TW200844023A - Substrate tranfer robot - Google Patents

Substrate tranfer robot Download PDF

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Publication number
TW200844023A
TW200844023A TW097115769A TW97115769A TW200844023A TW 200844023 A TW200844023 A TW 200844023A TW 097115769 A TW097115769 A TW 097115769A TW 97115769 A TW97115769 A TW 97115769A TW 200844023 A TW200844023 A TW 200844023A
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TW
Taiwan
Prior art keywords
substrate
tension
cantilever
transfer robot
line
Prior art date
Application number
TW097115769A
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Chinese (zh)
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TWI392632B (en
Inventor
Jun-Mo Jung
Yong-O Kim
Gi-Chan Han
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Sfa Engineering Corp
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Publication of TWI392632B publication Critical patent/TWI392632B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Abstract

A substrate transfer robot a robot main body, a plurality of fingers having one end coupled to the robot main body and supporting a substrate, and a tension application portion coupled to at least one of the fingers and the robot main body and applying a tension force to the fingers in a direction opposite to a direction in which the weight of the substrate is applied, to prevent sagging of the at least one of the fingers. The increase in the thickness of the finger and the sagging and deformation of the finger due to the weight of the substrate can be prevented.

Description

200844023 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種基板傳送機器人,且特別是有關 於一種可避免增加懸臂(finger)厚度,並同時可避免因基板 (如玻璃)重量而使懸臂變形下垂之基板傳送機器人。 【先前技術】200844023 IX. Description of the Invention: [Technical Field] The present invention relates to a substrate transfer robot, and more particularly to avoiding an increase in the thickness of a finger while avoiding the weight of a substrate such as glass. A substrate transfer robot that deforms the cantilever by sagging. [Prior Art]

k到基板’一般會關聯平面顯示器(flat panei display, FPD)、半導體晶圓(semiconductor wafer)以及玻璃光罩 (photo mask glass),其中平面顯示器可如液晶顯示器(liquid crystal display,LCD)、電漿顯示器(piasma diSpiay panei, PDP)以及有機電激發光顯示器(〇rganic丨丨幽⑽出丨叩出流, OLED)。如平面顯示器之基板與如半導體晶圓之基板在材 料或是應用上都非常不同,不過在基板的U製程中卻 有著本質上的相同,例如曝光、顯影、蝕刻、脫料⑼ripper)、 清洗_ing)以及洗淨(cleaning)。#這些製程依序完成 後,便完成製作基板。 如此-來’以下所敘述之基板可視為包含前述之所有 基板。然而,為求方便解說,在以下的敘述中,基板會參 造特別如液晶顯示器基板或是電«示n基板之平面顯示 器0 當,^造商製作出基板後,便會將基板提供至基板 般Γ胃的條板箱一e)便是‘㈣ 板製程公司,且條板箱可被理解為容 置數十到數百们基板的容置體。—般而言,12Q〜細片基 5 200844023 板可被裝载在一個條板箱内。 當裝載基板之條板箱從基板製造商被運送到基板製程 公司後’基板製程公司會透過玻璃投片系統將這些基板一 片片投入後績的程序。一個獨立的基板傳送機器人會將這 些待技片的基板裝載至俗稱卡匣(cassette)之基板承載裝 置,一般而言,數十到數百個基板可被裝載在一個卡匣内。 當特定數量的基板裝載至卡匣後,卡匣會被傳送以進行適 當的製程。接著,基板傳送機器人會將這些基板一片片拾 -f) 取(Pick up)進行製程,以完成製程步驟。 由於基板傳送機器人是安排在不同的製程中(如對基 板進行製程或是搬運基板),因此基板傳送機器人必須具有 對應此製程的結構與形狀。然而,以基板傳送機器人裝載 基板至卡匣或是自卡匣拾取基板而言,基板傳送機器人一 般是製造成懸臂式(cantilever)以避免與卡匣干擾而污染基 板,並同時將接觸基板的面積最小化以穩定傳送機板。韓 國第10-2006_0056654號與第10-2004-0104983號公開專利 ^ 已揭露此懸臂式之基板傳送機器人。 ‘近來,基板的水平/垂直長度已經增加到 1950mm/2250mm或1870mm/2200mm之七代廠尺寸或是 2160mm/2460mm之八代廠尺寸。不僅是基板尺寸,基板重 量亦同時增加。 如此一來,當以前述文件所揭露之技術而利用現有廠 房中懸臂式之基板傳送機器人來傳送大型基板時,從基板 下方支撐基板的懸臂(finger)將會因為基板重量而下垂 (sag)。當懸臂因下垂而造成形變時,懸臂便很難準確地自 6 200844023 卡Ε中取出或插入基板。再者, 撞卡Ε,鼓因此而損壞。以很有可能會接觸或碰 有鑑於此,如何傳送大 … 垂而形變的方法如今正被大‘亚(免基板因為懸臂下 將基板傳送機器人之懸臂:::2其中—種方法便是 懸臂重量並增加懸臂強户^ 空官結構,藉此以降低 基板的趨勢,僅用此方;二而’考量到當今大型化尺寸 Ο 彎折強度,進而避免;夠:度的懸臂以提升懸臂的 時,為輕在取$或插—=’的厚度增加 ΐ載間的間隔亦需對應增加。當卡匠中 時間(Tact time)。 便^產生製程損耗而使降低稼動 从一種基板傳送機器人需要被提出,其中此 基板傳送機為人可傳译士别盆4 臂下垂而形變,且^ 大縣板不會因為懸 數量。 不會減少裝载在單位卡匣中的基板 【發明内容】 機哭Ϊ解或是其他問題’本發明提供-種基板傳送 ^二臂增加懸臂厚度,並同時可避免因基板重 里而使懸臂變形下垂。 人,:之目的’本發明提出一種基板傳送機器 主體、多個懸臂以及張力施展部(tension 200844023 application portion),其中縣卷 體,並用於支稽基板,且張端是連接至機器人本 懸臂以及連接機器人本體^至少連接至其中一個 力,又張力的方向與基板重懸臂施加張 避免其中-個懸臂下垂。 加的方向相反,以至少 在本發明之一實施例中, 張力施展線,而張力施展緣之一端也展錢少可為 Γ ί. 懸臂之開放端部,且張力施=〉、連接至其中一個 本體。 、、策之另一端是連接至機器人 在本發明之一實施例中, 為多個,且這些張力施展線3一=之張力施展線的數量可 在本發明之一實施例中疋 ^應裝備至這些懸臂。 包括連接部,而連接部將張力施2基板傳送機器人更可 臂以及機器人本體。 、綠之兩端連接至每個懸 在本發明之一實施例中,上 、 旋鈕,而套蓋是連接至每個蟻二之連接部可包括套蓋與 力施展線之一端,且旋鈕是ς二的開放端部,並連接至張 張力施展線之另一端。疋 至機器人本體,並連接至 在本發明之一實施例中,上 與柄手部,而繞索捲筒是將張=之旋鈕可包括繞索捲筒 鬆,而張力施展線之—端是連χ施展線之另一端繞緊或放 反方向旋轉繞索捲筒以1 套蓋,且柄手部是以順、 在本發明之一實施:;張:施展線之張力。 空的結構,而張力施展線是 j之懸臂可製作成具有中 在本發明之—實_中,=懸臂中。 建之張力施展線可配置在 200844023 每個懸臂之外側表面。此外,線溝槽更可形成於每個懸臂 之外表面,以至少容置部份張力施展線。 在本發明之一實施例中,上述之多個張力施展線可配 置於每個懸臂。 • 在本發明之一貫施例中,上述之每個懸臂更形成多個 真空孔洞以吸附基板,且基板可為大型平面顯示器,而平 面顯示器選自液晶顯示器、電漿顯示器以及有機電激發光 顯不為之'一*。 〇 【實施方式】 一為表本發明之上述和其他目的、特徵和優點能更明顯 易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說 明如下。 “基板一般可指向關聯平面顯示器、半導體晶圓以及玻 璃光罩.,其中平面顯示器可如液晶顯示器、電漿顯示器以 及有機電激發光顯示器。在以下的敘述中,基板會認定為 U ^型的液晶顯示器或電漿顯示器基板。儘管大型基板一般 疋4日水平/垂直長度為1950mm/2250mm 或 1870mm/2200mm之七代廠尺寸或是216〇imn/2460mm之八 代廠尺寸的基板,不過本發明之權利範圍並不限定基板的 尺寸,亦不限定圖示中實施例的樣式。 圖一為依據本發明第一實施例之基板傳送機器人的透 視示意圖。圖二為圖—之基板傳送機器人的局部放大圖。 圖三為圖二之基板傳送機器人的側視示意圖。圖四為沿著 圖一中A-A連線的剖面圖。 9 200844023 如圖一至圖四所示,依據本實施例之基板傳送機器 之結構為懸臂式’而基板傳送機器人包括機器人主體⑺ ,多個懸臂,其中懸臂2Ga之—端是連接至機器 10’而懸臂20a是用於支樓基板〇。機器人主體1〇 二::及:二?Γχ至少一個方向進行旋轉、線 ,及向上或向下移動。臂桿12是連接 而支撐部14是固定於地面或其 〇 14’ Ο c 被地面或獨立結構所支稽。當臂二::,未綠示),並 旋轉、線性移動以及向上或4= 相;=,行 機态人主體10便可將基板G 、〜' 1 a連同 示))取出或插人。 自^_方(如卡以未繪 儘管圖示中並未描緣出細部結構,除了 ,明更可提供真空裝置(未飨示)於 ;:乂:, 產生真空狀態。當基板G安置為 人中以 便會從形成於懸臂20a上的真3上時,真空裝置 來,便可預防被懸臂20a所支斤^ =及入空氣。如此一 離。由於本發明之權利範圍未;^自懸臂20a上脫 明仍可應用在沒有真空裝置或是二:、同,,所以本發 機器人上。 ”二孔/问21的基板傳送 懸臂20a是連接至機器人太 之一端是連接至機器人本體1G 臂如即每個懸臂2〇a 外開放。具有前述型式之結構另一端是向 在本實施例中,共有五個縣生 排列。一般習知採用兩個懸臂;二人,:、預訂寬度間隔 中,不過以本實施例而言,僅 破用於工廠設備 僅如用兩個懸臂本質上不足以 10 200844023 傳送大型基板。 在本實施例中,五個懸臂20a是用來連接至機器人本 體10以有效傳送相對較大較重之基板G。然而,由於本發 明之權利範圍未限制前述,因此懸臂20a的數量可大於% 小於五個。為求方便說明,相同的參考標號適用於所有的 五個懸臂20a。 如前所述,當基板G的尺寸增加時,基板g的重量亦 會增加,所以僅具有簡單結構之懸臂20a會稍微不足以支 0 稽基板G◦這是由於基板傳送機器人傳送大量的基板〇 時,懸臂20a會因為基板G的重量而下垂(請參照圖二的部 位B)。如此一來,因為基板G並未自卡匣正確的位置取出 或插入,導致基板G可能損壞。在本實施例中,張力施屏 部(未繪示)是進一步提供來避免懸臂20a的下垂形變。、 張力施展部是連接至懸ΐ 20a與機器人本體1〇,、, 加張力至懸臂20a,以抵消相反方向之基板G的重力。在 本實施例中,張力施展線30可作為張力施展部。亦即張力 ◎ 施展線30之一端是連接至每個懸臂20a之開放端部,^張 力施展線30之另一端是連接至機器人本體1〇,以使姨^ 20a可避免因為基板G重量而下垂與形變。 張力施展線30是以如釣線(fishing line)之材質構成為 佳,而此材質具有相對較小的截面與高強度的特性。在^ 使用獨立的連接裝置而安裝張力施展線30時,藉由接人 (bonding)或打結(knotting)的方式,張力施展線30之〜端可 簡單連接至每個懸臂20a之開放端部,而張力施展線3〇之 另一端可連接至機器人本體10,且將張力施展線3〇抵緊 200844023 後便可達到要求的目的。 張力施展線30可全部安裝在五個懸臂2〇a或是僅安裝 在幾個懸臂20a上。然而,為求完全避免因為基板G重量 而,懸臂20a下垂,較佳的方式是將五個懸臂2〇a全部都 安I張力施展線30。此外,如圖四之實施例所示,張力施 展線30可由兩條釣線構成,而在其他實施例中,張力施展 線30可由一條或是三條已上的釣線構成。 Ο Ο ^本貫施例全部的懸臂20a是由中空矩形管所構成。套 盍^2是裝設在每個懸臂2〇a的開放端部,並用於開啟或封 個懸臂2Ga端部的開口。張力施展線3G的連接結構可 供慮由套I 22構成。亦即在本實施例中,£進一步提 二μ將張力施展線30兩端連接至機器人本體10與懸臂 2〇a之連接部40。 、〜 =择4 40包括套蓋22與旋鈕45,其中套蓋22是盥 太V Γ展線30之一端固定住,而旋鈕45是連接至機哭人 接與人張'力施展線3。之另-端— 二打結的方式固定於套蓋22上,或者,張力施 張力施Α 3Γ形成於套蓋22㈣面上的套環而連接至 並可ί=5ϋ連接至張力施展線3 g之另—端的構件, 旋鈕45 本體1〇的任何位置上。在本實施例中’ 線3〇之機益人本體10的後表面上,且張力施展 而連拉端是穿過每個懸臂20a内部與機器人本體1〇 ^ a為人本體10後表面上的旋鈕45。 ^方疋紐45纟調整張力施展、線30 m力的方法可達成改 12 200844023 - 善的效果。亦即在圖二中,旋鈕45更可包括繞索捲筒 (winding drUm)45a與柄手部45b,其中繞索捲筒4兄是將 張力施展線3G之另-端繞緊或放鬆,而張力施展線3〇之 -端是固,在套蓋22上,且柄手部视是以順、反方向旋 ,#繞索捲同45a以控制張力施展線3〇㈣力。當張力施展 線3㈣張力鬆掉,便可藉由旋轉柄手部.以將張力施展 線30的張力再度拉緊。由於前述實施難為舉例,本發明 並非限疋要包括繞索捲筒45a與柄手部45b。 〇 如前所述,每個懸臂2〇a可製作成具有中空的内部。 在此結構下,張力施展線30安排在每個懸臂2〇&中的狀態 即為張力施展線30之兩毅分職定在套蓋22與旋钮45 上。當張力施展線30依此安排在每個懸臂2〇a中,則基板 G放置在懸臂2Ga的上表面時’本發明的優點便是張力施 展線30與基板G之間不會產生任何交互干擾。 在前述之結構中,張力施展線30是配^在每個懸臂 20a内#,而張力施展線3〇之兩端是固定至套蓋d與旋 乂;鈕45,且上述之說明可應用至所有五個懸臂2〇a上。/、 如圖一所示,接著基板傳送機器人便會進行操作。亦 即當臂桿12相對支撐部14進行旋轉、線性移動以及向上 或向下移動’以使懸臂2Ga的上表面支撐基板G,並將基 板G自特定的地方(如卡匿)取出或插入,藉此完成傳送基 板。 儘管傳送基板的作動是不斷重複操作,由於本發明裝 配士張力知展線30之張力施展部至機器人本體⑺與懸臂 20a’因此可避免如圖二因基板G重量而導致懸臂施下垂 13 200844023 形變。 在本實施例而如同圖四所示,由於並未增加每個懸臂 20a之厚度t,便可避免減少每個卡匣所能承載的基板G數 量。依據本實施例,當避免每個懸臂20a之厚度t(請參考 圖四)增加時,亦同時可避免懸臂20a因為基板G重量而下 垂形變。 圖五為依據本發明另一實施例之基板傳送機器人的剖 面圖。在前述之實施例中,張力施展線30是配置在每個懸 ^ 臂20a内部之中間區域。然而在圖五鐘,張力施展線30可 配置在每個懸臂20a内部之上方區域而較靠近基板G。 圖六與圖七為依據本發明其他實施例之基板傳送機器 人的剖面圖。在前述之實施例中,所有的懸臂20a均是製 作成中空矩形館的結構。然而,在圖六與圖七之實施例中, 本發明之概念亦可應用將這些懸臂20b、20c製作成如鐵棒 之實心結構。在此結構下,由於每個懸臂20b、20c的中間 並非空心,所以張力施展線30便需配置在每個懸臂20b、 j 20c的外面,且張力施展線30的數量可為一個、兩個或是 更多個。 ' 如圖六所示,張力施展線30可一個個地繫在每個懸臂 20b的兩側錶面上。如圖七所示,張力施展線30可嵌入至 每個懸臂20c的上表面。然而,如圖七所示,當張力施展 線30裝載至每個懸臂20c的上表面時,由於張力施展線 30的影響,則懸臂20c可能較不容易支撐基板G。所以如 圖七所示,每個懸臂20c表面更可形成線溝槽32以部份容 置張力施展線30,甚至張力施展線30可全部容置於線溝 14 200844023 槽32内。 如前所述,依據本實施例,當避免每個懸臂之厚度增 加時,亦同時可避免懸臂因為基板重量而下垂形變。 雖然本發明已以較佳實施例揭露如上,然其並非用以 限定本發明,任何熟習此技藝者,在不脫離本發明之精神 和範圍内,當可作些許之更動與潤飾,因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 〇 【圖式簡單說明】 圖一為依據本發明第一實施例之基板傳送機器人的透 視不意圖。 圖二為圖一之基板傳送機器人的局部放大圖。 圖三為圖二之基板傳送機器人的側視示意圖。 圖四為沿著圖二中A-A連線的剖面圖。 圖五為依據本發明另一實施例之基板傳送機器人的剖 面圖。 I, 圖六為依據本發明再一實施例之基板傳送機器人的剖 面圖。 ’圖七為依據本發明又一實施例之基板傳送機器人的剖 面圖。 