WO2011148782A1 - Substrate processing apparatus and temporary storage shelf - Google Patents

Substrate processing apparatus and temporary storage shelf Download PDF

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Publication number
WO2011148782A1
WO2011148782A1 PCT/JP2011/060747 JP2011060747W WO2011148782A1 WO 2011148782 A1 WO2011148782 A1 WO 2011148782A1 JP 2011060747 W JP2011060747 W JP 2011060747W WO 2011148782 A1 WO2011148782 A1 WO 2011148782A1
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WIPO (PCT)
Prior art keywords
transfer robot
arm
substrate
substrate processing
temporary storage
Prior art date
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PCT/JP2011/060747
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French (fr)
Japanese (ja)
Inventor
祥一 田代
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シャープ株式会社
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Publication of WO2011148782A1 publication Critical patent/WO2011148782A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67276Production flow monitoring, e.g. for increasing throughput
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769Storage means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02Controlled or contamination-free environments or clean space conditions

Definitions

  • the present invention relates to a substrate processing apparatus for processing a substrate.
  • the present invention relates to a substrate processing apparatus for processing a thin substrate (for example, a glass substrate) used in a method for manufacturing a flat panel display (for example, a liquid crystal panel).
  • the present invention also relates to a temporary storage shelf on which a substrate can be temporarily placed by a first transfer robot and a second transfer robot. Note that this application claims priority based on Japanese Patent Application No. 2010-121387 filed on May 27, 2010, the entire contents of which are incorporated herein by reference. .
  • a liquid crystal panel which is a component of a liquid crystal display device (LCD) has a structure in which a pair of glass substrates are opposed to each other with a predetermined gap secured.
  • the glass substrates (mother glass) for liquid crystal panels have been increasing year by year, and the liquid crystal panel production line is used to transport such large glass substrates.
  • a substrate transfer device is provided in the factory.
  • a processing apparatus that processes a glass substrate for a liquid crystal panel often performs various processes by introducing the mother glass transported by the substrate transport apparatus into the processing apparatus from the viewpoint of efficiency.
  • Mother glass for liquid crystal panels continues to increase in size from the viewpoint of mass productivity and cost.
  • the size is 2880 mm (W) ⁇ 3130 mm (L). .
  • a CVD apparatus that performs a CVD process on a mother glass for a liquid crystal panel as compared with a CVD apparatus that performs a CVD process on a semiconductor wafer (for example, 300 mm in diameter)
  • a semiconductor wafer for example, 300 mm in diameter
  • Patent Documents 1 and 2 the configuration of a device for transporting a substrate (a transport robot) differs between a technology for transporting and processing a small semiconductor wafer compared to the mother glass and a technology for transporting and processing a mother glass.
  • FIG. 1 shows a CVD apparatus 1000 examined by the present inventors.
  • a CVD apparatus 1000 shown in FIG. 1 is an apparatus that performs a CVD process on a mother glass for a liquid crystal panel.
  • the CVD apparatus 1000 is provided with a first substrate processing chamber 101 and a second substrate processing chamber 102 that perform CVD processing.
  • a substrate carry-in chamber 103 into which a substrate (mother glass) is carried.
  • the substrate in the substrate carry-in chamber 103 is moved by an arm (arm 1) of the transfer robot 105 arranged in the transfer robot area 104. Introduced into the first substrate processing chamber 101.
  • FIG. 2 shows the temporary storage rack 110 viewed from the transport robot 105 or 108 side.
  • the temporary storage shelf 110 shown in FIG. 2 includes a shelf main body 120 in which the temporarily placed substrate 130 is stored, and an opening 117 provided on the side of the shelf main body 120 on the transfer robot 105 or 108 side.
  • the robot arm 115 (that is, arm 1 or arm 2) of the transfer robot 105 or 108 is inserted from the opening 117, and the substrate 130 can be taken in and out by the robot arm 115.
  • members pins, shelf pieces, etc.
  • the substrate (130) temporarily placed on the temporary shelf 110 is introduced into the second substrate processing 102 by the arm (arm 2) of the transfer robot 108 arranged in the transfer robot area 107. Note that the substrate can be moved in the reverse direction through the same procedure, and the processed substrate can be sent out to the substrate carry-in chamber 103.
  • the CVD apparatus 1000 includes the two substrate processing chambers (CVD processing chambers) 101 and 102, and the transfer robots 105 and 108 move the substrates in and out of the substrate processing chambers (101 and 102). It is carried out. That is, in this configuration, the loader (transfer robot area) positioned in front of the substrate processing chambers (CVD process chambers) 101 and 102 has an area (104, 106, 107).
  • the operation signals of the transfer robots 105 and 108 are common in the CVD apparatus 1000, when one transfer robot on one side is stopped, the other transfer robot on the other side also stops. Therefore, for example, during maintenance of the transfer robot 108, not only the transfer robot 108 but also the transfer robot 105 is stopped, resulting in a production operation loss.
  • the transfer robot 105 and the transfer robot 108 are only in contact with each other via the temporary storage rack 110, when the transfer robot 108 on one side is stopped, the transfer robot 105 on the other side is forcibly forcibly stopped. It is possible to secure safety by adopting a structure in which the motor is stopped. That is, during the maintenance of the transfer robot 108, if the transfer robot 105 is operated to perform an operation, if the transfer robot 108 is operated and the arm 2 enters the temporary storage rack 110, the arms 1 and 2 are There is a possibility of contact with the temporary storage rack 110. That is, in order to ensure the safety of the operation of the transfer robot, it is required to use a common stop signal for stopping both transfer robots. Therefore, during the maintenance of the transfer robot 108, a production operation loss occurs due to the stop of the transfer robot 105.
  • the present invention has been made in view of the above points, and a main object of the present invention is to provide a substrate processing apparatus capable of operating the other transfer robot while the other transfer robot is stopped to suppress a decrease in productivity. There is to do.
  • a substrate processing apparatus is an apparatus for processing a substrate, and is connected to a substrate carry-in chamber into which a substrate is carried in, a first transfer robot area connected to the substrate carry-in chamber, and the first transfer robot area.
  • a first transfer robot having an arm for transferring the substrate to the first substrate processing chamber is disposed in the first transfer robot area, and in the second transfer robot area, the second substrate processing chamber is provided.
  • a second transfer robot having an arm for transferring the substrate is disposed.
  • a temporary storage shelf capable of temporarily placing the substrate by the arm of the first transfer robot and the arm of the second transfer robot is disposed.
  • the temporary storage shelf includes the second storage shelf.
  • An arm intrusion cover that closes the opening on the transfer robot area side and prevents the arm of the second transfer robot from entering is disposed.
  • the temporary storage shelf is provided with a stop switch for stopping the driving of the second transfer robot in a state where the opening is closed by the arm entry cover.
  • a hook for supporting the arm entry cover is provided on an upper portion of the temporary storage shelf.
  • a cover storage portion for storing the arm intrusion cover is disposed at an upper portion of the temporary storage shelf, and the arm intrusion cover is pulled out from the cover storage portion to open the opening. It is characterized by blocking.
  • the arm intrusion cover has a structure that can be inserted and removed from the cover storage portion by electric power.
  • the substrate is a mother glass for a liquid crystal panel, and one of a CVD process and a dry etching process is performed in the first substrate processing chamber and the second substrate processing chamber.
  • the temporary storage shelf according to the present invention is a temporary storage shelf in which a substrate can be temporarily placed by a first transfer robot and a second transfer robot provided in a clean room, and a shelf main body for storing the substrate, and the shelf main body A first opening into which the arm of the first transfer robot is inserted, and a second opening that is provided in the shelf main body and into which the arm of the second transfer robot is inserted, An arm intrusion cover for preventing the arm of the second transport robot from entering the 2 opening is disposed, and the temporary storage shelf has the second opening in a state where the second opening is closed by the arm intrusion cover.
  • a stop switch for stopping the driving of the second transfer robot is provided.
  • the temporary storage shelf capable of temporarily placing the substrate in the temporary storage shelf area
  • An arm intrusion cover for preventing the arm of the transfer robot from entering is disposed.
  • a stop switch is provided for stopping the driving of the second transfer robot in a state where the opening is closed by the arm intrusion cover. Therefore, the arm intrusion cover can prevent the arm of the second transfer robot from entering, and the driving of the second transfer robot can be stopped by turning on the stop switch with the arm intrusion cover.
  • the second transfer robot is stopped (for example, during maintenance), the first transfer robot can be operated, and a reduction in productivity can be suppressed.
  • FIG. It is a figure which shows the structure of CVD apparatus 1000.
  • FIG. It is a figure which shows the structure of the temporary storage shelf.
  • It is sectional drawing (side view) which shows the modification of the temporary storage shelf.
  • FIG. 3 is a diagram (top view) schematically showing the configuration of the substrate processing apparatus 200 according to the embodiment of the present invention.
