SE0700501L - Mikromekaniskt kombielement och motsvarande framställningsförfarande - Google Patents
Mikromekaniskt kombielement och motsvarande framställningsförfarandeInfo
- Publication number
- SE0700501L SE0700501L SE0700501A SE0700501A SE0700501L SE 0700501 L SE0700501 L SE 0700501L SE 0700501 A SE0700501 A SE 0700501A SE 0700501 A SE0700501 A SE 0700501A SE 0700501 L SE0700501 L SE 0700501L
- Authority
- SE
- Sweden
- Prior art keywords
- manufacturing procedure
- corresponding manufacturing
- combination element
- micromechanical combination
- micromechanical
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Chemical & Material Sciences (AREA)
- Pressure Sensors (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Measuring Fluid Pressure (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006011545.7A DE102006011545B4 (de) | 2006-03-14 | 2006-03-14 | Mikromechanisches Kombi-Bauelement und entsprechendes Herstellungsverfahren |
Publications (1)
Publication Number | Publication Date |
---|---|
SE0700501L true SE0700501L (sv) | 2007-09-15 |
Family
ID=38374740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0700501A SE0700501L (sv) | 2006-03-14 | 2007-03-01 | Mikromekaniskt kombielement och motsvarande framställningsförfarande |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2007259439A (ko) |
KR (1) | KR101056612B1 (ko) |
DE (1) | DE102006011545B4 (ko) |
SE (1) | SE0700501L (ko) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7829366B2 (en) | 2008-02-29 | 2010-11-09 | Freescale Semiconductor, Inc. | Microelectromechanical systems component and method of making same |
WO2009133506A2 (en) * | 2008-04-29 | 2009-11-05 | Nxp B.V. | Mems device and manufacturing method |
JP4924663B2 (ja) * | 2008-12-25 | 2012-04-25 | 株式会社デンソー | 半導体装置およびその製造方法 |
JP5260342B2 (ja) * | 2009-01-30 | 2013-08-14 | ローム株式会社 | Memsセンサ |
DE102009002376A1 (de) * | 2009-04-15 | 2010-10-21 | Robert Bosch Gmbh | Multichip-Sensormodul und Verfahren dessen Herstellung |
US8119431B2 (en) * | 2009-12-08 | 2012-02-21 | Freescale Semiconductor, Inc. | Method of forming a micro-electromechanical system (MEMS) having a gap stop |
FR2954505B1 (fr) | 2009-12-22 | 2012-08-03 | Commissariat Energie Atomique | Structure micromecanique comportant une partie mobile presentant des butees pour des deplacements hors plan de la structure et son procede de realisation |
DE102010008044B4 (de) | 2010-02-16 | 2016-11-24 | Epcos Ag | MEMS-Mikrofon und Verfahren zur Herstellung |
JP5206726B2 (ja) * | 2010-04-12 | 2013-06-12 | 株式会社デンソー | 力学量検出装置およびその製造方法 |
DE102010039057B4 (de) | 2010-08-09 | 2018-06-14 | Robert Bosch Gmbh | Sensormodul |
JP5158160B2 (ja) * | 2010-09-10 | 2013-03-06 | 横河電機株式会社 | 振動式トランスデューサ |
JP5541306B2 (ja) | 2011-05-27 | 2014-07-09 | 株式会社デンソー | 力学量センサ装置およびその製造方法 |
FR2977319B1 (fr) | 2011-07-01 | 2014-03-14 | Commissariat Energie Atomique | Dispositif de mesure de pression a sensiblite optimisee |
DE102011081033B4 (de) * | 2011-08-16 | 2022-02-17 | Robert Bosch Gmbh | Verfahren zur Herstellung einer mikromechanischen Struktur und mikromechanische Struktur |
EP2693182A1 (en) * | 2012-07-31 | 2014-02-05 | Honeywell International Inc. | On-chip resonant gyro and pressure sensor |
US9562820B2 (en) | 2013-02-28 | 2017-02-07 | Mks Instruments, Inc. | Pressure sensor with real time health monitoring and compensation |
CN104678125B (zh) * | 2013-11-27 | 2019-07-02 | 中芯国际集成电路制造(上海)有限公司 | Mems加速度传感器的形成方法 |
DE102013224623B4 (de) | 2013-11-29 | 2022-10-06 | Robert Bosch Gmbh | Verfahren zur Herstellung eines mikromechanischen Bauelements |
DE102014200500A1 (de) | 2014-01-14 | 2015-07-16 | Robert Bosch Gmbh | Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren |
DE102014200507A1 (de) * | 2014-01-14 | 2015-07-16 | Robert Bosch Gmbh | Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren |
DE102014200512B4 (de) * | 2014-01-14 | 2017-06-08 | Robert Bosch Gmbh | Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren |
DE102016216207A1 (de) | 2016-08-29 | 2018-03-01 | Robert Bosch Gmbh | Verfahren zum Herstellen eines mikromechanischen Sensors |
