JP2007259439A - マイクロマシニング型のコンビ構成素子ならびに該コンビ構成素子のための製造方法 - Google Patents
マイクロマシニング型のコンビ構成素子ならびに該コンビ構成素子のための製造方法 Download PDFInfo
- Publication number
- JP2007259439A JP2007259439A JP2007064812A JP2007064812A JP2007259439A JP 2007259439 A JP2007259439 A JP 2007259439A JP 2007064812 A JP2007064812 A JP 2007064812A JP 2007064812 A JP2007064812 A JP 2007064812A JP 2007259439 A JP2007259439 A JP 2007259439A
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- JP
- Japan
- Prior art keywords
- conductive
- substrate
- layer
- structured
- sacrificial layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
- Micromachines (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006011545.7A DE102006011545B4 (de) | 2006-03-14 | 2006-03-14 | Mikromechanisches Kombi-Bauelement und entsprechendes Herstellungsverfahren |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007259439A true JP2007259439A (ja) | 2007-10-04 |
Family
ID=38374740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007064812A Pending JP2007259439A (ja) | 2006-03-14 | 2007-03-14 | マイクロマシニング型のコンビ構成素子ならびに該コンビ構成素子のための製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2007259439A (ko) |
KR (1) | KR101056612B1 (ko) |
DE (1) | DE102006011545B4 (ko) |
SE (1) | SE0700501L (ko) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010171368A (ja) * | 2008-12-25 | 2010-08-05 | Denso Corp | 半導体装置およびその製造方法 |
JP2010175482A (ja) * | 2009-01-30 | 2010-08-12 | Rohm Co Ltd | Memsセンサ |
JP2011148084A (ja) * | 2009-12-22 | 2011-08-04 | Commissariat A L'energie Atomique & Aux Energies Alternatives | 構造の平面外変位のための停止部を有する可動部を備える微小機械構造およびその製造プロセス |
JP2011220885A (ja) * | 2010-04-12 | 2011-11-04 | Denso Corp | 力学量検出装置およびその製造方法 |
JP2012058127A (ja) * | 2010-09-10 | 2012-03-22 | Yokogawa Electric Corp | 振動式トランスデューサとその製造方法 |
CN102762490A (zh) * | 2009-12-08 | 2012-10-31 | 飞思卡尔半导体公司 | 具有间隙挡块的微机电系统(mems)及其制造方法 |
JP2013011587A (ja) * | 2011-05-27 | 2013-01-17 | Denso Corp | 力学量センサ装置およびその製造方法 |
JP2013520118A (ja) * | 2010-02-16 | 2013-05-30 | エプコス アクチエンゲゼルシャフト | Memsマイクロフォンと製造方法 |
CN104678125A (zh) * | 2013-11-27 | 2015-06-03 | 中芯国际集成电路制造(上海)有限公司 | Mems加速度传感器的形成方法 |
CN104773705A (zh) * | 2014-01-14 | 2015-07-15 | 罗伯特·博世有限公司 | 微机械压力传感器装置以及相应的制造方法 |
CN114364313A (zh) * | 2019-09-18 | 2022-04-15 | 普和希控股公司 | 电极基板及其制造方法以及使用了这种电极基板的生物传感器 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7829366B2 (en) | 2008-02-29 | 2010-11-09 | Freescale Semiconductor, Inc. | Microelectromechanical systems component and method of making same |
WO2009133506A2 (en) * | 2008-04-29 | 2009-11-05 | Nxp B.V. | Mems device and manufacturing method |
DE102009002376A1 (de) * | 2009-04-15 | 2010-10-21 | Robert Bosch Gmbh | Multichip-Sensormodul und Verfahren dessen Herstellung |
DE102010039057B4 (de) | 2010-08-09 | 2018-06-14 | Robert Bosch Gmbh | Sensormodul |
FR2977319B1 (fr) | 2011-07-01 | 2014-03-14 | Commissariat Energie Atomique | Dispositif de mesure de pression a sensiblite optimisee |
DE102011081033B4 (de) * | 2011-08-16 | 2022-02-17 | Robert Bosch Gmbh | Verfahren zur Herstellung einer mikromechanischen Struktur und mikromechanische Struktur |
EP2693182A1 (en) * | 2012-07-31 | 2014-02-05 | Honeywell International Inc. | On-chip resonant gyro and pressure sensor |
US9562820B2 (en) | 2013-02-28 | 2017-02-07 | Mks Instruments, Inc. | Pressure sensor with real time health monitoring and compensation |
DE102013224623B4 (de) | 2013-11-29 | 2022-10-06 | Robert Bosch Gmbh | Verfahren zur Herstellung eines mikromechanischen Bauelements |
DE102014200507A1 (de) * | 2014-01-14 | 2015-07-16 | Robert Bosch Gmbh | Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren |
DE102014200512B4 (de) | 2014-01-14 | 2017-06-08 | Robert Bosch Gmbh | Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren |
DE102016216207A1 (de) | 2016-08-29 | 2018-03-01 | Robert Bosch Gmbh | Verfahren zum Herstellen eines mikromechanischen Sensors |
DE102016220077A1 (de) * | 2016-10-14 | 2018-04-19 | Robert Bosch Gmbh | Verfahren zum Herstellen eines mikromechanischen Drucksensors |
DE102019202794B3 (de) | 2019-03-01 | 2019-11-07 | Robert Bosch Gmbh | Mikromechanische Sensorvorrichtung und entsprechendes Herstellungsverfahren |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002209299A (ja) * | 2000-12-28 | 2002-07-26 | Toshiba Corp | 半導体振動センサ |
JP2003078981A (ja) * | 2001-09-05 | 2003-03-14 | Nippon Hoso Kyokai <Nhk> | マイクロホン実装回路基板および該基板を搭載する音声処理装置 |
JP2003329704A (ja) * | 2002-05-14 | 2003-11-19 | Mitsubishi Electric Corp | 慣性力センサ、およびその製造方法 |
JP2005268758A (ja) * | 2004-02-06 | 2005-09-29 | General Electric Co <Ge> | 薄く形成されたカンチレバー構造を備えた微小機械装置及び関連の方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69325732T2 (de) * | 1992-03-18 | 2000-04-27 | Knowles Electronics Inc | Festkörper-Kondensatormikrofon |
DE19537814B4 (de) * | 1995-10-11 | 2009-11-19 | Robert Bosch Gmbh | Sensor und Verfahren zur Herstellung eines Sensors |
DE19847455A1 (de) * | 1998-10-15 | 2000-04-27 | Bosch Gmbh Robert | Verfahren zur Bearbeitung von Silizium mittels Ätzprozessen |
US6088463A (en) * | 1998-10-30 | 2000-07-11 | Microtronic A/S | Solid state silicon-based condenser microphone |
US6522762B1 (en) * | 1999-09-07 | 2003-02-18 | Microtronic A/S | Silicon-based sensor system |
JP2001227902A (ja) * | 2000-02-16 | 2001-08-24 | Mitsubishi Electric Corp | 半導体装置 |
DE10017976A1 (de) * | 2000-04-11 | 2001-10-18 | Bosch Gmbh Robert | Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren |
DE10065013B4 (de) * | 2000-12-23 | 2009-12-24 | Robert Bosch Gmbh | Verfahren zum Herstellen eines mikromechanischen Bauelements |
GB0123054D0 (en) * | 2001-09-25 | 2001-11-14 | Randox Lab Ltd | Passive microvalve |
DE10221660B4 (de) * | 2002-05-15 | 2007-12-27 | Infineon Technologies Ag | Verfahren zur Herstellung eines mikromechanischen, kapazitiven Wandlers |
KR100622372B1 (ko) * | 2004-06-01 | 2006-09-19 | 삼성전자주식회사 | 복수개의 구성유닛을 포함하는 자이로센서 및 그 제조방법 |
