JP2007266638A - 基板の処理方法 - Google Patents
基板の処理方法 Download PDFInfo
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- JP2007266638A JP2007266638A JP2007181729A JP2007181729A JP2007266638A JP 2007266638 A JP2007266638 A JP 2007266638A JP 2007181729 A JP2007181729 A JP 2007181729A JP 2007181729 A JP2007181729 A JP 2007181729A JP 2007266638 A JP2007266638 A JP 2007266638A
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- 239000000758 substrate Substances 0.000 title claims abstract description 454
- 238000003672 processing method Methods 0.000 title description 3
- 238000000034 method Methods 0.000 claims description 30
- 230000032258 transport Effects 0.000 claims description 28
- 230000001965 increasing effect Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 11
- 230000003028 elevating effect Effects 0.000 description 4
- 238000004380 ashing Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007181729A JP2007266638A (ja) | 2007-07-11 | 2007-07-11 | 基板の処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007181729A JP2007266638A (ja) | 2007-07-11 | 2007-07-11 | 基板の処理方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004266631A Division JP4086826B2 (ja) | 2004-09-14 | 2004-09-14 | 基板の処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007266638A true JP2007266638A (ja) | 2007-10-11 |
| JP2007266638A5 JP2007266638A5 (enExample) | 2008-04-03 |
Family
ID=38639259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007181729A Withdrawn JP2007266638A (ja) | 2007-07-11 | 2007-07-11 | 基板の処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007266638A (enExample) |
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2007
- 2007-07-11 JP JP2007181729A patent/JP2007266638A/ja not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070717 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080215 |
|
| A761 | Written withdrawal of application |
Effective date: 20080402 Free format text: JAPANESE INTERMEDIATE CODE: A761 |