  • 4 and 5 are a cross-sectional view (side view) and a front view, respectively, schematically showing the configuration of the temporary storage shelf 100 arranged in the substrate processing apparatus 200 of the present embodiment.
  • the substrate processing apparatus 200 of the present embodiment is an apparatus that processes the substrate 10, for example, a CVD apparatus that performs a CVD (Chemical Vapor Deposition) process.
  • the substrate processing apparatus 200 of this embodiment includes a substrate carry-in chamber 61 into which the substrate 10 is carried in, a first transfer robot area 63, a first substrate processing chamber 51, a temporary storage shelf area 64, and a second transfer robot area. 65 and the second substrate processing chamber 52.
  • a CVD process can be performed on the substrate 10.
  • the substrate 10 of the present embodiment is, for example, a glass substrate, and the substrate 10 of the present embodiment is a glass substrate for a liquid crystal panel.
  • the substrate 10 is a mother glass before being cut out to the dimensions of the liquid crystal panel.
  • the size of the mother glass as the substrate 10 is 1 meter or more on one side. Specifically, when the substrate 10 is a 10th generation mother glass, the size is 2880 mm (W) ⁇ 3130 mm (L).
  • the substrate 10 is not limited to the mother glass before being cut out to the dimensions of the liquid crystal panel, but may be glass having the size of the liquid crystal panel after being cut out. Further, the substrate 10 may be an array substrate on which a thin film transistor (TFT) is manufactured (or a product in the middle of manufacturing), or a CF substrate on which a color filter (CF) is formed (or a device in the middle of manufacturing thereof). It may be. When the substrate 10 is an array substrate or a CF substrate (including those in the middle of production), a thin film (such as various patterns) is formed on the surface of the substrate 10. In addition, the substrate 10 is not limited to a liquid crystal panel, but may be used for other purposes (for example, a PDP or other flat panel display).
  • TFT thin film transistor
  • CF color filter
  • the substrate 10 is not limited to a liquid crystal panel, but may be used for other purposes (for example, a PDP or other flat panel display).
  • the first transfer robot area 63 is connected to the substrate loading chamber 61.
  • the first substrate processing chamber 51 is connected to the first transfer robot area 63, and the substrate 10 is introduced from the first transfer robot area 63.
  • the second transfer robot area 65 is connected to the first transfer robot area 63 via the temporary storage shelf area 64.
  • the second substrate processing chamber 52 is connected to the second transfer robot area 65, and the substrate 10 is introduced from the second transfer robot area 65.
  • a substrate transfer device for example, a roller conveyor, an air levitation conveyor
  • a substrate transfer device for example, a roller conveyor, an air levitation conveyor
  • a first transfer robot 70A having an arm 72 for transferring the substrate 10 to the first substrate processing chamber 51
  • a second transfer robot 70B having an arm 72 for transferring the substrate 10 to the second substrate processing chamber 52
  • the loader located in front of the first and second substrate processing chambers (CVD processing chambers) 51 and 52 is placed in an area (63, 64, 65) having the transfer robots 70A and 70B via the temporary storage shelf 100.
  • the first transfer robot 70A and the second transfer robot 70B basically use the same transfer robot 70, but different transfer robots may be used depending on circumstances.
  • the temporary storage shelf 100 is arranged in the temporary storage shelf area 64.
  • the temporary shelf 100 is a shelf in which the substrate 10 can be temporarily placed by the arm 72 of the first transfer robot 70A and the arm 72 of the second transfer robot 70B.
  • the temporary storage shelf 100 includes a shelf body 20 that stores the substrate 10, and a first opening 21 ⁇ / b> A and a second opening 21 ⁇ / b> B provided in the shelf body 20.
  • the shelf body 20 of the present embodiment can store the substrates 10 in multiple stages. Here, support members (pins, shelf pieces, etc.) for supporting the substrate 10 are not shown.
  • the first opening 21A faces the first transfer robot 70A, and the arm 72 of the first transfer robot 70A can be inserted from the first opening 21A.
  • the second opening 21B faces the second transfer robot 70B, and when the arm entry cover 30 is not provided, the arm 72 of the second transfer robot 70B is inserted from the second opening 21B. Can do.
  • the substrate 10 temporarily placed on the temporary shelf 100 can be introduced into the second substrate processing 52 by the arm 72 of the second transfer robot 70B. Note that it is possible to move the substrate in the reverse direction through the same procedure, and the processed substrate 10 can be sent out to the substrate carry-in chamber 61.
  • the arm intrusion cover 30 that prevents the arm 72 of the second transfer robot 70B from entering can be disposed in the second opening 21B. Further, the shelf body 20 is provided with a stop switch 40 for stopping the driving of the second transfer robot 70B in a state where the second opening 21B is closed by the arm intrusion cover 30.
  • a hook 22 that supports the arm intrusion cover 30 is provided on the upper part of the temporary storage shelf 100 of the present embodiment.
  • the hook support member 24 is formed on the upper plate of the shelf body 20, and the hook 22 is attached to the hook support member 24.
  • the arm intrusion cover 30 is provided with an engaging portion 32 that hooks onto the hook 22. By hooking the engaging portion 32 of the arm intrusion cover 30 on the hook 22, the second opening 21 ⁇ / b> B can be closed by the arm intrusion cover 30.
  • a stop switch 40 for stopping the driving of the second transfer robot 70B is provided on the shelf 25 that is a base of the shelf body 20.
  • the shelf 25 is disposed on the ground (for example, the floor of the panel production line) 90, and the stop switch 40 is provided on the side where the arm entry cover 30 is disposed.
  • a plurality (two) of stop switches 40 are provided, but one stop switch 40 may be provided.
  • a switch contact member (contact plate) 36 that is brought into contact with the stop switch 40 is attached to the arm intrusion cover 30.
  • a fastening member (screw, pin, etc.) 38 can be attached to the switch contact member 36, whereby the lower part of the arm intrusion cover 30 is covered with the second opening 21 ⁇ / b> B closed by the arm intrusion cover 30. Can be fixed.
  • the fastening member (screw, pin, etc.) 38 in order to fix the lower part of the arm intrusion cover 30, not only the fastening member (screw, pin, etc.) 38 but other fixing members (for example, magnetic force adsorbing member, etc.) can be used.
  • a wiring 42 is connected to the stop switch 40 of the present embodiment, and when the stop switch 40 is turned on, a signal (robot driving stop signal) for stopping the driving of the second transfer robot 70B is issued.
  • the stop signal is output through the wiring 42 to a control device (not shown) that controls the driving of the second transfer robot 70B.
  • a signal may be emitted from the stop switch 40 using radio or infrared rays without using the wiring 42.
  • FIG. 5 shows the temporary shelf 100 in a state where the arm opening cover 30 covers the second opening 21B.
  • the stop switch 40 issues a signal for stopping the driving of the second transfer robot 70B, and the arm intrusion cover 30 causes the second transfer robot 70B to stop driving. Intrusion of the arm 72 is prevented.
  • the first transfer robot area 63 is the second transfer robot area via the temporary storage shelf area 64. 65 is connected.
  • a temporary storage shelf 100 on which the substrate 10 can be temporarily placed by the arm 72 of the first transfer robot 70A and the arm 72 of the second transfer robot 70B is disposed.
  • the temporary storage rack 100 is provided with an arm intrusion cover 30 that prevents the arm 72 of the second transfer robot 70B from entering, and the second transfer robot 70B is in a state where the opening 21B is closed by the arm intrusion cover 30.
  • a stop switch 40 is provided to stop the driving.
  • the arm intrusion cover 30 can prevent the arm 72 of the second transfer robot 70B from entering, and the stop switch 40 is turned on by the arm intrusion cover 30 to stop the driving of the second transfer robot 70B. be able to.
  • the operation / stop signals of the first transfer robot 70A and the second transfer robot 70B are shared, and both transfer robots (70A, 70B) need not be stopped.
  • the second transfer robot 70B is stopped (for example, during maintenance)
  • the first transfer robot 70A can be operated, and a reduction in productivity can be suppressed.
  • the opening 21B can be closed with the arm intrusion cover 30 and the stop switch 40 can be turned on, so that the safety of the operation of the transfer robot can be ensured.
  • the operation / stop signal of the first transfer robot 70A and the second transfer robot 70B is made independent (not common), and the operation of the second transfer robot 70B is stopped only by turning on the stop switch 40.
  • the stop switch 40 can be reliably turned on when the opening 21B is closed with the arm intrusion cover 30, so that the second transfer robot 70B is stopped (for example, during maintenance). If the arm intrusion cover 30 completely blocks the opening 21B, the operation of the second transfer robot 70B can be surely stopped. As a result, the second transfer robot 70B may malfunction. Can be avoided. That is, by ensuring the safety in this way, the operation of the first transfer robot 70A can be executed, and as a result, a reduction in productivity can be suppressed.
  • the inside of the substrate processing apparatus 200 of the present embodiment is a clean room, and the substrate 10 is transported and moved in the clean room.
  • the first substrate processing chamber 51 and the second substrate processing chamber 52 are CVD processing chambers that perform CVD processing on the substrate 10, but may be processing chambers that perform other processing.
  • it may be a dry etching processing chamber for performing a dry etching process on the substrate 10.
  • FIG. 6 shows a substrate processing apparatus 210 (modified example) of this embodiment.
  • the substrate processing apparatus 210 shown in FIG. 6 further includes a third transfer robot area 67 in which the third transfer robot 70C is arranged, and a third substrate processing chamber 53.
  • the temporary storage rack 100A of the present embodiment is provided between the first transfer robot 70A and the second transfer robot 70B, and also between the second transfer robot 70B and the third transfer robot 70C.
  • the temporary storage shelf 100B of the present embodiment is provided.
  • the first, second, and third transfer robots 70A, 70B, and 70C are first operated, the first, second, and third substrate processing chambers are operated.
  • the processing can be executed at 51, 52, 53.
  • the arm intrusion cover 30 can be set on the temporary storage shelf 100B to stop the operation of the third transfer robot 70C. At that time, since the first transfer robot 70A and the second transfer robot 70B can be operated, a decrease in productivity can be suppressed.
  • the arm intrusion cover 30 can be set on the temporary storage shelf 100A to stop the operation of the second transfer robot 70B. At that time, the first transfer robot 70A can be operated, so that a reduction in productivity can be suppressed.
  • FIG. 7 is a cross-sectional view (side view) showing a modified example of the temporary storage shelf 100 of the present embodiment.
  • the engaging portion 32 of the arm intrusion cover 30 is attached to the hook 22 and the opening portion 21 ⁇ / b> B is closed with the arm intrusion cover 30. You can also.
  • a cover storage unit 26 for storing the arm entry cover 31 is disposed on the temporary storage shelf 100.
  • the arm intrusion cover 31 is wound and stored in a roll shape in the cover storage unit 26.
  • the arm intrusion cover 31 can be pulled out from the cover storage portion 26 to close the opening 21 ⁇ / b> B as indicated by an arrow 81.
  • the arm entry cover 31 has a so-called shutter structure. Further, when the arm intrusion cover 31 closes the opening 21B, the distal end portion 33 of the arm intrusion cover 31 can come into contact with the stop switch 44 to turn on the stop switch 44. When the stop switch 44 is turned on, a stop signal for stopping the operation of the second transfer robot 70B is issued.
  • the temporary storage shelf 100 shown in FIG. 4 it is convenient for an operator to manually execute the engagement portion 32 of the arm entry cover 30 on the hook 22.
  • the temporary storage shelf 100 shown in FIG. 7 it is possible to adopt a structure in which the tip 33 of the arm entry cover 31 is moved downward by electric drive. If the arm intrusion cover 31 is configured to be electrically movable downward, it is convenient that the operation of setting the arm intrusion cover 31 can be executed without an operator entering the temporary storage shelf area 64. Even in the case of the temporary storage shelf 100 shown in FIG. 7, the operator may manually lower the tip 33 of the arm entry cover 31.
  • FIG. 8 is a cross-sectional view (front view) showing a modified example of the temporary storage shelf 100 of the present embodiment.
  • the opening 21 ⁇ / b> B can be closed by moving the arm entry cover 35 in the parallel direction 82.
  • the arm entry cover 35 has a so-called curtain structure.
  • the arm entry cover 35 does not block the opening 21B, the arm entry cover 35 is folded and brought together at one end.
  • the arm intrusion cover 35 closes the opening 21B, a part 37 of the arm intrusion cover 35 can come into contact with the stop switch 46 to turn on the stop switch 46.
  • the stop switch 46 is turned on, a stop signal for stopping the operation of the second transfer robot 70B is issued.
  • the temporary storage rack 100 shown in FIG. 8 can also be configured to move the arm intrusion cover 35 in the horizontal direction (left-right direction) 82 electrically. Even in the case of the temporary storage shelf 100 shown in FIG. 8, the operator may manually move the arm entry cover 35 in the horizontal direction 82.
  • the present invention it is possible to provide a substrate processing apparatus capable of suppressing a decrease in productivity by operating the other transfer robot even when one transfer robot is stopped.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Automation & Control Theory (AREA)
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Abstract

Disclosed is a substrate processing apparatus wherein, even if one transfer robot is stopped, deterioration of productivity is suppressed by having the other transfer robot operate. The substrate processing apparatus (200) that processes a substrate (10) is provided with a substrate carry-in chamber (61), a first transfer robot area (63), a first substrate processing chamber (51), a storage shelf area (64), a second transfer robot area (65), and a second substrate processing chamber (52). In a temporary storage shelf (100) disposed in the temporary storage shelf area (64), an arm intrusion cover (30) that covers an opening (21B) on the second transfer robot area (65) side is disposed, and furthermore, the temporary storage shelf (100) is provided with a stop switch (40) that stops driving of the second transfer robot (70B) in a state wherein the opening (21B) is covered with the arm intrusion cover (30).

Description

基板処理装置および仮置き棚Substrate processing apparatus and temporary storage shelf
 本発明は、基板を処理する基板処理装置に関する。特に、フラットパネルディスプレイ(例えば、液晶パネル)の製造方法に用いる薄型の基板(例えば、ガラス基板)を処理する基板処理装置に関する。本発明はまた、第1搬送ロボットおよび第2搬送ロボットによって基板を仮置き可能な仮置き棚に関する。
 なお、本出願は2010年5月27日に出願された日本国特許出願2010-121387号に基づく優先権を主張しており、その出願の全内容は本明細書中に参照として組み入れられている。
The present invention relates to a substrate processing apparatus for processing a substrate. In particular, the present invention relates to a substrate processing apparatus for processing a thin substrate (for example, a glass substrate) used in a method for manufacturing a flat panel display (for example, a liquid crystal panel). The present invention also relates to a temporary storage shelf on which a substrate can be temporarily placed by a first transfer robot and a second transfer robot.
Note that this application claims priority based on Japanese Patent Application No. 2010-121387 filed on May 27, 2010, the entire contents of which are incorporated herein by reference. .
 液晶表示装置(LCD)の構成部品である液晶パネルは、一対のガラス基板を所定のギャップを確保した状態で対向させた構造を有している。液晶パネルの大型化・量産化に伴って、液晶パネル用のガラス基板(マザーガラス)は年々大型化しており、液晶パネルの製造ラインにおいては、そのように大型化したガラス基板を搬送するための基板搬送装置が工場内に設けられている。 A liquid crystal panel, which is a component of a liquid crystal display device (LCD), has a structure in which a pair of glass substrates are opposed to each other with a predetermined gap secured. With the increase in size and mass production of liquid crystal panels, the glass substrates (mother glass) for liquid crystal panels have been increasing year by year, and the liquid crystal panel production line is used to transport such large glass substrates. A substrate transfer device is provided in the factory.
 近年、液晶パネル用のガラス基板に対して処理を行う処理装置では、効率化の観点から、基板搬送装置で搬送したマザーガラスを処理装置に導入して各種処理を施すことが多い。液晶パネル用のマザーガラスは、量産性・コストの観点から大型になる傾向が続いており、第10世代のマザーガラスの場合、その寸法は2880mm(W)×3130mm(L)という大きさになる。 In recent years, a processing apparatus that processes a glass substrate for a liquid crystal panel often performs various processes by introducing the mother glass transported by the substrate transport apparatus into the processing apparatus from the viewpoint of efficiency. Mother glass for liquid crystal panels continues to increase in size from the viewpoint of mass productivity and cost. In the case of the 10th generation mother glass, the size is 2880 mm (W) × 3130 mm (L). .
 したがって、例えば、基板のCVD処理を行う場合、半導体ウエハ(例えば、直径300mm)のCVD処理を行うCVD装置に比べて、液晶パネル用のマザーガラスにCVD処理をするCVD装置では異なる部分がある(例えば、特許文献1、2)。具体的には、マザーガラスと比較して小さい半導体ウエハを搬送して処理する技術と、マザーガラスを搬送して処理する技術とでは、基板を搬送する装置(搬送ロボット)の構成が異なってくる。 Therefore, for example, when performing a CVD process on a substrate, there is a difference in a CVD apparatus that performs a CVD process on a mother glass for a liquid crystal panel as compared with a CVD apparatus that performs a CVD process on a semiconductor wafer (for example, 300 mm in diameter) ( For example, Patent Documents 1 and 2). Specifically, the configuration of a device for transporting a substrate (a transport robot) differs between a technology for transporting and processing a small semiconductor wafer compared to the mother glass and a technology for transporting and processing a mother glass. .
