic components, and examples thereof include polyacrylic acid derivatives, polyacrylate derivatives, polyvinyl acetate derivatives, styrene-based One or more of resins, olefin resins, and cyclic olefin resins, and their copolymers. Among them, polyacrylic acid derivatives, polyacrylate derivatives, olefin-based resins, and cyclic olefin resins are preferred from the viewpoint of performance balance, olefin-based resins are more preferred, and vinyl-based resins are still more preferred.

The thickness of the intermediate layer 2 is typically not less than 10 μm and not more than 50 μm, preferably not less than 15 μm and not more than 45 μm, from the viewpoint of further improving the adhesiveness between the cover tape 10 for packaging electronic components and the carrier tape during sealing.

＜Sealant layer＞ The sealant layer 3 contains (A) an adhesive resin, and is provided on the surface side of the intermediate layer 2 opposite to the surface in contact with the base material layer 1 . The sealant layer 3 is usually in contact with the carrier tape when the cover tape 10 for packaging electronic components is sealed (for example, heat-sealed) to the carrier tape. Usually, the sealant layer 3 has heat sealability, can be bonded to the carrier tape, and exhibits easy peelability that can be easily peeled off during use.

Specific examples of the material of the (A) adhesive resin of the sealant layer 3 include one or two selected from acrylic resins, styrene resins, olefin resins, urethane resins, and ester resins. More than one species and their copolymers, etc. Among them, from the viewpoint of dissolving or dispersing the antistatic agent well, it is preferable to contain at least one or more of styrene-based resins, acrylic resins, and ester-based resins. Specific examples of styrene-based resins include polystyrene, styrene/butadiene copolymer (SB), styrene/butadiene/styrene block copolymer (SBS), styrene/ethylene/ Butadiene/styrene block copolymer (SEBS), styrene/isoprene/styrene block copolymer (SIS), styrene/ethylene/propylene/styrene block copolymer (SEPS), benzene Ethylene-(meth)methyl acrylate copolymer, hydrogenated styrene block copolymer, impact-resistant polystyrene (HIPS; High Impact Polystyrene), general-purpose polystyrene resin (GPPS; General Purpose Polystyrene), etc. These can also be used in combination of 2 or more types. Among them, from the standpoint of high transparency, and a balanced improvement in adhesion resistance and peel strength, styrene/butadiene copolymer (SB) is a specific example of acrylic resin that is preferable, such as acrylic acid, methacrylic acid Acrylic acid, methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate and other acrylates; methyl methacrylate, ethyl methacrylate, butyl methacrylate and other methacrylates; A resin composed of monomers such as acrylonitrile, methacrylonitrile, and acrylamide. As a constituent monomer of the acrylic resin, one or two or more of these exemplified monomers can be contained. Moreover, as a constituent monomer of an acrylic resin, you may contain the monomer other than these illustrations further. In addition, derivatives of these monomers may also be used. The ester-based resin is a resin obtained by polycondensation of an alcohol component (typically, diol) and a carboxylic acid component (typically, dicarboxylic acid). Specific examples of alcohol components include ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, and 1,4-butanediol , 2,3-butanediol, 2,2-dimethyl-1,3-propanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 1,10 - Decanediol, 1,12-dodecanediol and other chain or branched aliphatic diols, hydrogenated bisphenol A [2,2-bis (4-hydroxycyclohexyl) propane], carbon of hydrogenated bisphenol A Alicyclic diols, glycerol, neopentylthritol, trimethylolpropane, sorbose, etc. Alcohols and other polyhydric alcohols with a valence of 3 or more. These alcohol components can be used 1 type or 2 or more types. Examples of the carboxylic acid component include oxalic acid, malonic acid, maleic acid, fumaric acid, citraconic acid, itaconic acid, glutaconic acid, succinic acid, adipic acid, and sebacic acid. , dodecanedioic acid, azelaic acid, dodecylsuccinic acid, dodecenylsuccinic acid, octenylsuccinic acid and other chain or branched aliphatic dicarboxylic acids, trimellitic acid or its anhydride, etc. Aromatic dicarboxylic acids such as the above polyvalent carboxylic acids, phthalic acid, isophthalic acid, terephthalic acid, and aromatic dicarboxylic acids, and the like. These carboxylic acid components can be used 1 type or 2 or more types.

(A) Adhesive resin of sealant layer 3 uses a differential scanning calorimeter (DSC) to heat up to 0°C to 200°C at a temperature of 10°C/min, and the glass transition temperature (°C) measured under nitrogen ambient conditions is greater than 60 °C is 120°C or lower, preferably 118°C or lower, more preferably 116°C or lower, further preferably 114°C or lower. By keeping the glass transition temperature in the above range, the 60°C adhesive force of the cover tape for packaging electronic components can be kept in an appropriate range, and then the cover tape and the carrier tape are bonded together to form a package and wound on a reel On the other hand, in the case of storage, adhesion between the cover tape and the carrier tape can be suppressed at locations other than the portion bonded by heat sealing.

