JP2007235114A5 - - Google Patents

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Publication number
JP2007235114A5
JP2007235114A5 JP2007019166A JP2007019166A JP2007235114A5 JP 2007235114 A5 JP2007235114 A5 JP 2007235114A5 JP 2007019166 A JP2007019166 A JP 2007019166A JP 2007019166 A JP2007019166 A JP 2007019166A JP 2007235114 A5 JP2007235114 A5 JP 2007235114A5
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JP
Japan
Prior art keywords
roller
elements
semiconductor integrated
integrated circuits
holding portions
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Application number
JP2007019166A
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English (en)
Japanese (ja)
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JP4912900B2 (ja
JP2007235114A (ja
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Priority to JP2007019166A priority Critical patent/JP4912900B2/ja
Priority claimed from JP2007019166A external-priority patent/JP4912900B2/ja
Publication of JP2007235114A publication Critical patent/JP2007235114A/ja
Publication of JP2007235114A5 publication Critical patent/JP2007235114A5/ja
Application granted granted Critical
Publication of JP4912900B2 publication Critical patent/JP4912900B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007019166A 2006-02-03 2007-01-30 半導体装置の作製方法 Expired - Fee Related JP4912900B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007019166A JP4912900B2 (ja) 2006-02-03 2007-01-30 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006027737 2006-02-03
JP2006027737 2006-02-03
JP2007019166A JP4912900B2 (ja) 2006-02-03 2007-01-30 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2007235114A JP2007235114A (ja) 2007-09-13
JP2007235114A5 true JP2007235114A5 (enExample) 2010-03-11
JP4912900B2 JP4912900B2 (ja) 2012-04-11

Family

ID=38555337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007019166A Expired - Fee Related JP4912900B2 (ja) 2006-02-03 2007-01-30 半導体装置の作製方法

Country Status (1)

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JP (1) JP4912900B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY168368A (en) 2010-10-14 2018-10-31 Stora Enso Oyj Method and arrangement for attaching a chip to a printed conductive surface
WO2013051395A1 (ja) * 2011-10-07 2013-04-11 シャープ株式会社 接着装置およびそれを用いて作製した接着基板
KR102417917B1 (ko) * 2016-04-26 2022-07-07 삼성전자주식회사 공정 시스템 및 그 동작 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169423A (ja) * 1986-01-22 1987-07-25 Hitachi Ltd 部品移載装置
JPS62274636A (ja) * 1986-05-22 1987-11-28 Mitsubishi Electric Corp ボンデイング装置
JP2628392B2 (ja) * 1990-01-16 1997-07-09 新明和工業株式会社 Ｉｃパッケージのハンドリング方法
JP3255065B2 (ja) * 1997-01-22 2002-02-12 松下電器産業株式会社 チップの搭載装置
JP4480840B2 (ja) * 2000-03-23 2010-06-16 パナソニック株式会社 部品実装装置、及び部品実装方法
JP2005522046A (ja) * 2002-04-04 2005-07-21 シリナー，ゲオルグ，ルドルフ 電気部品とくに半導体チップを処理するためのプロセス、およびこのプロセスを実行するための装置
JP2004356376A (ja) * 2003-05-29 2004-12-16 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
JP2005215754A (ja) * 2004-01-27 2005-08-11 Dainippon Printing Co Ltd Ｉｃタグ付シートの製造方法およびその製造装置

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