【主要元件符號說明】 10 :機器人主體 12 :臂桿 14 :支撐部 15 200844023 20a、20b、20c :懸臂 21 :真空孔洞 22 :套蓋 30 :張力施展線 32 :線溝槽 40 :連接部 45 :旋鈕 45a :繞索捲筒 4 5 b :柄手部 G :基板 16The k-substrate 'is generally associated with a flat panel display (FPD), a semiconductor wafer, and a photo mask glass, wherein the flat panel display can be a liquid crystal display (LCD), or a liquid crystal display. Piasma diSpiay panei (PDP) and organic electroluminescent display (〇rganic (10) outflow, OLED). A substrate such as a flat panel display is very different in material or application from a substrate such as a semiconductor wafer, but is essentially the same in the U process of the substrate, such as exposure, development, etching, stripping (9) ripper, cleaning _ Ing) and cleaning. # These processes are completed in sequence, and the substrate is completed. The substrate described below can be considered to include all of the substrates described above. However, for convenience of explanation, in the following description, the substrate will be formed, for example, as a liquid crystal display substrate or a flat display 0 of an electric substrate, and after the manufacturer fabricates the substrate, the substrate is supplied to the substrate. A crate-like crate-e) is a '(four) board process company, and a crate can be understood as a container for tens to hundreds of substrates. In general, 12Q~ fine base 5 200844023 boards can be loaded in a crates. When the pallets on which the substrates are loaded are transported from the substrate manufacturer to the substrate manufacturing company, the substrate processing company will put these substrates into a post-production program through the glass filming system. A separate substrate transfer robot loads the substrates of these substrates into a substrate carrier commonly known as a cassette. Generally, tens to hundreds of substrates can be loaded in a cassette. When a specific number of substrates are loaded into the cassette, the cassette is transferred for proper processing. Then, the substrate transfer robot picks up the substrates one by one and picks them up to complete the process steps. Since the substrate transfer robot is arranged in a different process (e.g., processing the substrate or transporting the substrate), the substrate transfer robot must have a structure and shape corresponding to the process. However, in the case where the substrate transfer robot loads the substrate to the cassette or picks up the substrate from the cassette, the substrate transfer robot is generally manufactured as a cantilever to avoid contamination of the substrate by interference with the cassette, and at the same time, the area of the substrate to be contacted. Minimize to stabilize the conveyor board. Korean Patent Publication No. 10-2006_0056654 and No. 10-2004-0104983 disclose the cantilever type substrate transfer robot. ‘Recently, the horizontal/vertical length of the substrate has been increased to the seven-generation factory size of 1950mm/2250mm or 1870mm/2200mm or the eight-generation factory size of 2160mm/2460mm. Not only the substrate size, but also the substrate weight increases. As a result, when the large substrate is transported by the cantilever type substrate transfer robot in the existing factory by the technique disclosed in the above document, the finger supporting the substrate from the lower side of the substrate will sag due to the weight of the substrate. When the cantilever is deformed due to sagging, the cantilever is difficult to accurately remove or insert the substrate from the 6 200844023 cassette. Furthermore, when the card is hit, the drum is damaged. It is very likely that it will touch or touch in view of this, how to transmit large... The method of deformation is now being made by the big 'Asia (free of the substrate because the cantilever is under the cantilever of the substrate transfer robot:::2 which is a cantilever Weight and increase the cantilever strong ^ ^ empty official structure, in order to reduce the trend of the substrate, only use this side; second and 'consider the current large size 弯 bending strength, and thus avoid; enough: degree of cantilever to enhance the cantilever In order to increase the thickness of the $ or insert -=', the interval between the carriers must also increase accordingly. When the card is in the Tact time, it will generate process losses and reduce the need for the robot to transfer the robot from a substrate. It is proposed that the substrate conveyor is deformed by the 4 arms of the squad, and the large plate is not suspended. The substrate loaded in the unit cassette is not reduced. [Inventive content] Weeping solution