特開平6-69140号公報JP-A-6-69140 特開2000-228431号公報JP 2000-228431 A
 図1は、本願発明者が検討したCVD装置1000である。図1に示したCVD装置1000は、液晶パネル用のマザーガラスをCVD処理する装置である。CVD装置1000には、CVD処理を行う第1基板処理室101および第2基板処理室102が設けられている。CVD装置1000の入口には、基板(マザーガラス)が搬入される基板搬入室103があり、基板搬入室103の基板は、搬送ロボットエリア104に配置された搬送ロボット105のアーム(アーム1)によって第1基板処理室101に導入される。 FIG. 1 shows a CVD apparatus 1000 examined by the present inventors. A CVD apparatus 1000 shown in FIG. 1 is an apparatus that performs a CVD process on a mother glass for a liquid crystal panel. The CVD apparatus 1000 is provided with a first substrate processing chamber 101 and a second substrate processing chamber 102 that perform CVD processing. At the entrance of the CVD apparatus 1000 is a substrate carry-in chamber 103 into which a substrate (mother glass) is carried. The substrate in the substrate carry-in chamber 103 is moved by an arm (arm 1) of the transfer robot 105 arranged in the transfer robot area 104. Introduced into the first substrate processing chamber 101.
 また、搬送ロボット105のアーム1によって、仮置き棚エリア106に配置された仮置き棚110に基板を仮置きすることができる。図2は、搬送ロボット105または108側から見た仮置き棚110を示している。図2に示した仮置き棚110は、仮置きされた基板130が収納される棚本体部120と、棚本体部120のうち搬送ロボット105または108側に設けられた開口部117とから構成されている。開口部117から、搬送ロボット105または108のロボットアーム115(すなわち、アーム1またはアーム2)が挿入され、そのロボットアーム115によって基板130を出し入れすることができる。なお、棚本体部120には、基板130を支持する部材(ピン、棚片など)は示していない。 Also, the substrate can be temporarily placed on the temporary shelf 110 arranged in the temporary shelf area 106 by the arm 1 of the transfer robot 105. FIG. 2 shows the temporary storage rack 110 viewed from the transport robot 105 or 108 side. The temporary storage shelf 110 shown in FIG. 2 includes a shelf main body 120 in which the temporarily placed substrate 130 is stored, and an opening 117 provided on the side of the shelf main body 120 on the transfer robot 105 or 108 side. ing. The robot arm 115 (that is, arm 1 or arm 2) of the transfer robot 105 or 108 is inserted from the opening 117, and the substrate 130 can be taken in and out by the robot arm 115. In the shelf main body 120, members (pins, shelf pieces, etc.) that support the substrate 130 are not shown.
 再び図1を参照する。仮置き棚110に仮置きした基板(130)は、搬送ロボットエリア107に配置された搬送ロボット108のアーム(アーム2)によって第2基板処理102に導入される。なお、同様の手順を通じて、逆向きに基板を移動させることが可能であり、処理された基板は、基板搬入室103に送り出すことができる。 Refer to FIG. 1 again. The substrate (130) temporarily placed on the temporary shelf 110 is introduced into the second substrate processing 102 by the arm (arm 2) of the transfer robot 108 arranged in the transfer robot area 107. Note that the substrate can be moved in the reverse direction through the same procedure, and the processed substrate can be sent out to the substrate carry-in chamber 103.
 このように、CVD装置1000では、2つの基板処理室(CVD処理室)101、102を設けており、そして、各搬送ロボット105、108によって各基板処理室(101、102)への基板の出し入れを行っている。すなわち、この構成において、基板処理室(CVD処理室)101、102の前に位置するローダ(搬送ロボットエリア)は、仮置き棚110を介して搬送ロボット105、108を有するエリア(104、106、107)である。また、CVD装置1000において、搬送ロボット105、108の動作信号は共通しているので、片側1台の搬送ロボットを停止させた場合、もう片側1台の搬送ロボットも停止してしまう。したがって、例えば搬送ロボット108のメンテナンス中においては、搬送ロボット108のみならず、搬送ロボット105も停止してしまうので、生産稼働ロスが生じる。 As described above, the CVD apparatus 1000 includes the two substrate processing chambers (CVD processing chambers) 101 and 102, and the transfer robots 105 and 108 move the substrates in and out of the substrate processing chambers (101 and 102). It is carried out. That is, in this configuration, the loader (transfer robot area) positioned in front of the substrate processing chambers (CVD process chambers) 101 and 102 has an area (104, 106, 107). In addition, since the operation signals of the transfer robots 105 and 108 are common in the CVD apparatus 1000, when one transfer robot on one side is stopped, the other transfer robot on the other side also stops. Therefore, for example, during maintenance of the transfer robot 108, not only the transfer robot 108 but also the transfer robot 105 is stopped, resulting in a production operation loss.
 一方、搬送ロボット105と搬送ロボット108とは、仮置き棚110を介して接しているだけなので、片側1台の搬送ロボット108を停止させた際に、強制的にもう片側1台の搬送ロボット105も停止させる構造にした方が安全性の確保を図ることができる。すなわち、搬送ロボット108のメンテナンス中において、搬送ロボット105を動作して作業を行うと、もし搬送ロボット108が動作してアーム2が仮置き棚110に侵入したとすれば、アーム1とアーム2が仮置き棚110で接触する可能性がある。つまり、搬送ロボットの動作の安全性を確実に確保するためには、両方の搬送ロボットを停止させる停止信号を共通にすることが求められる。それゆえに、搬送ロボット108のメンテナンス中は、搬送ロボット105が停止することによる生産稼働ロスが生じる。 On the other hand, since the transfer robot 105 and the transfer robot 108 are only in contact with each other via the temporary storage rack 110, when the transfer robot 108 on one side is stopped, the transfer robot 105 on the other side is forcibly forcibly stopped. It is possible to secure safety by adopting a structure in which the motor is stopped. That is, during the maintenance of the transfer robot 108, if the transfer robot 105 is operated to perform an operation, if the transfer robot 108 is operated and the arm 2 enters the temporary storage rack 110, the arms 1 and 2 are There is a possibility of contact with the temporary storage rack 110. That is, in order to ensure the safety of the operation of the transfer robot, it is required to use a common stop signal for stopping both transfer robots. Therefore, during the maintenance of the transfer robot 108, a production operation loss occurs due to the stop of the transfer robot 105.
 本発明はかかる点に鑑みてなされたものであり、その主な目的は、一方の搬送ロボットの停止中でも他方の搬送ロボットを動作させて生産性の低下を抑制することができる基板処理装置を提供することにある。 The present invention has been made in view of the above points, and a main object of the present invention is to provide a substrate processing apparatus capable of operating the other transfer robot while the other transfer robot is stopped to suppress a decrease in productivity. There is to do.
 本発明に係る基板処理装置は、基板を処理する装置であり、基板が搬入される基板搬入室と、前記基板搬入室に連結された第1搬送ロボットエリアと、前記第1搬送ロボットエリアに連結され、前記第1搬送ロボットエリアから前記基板が導入される第1基板処理室と、前記第1搬送ロボットエリアに、仮置き棚エリアを介して連結された前記第2搬送ロボットエリアと、前記第2搬送ロボットエリアに連結され、前記第2搬送ロボットエリアから前記基板が導入される第2基板処理室とを備えている。前記第1搬送ロボットエリアには、前記第1基板処理室に前記基板を搬送するアームを有する第1搬送ロボットが配置されており、前記第2搬送ロボットエリアには、前記第2基板処理室に前記基板を搬送するアームを有する第2搬送ロボットが配置されている。前記仮置き棚エリアには、前記第1搬送ロボットのアームおよび前記第2搬送ロボットのアームによって前記基板を仮置き可能な仮置き棚が配置されており、前記仮置き棚には、前記第2搬送ロボットエリア側の開口部を塞ぎ、前記第2搬送ロボットのアームの侵入を防止するアーム侵入カバーが配置されている。しかも、前記仮置き棚には、前記アーム侵入カバーによって前記開口部を塞いだ状態において前記第2搬送ロボットの駆動を停止させる停止スイッチが設けられている。
 ある好適な実施形態において、前記仮置き棚の上部には、前記アーム侵入カバーを支持するフックが設けられている。
 ある好適な実施形態において、前記仮置き棚の上部には、前記アーム侵入カバーを収納するカバー収納部が配置されており、前記アーム侵入カバーは、前記カバー収納部から引き出されて前記開口部を塞ぐことを特徴とする。
 前記アーム侵入カバーは、電動によって前記カバー収納部から出し入れ可能な構造を有する。
 ある好適な実施形態において、前記基板は、液晶パネル用マザーガラスであり、前記第1基板処理室および前記第2基板処理室においては、CVD処理およびドライエッチング処理の一方が実行される。
 本発明に係る仮置き棚は、クリーンルーム内に設けられた第1搬送ロボットおよび第2搬送ロボットによって基板を仮置き可能な仮置き棚であり、前記基板を収納する棚本体部と、前記棚本体部に設けられ、前記第1搬送ロボットのアームが挿入される第1開口部と、前記棚本体部に設けられ、前記第2搬送ロボットのアームが挿入される第2開口部とを備え、第2開口部には、前記第2搬送ロボットのアームの侵入を防止するアーム侵入カバーが配置され、そして、前記仮置き棚には、前記アーム侵入カバーによって前記第2開口部を塞いだ状態において前記第2搬送ロボットの駆動を停止させる停止スイッチが設けられている。
A substrate processing apparatus according to the present invention is an apparatus for processing a substrate, and is connected to a substrate carry-in chamber into which a substrate is carried in, a first transfer robot area connected to the substrate carry-in chamber, and the first transfer robot area. A first substrate processing chamber into which the substrate is introduced from the first transfer robot area; the second transfer robot area connected to the first transfer robot area via a temporary storage shelf area; And a second substrate processing chamber connected to the second transfer robot area and into which the substrate is introduced from the second transfer robot area. A first transfer robot having an arm for transferring the substrate to the first substrate processing chamber is disposed in the first transfer robot area, and in the second transfer robot area, the second substrate processing chamber is provided. A second transfer robot having an arm for transferring the substrate is disposed. In the temporary storage shelf area, a temporary storage shelf capable of temporarily placing the substrate by the arm of the first transfer robot and the arm of the second transfer robot is disposed. The temporary storage shelf includes the second storage shelf. An arm intrusion cover that closes the opening on the transfer robot area side and prevents the arm of the second transfer robot from entering is disposed. Moreover, the temporary storage shelf is provided with a stop switch for stopping the driving of the second transfer robot in a state where the opening is closed by the arm entry cover.