Furthermore, since the glass transition temperature (°C) of the (A) adhesive resin of the sealant layer 3 is higher than 60°C, even at a high temperature of around 60°C or Even when stored in a high-humidity environment for a certain period of time, it is easy to control the rate of change over time in the peel strength of the cover tape for packaging electronic components to the carrier tape compared with the initial value (immediately after heat sealing) within a specified range. This is considered to be because the adhesive resin of the sealant layer 3 has a glass transition temperature (°C) higher than 60°C even when stored in a high-temperature environment around 60°C, so the adhesive resin can maintain a glass state. The lower limit of the glass transition temperature may be higher than 90°C, for example, 91°C or higher, 95°C or higher, or 100°C or higher. By having such a property, it is possible to achieve a good balance of adhesion and peelability to the carrier tape even when the package consisting of the carrier tape and the cover tape is transported to the work area for surface mounting or after transport, It is possible to suppress problems such as peeling of the cover tape during transportation, falling of the electronic components contained in the package, or failure of the cover tape to be smoothly peeled off from the carrier tape during the mounting process.

The sealing compound layer 3 can further contain (B) an antistatic agent from a viewpoint of reducing the surface resistance value of the sealing compound layer 3, suppressing generation|occurrence|production of static electricity accompanying peeling, and maintaining sealing property. In the sealant layer 3 , it is preferable to dissolve or disperse (B) an antistatic agent in (A) adhesive resin. That is, it is preferable that the compatibility between (A) adhesive resin and (B) antistatic agent is good, and that (B) antistatic agent is uniformly dispersed throughout the sealant in (A) adhesive resin which is a matrix resin. on layer 3. Examples of the state of dissolution or dispersion include (B) the case where the antistatic agent is dissolved in the (A) adhesive resin via a solvent, and the state where (B) the antistatic agent is water-dispersed in (A) the adhesive resin Like this, it varies according to the properties of (A) adhesive resin and (B) antistatic agent. Specific examples of (B) antistatic agents include antimony-doped tin, conductive polymers (such as polythiophene or polythiophene derivatives), phosphorus-doped tin, fluorine-doped tin, and carbon nanotubes. In terms of good compatibility with (A) adhesive resin, etc., (B) the antistatic agent contains antimony-doped tin oxide, phosphorus-doped tin oxide, fluorine-doped tin oxide, and conductive polymers. One or more types are preferred.

Examples of polythiophene or polythiophene derivatives that are conductive polymers include polythiophene, poly(3,4)-ethylenedioxythiophene, poly(3-thiophene-β-ethanesulfonic acid), and the like. Among them, poly-3,4-ethylenedioxythiophene or its derivatives are preferred from the viewpoint of maintaining better antistatic properties and sealing properties.

The sealant layer 3 may contain, as other additives, a dispersant, a silica sol, a leveling agent, a conductive additive, and the like for improving the dispersibility of the antistatic agent.

The thickness of the sealant layer 3 is typically preferably not less than 0.02 μm and not more than 20 μm, more preferably not less than 0.03 μm and not more than 15 μm, from the viewpoint of properly performing the sealing operation and the peeling operation.

From the standpoint of balance between film strength assurance and handleability, the thickness of the electronic component packaging cover tape of this embodiment is preferably 40 μm to 65 μm, more preferably 45 μm to 60 μm.

Hereinafter, the characteristics of the cover tape for electronic component packaging of this embodiment will be described.

In the cover tape for packaging electronic components of this embodiment, regarding the adhesive force of the sealant layer 3, a stainless steel material with a contact area of 20mm2 is pressed against the sealant layer ³ of the cover tape at a contact speed of 30mm/min to measure the temperature After holding at 60°C for 20 seconds under a contact load of 25N, the measured value of the load per unit area at the time of peeling at a speed of 600 mm/min was defined as the adhesive force at 60°C. At this time, from the viewpoint of adhesion resistance, the adhesive force of the sealant layer 3 at 60° C. is 5.0 N/cm ² or less, preferably 4.5 N/cm ² or less, more preferably 4.0 N/cm ² the following. That is, at a temperature lower than the heat-sealing temperature of 60° C., good adhesion resistance can be obtained by designing the cover tape so that the adhesive force of the sealant layer 3 is sufficiently low. The lower limit of the adhesive force at 60° C. is not limited, and is, for example, 0 N/cm ² or more, specifically, 0.01 N/cm ² or more.

The "adhesion resistance" of the cover tape for packaging electronic components and the carrier tape of this embodiment is good. That is, sticking of the cover tape for electronic component packaging and the carrier tape in the present embodiment is suppressed at the unheat-sealed portion. This "adhesion resistance" can be quantified by the following <adhesion resistance test>. In other words, by designing the cover tape using the length of the bonding mark measured in the following <adhesion resistance test> as a design index, it is possible to manufacture a cover tape with better performance.

＜Adhesion Resistance Test＞ In the cover tape for packaging electronic components of this embodiment, the cover tape for packaging electronic components has a width of 10.0 mm, the sealant layer side of the cover tape has a width of 8.0 mm, and the uneven surface A polystyrene film with an average surface roughness (Ra) of 0.25 μm was used as a sample, with the concave and convex sides superimposed on each other. On the upper surface of the cover tape of this sample, a sealing iron with a U-shaped cross-section with a grounding part width of 0.5mm, a length of 32.0mm, and a weight of 46.0g was placed, and it was left to stand for 24 hours at 60°C and 90%RH. . After standing still, the presence or absence of adhesion between the polystyrene film and the cover tape for packaging electronic components was evaluated by the adhesion marks attached to the polystyrene film. Specifically, in the adhesive trace attached to the polystyrene film, the dimension of the longitudinal direction of the polystyrene film was measured as the length of the adhesive trace attached to the polystyrene film. The length of the adhesive mark attached to the polystyrene film is preferably at most 15 mm, more preferably at most 13 mm, further preferably at most 11 mm. The lower limit of the length of the adhesive mark attached to the polystyrene film is not limited, and is, for example, 0 mm or more. Incidentally, a sealing iron having the above-mentioned shape and size can be obtained from Tokyo Weld Co., Ltd., which is a manufacturer of a sealing machine, for example.