DE102016220077A1 (de) * | 2016-10-14 | 2018-04-19 | Robert Bosch Gmbh | Verfahren zum Herstellen eines mikromechanischen Drucksensors |
DE102019202794B3 (de) | 2019-03-01 | 2019-11-07 | Robert Bosch Gmbh | Mikromechanische Sensorvorrichtung und entsprechendes Herstellungsverfahren |
JPWO2021054081A1 (ko) * | 2019-09-18 | 2021-03-25 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69325732T2 (de) * | 1992-03-18 | 2000-04-27 | Knowles Electronics Inc | Festkörper-Kondensatormikrofon |
DE19537814B4 (de) * | 1995-10-11 | 2009-11-19 | Robert Bosch Gmbh | Sensor und Verfahren zur Herstellung eines Sensors |
DE19847455A1 (de) * | 1998-10-15 | 2000-04-27 | Bosch Gmbh Robert | Verfahren zur Bearbeitung von Silizium mittels Ätzprozessen |
US6088463A (en) * | 1998-10-30 | 2000-07-11 | Microtronic A/S | Solid state silicon-based condenser microphone |
US6522762B1 (en) * | 1999-09-07 | 2003-02-18 | Microtronic A/S | Silicon-based sensor system |
JP2001227902A (ja) * | 2000-02-16 | 2001-08-24 | Mitsubishi Electric Corp | 半導体装置 |
DE10017976A1 (de) * | 2000-04-11 | 2001-10-18 | Bosch Gmbh Robert | Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren |
DE10065013B4 (de) * | 2000-12-23 | 2009-12-24 | Robert Bosch Gmbh | Verfahren zum Herstellen eines mikromechanischen Bauelements |
JP2002209299A (ja) * | 2000-12-28 | 2002-07-26 | Toshiba Corp | 半導体振動センサ |
JP2003078981A (ja) * | 2001-09-05 | 2003-03-14 | Nippon Hoso Kyokai <Nhk> | マイクロホン実装回路基板および該基板を搭載する音声処理装置 |
GB0123054D0 (en) * | 2001-09-25 | 2001-11-14 | Randox Lab Ltd | Passive microvalve |
JP2003329704A (ja) * | 2002-05-14 | 2003-11-19 | Mitsubishi Electric Corp | 慣性力センサ、およびその製造方法 |
DE10221660B4 (de) * | 2002-05-15 | 2007-12-27 | Infineon Technologies Ag | Verfahren zur Herstellung eines mikromechanischen, kapazitiven Wandlers |
US20050172717A1 (en) * | 2004-02-06 | 2005-08-11 | General Electric Company | Micromechanical device with thinned cantilever structure and related methods |
KR100622372B1 (ko) * | 2004-06-01 | 2006-09-19 | 삼성전자주식회사 | 복수개의 구성유닛을 포함하는 자이로센서 및 그 제조방법 |
-
2006
- 2006-03-14 DE DE102006011545.7A patent/DE102006011545B4/de not_active Expired - Fee Related
-
2007
- 2007-03-01 SE SE0700501A patent/SE0700501L/sv not_active Application Discontinuation
- 2007-03-13 KR KR1020070024244A patent/KR101056612B1/ko active IP Right Grant
- 2007-03-14 JP JP2007064812A patent/JP2007259439A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE102006011545B4 (de) | 2016-03-17 |
KR20070093837A (ko) | 2007-09-19 |
JP2007259439A (ja) | 2007-10-04 |
KR101056612B1 (ko) | 2011-08-11 |
DE102006011545A1 (de) | 2007-09-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SE0700501L (sv) | Mikromekaniskt kombielement och motsvarande framställningsförfarande | |
DE502006003041D1 (de) | Anschlusselement | |
BRPI0812367A2 (pt) | Dispositivos interoclusais e respectivos métodos de fabrico | |
NO20050756D0 (no) | Mikroelektromekaniske anordninger | |
BRPI0716318A2 (pt) | Faixa compressora | |
DE602007010795D1 (de) | Blattsauger und -häcksler | |
DE502006007925D1 (de) | Filterelement | |
ATE546437T1 (de) | Aminomethyl-4-imidazole | |
ITMI20070119A1 (it) | Componente micromeccanica e relativo procedimento di fabbricazione | |
DE602006005328D1 (de) | Differentialgehäuse | |
DE602007001179D1 (de) | Vibrationsdämpfendes Element | |
ATE520316T1 (de) | Ballaststoff | |
DE602007012951D1 (de) | Verbundschraubenausräumtür | |
DE602007011008D1 (de) | Optische Verbindungsteile und optische Verbindungsstruktur | |
BRPI0719956A2 (pt) | Radiofluoração | |
DE102005011601A8 (de) | Abreißkupplung | |
DE602007003298D1 (de) | Koppelelement | |
FR2908124B1 (fr) | Actionneur micromecanique | |
DE602006018979D1 (de) | Strahltrennendes optisches element | |
DE502006008302D1 (de) | Filterelement | |
FR2881416B1 (fr) | Microresonateur | |
AT8539U3 (de) | Lärmschutz-element | |
DK1846959T3 (da) | Piezoelektrisk element | |
AT504332B8 (de) | Chokerseil und chokerseilsystem | |
SE0801757L (sv) | Väggelement |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |