JP2007259439A - マイクロマシニング型のコンビ構成素子ならびに該コンビ構成素子のための製造方法 - Google Patents

マイクロマシニング型のコンビ構成素子ならびに該コンビ構成素子のための製造方法 Download PDF

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Publication number
JP2007259439A
JP2007259439A JP2007064812A JP2007064812A JP2007259439A JP 2007259439 A JP2007259439 A JP 2007259439A JP 2007064812 A JP2007064812 A JP 2007064812A JP 2007064812 A JP2007064812 A JP 2007064812A JP 2007259439 A JP2007259439 A JP 2007259439A
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Japan
Prior art keywords
conductive
substrate
layer
structured
sacrificial layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007064812A
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English (en)
Japanese (ja)
Inventor
Frank Reichenbach
ライヒェンバッハ フランク
Frank Fischer
フィッシャー フランク
Christoph Schelling
シェリング クリストフ
Arnim Hoechst
ヘヒスト アルニム
Stefan Weiss
ヴァイス シュテファン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JP2007259439A publication Critical patent/JP2007259439A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
JP2007064812A 2006-03-14 2007-03-14 マイクロマシニング型のコンビ構成素子ならびに該コンビ構成素子のための製造方法 Pending JP2007259439A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006011545.7A DE102006011545B4 (de) 2006-03-14 2006-03-14 Mikromechanisches Kombi-Bauelement und entsprechendes Herstellungsverfahren

Publications (1)

Publication Number Publication Date
JP2007259439A true JP2007259439A (ja) 2007-10-04

Family

ID=38374740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007064812A Pending JP2007259439A (ja) 2006-03-14 2007-03-14 マイクロマシニング型のコンビ構成素子ならびに該コンビ構成素子のための製造方法

Country Status (4)

Country Link
JP (1) JP2007259439A (ko)
KR (1) KR101056612B1 (ko)
DE (1) DE102006011545B4 (ko)
SE (1) SE0700501L (ko)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171368A (ja) * 2008-12-25 2010-08-05 Denso Corp 半導体装置およびその製造方法
JP2010175482A (ja) * 2009-01-30 2010-08-12 Rohm Co Ltd Ｍｅｍｓセンサ
JP2011148084A (ja) * 2009-12-22 2011-08-04 Commissariat A L'energie Atomique & Aux Energies Alternatives 構造の平面外変位のための停止部を有する可動部を備える微小機械構造およびその製造プロセス
JP2011220885A (ja) * 2010-04-12 2011-11-04 Denso Corp 力学量検出装置およびその製造方法
JP2012058127A (ja) * 2010-09-10 2012-03-22 Yokogawa Electric Corp 振動式トランスデューサとその製造方法
CN102762490A (zh) * 2009-12-08 2012-10-31 飞思卡尔半导体公司 具有间隙挡块的微机电系统（mems）及其制造方法
JP2013011587A (ja) * 2011-05-27 2013-01-17 Denso Corp 力学量センサ装置およびその製造方法
JP2013520118A (ja) * 2010-02-16 2013-05-30 エプコス アクチエンゲゼルシャフト Ｍｅｍｓマイクロフォンと製造方法
CN104678125A (zh) * 2013-11-27 2015-06-03 中芯国际集成电路制造(上海)有限公司 Mems加速度传感器的形成方法
CN104773705A (zh) * 2014-01-14 2015-07-15 罗伯特·博世有限公司 微机械压力传感器装置以及相应的制造方法
CN114364313A (zh) * 2019-09-18 2022-04-15 普和希控股公司 电极基板及其制造方法以及使用了这种电极基板的生物传感器

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7829366B2 (en) 2008-02-29 2010-11-09 Freescale Semiconductor, Inc. Microelectromechanical systems component and method of making same
WO2009133506A2 (en) * 2008-04-29 2009-11-05 Nxp B.V. Mems device and manufacturing method
DE102009002376A1 (de) * 2009-04-15 2010-10-21 Robert Bosch Gmbh Multichip-Sensormodul und Verfahren dessen Herstellung
DE102010039057B4 (de) 2010-08-09 2018-06-14 Robert Bosch Gmbh Sensormodul
FR2977319B1 (fr) 2011-07-01 2014-03-14 Commissariat Energie Atomique Dispositif de mesure de pression a sensiblite optimisee
DE102011081033B4 (de) * 2011-08-16 2022-02-17 Robert Bosch Gmbh Verfahren zur Herstellung einer mikromechanischen Struktur und mikromechanische Struktur
EP2693182A1 (en) * 2012-07-31 2014-02-05 Honeywell International Inc. On-chip resonant gyro and pressure sensor
US9562820B2 (en) 2013-02-28 2017-02-07 Mks Instruments, Inc. Pressure sensor with real time health monitoring and compensation
DE102013224623B4 (de) 2013-11-29 2022-10-06 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Bauelements
DE102014200512B4 (de) * 2014-01-14 2017-06-08 Robert Bosch Gmbh Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren
DE102014200507A1 (de) 2014-01-14 2015-07-16 Robert Bosch Gmbh Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren
DE102016216207A1 (de) 2016-08-29 2018-03-01 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Sensors
DE102016220077A1 (de) * 2016-10-14 2018-04-19 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Drucksensors
DE102019202794B3 (de) * 2019-03-01 2019-11-07 Robert Bosch Gmbh Mikromechanische Sensorvorrichtung und entsprechendes Herstellungsverfahren

Citations (4)

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JP2002209299A (ja) * 2000-12-28 2002-07-26 Toshiba Corp 半導体振動センサ
JP2003078981A (ja) * 2001-09-05 2003-03-14 Nippon Hoso Kyokai <Nhk> マイクロホン実装回路基板および該基板を搭載する音声処理装置
JP2003329704A (ja) * 2002-05-14 2003-11-19 Mitsubishi Electric Corp 慣性力センサ、およびその製造方法
JP2005268758A (ja) * 2004-02-06 2005-09-29 General Electric Co <Ge> 薄く形成されたカンチレバー構造を備えた微小機械装置及び関連の方法

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DE69325732T2 (de) * 1992-03-18 2000-04-27 Knowles Electronics Inc Festkörper-Kondensatormikrofon
DE19537814B4 (de) * 1995-10-11 2009-11-19 Robert Bosch Gmbh Sensor und Verfahren zur Herstellung eines Sensors
DE19847455A1 (de) * 1998-10-15 2000-04-27 Bosch Gmbh Robert Verfahren zur Bearbeitung von Silizium mittels Ätzprozessen
US6088463A (en) * 1998-10-30 2000-07-11 Microtronic A/S Solid state silicon-based condenser microphone
US6522762B1 (en) * 1999-09-07 2003-02-18 Microtronic A/S Silicon-based sensor system
JP2001227902A (ja) * 2000-02-16 2001-08-24 Mitsubishi Electric Corp 半導体装置
DE10017976A1 (de) * 2000-04-11 2001-10-18 Bosch Gmbh Robert Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
DE10065013B4 (de) * 2000-12-23 2009-12-24 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Bauelements
GB0123054D0 (en) * 2001-09-25 2001-11-14 Randox Lab Ltd Passive microvalve
DE10221660B4 (de) * 2002-05-15 2007-12-27 Infineon Technologies Ag Verfahren zur Herstellung eines mikromechanischen, kapazitiven Wandlers
KR100622372B1 (ko) * 2004-06-01 2006-09-19 삼성전자주식회사 복수개의 구성유닛을 포함하는 자이로센서 및 그 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002209299A (ja) * 2000-12-28 2002-07-26 Toshiba Corp 半導体振動センサ
JP2003078981A (ja) * 2001-09-05 2003-03-14 Nippon Hoso Kyokai <Nhk> マイクロホン実装回路基板および該基板を搭載する音声処理装置
JP2003329704A (ja) * 2002-05-14 2003-11-19 Mitsubishi Electric Corp 慣性力センサ、およびその製造方法
JP2005268758A (ja) * 2004-02-06 2005-09-29 General Electric Co <Ge> 薄く形成されたカンチレバー構造を備えた微小機械装置及び関連の方法

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171368A (ja) * 2008-12-25 2010-08-05 Denso Corp 半導体装置およびその製造方法
JP2010175482A (ja) * 2009-01-30 2010-08-12 Rohm Co Ltd Ｍｅｍｓセンサ
JP2013512792A (ja) * 2009-12-08 2013-04-18 フリースケール セミコンダクター インコーポレイテッド ギャップ停止部を有した微小電気機械システム（ｍｅｍｓ）およびそのための方法
CN102762490A (zh) * 2009-12-08 2012-10-31 飞思卡尔半导体公司 具有间隙挡块的微机电系统（mems）及其制造方法
JP2011148084A (ja) * 2009-12-22 2011-08-04 Commissariat A L'energie Atomique & Aux Energies Alternatives 構造の平面外変位のための停止部を有する可動部を備える微小機械構造およびその製造プロセス
US9061895B2 (en) 2009-12-22 2015-06-23 Commissariat à l'énergie atomique et aux énergies alternatives Micromechanical structure comprising a mobile part having stops for out-of plane displacements of the structure and its production process
JP2013520118A (ja) * 2010-02-16 2013-05-30 エプコス アクチエンゲゼルシャフト Ｍｅｍｓマイクロフォンと製造方法
US9133016B2 (en) 2010-02-16 2015-09-15 Epcos Ag MEMS microphone and method for manufacture
US8604565B2 (en) 2010-04-12 2013-12-10 Denso Corporation Physical quantity detection device and method for manufacturing the same
JP2011220885A (ja) * 2010-04-12 2011-11-04 Denso Corp 力学量検出装置およびその製造方法
JP2012058127A (ja) * 2010-09-10 2012-03-22 Yokogawa Electric Corp 振動式トランスデューサとその製造方法
JP2013011587A (ja) * 2011-05-27 2013-01-17 Denso Corp 力学量センサ装置およびその製造方法
US8829627B2 (en) 2011-05-27 2014-09-09 Denso Corporation Dynamic quantity sensor device and manufacturing method of the same
CN104678125A (zh) * 2013-11-27 2015-06-03 中芯国际集成电路制造(上海)有限公司 Mems加速度传感器的形成方法
CN104773705A (zh) * 2014-01-14 2015-07-15 罗伯特·博世有限公司 微机械压力传感器装置以及相应的制造方法
CN104773705B (zh) * 2014-01-14 2021-10-08 罗伯特·博世有限公司 微机械压力传感器装置以及相应的制造方法
CN114364313A (zh) * 2019-09-18 2022-04-15 普和希控股公司 电极基板及其制造方法以及使用了这种电极基板的生物传感器

Also Published As

Publication number Publication date
DE102006011545B4 (de) 2016-03-17
DE102006011545A1 (de) 2007-09-20
KR20070093837A (ko) 2007-09-19
KR101056612B1 (ko) 2011-08-11
SE0700501L (sv) 2007-09-15

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