-
2006
- 2006-03-14 DE DE102006011545.7A patent/DE102006011545B4/de not_active Expired - Fee Related
-
2007
- 2007-03-01 SE SE0700501A patent/SE0700501L/sv not_active Application Discontinuation
- 2007-03-13 KR KR1020070024244A patent/KR101056612B1/ko active IP Right Grant
- 2007-03-14 JP JP2007064812A patent/JP2007259439A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002209299A (ja) * | 2000-12-28 | 2002-07-26 | Toshiba Corp | 半導体振動センサ |
JP2003078981A (ja) * | 2001-09-05 | 2003-03-14 | Nippon Hoso Kyokai <Nhk> | マイクロホン実装回路基板および該基板を搭載する音声処理装置 |
JP2003329704A (ja) * | 2002-05-14 | 2003-11-19 | Mitsubishi Electric Corp | 慣性力センサ、およびその製造方法 |
JP2005268758A (ja) * | 2004-02-06 | 2005-09-29 | General Electric Co <Ge> | 薄く形成されたカンチレバー構造を備えた微小機械装置及び関連の方法 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010171368A (ja) * | 2008-12-25 | 2010-08-05 | Denso Corp | 半導体装置およびその製造方法 |
JP2010175482A (ja) * | 2009-01-30 | 2010-08-12 | Rohm Co Ltd | Memsセンサ |
JP2013512792A (ja) * | 2009-12-08 | 2013-04-18 | フリースケール セミコンダクター インコーポレイテッド | ギャップ停止部を有した微小電気機械システム(mems)およびそのための方法 |
CN102762490A (zh) * | 2009-12-08 | 2012-10-31 | 飞思卡尔半导体公司 | 具有间隙挡块的微机电系统(mems)及其制造方法 |
JP2011148084A (ja) * | 2009-12-22 | 2011-08-04 | Commissariat A L'energie Atomique & Aux Energies Alternatives | 構造の平面外変位のための停止部を有する可動部を備える微小機械構造およびその製造プロセス |
US9061895B2 (en) | 2009-12-22 | 2015-06-23 | Commissariat à l'énergie atomique et aux énergies alternatives | Micromechanical structure comprising a mobile part having stops for out-of plane displacements of the structure and its production process |
JP2013520118A (ja) * | 2010-02-16 | 2013-05-30 | エプコス アクチエンゲゼルシャフト | Memsマイクロフォンと製造方法 |
US9133016B2 (en) | 2010-02-16 | 2015-09-15 | Epcos Ag | MEMS microphone and method for manufacture |
US8604565B2 (en) | 2010-04-12 | 2013-12-10 | Denso Corporation | Physical quantity detection device and method for manufacturing the same |
JP2011220885A (ja) * | 2010-04-12 | 2011-11-04 | Denso Corp | 力学量検出装置およびその製造方法 |
JP2012058127A (ja) * | 2010-09-10 | 2012-03-22 | Yokogawa Electric Corp | 振動式トランスデューサとその製造方法 |
JP2013011587A (ja) * | 2011-05-27 | 2013-01-17 | Denso Corp | 力学量センサ装置およびその製造方法 |
US8829627B2 (en) | 2011-05-27 | 2014-09-09 | Denso Corporation | Dynamic quantity sensor device and manufacturing method of the same |
CN104678125A (zh) * | 2013-11-27 | 2015-06-03 | 中芯国际集成电路制造(上海)有限公司 | Mems加速度传感器的形成方法 |
CN104773705A (zh) * | 2014-01-14 | 2015-07-15 | 罗伯特·博世有限公司 | 微机械压力传感器装置以及相应的制造方法 |
CN104773705B (zh) * | 2014-01-14 | 2021-10-08 | 罗伯特·博世有限公司 | 微机械压力传感器装置以及相应的制造方法 |
CN114364313A (zh) * | 2019-09-18 | 2022-04-15 | 普和希控股公司 | 电极基板及其制造方法以及使用了这种电极基板的生物传感器 |
Also Published As
Publication number | Publication date |
---|---|
KR20070093837A (ko) | 2007-09-19 |
DE102006011545A1 (de) | 2007-09-20 |
SE0700501L (sv) | 2007-09-15 |
KR101056612B1 (ko) | 2011-08-11 |
DE102006011545B4 (de) | 2016-03-17 |
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