By designing the cover tape for electronic component packaging so that the length of the above-mentioned adhesive line becomes 15 mm or less, when the cover tape for electronic component packaging and the carrier tape are bonded together to form a package, and the package is wound on a reel and stored, Adhesion between the cover tape and the carrier tape can be further suppressed at locations other than the portion bonded by heat sealing. That is, adhesion resistance can be further improved.

The cover tape for electronic component packaging of this embodiment has good adhesion to the carrier tape (heat sealability with the carrier tape). This can be quantified by the following <heat seal test>, for example. In other words, by designing the cover tape using the peel strength obtained from the following <heat seal test> as a design index, it is possible to manufacture a cover tape with better adhesion to the carrier tape.

＜Heat seal test＞ The cover tape for packaging electronic parts is made into a size with a width of 5.5 mm, and the sealant layer side of the cover tape for packaging electronic parts is 8 mm in width, and the average surface roughness (Ra) of the uneven surface is 0.25 μm or less. The above-mentioned concave-convex side of the polystyrene film is bonded, using a double-edged heat-sealing knife with a single blade width of 0.4 mm and a length of 28 mm, at a sealing temperature of 180 ° C, a load of 5 kgf, a sealing time of 60 milliseconds, and a carrier belt. Heat-sealing was carried out under the condition of a distance of 4mm, and it was used as a sample. Using this sample, a peeling test was performed under conditions of a peeling speed of 300 mm/min, a measurement temperature of 25° C., and a peeling angle of 170°. The lower limit of the peel strength in this test is preferably at least 0.2N, more preferably at least 0.22N, still more preferably at least 0.23N. In addition, the upper limit of the peel strength is preferably at most 0.9N, more preferably at most 0.8N, even more preferably at most 0.7N. By making this peel strength into the said range, the balance of the adhesiveness with respect to a carrier tape, and peelability can be made more favorable.

<Peel strength when stored at 60°C after the heat seal test> The peel strength of a package composed of a cover tape for electronic parts and a carrier tape during storage at high temperature will be described. After storing the samples obtained in the above <Heat Seal Test> at 60°C for 30 days, the 170°C peel strength was measured by the same method as in the above <Heat Seal Test>. In this case, the lower limit of the peel strength is preferably at least 0.10N, more preferably at least 0.11N, and still more preferably at least 0.12N. In addition, the upper limit of the peel strength is preferably at most 1.35N, more preferably at most 1.20N, even more preferably at most 1.05N. By setting the peel strength within the above range, the balance of adhesiveness and peelability to the carrier tape can be further improved even in the case of conveyance, storage, etc. of a package in which the carrier tape and the cover tape are bonded together.

＜Peel strength when stored at 60℃90%RH after heat seal test＞ The peel strength of a package composed of a cover tape for electronic parts and a carrier tape during high-temperature and high-humidity storage will be described. After the samples obtained in the above <Heat Seal Test> were stored at 60°C and 90%RH for 30 days, the 170°C peel strength was measured in the same manner as in the above <Heat Seal Test>. In this case, the lower limit of the peel strength is preferably at least 0.10N, more preferably at least 0.11N, and still more preferably at least 0.12N. In addition, the upper limit of the peel strength is preferably at most 1.35N, more preferably at most 1.20N, even more preferably at most 1.05N. By setting the peel strength within the above range, the balance of adhesiveness and peelability to the carrier tape can be further improved even in the case of conveyance, storage, etc. of a package in which the carrier tape and the cover tape are bonded together.

<Change in peel strength after heat seal test and storage at 60°C> The case of quantifying the time-dependent change of a package composed of a cover tape for electronic parts and a carrier tape during high-temperature storage will be described. The 170°C peel strength measured in the above <heat seal test> (that is, the peel strength immediately after heat sealing) is taken as P, and the peel strength measured in the above <heat seal test after storage at 60°C> The 170°C peel strength was set to P1. The upper limit of the absolute value (|((P1-P)/P)×100|) (%) of the change rate of the peel strength after storage at 60°C relative to the initial value of the peel strength immediately after heat sealing Preferably it is 50% or less, More preferably, it is 40% or less, More preferably, it is 35% or less. Also, the lower limit of the absolute value of the rate of change in peel strength is not particularly limited, and is, for example, 0% or more. By setting the rate of change within the above range, the balance of adhesiveness and peelability to the carrier tape can be further improved even in the case of conveyance, storage, etc. of a package in which the carrier tape and the cover tape are bonded together.

<Change in peel strength after heat seal test and storage at 60°C 90%RH> The case of quantifying the time-dependent change of a package composed of a cover tape and a carrier tape for electronic components during storage at high temperature and high humidity will be described. Let the peel strength at 170°C measured in the above <heat seal test> (that is, the peel strength immediately after heat sealing) be P, and the above <peel strength after heat seal test and storage at 60°C and 90%RH> The 170°C peel strength measured in the middle is set as P2. The upper limit of the absolute value (|((P2-P)/P)×100|) (%) of the change rate of the peel strength after storage at 60°C relative to the initial value of the peel strength immediately after heat sealing Preferably it is 50% or less, More preferably, it is 40% or less, More preferably, it is 35% or less. Also, the lower limit of the absolute value of the rate of change in peel strength is not particularly limited, and is, for example, 0% or more. By setting the rate of change within the above range, the balance of adhesiveness and peelability to the carrier tape can be further improved even in the case of conveyance, storage, etc. of a package in which the carrier tape and the cover tape are bonded together.

