JP2007266449A - 高周波モジュール - Google Patents
高周波モジュール Download PDFInfo
- Publication number
- JP2007266449A JP2007266449A JP2006091548A JP2006091548A JP2007266449A JP 2007266449 A JP2007266449 A JP 2007266449A JP 2006091548 A JP2006091548 A JP 2006091548A JP 2006091548 A JP2006091548 A JP 2006091548A JP 2007266449 A JP2007266449 A JP 2007266449A
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- Prior art keywords
- frequency signal
- signal line
- line
- substrate
- base substrate
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/04—Fixed joints
- H01P1/047—Strip line joints
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
- H01L2924/19032—Structure including wave guides being a microstrip line type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Waveguides (AREA)
- Amplifiers (AREA)
Abstract
【解決手段】高周波モジュール1Aにおいて、第1表面2aに第1高周波信号線3aを有し、第1表面2aの反対面である第2表面2bに第1高周波信号線3aに電気的に接続する第2高周波信号線3bを有する線路基板2と、線路基板2の第2表面2bに設けられ、第2高周波信号線3bから離間するように形成されたベース基板4とを備える。
【選択図】図3
Description
本発明の第1の実施の形態について図1ないし図4を参照して説明する。
本発明の第2の実施の形態について図5及び図6を参照して説明する。
本発明の第3の実施の形態について図7を参照して説明する。
なお、本発明は、前述の実施の形態に限るものではなく、その要旨を逸脱しない範囲において種々変更可能である。
Claims (3)
- 第1表面に第1高周波信号線を有し、前記第1表面の反対面である第2表面に前記第1高周波信号線に電気的に接続する第2高周波信号線を有する線路基板と、
前記線路基板の前記第2表面に設けられ、前記第2高周波信号線から離間するように形成されたベース基板と、
を備えることを特徴とする高周波モジュール。 - 前記ベース基板は、前記第2高周波信号線に対向し前記第2高周波信号線から離間する凹部を有していることを特徴とする請求項1記載の高周波モジュール。
- 前記ベース基板は、前記第2高周波信号線から離間する切欠部を有していることを特徴とする請求項1記載の高周波モジュール。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006091548A JP4969885B2 (ja) | 2006-03-29 | 2006-03-29 | 高周波モジュール |
US11/535,329 US7792503B2 (en) | 2006-03-29 | 2006-09-26 | High frequency module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006091548A JP4969885B2 (ja) | 2006-03-29 | 2006-03-29 | 高周波モジュール |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007266449A true JP2007266449A (ja) | 2007-10-11 |
JP2007266449A5 JP2007266449A5 (ja) | 2009-04-16 |
JP4969885B2 JP4969885B2 (ja) | 2012-07-04 |
Family
ID=38559828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006091548A Expired - Fee Related JP4969885B2 (ja) | 2006-03-29 | 2006-03-29 | 高周波モジュール |
Country Status (2)
Country | Link |
---|---|
US (1) | US7792503B2 (ja) |
JP (1) | JP4969885B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2932355A1 (fr) * | 2008-06-06 | 2009-12-11 | Thales Sa | Boitier hyperfrequence a isolation amelioree. |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5019342A (ja) * | 1973-06-20 | 1975-02-28 | ||
JPS648806U (ja) * | 1987-07-03 | 1989-01-18 | ||
JPH0252496A (ja) * | 1988-08-16 | 1990-02-22 | Nippon Telegr & Teleph Corp <Ntt> | プリント配線基板間の高周波配線接続方法 |
JPH0390503U (ja) * | 1989-12-29 | 1991-09-13 | ||
JP2002151915A (ja) * | 2000-11-07 | 2002-05-24 | Matsushita Commun Ind Co Ltd | ミリ波モジュール用基板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3891918B2 (ja) | 2002-10-29 | 2007-03-14 | Tdk株式会社 | 高周波モジュール |
TWI234210B (en) * | 2002-12-03 | 2005-06-11 | Sanyo Electric Co | Semiconductor module and manufacturing method thereof as well as wiring member of thin sheet |
US7330080B1 (en) * | 2004-11-04 | 2008-02-12 | Transmeta Corporation | Ring based impedance control of an output driver |
US20070152739A1 (en) * | 2006-01-03 | 2007-07-05 | Freescale Semiconductor, Inc. | Power management in integrated circuits using process detection |
US7368940B1 (en) * | 2006-06-08 | 2008-05-06 | Xilinx, Inc. | Programmable integrated circuit with selective programming to compensate for process variations and/or mask revisions |
-
2006
- 2006-03-29 JP JP2006091548A patent/JP4969885B2/ja not_active Expired - Fee Related
- 2006-09-26 US US11/535,329 patent/US7792503B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5019342A (ja) * | 1973-06-20 | 1975-02-28 | ||
JPS648806U (ja) * | 1987-07-03 | 1989-01-18 | ||
JPH0252496A (ja) * | 1988-08-16 | 1990-02-22 | Nippon Telegr & Teleph Corp <Ntt> | プリント配線基板間の高周波配線接続方法 |
JPH0390503U (ja) * | 1989-12-29 | 1991-09-13 | ||
JP2002151915A (ja) * | 2000-11-07 | 2002-05-24 | Matsushita Commun Ind Co Ltd | ミリ波モジュール用基板 |
Also Published As
Publication number | Publication date |
---|---|
US7792503B2 (en) | 2010-09-07 |
US20070232247A1 (en) | 2007-10-04 |
JP4969885B2 (ja) | 2012-07-04 |
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