or other problems 'The present invention provides a substrate transfer ^ two arms to increase the thickness of the cantilever, and at the same time can avoid the cantilever deformation and sagging due to the weight of the substrate. Human,: the purpose of the present invention proposes a substrate transmission Sending a machine main body, a plurality of cantilever arms, and a tension applying portion (tension 200844023 application portion), wherein the county roll body is used for supporting the substrate, and the end is connected to the robot cantilever and the connecting robot body ^ is connected to at least one of the forces, The direction of the tension is applied to the substrate re-arming arm to prevent the suspension of one of the cantilevers. The direction of the addition is reversed, so that at least in one embodiment of the invention, the tension exerts a line, and one end of the tension application edge is also less expensive. ί. The open end of the cantilever, and the tension is connected to one of the bodies. The other end of the method is connected to the robot. In one embodiment of the present invention, there are a plurality of these tension applying lines 3 The number of tension application lines can be equipped to these cantilevers in one embodiment of the invention. The connection portion is included, and the connection portion applies the tension to the substrate transfer robot to the arm and the robot body. Connected to each of the embodiments of the present invention, the upper, the knob, and the cover is connected to each of the ant two connection portions may include a cover and a force application line One end, and the knob is the open end of the second, and is connected to the other end of the tensile tension line. The robot is attached to the robot body and connected to the handle of the handle in one embodiment of the present invention, and the coil is wound. The cylinder is such that the knob of the Zhang= can be included in the winding of the winding cable, and the end of the tensioning line is the other end of the connecting line, which is rotated or reversed to rotate the winding drum with a cover, and the handle of the handle Yishun, in one embodiment of the present invention: Zhang: the tension of the application line. The empty structure, and the tension application line is a cantilever of j can be made in the present invention - the real _, = cantilever. The tension application line can be disposed on the outer surface of each cantilever of 200844023. In addition, a line groove can be formed on the outer surface of each cantilever to accommodate at least part of the tension application line. In an embodiment of the invention, the plurality of tensioning lines described above may be associated with each of the cantilevers. In the consistent embodiment of the present invention, each of the cantilever arms further forms a plurality of vacuum holes to adsorb the substrate, and the substrate can be a large flat display, and the flat display is selected from the group consisting of a liquid crystal display, a plasma display, and an organic electroluminescent display. Not for 'one*. The above and other objects, features, and advantages of the present invention will become more apparent from the aspects of the invention. "Substrate can generally be directed to associated flat panel displays, semiconductor wafers, and glass reticle. The flat panel displays can be such as liquid crystal displays, plasma displays, and organic electroluminescent displays. In the following description, the substrate will be identified as U^ type. Liquid crystal display or plasma display substrate. Although the large substrate is generally 7th horizontal/vertical length of 1950mm/2250mm or 1870mm/2200mm seven generation factory size or 216〇imn/2460mm eighth generation factory size substrate, the present invention The scope of the invention does not limit the size of the substrate, nor does it limit the mode of the embodiment shown in the drawings. Figure 1 is a schematic perspective view of a substrate transfer robot according to a first embodiment of the present invention. Figure 2 is a partial enlargement of the substrate transfer robot of Figure Figure 3 is a side view of the substrate transfer robot of Figure 2. Figure 4 is a cross-sectional view taken along line AA of Figure 1. 