The surface resistance value of the surface of the above-mentioned substrate layer measured under the condition of 25°C and 50%RH of the cover tape for packaging electronic parts according to this embodiment is preferably 1.0×10 ³ Ω or more, more preferably 1.0×10 ⁴ Ω Above, more preferably 1.0×10 ⁵ Ω or more, and preferably 1.0×10 ¹³ Ω or less, more preferably 1.0×10 ¹² Ω or less, still more preferably 1.0×10 ¹¹ Ω or less. By setting the surface resistance value of the base material layer of the cover tape for packaging electronic components within the above range, static electricity generated due to various causes can be efficiently released to the outside. In addition, the surface of the base layer refers to the exposed side of the base layer of the cover tape for packaging electronic components (that is, the surface of the base layer that is not in contact with the intermediate layer).

The surface resistance value of the surface of the sealant layer measured under the conditions of 25°C and 50%RH of the cover tape for packaging electronic parts according to this embodiment is preferably 1.0×10 ³ Ω or more, more preferably 1.0×10 ⁴ Ω or more, more preferably 1.0×10 ⁵ Ω or more, and preferably 1.0×10 ¹² Ω or less, more preferably 1.0×10 ¹¹ Ω or less, further preferably 1.0×10 ¹⁰ Ω or less. By making the surface resistance value of the surface of the sealant layer of the cover tape for electronic component packaging measured under the conditions of 25°C and 50%RH fall within the above range, it is possible to make the antistatic property better accompanying the peeling of the carrier tape. Excellent cover tape for electronic parts packaging. In addition, the surface of the sealant layer refers to the exposed surface side of the sealant layer of the cover tape for packaging electronic components (that is, the surface of the sealant layer that is not in contact with the intermediate layer).

The total light transmittance of the cover tape for electronic component packaging according to the present embodiment is preferably 70% or more, more preferably 75% or more, and still more preferably 80% when measured with light source D65 based on JIS K 7361-1 (1997). % or more, and preferably less than 95%, more preferably less than 94%, further preferably less than 93%. Thereby, in the package body 100 which consists of the cover tape 10 for packaging electronic components, and the carrier tape, the transparency of the grade which can check whether electronic components are accommodated correctly in the pocket of the said carrier tape can be provided. That is, by setting the total light transmittance of the cover tape for packaging electronic components to be equal to or greater than the above-mentioned lower limit value, it is possible to visually confirm the package contained in the cover tape 10 and the carrier tape from the outside of the package 100 . Electronic components inside the packaging body 100 .

The external haze of the cover tape for electronic component packaging according to the present embodiment measured by light source D65 based on JIS K 7136 (2000) is preferably 5% or more, more preferably 6% or more, most preferably 7% or more, and is relatively Preferably it is less than 50%, more preferably less than 45%, most preferably less than 40%. By setting the external haze of the cover tape for packaging electronic parts below the above-mentioned upper limit, in the package composed of the cover tape 10 for packaging electronic parts and the carrier tape, it is possible to provide The degree of transparency inside the bag of the above-mentioned carrier tape.

In this embodiment, for example, by appropriately selecting the types, properties, or blending amounts of the components contained in the base material layer 1, the intermediate layer 2, and the sealant layer 3 constituting the cover tape for packaging electronic parts, the electronic parts Conditions such as the production method of the cover tape for packaging can control the adhesive force of the above-mentioned cover tape for packaging electronic components at 60°C. In addition, in this embodiment, in addition to using (A) an adhesive resin having a glass transition temperature in a specific range for the sealant layer 3, by further studying other conditions, it is possible to suppress the above-mentioned polystyrene film and cover. One or more of the surface resistance value of the base material layer 1, the surface resistance value of the sealant layer 3, the total light transmittance, and the external haze can be controlled. Thereby, in the cover tape for electronic component packaging, when the cover tape and the carrier tape are bonded together to form a package, it is possible to suppress the generation of the cover tape and the carrier tape at parts other than the portion bonded by heat sealing. The adhesion of the carrier tape can suppress static electricity at the time of peeling, and can provide transparency to the extent that electronic components can be visually recognized from the outside.

＜Manufacturing method of cover tape for packaging electronic parts＞ An example of the manufacturing method of the cover tape for electronic component packaging of this embodiment is demonstrated. First, the intermediate layer 2 is formed on the surface of the base material layer 1 . The intermediate layer 2 can be formed by, for example, extrusion lamination or dry lamination. Next, on the intermediate layer 2 , a sealant layer coating liquid is prepared using a predetermined material, applied by a coating method and dried, or laminated by an extrusion lamination method to form a sealant layer 3 . Examples of methods for preparing the sealant layer coating solution include mixing (A) an aqueous dispersion of an adhesive resin and (B) an aqueous dispersion of an antistatic agent, and mixing (A) an adhesive resin with a solvent. The method of mixing resin and (B) antistatic agent. Choose any method according to the type of (A) adhesive resin and (B) antistatic agent.

Moreover, when forming the said adhesive layer, what is necessary is just to coat the material of an adhesive layer on the surface of a target layer by the conventionally well-known coating method.

The cover tape for packaging electronic components of this embodiment can be attached to a carrier tape and used as a package. That is, it is preferable to manufacture a package comprising: a carrier tape having a plurality of storage sections for storing electronic components, the electronic components stored in the storage sections, and the above-mentioned storage sections arranged so as to cover the storage sections. Cover tape for electronic parts packaging. According to such a package, generation|occurrence|production of static electricity can be suppressed, and the electronic component accommodated in a storage part can be protected more reliably from static electricity.

＜Electronic parts package＞ An electronic component package can be obtained from the cover tape for packaging electronic components of the present embodiment described above and the carrier tape in which the electronic components are housed in the recesses. This will be described with reference to FIG. 2 .

In FIG. 2 , a cover tape 10 for packaging electronic components is used as a cover material for a belt-shaped carrier tape 20 with concave pockets 21 continuously provided in accordance with the shape of the electronic components. Specifically, the cover tape 10 for packaging electronic components is bonded (usually heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the bag 21 of the carrier tape 20 . In addition, hereafter, the structure which bonded the cover tape 10 for electronic component packaging, and the carrier tape 20 is called the electronic component packaging body 100.

The electronic component package 100 can be produced in the following steps, for example. First, electronic components are accommodated in the pocket 21 of the carrier tape 20 . Next, the cover tape 10 for packaging electronic components is adhered to the surface of the carrier tape 20 by a heat-sealing method so as to cover the entire surface of the opening of the bag 21 of the carrier tape 20 . At this time, the sealant layer 3 in the cover tape 10 for packaging electronic components is brought into contact with the carrier tape 20 (that is, the "back side" of the cover tape 10 for packaging electronic components in FIG. heat seal). As long as the cover tape 10 for electronic component packaging and the carrier tape 20 are sufficiently firmly bonded, the specific method and conditions of heat sealing are not particularly limited. Typically, using a known heat sealer, it can be carried out within the range of temperature 100-240° C., load 0.1-10 kgf, and time 0.0001-1 second.

Thereby, a structure (electronic component package 100 ) in which electronic components are hermetically accommodated is obtained. This structure (electronic component package 100 ), for example, is wound up on a reel, and then conveyed to a working area where electronic components are mounted on an electronic circuit board or the like. The material of the scroll can be metal, paper, plastic or the like.

After the electronic component package 100 is transported to the work area, the electronic component packaging cover tape 10 is peeled off from the carrier tape 20 to take out the housed electronic components.

The electronic components accommodated in the electronic component package 100 are not particularly limited. Examples include semiconductor wafers, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related components, connectors, electrodes, and all other parts used in the manufacture of electrical and electronic equipment.

As mentioned above, although embodiment of this invention was described in detail, these are only illustrations of this invention. In addition, various configurations other than the above can be adopted. In addition, this invention is not limited to the said embodiment. [Example]

Embodiments of the present invention will be described in detail based on Examples and Comparative Examples, but the present invention is not limited thereto.

Each constituent material of the sealant layer shown in Table 1 and Table 2 is as follows. (adhesive resin) ・Resin 1: Styrene-based resin ("L8900" manufactured by Asahi Kasei Co., Ltd.) ・Resin 2: Ester-based resin ("Elitel KA-3556" manufactured by UNITIKA Corporation) ・Resin 3: Acrylic resin ("MB-2660" manufactured by Mitsubishi Chemical Corporation) ・Resin 4: Acrylic resin ("US-1071" manufactured by Starlight PMC Co., Ltd.) ・Resin 5: Acrylic resin ("B-811" manufactured by Kusumoto Chemical Co., Ltd.) ・Resin 6: Styrene-based resin ("L1432" manufactured by Asahi Kasei Co., Ltd.) ・Resin 7: Acrylic resin ("VSC6828w" manufactured by Daicel Ornex Co., Ltd.) ・Resin 8: Ester-based resin ("Elitel KA-0134" manufactured by UNITIKA Corporation) ・Resin 9: Acrylic resin ("X-310" manufactured by Starlight PMC Co., Ltd.) ・Resin 10: Acrylic resin ("TE-1048" manufactured by Starlight PMC Co., Ltd.) (antistatic agent) ・Antistatic agent 1: Antimony-doped tin oxide ("T-1" manufactured by Mitsubishi Materials Corporation) ・Antistatic agent 2: Polythiophene derivatives (PEDOT:PSS) ("Clevios P1000" manufactured by Heraeus) ・Antistatic agent 3: Polythiophene derivative ("SEPLEGYDA SAS-16" manufactured by Shin-Etsu Polymer Co., Ltd.)

<Example 1> On an antistatic polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd. "E7455") with a thickness of 12 μm, a 4 μm adhesion-promoting coating agent is wet-coated by gravure coating at 100°C dry. Then, low-density polyethylene ("SUMIKATHENE L705" manufactured by Sumitomo Chemical Co., Ltd., "SUMIKATHENE L705", 37 μ thick) was extrusion laminated, and cooled with a cooling roll (surface temperature: 20° C.). In this way, a laminated film composed of the base material layer and the intermediate layer was produced.

On the surface of the obtained laminated film on the side of the intermediate layer, the blended components shown in Table 1 were formed into a film by the gravure coating method so as to have a film thickness of 0.5 μm. In this way, a sealant layer is provided. Table 1 and Table 2 show the thickness of the entire cover tape.

<Examples 2 to 6 and Comparative Examples 1 to 5> According to the blends described in Table 1 and Table 2, a cover tape for electronic component packaging was produced in the same manner as in Example 1.

＜Glass transition temperature＞ For the above-mentioned adhesive resins used in Examples and Comparative Examples, using a differential scanning calorimeter (DSC) (manufactured by Hitachi Advanced Technology Co., Ltd., "DSC7000X"), the temperature was raised from 0°C to 200°C at a temperature increase condition of 10°C/min. Under nitrogen ambient conditions, the glass transition temperature (°C) was measured.

<Adhesion at 60°C> Using a tack tester TAC0-1000 manufactured by RHESCA, press a stainless steel material (SUS304) with a contact area of ^20mm2 against the sealant layer of the cover tape at a contact speed of 30mm/min to measure the temperature The load per unit area when peeling off at a speed of 600 mm/min after holding at 60°C for 20 seconds under a contact load of 25 N was measured as the adhesive force (N/cm ² ) at 60°C. In addition, the above-mentioned stainless steel material is attached to the viscosity tester.

＜Adhesion resistance test＞ (Measurement of the length of adhesion marks) The cover tape for packaging electronic parts obtained above was made into a size with a width of 10.0 mm. The sealant layer side of the cover tape and the size with a width of 8.0 mm and the average surface roughness (Ra) of the uneven surface were 0.25 μm or less. A polystyrene film ("CEL-E980A" manufactured by Sumitomo Bakelite Co., Ltd.) was superimposed on the concave and convex sides and used as a sample. This sample was placed on a flat surface with the cover tape side as the upper surface. Then, on the upper surface of the cover tape, a sealing iron having a U-shaped cross-section with a ground portion width of 0.5 mm, a length of 32.0 mm, and a weight of 46.0 g was placed, and left for 24 hours at 60° C. and 90% RH. For reference, the shape of the sealing iron used here is shown in FIG. 3 . In Fig. 3, a=0.5mm, b=32.0mm, c=3.1mm. Then, the dimension in the longitudinal direction of the polystyrene film in the adhesive mark (visible gloss) attached to the polystyrene film was measured as the length of the adhesive mark attached to the polystyrene film. Incidentally, "the length of the bonding marks" indicates the total length of the bonding marks when the bonding marks are observed intermittently (intermittently). The shorter the bond line, it can be said that the part of the cover tape which is not heat-sealed with the carrier tape is bonded to the carrier tape (undesired bond).

＜Heat seal test: 170°peel strength against polystyrene film＞ Each of the cover tapes for packaging electronic components obtained above was made into a size with a width of 5.5 mm, and the average surface roughness (Ra) of the uneven surface of the cover tape for packaging electronic components with a size of 8 mm in width and a sealant layer side The above-mentioned concavo-convex surfaces of a 0.25 μm polystyrene film (“CEL-E980A” manufactured by Sumitomo Bakelite Co., Ltd.) were superimposed on each other. For the superimposed material, use a double-edged heat-sealing knife with a single-edged width of 0.4mm and a length of 28mm, at a sealing temperature of 180°C, a load of 5kgf, a sealing time of 60 milliseconds, a carrier belt conveying distance of 4mm, and 2 rows·7 The samples were heat-sealed using a heat sealer (“TWA-6621” manufactured by Tokyo Weld Co., Ltd.) under the conditions of the first pressing. Using the obtained sample, the peel strength (N) immediately after heat-sealing of the cover tape for electronic component packaging with respect to the said polystyrene film was measured. In addition, the peel strength was measured using a peel tester ("PTS-5000" manufactured by EPI Corporation) under conditions of a peel speed of 300 mm/min, a peel angle of 170°, and a measurement temperature of 25°C. The results are shown in Table 1 and Table 2. In addition, with regard to the surface roughness (Ra) of the polystyrene film, the portion of the polystyrene film used above that is bonded to the above-mentioned cover tape for packaging electronic components is Before lamination, measurement was performed using a surface roughness measuring device ("SJ-210" manufactured by Mitutoyo Corporation) in accordance with JIS B 0601 (2001).

<Tests of storing heat-sealed samples at 60°C and at 60°C90%RH: 170° peel strength to polystyrene film> The sample obtained in <Heat Seal Test: 170°Peel Strength to Polystyrene Film> was placed in an environment of 60°C (0%RH to 20%RH) or 60°C 90%RH for 30 days, respectively. As a 60°C storage sample, a 60°C 90%RH storage sample. Using the samples stored at 60°C and 60°C at 90%RH, the 170° peel strength (N) was measured under the same conditions as described in <Heat seal test: 170° peel strength to polystyrene film> , as P1(N) and P2(N) respectively. Moreover, the peeling strength (N) immediately after heat-sealing this cover tape for electronic component packaging with respect to the polystyrene film was made into P(N). From the values of P, P1, and P2, the change rate (absolute value) of the 170° peel strength after storage at 60°C and the 170° peel strength after storage at 60°C and 90%RH are calculated by the following formulas (1) and (2). Rate of change of intensity (absolute value). Change rate from initial peel strength (absolute value) (%) after storage at 60°C for 30 days: |((P1-P)/P)×100|・・・(1) Change rate from initial peel strength (absolute value) (%) after storage at 60℃90%RH for 30 days: |((P2-P)/P)×100|・・・(2) Tables 1 and 2 show the values of |((P1-P)/P)×100| and |((P2-P)/P)×100|.

<Surface resistance value of base material layer> Using a surface resistance measuring device manufactured by SIMCO Corporation ("ST-3" manufactured by SIMCO Corporation), the substrate of the cover tape for packaging electronic parts obtained above was measured in an environment of 25°C and 50%RH. The surface resistance value (Ω) of the material layer surface was measured. The results are shown in Table 1. In addition, "5.E+10" in Example 1 described in Table 1 and Table 2 means "5×10 ¹⁰ ", for example.

<Surface resistance value of sealant layer> Using a surface resistance measuring device manufactured by SIMCO Corporation ("ST-3" manufactured by SIMCO Corporation), the sealing of the cover tape for packaging electronic parts obtained above was carried out in an environment of 25°C and 50%RH. The surface resistance value (Ω) of the agent layer surface was measured. The results are shown in Table 1. In addition, "1.E+07" of Example 1 described in Table 1 and Table 2, for example, represents "1×10 ⁷ ".

＜Total light transmittance＞ According to JIS K 7361-1 (1997), the total light transmittance (%) of the cover tape for packaging electronic parts obtained above was measured using a Haze Meter NDH 2000 manufactured by Nippon Densho Kogyo Co., Ltd., using a light source D65. The results are shown in Table 1 and Table 2.

＜External Haze＞ According to JIS K 7136 (2000), the external haze (%) of the cover tape for packaging electronic components obtained above was measured using a Haze Meter NDH 2000 manufactured by Nippon Densho Kogyo Co., Ltd. with a light source D65. The results are shown in Table 1 and Table 2.

【Table 1】 unit Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Overall thickness of cover tape μm 50 50 50 50 50 50 Substrate layer - Antistatic PET film E7455 Antistatic PET film E7455 Antistatic PET film E7455 Antistatic PET film E7455 Antistatic PET film E7455 Antistatic PET film E7455 middle layer - LDPE SUMIKATHENE L705 LDPE SUMIKATHENE L705 LDPE SUMIKATHENE L705 LDPE SUMIKATHENE L705 LDPE SUMIKATHENE L705 LDPE SUMIKATHENE L705 sealant layer Resin 1 quality% 90 Resin 2 quality% 90 Resin 3 quality% 40 85 Resin 4 quality% 40 Resin 5 quality% 40 Resin 6 quality% Resin 7 quality% Resin 8 quality% Resin 9 quality% Resin 10 quality% Antistatic agent 1 quality% 60 60 60 Antistatic agent 2 quality% 10 10 Antistatic agent 3 quality% 15 (A) Glass transition temperature of adhesive resin ℃ 100 80 63 104 110 63 Adhesion at 60°C N/ ^cm2 0.70 1.25 1.00 1.00 0.90 1.00 Adhesion resistance test (the length of the adhesion mark) mm 0 7 0 3 0 0 170°peel strength of polystyrene film (P) N 0.55 0.37 0.36 0.36 0.24 0.42 170° peel strength after storage at 60°C for 30 days (P1) N 0.61 0.44 0.46 0.46 0.30 0.50 170°peel strength (P2) after storage at 60°C 90%RH for 30 days N 0.55 0.38 0.37 0.44 0.29 0.35 Rate of change from initial peel strength after storage at 60°C for 30 days (absolute value) |(P1-P)/P×100| % 11 20 28 28 25 18 Change rate from initial peel strength (absolute value) |(P2-P)/P×100| % 1 4 3 twenty two 20 -17 Surface resistance value (substrate layer) Ω 5. E+10 5. E+10 5. E+10 5. E+10 5. E+10 5. E+10 Surface resistance value (sealant layer) Ω 1. E+07 2. E+06 2. E+08 2. E+08 6. E+08 8. E+08 Total light transmittance % 89 88 87 87 88 86 External Haze % 8 13 18 20 twenty three 8

【Table 2】 unit Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 Comparative Example 5 Overall thickness of cover tape μm 50 50 50 50 50 Substrate layer - Antistatic PET film E7455 Antistatic PET film E7455 Antistatic PET film E7455 Antistatic PET film E7455 Antistatic PET film E7455 middle layer - LDPE SUMIKATHENE L705 LDPE SUMIKATHENE L705 LDPE SUMIKATHENE L705 LDPE SUMIKATHENE L705 LDPE SUMIKATHENE L705 sealant layer Resin 1 quality% Resin 2 quality% Resin 3 quality% Resin 4 quality% Resin 5 quality% Resin 6 quality% 90 Resin 7 quality% 90 Resin 8 quality% 90 Resin 9 quality% 40 Resin 10 quality% 90 Antistatic agent 1 quality% 60 Antistatic agent 2 quality% 10 10 10 10 Antistatic agent 3 quality% (A) Glass transition temperature of adhesive resin ℃ 18 42 40 53 123 Adhesion at 60°C N/ ^cm2 7.99 5.24 18.17 5.99 0.90 Adhesion resistance test (the length of the adhesion mark) mm 32 18 32 30 0.00 170°peel strength of polystyrene film (P) N 0.64 0.00 0.38 0.39 0.00 170°peel strength after storage at 60°C for 30 days (P1) N 1.17 - 0.48 0.65 - 170°peel strength (P2) after storage at 60°C 90%RH for 30 days N 1.23 - 0.65 0.70 - Rate of change from initial peel strength after storage at 60°C for 30 days (absolute value) |(P1-P)/P×100| % 83 Can't comment 25 66 Can't comment Change rate from initial peel strength (absolute value) |(P2-P)/P×100| % 92 Can't comment 69 80 Can't comment Surface resistance value (substrate layer) Ω 5. E+10 5. E+10 5. E+10 5. E+10 5. E+10 Surface resistance value (sealant layer) Ω 1. E+07 2. E+07 7. E+07 3. E+08 3. E+08 Total light transmittance % 88 88 88 87 86 External haze % 13 13 17 16 twenty one

In Examples 1 to 6, electronic component packages with good adhesion resistance evaluated in the adhesion resistance test (length of the adhesive mark) and appropriate heat seal strength evaluated in the 170° peel strength to polystyrene films were obtained Use cover tape. Moreover, in Examples 1-6, the time-dependent change rate of the peeling strength after 60 degreeC storage and 60 degreeC90%RH storage was small. On the other hand, since the glass transition temperature of (A) adhesive resin of Comparative Examples 1-5 was 60 degreeC or less, or exceeded 120 degreeC, the result was inferior to an Example. In addition, in Comparative Examples 1 to 5, the rate of change over time in the peel strength after storage at 60° C. and after storage at 60° C. and 90% RH was large.

This application is based on Japanese Patent Application No. 2021-060188 filed on March 31, 2021, Japanese Patent Application No. 2021-112596 filed on July 7, 2021, and Japanese Patent Application on October 22, 2021 The priority of Japanese Patent Application No. 2021-172916 is incorporated here.

1: Substrate layer 2: middle layer 3: Sealant layer 10: Cover tape 20: Carrier belt 21: bag 100: electronic parts package

[ Fig. 1 ] is a diagram schematically showing an example of a cover tape for packaging electronic components according to this embodiment. [ Fig. 2 ] is a diagram showing an example of a state where the cover tape for packaging electronic components is adhered (heat-sealed) to the carrier tape. [Fig. 3] It is a diagram for explaining the shape of the sealing iron used in the "adhesion resistance test".

none

1: Substrate layer

2: middle layer

3: Sealant layer

10: Cover tape

Claims (11)

A cover tape for electronic component packaging, which has in order: a base material layer; an intermediate layer; and a sealant layer, the sealant layer containing (A) adhesive resin, the (A) adhesive resin according to the following <glass transfer Measurement method of temperature> The measured glass transition temperature is greater than 60°C and less than 120°C, and the adhesive force of the sealant layer measured by the following <Measurement method of adhesion force> is 0 N/cm ² or more and 5.0 N/cm ² Hereinafter, <Measurement method of glass transition temperature> Using a differential scanning calorimeter (DSC), raise the glass transition temperature (°C) of the (A) adhesive resin to 0°C to 200°C at a heating condition of 10°C/min, and The measurement was carried out under nitrogen ambient conditions. <Measurement method of adhesion> A stainless steel material with a contact area of 20mm ² was pressed against the sealant layer of the cover tape for electronic component packaging at a contact speed of 30mm/min, and the measurement temperature was 60°C , The measured value of the load per unit area when peeled at a speed of 600 mm/min after holding a contact load of 25 N for 20 seconds was defined as the adhesive force (N/cm ² ) at 60°C. Such as the cover tape for packaging electronic parts of claim 1, wherein, The (A) adhesive resin of the sealant layer contains at least one or more of styrene-based resins, acrylic resins, and ester-based resins. The cover tape for packaging electronic parts as claimed in item 1 or 2, wherein, The sealant layer also contains (B) an antistatic agent. Such as the cover tape for packaging electronic parts of claim 3, wherein, The (B) antistatic agent contains one or more species selected from the group consisting of antimony-doped tin oxide, phosphorus-doped tin oxide, fluorine-doped tin oxide, and a conductive polymer. The cover tape for packaging electronic parts as claimed in item 1 or 2, wherein, The intermediate layer contains one or two or more resins selected from the group consisting of polyacrylic acid derivatives, polyacrylate derivatives, olefin resins, and cyclic olefin resins. The cover tape for packaging electronic parts as claimed in item 1 or 2, wherein, In the case of evaluation by the following <adhesion resistance test>, the length of the adhesive mark attached to the polystyrene film is not less than 0mm and not more than 15mm, ＜Adhesion Resistance Test＞ This cover tape for packaging electronic parts has a width of 10.0 mm, and the sealant layer side of the cover tape has a width of 8.0 mm. Polyphenylene with an average surface roughness (Ra) of 0.25 μm on the uneven surface The concave and convex sides of the vinyl film are superimposed, and as a sample, a sealing iron with a width of 0.5mm, a length of 32.0mm, and a weight of 46.0g is placed on the upper surface of the cover tape of the sample, and the temperature is 60°C 90%RH After standing still for 24 hours, in the adhesive marks attached to the polystyrene film, the dimension in the longitudinal direction of the polystyrene film is taken as the length of the adhesive mark attached to the polystyrene film Measurement. The cover tape for packaging electronic components according to Claim 1 or 2, wherein the surface resistance value of the surface of the base material layer measured under the conditions of 25°C and 50%RH is 1.0×10 ³ Ω or more and 1.0×10 ¹³ Ω or less. The cover tape for packaging electronic parts according to claim 1 or 2, wherein the surface resistance value of the surface of the sealant layer measured under the conditions of 25°C and 50%RH is 1.0×10 ³ Ω or more and 1.0×10 ¹² Ω or less. The cover tape for packaging electronic parts as claimed in item 1 or 2, wherein, The total light transmittance measured by light source D65 based on JIS K 7361-1 (1997) is 70% or more and 95% or less. The cover tape for packaging electronic parts as claimed in item 1 or 2, wherein, The external haze measured by light source D65 based on JIS K 7136 (2000) is 5% or more and 50% or less. An electronic component packaging body, which has: a carrier tape containing electronic components in recesses; and The cover tape for packaging electronic parts according to any one of claims 1 to 10, The sealant layer is side-bonded on the carrier tape to seal the electronic component.

Images