9 200844023 As shown in Figures 1 to 4, the substrate transfer machine according to the present embodiment The structure is a cantilever type and the substrate transfer robot comprises a robot body (7), a plurality of cantilevers, wherein the end of the cantilever 2Ga is connected to The cantilever 20a is used for the support substrate 〇. The robot body 1 : 2:: and 2: Γχ rotates, lines, and moves up or down in at least one direction. The arm 12 is connected and the support portion 14 Is fixed to the ground or its 〇 14' Ο c is supported by the ground or independent structure. When arm 2::, not green), and rotates, linearly moves and up or 4 = phase; =, the human body 10, the substrate G, ~ '1 a together with the display)) can be taken out or inserted. From the ^_ square (if the card is not painted, although the detailed structure is not depicted in the figure, in addition, Ming can provide vacuum device (not shown);: 乂:, a vacuum state is generated. When the substrate G is placed in a person so as to be from the true 3 formed on the cantilever 20a, the vacuum device can prevent the cantilever 20a from being supported. = and into the air. So far away. Because the scope of the invention is not; ^ self-cantilever 20a can be used in the absence of a vacuum device or two:, the same, so the robot on the hair." Two holes / ask 21 of the substrate transfer cantilever 20a is connected to the robot too much end is connected to the robot body 1G arm, ie each The cantilever 2〇a is open outside. The other end of the structure having the foregoing type is arranged in the present embodiment, and there are five county students. Generally, two cantilevers are used; two people::, in the width of the reservation, but In the present embodiment, only the factory equipment is used to transfer a large substrate as if the two cantilevers are not substantially sufficient for 10 200844023. In the present embodiment, five cantilevers 20a are used to connect to the robot body 10 for efficient transmission. The larger and heavier substrate G. However, since the scope of the present invention does not limit the foregoing, the number of the cantilevers 20a may be greater than % and less than five. For convenience of explanation, the same reference numerals are applied to all of the five cantilevers 20a. As described above, when the size of the substrate G is increased, the weight of the substrate g is also increased, so that the cantilever 20a having only a simple structure is slightly insufficient to support the substrate G. This is because the substrate transfer robot transfers a large number of substrates. At this time, the cantilever 20a hangs down due to the weight of the substrate G (please refer to the portion B of FIG. 2). As a result, the substrate G may be damaged because the substrate G is not taken out or inserted from the correct position of the cassette. In the present embodiment, a tension applying portion (not shown) is further provided to avoid sagging deformation of the cantilever 20a. The tension applying portion is connected to the suspension 20a and the robot body 1〇, and is tensioned to the cantilever 20a to counteract the gravity of the substrate G in the opposite direction. In the present embodiment, the tension applying wire 30 can function as a tension applying portion. That is, the tension ◎ one end of the application line 30 is connected to the open end of each cantilever 20a, and the other end of the tension application line 30 is connected to the robot body 1 〇 so that the 姨 20 20 can avoid sagging due to the weight of the substrate G And deformation. The tension applying line 30 is preferably made of a material such as a fishing line, and the material has a relatively small cross section and high strength. When the tension applying wire 30 is mounted using a separate connecting device, the end of the tension applying wire 30 can be simply connected to the open end of each cantilever 20a by means of bonding or knotting. The other end of the tension applying line 3〇 can be connected to the robot body 10, and the tension applying line 3〇 can be pressed against 200844023 to achieve the required purpose. The tension application line 30 can be mounted entirely on five cantilever arms 2a or only on several cantilevers 20a. However, in order to completely avoid the suspension arm 20a from sagging due to the weight of the substrate G, it is preferable to have all of the five cantilevers 2〇a be applied to the tension line 30. Moreover, as shown in the embodiment of Fig. 4, the tensioning line 30 can be constructed of two fishing lines, while in other embodiments, the tensioning line 30 can be constructed of one or three upper fishing lines. Ο Ο ^All of the cantilever 20a of the present embodiment is composed of a hollow rectangular tube. The sleeve 2^2 is an opening provided at the open end of each of the cantilevers 2A, and is used to open or seal the opening of the cantilever 2Ga end. The connection structure of the tension applying wire 3G can be considered to be constituted by the sleeve I 22. That is, in the present embodiment, the two ends of the tension applying wire 30 are connected to the connecting portion 40 of the robot body 10 and the cantilever 2〇a. , ~ = 4 40 includes a cover 22 and a knob 45, wherein the cover 22 is fixed at one end of the 盥 too V Γ line 30, and the knob 45 is connected to the machine to cry the person to connect with the person's force line 3. The other end-to-end knot is fixed to the cover 22, or the tension applying tension 3Γ is formed on the sleeve of the cover 22 (four) and is connected to and can be connected to the tension application line 3 g The other end member, the knob 45 is at any position of the body 1〇. In the present embodiment, the rear surface of the body of the human body 10 is stretched and the tension is applied through the inside of each cantilever 20a and the robot body 1 is the rear surface of the human body 10. Knob 45. ^方疋纽45纟 Adjusting the tension and spreading, the line 30 m force can be changed 12 200844023 - Good effect. That is, in FIG. 2, the knob 45 may further include a winding drUm 45a and a handle portion 45b, wherein the winding reel 4 brother winds or relaxes the other end of the tension applying line 3G. The end of the tension application line 3 is solid, on the cover 22, and the handle of the handle is rotated in the forward and reverse directions, and the coil is wound with the 45a to control the tension of the line 3 (four) force. When the tension line 3 (4) tension is loosened, the tension of the tension applying wire 30 can be tightened again by rotating the handle of the handle. Since the foregoing embodiment is difficult to exemplify, the present invention is not limited to including the winding reel 45a and the handle portion 45b. 〇 As previously mentioned, each cantilever 2〇a can be made to have a hollow interior. Under this configuration, the state in which the tension applying line 30 is arranged in each of the cantilever arms 2, that is, the tension applying line 30 is set on the cover 22 and the knob 45. When the tension applying line 30 is arranged in each of the cantilevers 2a, the substrate G is placed on the upper surface of the cantilever 2Ga. The advantage of the present invention is that no interference occurs between the tension applying line 30 and the substrate G. . In the foregoing structure, the tension applying line 30 is disposed in each cantilever 20a, and the ends of the tension applying line 3〇 are fixed to the cover d and the knob; the button 45, and the above description can be applied to All five cantilevers are on 2〇a. /, as shown in Figure 1, the substrate transfer robot will operate. That is, when the arm 12 is rotated, linearly moved, and moved up or down with respect to the support portion 14 to support the substrate G on the upper surface of the cantilever 2Ga, and the substrate G is taken out or inserted from a specific place (such as a card), Thereby, the transfer substrate is completed. Although the operation of the transfer substrate is repeated operation, the tension applying portion of the assembly tension tension line 30 of the present invention to the robot body (7) and the cantilever 20a' can avoid the cantilever sag due to the weight of the substrate G as shown in Fig. 2 200844023 Deformation . In the present embodiment, as shown in Fig. 4, since the thickness t of each of the cantilevers 20a is not increased, it is possible to avoid reducing the number of substrates G that can be carried by each of the cassettes. According to the present embodiment, when the thickness t (see Fig. 4) of each of the cantilevers 20a is prevented from being increased, the cantilever 20a can be prevented from sagging due to the weight of the substrate G at the same time. Figure 5 is a cross-sectional view showing a substrate transfer robot according to another embodiment of the present invention. In the foregoing embodiment, the tension applying line 30 is an intermediate portion disposed inside each of the suspension arms 20a. However, in Fig. 5, the tension applying line 30 can be disposed in the upper region of each of the cantilevers 20a and closer to the substrate G. 6 and 7 are cross-sectional views of a substrate transfer robot in accordance with another embodiment of the present invention. In the foregoing embodiment, all of the cantilevers 20a are constructed as a hollow rectangular hall. However, in the embodiments of Figs. 6 and 7, the concept of the present invention can also be applied to form the cantilever 20b, 20c into a solid structure such as an iron bar. In this configuration, since the middle of each of the cantilevers 20b, 20c is not hollow, the tension applying wire 30 needs to be disposed outside each of the cantilevers 20b, j 20c, and the number of the tension applying wires 30 can be one, two or More. As shown in Fig. 6, the tension applying wires 30 may be attached one by one to both side surfaces of each of the cantilevers 20b. As shown in Fig. 7, a tension applying line 30 can be embedded in the upper surface of each cantilever 20c. However, as shown in Fig. 7, when the tension applying wire 30 is loaded to the upper surface of each cantilever 20c, the cantilever 20c may be less likely to support the substrate G due to the influence of the tension applying wire 30. Therefore, as shown in FIG. 7, the surface of each cantilever 20c can be formed with a line groove 32 for partially accommodating the tension applying line 30, and even the tension applying line 30 can be entirely accommodated in the groove 32 200844023. As described above, according to the present embodiment, when the thickness of each of the cantilevers is prevented from increasing, it is also possible to prevent the cantilever from sagging deformation due to the weight of the substrate. While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a substrate transfer robot according to a first embodiment of the present invention. 2 is a partial enlarged view of the substrate transfer robot of FIG. 1. FIG. 3 is a side view of the substrate transfer robot of FIG. Figure 4 is a cross-sectional view taken along line A-A of Figure 2. Figure 5 is a cross-sectional view showing a substrate transfer robot according to another embodiment of the present invention. I, Fig. 6 is a cross-sectional view showing a substrate transfer robot according to still another embodiment of the present invention. Figure 7 is a cross-sectional view showing a substrate transfer robot according to still another embodiment of the present invention. [Main component symbol description] 10 : Robot main body 12 : Arm 14 : Support portion 15 200844023 20a, 20b, 20c : Cantilever 21 : Vacuum hole 22 : Cover 30 : Tension application line 32 : Wire groove 40 : Connection portion 45 : Knob 45a: Winding reel 4 5 b : Handle G: Substrate 16

Claims (1)

200844023 十、申請專利範圍: 1 · 一種基板傳送機器人,包括: 一機器人本體; 多個懸臂,而該些懸臂之一端是連接至機器人本體, 且該些懸臂支撐一基板;以及 r* 一張力施展部,至少連接至其中一個懸臂以及連接該 機器人本體,而張力施展部會對該些懸臂施加一張力,且 該張力的方向與該基板重量所施加的方向相反,以至少避 (] 免其中一個懸臂下垂。 2·如申請專利範圍第1項所述之基板傳送機器人,其 中該張力施展部至少為一張力施展線,而該張力施展線之 一端是至少連接至其中一個懸臂之一開放端部,且該張力 施展線之另一端是連接至該機器人本體。 3.如申請專利範圍第2項所述之基板傳送機器人,其 中該張力施展線的數量為多個,且該些張力施展線是—— 對應裝備至該些懸臂。 I 4.如申請專利範圍第2項所述之基板傳送機器人,更 ' 包括一連接部,而該連接部將該張力施展線之兩端連接至 ^ 其中一個懸臂以及該機器人本體。 5·如申請專利範圍第4項所述之基板傳送機器人,其 中該連接部包括: 一套蓋,連接至每個懸臂的該開放端部,並連接至該 張力施展線之一端;以及 一旋鈕,連接至該機器人本體,並連接至該張力施展 線之另一端。 17 200844023 6·如申請專利範圍第5項所述之基板傳送機器人,其 中該旋鈕包括: 一繞索捲筒,將張力施展線之另一端繞緊或放鬆,而 該張力施展線之一端是連接至該套蓋;以及 柄手部,以順、反方向旋轉該繞索捲筒以調整該張力 施展線之該張力。 7. 如申請專利範圍第2項所述之基板傳送機器人,其 中該懸臂是製作成具有中空的結構,而該張力施展線是配 置在該懸臂中。 8. 如申請專利範圍第2項所述之基板傳送機器人,其 中該張力施展線是配置在每個懸臂之外側表面。 9. 如申請專利範圍第8項所述之基板傳送機器人,其 中一線溝槽更形成於每個懸臂之外表面,以至少容置部份 張力施展線。 10. 如申請專利範圍第2項所述之基板傳送機器人,其 中多個張力施展線配置於每個懸臂。 11. 如申請專利範圍第1項所述之基板傳送機器人,其 中每個懸臂更形成多個真空孔洞以吸附該基板,且該基板 為大型平面顯示器,而平面顯示器選自液晶顯示器、電漿 顯示器以及有機電激發光顯示器之一。 18200844023 X. Patent application scope: 1 · A substrate transfer robot comprising: a robot body; a plurality of cantilevers, one of the cantilever arms is connected to the robot body, and the cantilever supports a substrate; and r* a tension is applied a portion connected to at least one of the cantilever arms and the robot body, and the tension applying portion applies a force to the cantilever arms, and the direction of the tension is opposite to the direction in which the weight of the substrate is applied to at least avoid one of The substrate transfer robot of claim 1, wherein the tension applying portion is at least one force applying line, and one end of the tension applying line is connected to at least one open end of one of the cantilever arms. And the other end of the tension application line is connected to the robot body. 3. The substrate transfer robot according to claim 2, wherein the number of the tension application lines is plural, and the tension application lines are —— Corresponding equipment to the cantilever. I 4. The substrate transfer robot as described in the second paragraph of the patent application, The splicing portion includes a connecting portion, and the connecting portion connects the two ends of the tensioning wire to the one of the cantilever arm and the robot body. The substrate transfer robot of claim 4, wherein the connecting portion includes : a cover attached to the open end of each cantilever and connected to one end of the tension application line; and a knob coupled to the robot body and coupled to the other end of the tension application line. 17 200844023 6 The substrate transfer robot of claim 5, wherein the knob comprises: a winding reel that winds or relaxes the other end of the tension application line, and one end of the tension application line is connected to the sleeve And a handle of the shank that rotates the slinger in a forward and reverse direction to adjust the tension of the tension line. 7. The substrate transfer robot of claim 2, wherein the cantilever is made The substrate has a hollow structure, and the tension application line is disposed in the cantilever. 8. The substrate transfer robot according to claim 2, wherein the tension is applied The display line is disposed on the outer surface of each cantilever. 9. The substrate transfer robot according to claim 8, wherein a groove is formed on the outer surface of each cantilever to accommodate at least part of the tension. 10. The substrate transfer robot of claim 2, wherein a plurality of tension application lines are disposed in each of the cantilever arms. 11. The substrate transfer robot of claim 1, wherein each cantilever A plurality of vacuum holes are formed to adsorb the substrate, and the substrate is a large flat display, and the flat display is selected from one of a liquid crystal display, a plasma display, and an organic electroluminescent display.
TW097115769A 2007-05-03 2008-04-29 Substrate tranfer robot TWI392632B (en)

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
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JP5071514B2 (en) * 2010-04-21 2012-11-14 株式会社安川電機 Horizontal articulated robot and substrate transfer system including the same
KR101334690B1 (en) * 2011-11-15 2013-12-02 주식회사 로보스타 Particle leakage preventing apparatus of transfer robot
CN104444364A (en) * 2014-10-29 2015-03-25 京东方科技集团股份有限公司 Substrate carrying device
CN104669283A (en) * 2015-02-13 2015-06-03 北京欣奕华科技有限公司 Substrate carrying robot and manipulator thereof
CN106032014A (en) * 2015-03-13 2016-10-19 上海理想万里晖薄膜设备有限公司 Mechanical arm
CN104909046A (en) * 2015-05-08 2015-09-16 合肥鑫晟光电科技有限公司 Substrate carrying device and system
CN106672624A (en) * 2016-12-13 2017-05-17 惠科股份有限公司 Conveyer for display panel
KR102198202B1 (en) * 2018-10-26 2021-01-05 주식회사 알에스 CFRP substrate transfer robot hand using pre-tension wire
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Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000153487A (en) * 1998-11-16 2000-06-06 Mitsubishi Electric Corp Grasping device of industrial robot
CN1787954A (en) * 2003-06-19 2006-06-14 日商乐华股份有限公司 Thin plate-supporting body

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI500098B (en) * 2011-03-18 2015-09-11 Gallant Micro Machining Co Ltd Sticky crystal machine

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