In a preferred embodiment, a hook for supporting the arm entry cover is provided on an upper portion of the temporary storage shelf.
In a preferred embodiment, a cover storage portion for storing the arm intrusion cover is disposed at an upper portion of the temporary storage shelf, and the arm intrusion cover is pulled out from the cover storage portion to open the opening. It is characterized by blocking.
The arm intrusion cover has a structure that can be inserted and removed from the cover storage portion by electric power.
In a preferred embodiment, the substrate is a mother glass for a liquid crystal panel, and one of a CVD process and a dry etching process is performed in the first substrate processing chamber and the second substrate processing chamber.
The temporary storage shelf according to the present invention is a temporary storage shelf in which a substrate can be temporarily placed by a first transfer robot and a second transfer robot provided in a clean room, and a shelf main body for storing the substrate, and the shelf main body A first opening into which the arm of the first transfer robot is inserted, and a second opening that is provided in the shelf main body and into which the arm of the second transfer robot is inserted, An arm intrusion cover for preventing the arm of the second transport robot from entering the 2 opening is disposed, and the temporary storage shelf has the second opening in a state where the second opening is closed by the arm intrusion cover. A stop switch for stopping the driving of the second transfer robot is provided.
 本発明によれば、第1基板処理室及び第2基板処理室を備えた基板処理装置において、仮置き棚エリアに基板を仮置き可能な仮置き棚が配置され、仮置き棚には、第2搬送ロボットのアームの侵入を防止するアーム侵入カバーが配置されている。しかも、アーム侵入カバーによって開口部を塞いだ状態において第2搬送ロボットの駆動を停止させる停止スイッチが設けられている。したがって、アーム侵入カバーによって、第2搬送ロボットのアームの侵入を防止することができるとともに、アーム侵入カバーで停止スイッチをONすることによって、第2搬送ロボットの駆動を停止させることができる。その結果、第2搬送ロボットの停止中(例えば、メンテナンス中)においても、第1搬送ロボットを動作させることができ、生産性の低下を抑制することができる。 According to the present invention, in the substrate processing apparatus including the first substrate processing chamber and the second substrate processing chamber, the temporary storage shelf capable of temporarily placing the substrate in the temporary storage shelf area is disposed, 2 An arm intrusion cover for preventing the arm of the transfer robot from entering is disposed. In addition, a stop switch is provided for stopping the driving of the second transfer robot in a state where the opening is closed by the arm intrusion cover. Therefore, the arm intrusion cover can prevent the arm of the second transfer robot from entering, and the driving of the second transfer robot can be stopped by turning on the stop switch with the arm intrusion cover. As a result, even when the second transfer robot is stopped (for example, during maintenance), the first transfer robot can be operated, and a reduction in productivity can be suppressed.
CVD装置1000の構成を示す図である。It is a figure which shows the structure of CVD apparatus 1000. FIG. 仮置き棚110の構成を示す図である。It is a figure which shows the structure of the temporary storage shelf. 本発明の実施形態に係る基板処理装置200の構成を示す図である。It is a figure which shows the structure of the substrate processing apparatus 200 which concerns on embodiment of this invention. 本発明の実施形態に係る仮置き棚100の断面図(側面図)である。It is sectional drawing (side view) of the temporary storage shelf 100 which concerns on embodiment of this invention. 本発明の実施形態に係る仮置き棚100の正面図である。It is a front view of temporary storage shelf 100 concerning an embodiment of the present invention. 本発明の実施形態に係る基板処理装置210を示す図である。It is a figure which shows the substrate processing apparatus 210 which concerns on embodiment of this invention. 仮置き棚100の改変例を示す断面図(側面図)である。It is sectional drawing (side view) which shows the modification of the temporary storage shelf. 仮置き棚100の改変例を示す正面図である。It is a front view which shows the example of a change of the temporary storage shelf.
 以下、図面を参照しながら、本発明の実施形態を説明する。以下の図面においては、説明の簡潔化のために、実質的に同一の機能を有する構成要素を同一の参照符号で示す。なお、本発明は以下の実施形態に限定されない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, components having substantially the same function are denoted by the same reference numerals for the sake of brevity. In addition, this invention is not limited to the following embodiment.
 図3は、本発明の実施形態に係る基板処理装置200の構成を模式的に示す図(上面図)である。図4および図5は、それぞれ、本実施形態の基板処理装置200内に配置される仮置き棚100の構成を模式的に示す断面図(側面図)および正面図である。 FIG. 3 is a diagram (top view) schematically showing the configuration of the substrate processing apparatus 200 according to the embodiment of the present invention. 4 and 5 are a cross-sectional view (side view) and a front view, respectively, schematically showing the configuration of the temporary storage shelf 100 arranged in the substrate processing apparatus 200 of the present embodiment.
 本実施形態の基板処理装置200は、基板10を処理する装置であり、例えば、CVD(Chemical Vapor Deposition)処理を実行するCVD装置である。本実施形態の基板処理装置200は、基板10が搬入される基板搬入室61と、第1搬送ロボットエリア63と、第1基板処理室51と、仮置き棚エリア64と、第2搬送ロボットエリア65と、第2基板処理室52とから構成されている。本実施形態の第1基板処理室51および第2基板処理室52では、基板10に対してCVD処理を実行することができる。 The substrate processing apparatus 200 of the present embodiment is an apparatus that processes the substrate 10, for example, a CVD apparatus that performs a CVD (Chemical Vapor Deposition) process. The substrate processing apparatus 200 of this embodiment includes a substrate carry-in chamber 61 into which the substrate 10 is carried in, a first transfer robot area 63, a first substrate processing chamber 51, a temporary storage shelf area 64, and a second transfer robot area. 65 and the second substrate processing chamber 52. In the first substrate processing chamber 51 and the second substrate processing chamber 52 of the present embodiment, a CVD process can be performed on the substrate 10.
 本実施形態の基板10は、例えば、ガラス基板であり、本実施形態における基板10は、液晶パネル用のガラス基板である。図示した例では、基板10は、液晶パネルの寸法に切り出す前のマザーガラスである。基板10としてのマザーガラスの寸法は1辺が1メートル以上あり、具体的には、基板10が第10世代のマザーガラスの場合、その寸法は2880mm(W)×3130mm(L)である。 The substrate 10 of the present embodiment is, for example, a glass substrate, and the substrate 10 of the present embodiment is a glass substrate for a liquid crystal panel. In the illustrated example, the substrate 10 is a mother glass before being cut out to the dimensions of the liquid crystal panel. The size of the mother glass as the substrate 10 is 1 meter or more on one side. Specifically, when the substrate 10 is a 10th generation mother glass, the size is 2880 mm (W) × 3130 mm (L).
 なお、基板10は、液晶パネルの寸法に切り出す前のマザーガラスに限らず、切り出した後の液晶パネルのサイズのガラスであってもよい。さらに、基板10は、薄膜トランジスタ(TFT)が作製されるアレイ基板(またはその作製途中のもの)であってもよいし、カラーフィルタ(CF)が形成されるCF基板(またはその作製途中のもの)であってもよい。基板10がアレイ基板またはCF基板(それぞれ作製途中のものを含む)の場合、基板10の表面には薄膜(各種パターンなど)が形成されている。また、基板10は、液晶パネルの用途のものに限らず、他の用途のもの(例えば、PDPその他のフラットパネルディスプレイ)であっても構わない。 The substrate 10 is not limited to the mother glass before being cut out to the dimensions of the liquid crystal panel, but may be glass having the size of the liquid crystal panel after being cut out. Further, the substrate 10 may be an array substrate on which a thin film transistor (TFT) is manufactured (or a product in the middle of manufacturing), or a CF substrate on which a color filter (CF) is formed (or a device in the middle of manufacturing thereof). It may be. When the substrate 10 is an array substrate or a CF substrate (including those in the middle of production), a thin film (such as various patterns) is formed on the surface of the substrate 10. In addition, the substrate 10 is not limited to a liquid crystal panel, but may be used for other purposes (for example, a PDP or other flat panel display).
 第1搬送ロボットエリア63は、基板搬入室61に連結されている。第1基板処理室51は、第1搬送ロボットエリア63に連結され、第1搬送ロボットエリア63から基板10が導入される。第2搬送ロボットエリア65は、仮置き棚エリア64を介して、第1搬送ロボットエリア63に連結されている。また、第2基板処理室52は、第2搬送ロボットエリア65に連結され、第2搬送ロボットエリア65から基板10が導入される。 The first transfer robot area 63 is connected to the substrate loading chamber 61. The first substrate processing chamber 51 is connected to the first transfer robot area 63, and the substrate 10 is introduced from the first transfer robot area 63. The second transfer robot area 65 is connected to the first transfer robot area 63 via the temporary storage shelf area 64. The second substrate processing chamber 52 is connected to the second transfer robot area 65, and the substrate 10 is introduced from the second transfer robot area 65.
 基板搬入室61には、基板搬送装置(例えば、ローラコンベア、エア浮上コンベア)62が配置されている。第1搬送ロボットエリア63には、第1基板処理室51に基板10を搬送するアーム72を有する第1搬送ロボット70Aが配置されている。また、第2搬送ロボットエリア65には、第2基板処理室52に基板10を搬送するアーム72を有する第2搬送ロボット70Bが配置されている。ここで、第1及び第2基板処理室(CVD処理室)51、52の前に位置するローダは、仮置き棚100を介して搬送ロボット70A及び70Bを有するエリア(63、64、65)になる。なお、第1搬送ロボット70Aと第2搬送ロボット70Bは、基本的に同種の搬送ロボット70を使用するが、場合によっては異なる搬送ロボットを使用しても構わない。 In the substrate carry-in chamber 61, a substrate transfer device (for example, a roller conveyor, an air levitation conveyor) 62 is disposed. In the first transfer robot area 63, a first transfer robot 70A having an arm 72 for transferring the substrate 10 to the first substrate processing chamber 51 is disposed. In the second transfer robot area 65, a second transfer robot 70B having an arm 72 for transferring the substrate 10 to the second substrate processing chamber 52 is disposed. Here, the loader located in front of the first and second substrate processing chambers (CVD processing chambers) 51 and 52 is placed in an area (63, 64, 65) having the transfer robots 70A and 70B via the temporary storage shelf 100. Become. The first transfer robot 70A and the second transfer robot 70B basically use the same transfer robot 70, but different transfer robots may be used depending on circumstances.
 また、仮置き棚エリア64には、仮置き棚100が配置されている。仮置き棚100は、第1搬送ロボット70Aのアーム72および第2搬送ロボット70Bのアーム72によって基板10を仮置き可能な棚である。図4に示すように、仮置き棚100は、基板10を収納する棚本体部20と、棚本体部20に設けられた第1開口部21Aおよび第2開口部21Bとを備えている。本実施形態の棚本体部20には、基板10を多段に収納可能である。なお、ここでは、基板10を支持する支持部材(ピン、棚片など)は示していない。 Also, the temporary storage shelf 100 is arranged in the temporary storage shelf area 64. The temporary shelf 100 is a shelf in which the substrate 10 can be temporarily placed by the arm 72 of the first transfer robot 70A and the arm 72 of the second transfer robot 70B. As shown in FIG. 4, the temporary storage shelf 100 includes a shelf body 20 that stores the substrate 10, and a first opening 21 </ b> A and a second opening 21 </ b> B provided in the shelf body 20. The shelf body 20 of the present embodiment can store the substrates 10 in multiple stages. Here, support members (pins, shelf pieces, etc.) for supporting the substrate 10 are not shown.
 第1開口部21Aは、第1搬送ロボット70A側を向いており、第1開口部21Aからは、第1搬送ロボット70Aのアーム72を挿入することができる。一方、第2開口部21Bは、第2搬送ロボット70B側を向いており、アーム侵入カバー30が設けられていないときには、第2開口部21Bから、第2搬送ロボット70Bのアーム72を挿入することができる。仮置き棚100に仮置きした基板10は、第2搬送ロボット70Bのアーム72によって第2基板処理52に導入することができる。なお、同様の手順を通じて、逆向きに基板を移動させることが可能であり、処理された基板10は、基板搬入室61に送り出すことができる。 The first opening 21A faces the first transfer robot 70A, and the arm 72 of the first transfer robot 70A can be inserted from the first opening 21A. On the other hand, the second opening 21B faces the second transfer robot 70B, and when the arm entry cover 30 is not provided, the arm 72 of the second transfer robot 70B is inserted from the second opening 21B. Can do. The substrate 10 temporarily placed on the temporary shelf 100 can be introduced into the second substrate processing 52 by the arm 72 of the second transfer robot 70B. Note that it is possible to move the substrate in the reverse direction through the same procedure, and the processed substrate 10 can be sent out to the substrate carry-in chamber 61.
 本実施形態の仮置き棚100においては、第2開口部21Bには、第2搬送ロボット70Bのアーム72の侵入を防止するアーム侵入カバー30を配置することができる。さらに、棚本体部20には、アーム侵入カバー30によって第2開口部21Bを塞いだ状態において第2搬送ロボット70Bの駆動を停止させる停止スイッチ40が設けられている。 In the temporary storage shelf 100 of the present embodiment, the arm intrusion cover 30 that prevents the arm 72 of the second transfer robot 70B from entering can be disposed in the second opening 21B. Further, the shelf body 20 is provided with a stop switch 40 for stopping the driving of the second transfer robot 70B in a state where the second opening 21B is closed by the arm intrusion cover 30.
 本実施形態の仮置き棚100の上部には、アーム侵入カバー30を支持するフック22が設けられている。図4に示した例では、棚本体部20の上板にフック支持部材24が形成されており、フック支持部材24にフック22が取り付けられている。アーム侵入カバー30には、フック22に引っ掛ける係合部32が取り付けられている。アーム侵入カバー30の係合部32をフック22に引っ掛けることによって、アーム侵入カバー30によって第2開口部21Bを塞ぐことができる。 A hook 22 that supports the arm intrusion cover 30 is provided on the upper part of the temporary storage shelf 100 of the present embodiment. In the example shown in FIG. 4, the hook support member 24 is formed on the upper plate of the shelf body 20, and the hook 22 is attached to the hook support member 24. The arm intrusion cover 30 is provided with an engaging portion 32 that hooks onto the hook 22. By hooking the engaging portion 32 of the arm intrusion cover 30 on the hook 22, the second opening 21 </ b> B can be closed by the arm intrusion cover 30.
 また、図示した例では、棚本体部20の土台となる棚台25に、第2搬送ロボット70Bの駆動を停止させる停止スイッチ40が設けられている。棚台25は、地面(例えば、パネル製造ラインの床)90の上に配置され、そして、停止スイッチ40は、アーム侵入カバー30が配置される側に設けられる。図示した例では、停止スイッチ40を複数(2つ)設けているが、1つでも構わない。また、アーム侵入カバー30には、停止スイッチ40に接触させるスイッチ接触部材(接触板)36が取り付けられている。さらに、スイッチ接触部材36には、締結部材(ネジ、ピンなど)38を取り付けることができ、これによって、アーム侵入カバー30によって第2開口部21Bを塞いだ状態で、アーム侵入カバー30の下部を固定することができる。なお、アーム侵入カバー30の下部を固定するには、締結部材(ネジ、ピンなど)38に限らず、他の固定部材(例えば、磁力吸着部材など)を用いることも可能である。 Further, in the illustrated example, a stop switch 40 for stopping the driving of the second transfer robot 70B is provided on the shelf 25 that is a base of the shelf body 20. The shelf 25 is disposed on the ground (for example, the floor of the panel production line) 90, and the stop switch 40 is provided on the side where the arm entry cover 30 is disposed. In the illustrated example, a plurality (two) of stop switches 40 are provided, but one stop switch 40 may be provided. Further, a switch contact member (contact plate) 36 that is brought into contact with the stop switch 40 is attached to the arm intrusion cover 30. Further, a fastening member (screw, pin, etc.) 38 can be attached to the switch contact member 36, whereby the lower part of the arm intrusion cover 30 is covered with the second opening 21 </ b> B closed by the arm intrusion cover 30. Can be fixed. In addition, in order to fix the lower part of the arm intrusion cover 30, not only the fastening member (screw, pin, etc.) 38 but other fixing members (for example, magnetic force adsorbing member, etc.) can be used.
 本実施形態の停止スイッチ40には、配線42が接続されており、停止スイッチ40がONになると、第2搬送ロボット70Bの駆動を停止させる信号(ロボット駆動の停止信号)が発せられて、その停止信号は配線42を通じて、第2搬送ロボット70Bの駆動を制御する制御装置(不図示)に出力される。なお、停止スイッチ40の配線42に代えて、配線42を用いずに、停止スイッチ40から信号を、無線または赤外線などを利用して発するようにしてもよい。 A wiring 42 is connected to the stop switch 40 of the present embodiment, and when the stop switch 40 is turned on, a signal (robot driving stop signal) for stopping the driving of the second transfer robot 70B is issued. The stop signal is output through the wiring 42 to a control device (not shown) that controls the driving of the second transfer robot 70B. Instead of the wiring 42 of the stop switch 40, a signal may be emitted from the stop switch 40 using radio or infrared rays without using the wiring 42.
 図5は、アーム侵入カバー30で第2開口部21Bを塞いだ状態における仮置き棚100を示している。言い換えると、第2搬送ロボット70Bから見た仮置き棚100の正面図である。ここでは、アーム侵入カバー30が第2開口部21Bを塞ぐことによって、停止スイッチ40が第2搬送ロボット70Bの駆動を停止させる信号を発しているとともに、アーム侵入カバー30によって第2搬送ロボット70Bのアーム72の侵入を防止している。 FIG. 5 shows the temporary shelf 100 in a state where the arm opening cover 30 covers the second opening 21B. In other words, it is a front view of the temporary storage shelf 100 as viewed from the second transfer robot 70B. Here, when the arm intrusion cover 30 closes the second opening 21B, the stop switch 40 issues a signal for stopping the driving of the second transfer robot 70B, and the arm intrusion cover 30 causes the second transfer robot 70B to stop driving. Intrusion of the arm 72 is prevented.
 本実施形態の構成では、第1基板処理室51及び第2基板処理室52を備えた基板処理装置200において、第1搬送ロボットエリア63は、仮置き棚エリア64を介して第2搬送ロボットエリア65が連結されている。仮置き棚エリア64には、第1搬送ロボット70Aのアーム72および第2搬送ロボット70Bのアーム72によって基板10を仮置き可能な仮置き棚100が配置されている。そして、仮置き棚100には、第2搬送ロボット70Bのアーム72の侵入を防止するアーム侵入カバー30が配置され、しかも、アーム侵入カバー30によって開口部21Bを塞いだ状態において第2搬送ロボット70Bの駆動を停止させる停止スイッチ40が設けられている。 In the configuration of this embodiment, in the substrate processing apparatus 200 including the first substrate processing chamber 51 and the second substrate processing chamber 52, the first transfer robot area 63 is the second transfer robot area via the temporary storage shelf area 64. 65 is connected. In the temporary storage shelf area 64, a temporary storage shelf 100 on which the substrate 10 can be temporarily placed by the arm 72 of the first transfer robot 70A and the arm 72 of the second transfer robot 70B is disposed. The temporary storage rack 100 is provided with an arm intrusion cover 30 that prevents the arm 72 of the second transfer robot 70B from entering, and the second transfer robot 70B is in a state where the opening 21B is closed by the arm intrusion cover 30. A stop switch 40 is provided to stop the driving.
 したがって、アーム侵入カバー30によって、第2搬送ロボット70Bのアーム72の侵入を防止することができるとともに、アーム侵入カバー30で停止スイッチ40をONすることによって、第2搬送ロボット70Bの駆動を停止させることができる。その結果、第1搬送ロボット70Aおよび第2搬送ロボット70Bの動作・停止信号を共通にして、両方の搬送ロボット(70A、70B)を停止させなくてもよい。具体的には、第2搬送ロボット70Bの停止中(例えば、メンテナンス中)においても、第1搬送ロボット70Aを動作させることができ、生産性の低下を抑制することができる。特に、アーム侵入カバー30で開口部21Bを塞ぐとともに、停止スイッチ40をONすることができるので、搬送ロボットの動作の安全性を確実に確保することができる。 Therefore, the arm intrusion cover 30 can prevent the arm 72 of the second transfer robot 70B from entering, and the stop switch 40 is turned on by the arm intrusion cover 30 to stop the driving of the second transfer robot 70B. be able to. As a result, the operation / stop signals of the first transfer robot 70A and the second transfer robot 70B are shared, and both transfer robots (70A, 70B) need not be stopped. Specifically, even when the second transfer robot 70B is stopped (for example, during maintenance), the first transfer robot 70A can be operated, and a reduction in productivity can be suppressed. In particular, the opening 21B can be closed with the arm intrusion cover 30 and the stop switch 40 can be turned on, so that the safety of the operation of the transfer robot can be ensured.
 さらに説明すると、単に、第1搬送ロボット70Aおよび第2搬送ロボット70Bの動作・停止信号を独立にして(共通にせずに)、停止スイッチ40のONだけで、第2搬送ロボット70Bの動作を停止した場合には、万が一の停止スイッチ40の押し間違いによる第2搬送ロボット70Bの誤動作が懸念される。一方、本実施形態の構成の場合、アーム侵入カバー30で開口部21Bを塞ぐと確実に停止スイッチ40をONすることができるので、第2搬送ロボット70Bの停止中(例えば、メンテナンス中)の際には、アーム侵入カバー30が開口部21Bを塞ぐことを徹底すれば、確実に、第2搬送ロボット70Bの動作を停止することができ、その結果、第2搬送ロボット70Bの万が一の誤動作の問題を回避することができる。つまり、このように安全性が確保されていることによって、第1搬送ロボット70Aの動作を実行することができ、その結果、生産性の低下を抑制することができる。 More specifically, the operation / stop signal of the first transfer robot 70A and the second transfer robot 70B is made independent (not common), and the operation of the second transfer robot 70B is stopped only by turning on the stop switch 40. In such a case, there is a concern that the second transport robot 70B malfunctions due to an erroneous pressing of the stop switch 40. On the other hand, in the configuration of the present embodiment, the stop switch 40 can be reliably turned on when the opening 21B is closed with the arm intrusion cover 30, so that the second transfer robot 70B is stopped (for example, during maintenance). If the arm intrusion cover 30 completely blocks the opening 21B, the operation of the second transfer robot 70B can be surely stopped. As a result, the second transfer robot 70B may malfunction. Can be avoided. That is, by ensuring the safety in this way, the operation of the first transfer robot 70A can be executed, and as a result, a reduction in productivity can be suppressed.
 また、本実施形態の基板処理装置200の内部はクリーンルームとなっており、基板10は、そのクリーンルームの中を搬送・移動する。上述した例では、第1基板処理室51及び第2基板処理室52は、基板10にCVD処理を実行するCVD処理室であるが、他の処理を実行する処理室であってもよい。例えば、基板10にドライエッチング処理を実行するドライエッチング処理室であってもよい。 Further, the inside of the substrate processing apparatus 200 of the present embodiment is a clean room, and the substrate 10 is transported and moved in the clean room. In the example described above, the first substrate processing chamber 51 and the second substrate processing chamber 52 are CVD processing chambers that perform CVD processing on the substrate 10, but may be processing chambers that perform other processing. For example, it may be a dry etching processing chamber for performing a dry etching process on the substrate 10.
 さらに、本実施形態の基板処理装置200は次のように改変することも可能である。図6は、本実施形態の基板処理装置210(改変例)である。図6に示した基板処理装置210は、図3に示した構成例と比較して、さらに、第3搬送ロボット70Cが配置された第3搬送ロボットエリア67と、第3基板処理室53とが設けられている。そして、第1搬送ロボット70Aと第2搬送ロボット70Bとの間には、本実施形態の仮置き棚100Aが設けられているとともに、第2搬送ロボット70Bと第3搬送ロボット70Cとの間にも、本実施形態の仮置き棚100Bが設けられている。 Furthermore, the substrate processing apparatus 200 of the present embodiment can be modified as follows. FIG. 6 shows a substrate processing apparatus 210 (modified example) of this embodiment. Compared with the configuration example shown in FIG. 3, the substrate processing apparatus 210 shown in FIG. 6 further includes a third transfer robot area 67 in which the third transfer robot 70C is arranged, and a third substrate processing chamber 53. Is provided. In addition, the temporary storage rack 100A of the present embodiment is provided between the first transfer robot 70A and the second transfer robot 70B, and also between the second transfer robot 70B and the third transfer robot 70C. The temporary storage shelf 100B of the present embodiment is provided.
 したがって、図6に示した基板処理装置210の場合、まず、第1、第2、第3搬送ロボット70A、70B、70Cを動作させている時は、第1、第2、第3基板処理室51、52、53で処理を実行することができる。ここで、第3搬送ロボット70Cを例えばメンテナンスで停止させるときには、仮置き棚100Bにアーム侵入カバー30をセットして、第3搬送ロボット70Cの動作を停止させることができる。そのときは、第1搬送ロボット70Aおよび第2搬送ロボット70Bを動作させることができるので、生産性の低下を抑えることができる。 Therefore, in the case of the substrate processing apparatus 210 shown in FIG. 6, when the first, second, and third transfer robots 70A, 70B, and 70C are first operated, the first, second, and third substrate processing chambers are operated. The processing can be executed at 51, 52, 53. Here, when the third transfer robot 70C is stopped by, for example, maintenance, the arm intrusion cover 30 can be set on the temporary storage shelf 100B to stop the operation of the third transfer robot 70C. At that time, since the first transfer robot 70A and the second transfer robot 70B can be operated, a decrease in productivity can be suppressed.
 加えて、第2搬送ロボット70Bを例えばメンテナンスで停止させるときには、上述したように、仮置き棚100Aにアーム侵入カバー30をセットして、第2搬送ロボット70Bの動作を停止させることができる。そのときは、第1搬送ロボット70Aを動作させることができるので、生産性の低下を抑えることができる。 In addition, when the second transfer robot 70B is stopped by maintenance, for example, as described above, the arm intrusion cover 30 can be set on the temporary storage shelf 100A to stop the operation of the second transfer robot 70B. At that time, the first transfer robot 70A can be operated, so that a reduction in productivity can be suppressed.
 さらに、本実施形態の仮置き棚100は、次のように改変することも可能である。図7は、本実施形態の仮置き棚100の改変例を示す断面図(側面図)である。図4に示した仮置き棚100では、アーム侵入カバー30の係合部32をフック22に取り付けて、アーム侵入カバー30で開口部21Bを塞いだが、これに限らず他の手法を採用することもできる。図7に示した改変例では、仮置き棚100の上部に、アーム侵入カバー31を収納するカバー収納部26が配置されている。 Furthermore, the temporary storage shelf 100 of the present embodiment can be modified as follows. FIG. 7 is a cross-sectional view (side view) showing a modified example of the temporary storage shelf 100 of the present embodiment. In the temporary shelf 100 shown in FIG. 4, the engaging portion 32 of the arm intrusion cover 30 is attached to the hook 22 and the opening portion 21 </ b> B is closed with the arm intrusion cover 30. You can also. In the modified example shown in FIG. 7, a cover storage unit 26 for storing the arm entry cover 31 is disposed on the temporary storage shelf 100.
 この例では、アーム侵入カバー31は、カバー収納部26内でロール状に巻かれて収納されている。アーム侵入カバー31は、矢印81に示すように、カバー収納部26から引き出されて開口部21Bを塞ぐことができる。アーム侵入カバー31は、いわゆるシャッター構造を有している。また、アーム侵入カバー31が開口部21Bを塞いだ際には、アーム侵入カバー31の先端部33は、停止スイッチ44に接触して、停止スイッチ44をONすることができる。停止スイッチ44がONになると、第2搬送ロボット70Bの動作を停止させる停止信号が発せられる。 In this example, the arm intrusion cover 31 is wound and stored in a roll shape in the cover storage unit 26. The arm intrusion cover 31 can be pulled out from the cover storage portion 26 to close the opening 21 </ b> B as indicated by an arrow 81. The arm entry cover 31 has a so-called shutter structure. Further, when the arm intrusion cover 31 closes the opening 21B, the distal end portion 33 of the arm intrusion cover 31 can come into contact with the stop switch 44 to turn on the stop switch 44. When the stop switch 44 is turned on, a stop signal for stopping the operation of the second transfer robot 70B is issued.
 また、図4に示した仮置き棚100の場合には、アーム侵入カバー30の係合部32をフック22に取り付けるには、作業員が手動で実行することが便利である。また、図7に示した仮置き棚100の場合は、アーム侵入カバー31の先端部33を電動によって下方に移動させる構造にすることもできる。アーム侵入カバー31を電動で下方に移動可能な構造にすれば、作業員が仮置き棚エリア64に入らなくても、アーム侵入カバー31のセットの動作を実行することができ便利である。なお、図7に示した仮置き棚100の場合でも、アーム侵入カバー31の先端部33を作業員が手動で下に降ろしてもよい。 Further, in the case of the temporary storage shelf 100 shown in FIG. 4, it is convenient for an operator to manually execute the engagement portion 32 of the arm entry cover 30 on the hook 22. Further, in the case of the temporary storage shelf 100 shown in FIG. 7, it is possible to adopt a structure in which the tip 33 of the arm entry cover 31 is moved downward by electric drive. If the arm intrusion cover 31 is configured to be electrically movable downward, it is convenient that the operation of setting the arm intrusion cover 31 can be executed without an operator entering the temporary storage shelf area 64. Even in the case of the temporary storage shelf 100 shown in FIG. 7, the operator may manually lower the tip 33 of the arm entry cover 31.
 また、本実施形態の仮置き棚100は、図8に示すように改変することも可能である。図8は、本実施形態の仮置き棚100の改変例を示す断面図(正面図)である。図8に示した仮置き棚100では、アーム侵入カバー35を平行方向82に移動させることによって開口部21Bを塞ぐことができる。アーム侵入カバー35は、いわゆるカーテン構造を有している。アーム侵入カバー35が開口部21Bを塞いでいないときは、アーム侵入カバー35は折り畳まれて一方の端に寄せられて纏められている。アーム侵入カバー35が開口部21Bを塞いだ際には、アーム侵入カバー35の一部37は、停止スイッチ46に接触して、停止スイッチ46をONすることができる。停止スイッチ46がONになると、第2搬送ロボット70Bの動作を停止させる停止信号が発せられる。 Further, the temporary storage shelf 100 of the present embodiment can be modified as shown in FIG. FIG. 8 is a cross-sectional view (front view) showing a modified example of the temporary storage shelf 100 of the present embodiment. In the temporary storage rack 100 shown in FIG. 8, the opening 21 </ b> B can be closed by moving the arm entry cover 35 in the parallel direction 82. The arm entry cover 35 has a so-called curtain structure. When the arm entry cover 35 does not block the opening 21B, the arm entry cover 35 is folded and brought together at one end. When the arm intrusion cover 35 closes the opening 21B, a part 37 of the arm intrusion cover 35 can come into contact with the stop switch 46 to turn on the stop switch 46. When the stop switch 46 is turned on, a stop signal for stopping the operation of the second transfer robot 70B is issued.
 図8に示した仮置き棚100は、アーム侵入カバー35を電動によって水平方向(左右方向)82に移動させる構造にすることもできる。なお、図8に示した仮置き棚100の場合でも、アーム侵入カバー35を作業員が手動で水平方向82に移動させてもよい。 The temporary storage rack 100 shown in FIG. 8 can also be configured to move the arm intrusion cover 35 in the horizontal direction (left-right direction) 82 electrically. Even in the case of the temporary storage shelf 100 shown in FIG. 8, the operator may manually move the arm entry cover 35 in the horizontal direction 82.
 以上、本発明を好適な実施形態により説明してきたが、こうした記述は限定事項ではなく、勿論、種々の改変が可能である。 As mentioned above, although this invention has been demonstrated by suitable embodiment, such description is not a limitation matter and, of course, various modifications are possible.
 本発明によれば、一方の搬送ロボットの停止中でも他方の搬送ロボットを動作させて生産性の低下を抑制することができる基板処理装置を提供することができる。 According to the present invention, it is possible to provide a substrate processing apparatus capable of suppressing a decrease in productivity by operating the other transfer robot even when one transfer robot is stopped.
 10 基板
 20 棚本体部
 21A、21B 開口部
 22 フック
 24 フック支持部材
 25 棚台
 26 カバー収納部
 30 アーム侵入カバー
 31 アーム侵入カバー
 32 係合部
 33 先端部
 35 アーム侵入カバー
 36 スイッチ接触部材
 40 停止スイッチ
 42 配線
 44 停止スイッチ
 46 停止スイッチ
 51 第1基板処理室
 52 第2基板処理室
 53 第3基板処理室
 61 基板搬入室
 63 第1搬送ロボットエリア
 64 仮置き棚エリア
 65 第2搬送ロボットエリア
 67 第3搬送ロボットエリア
 70A 第1搬送ロボット
 70B 第2搬送ロボット
 70C 第3搬送ロボット
 72 アーム(ロボットアーム)
100 仮置き棚
200 基板処理装置(CVD装置)
210 基板処理装置(CVD装置)
1000 基板処理装置(CVD装置)
DESCRIPTION OF SYMBOLS 10 Board | substrate 20 Shelf body part 21A, 21B Opening part 22 Hook 24 Hook support member 25 Shelf 26 Cover storage part 30 Arm intrusion cover 31 Arm intrusion cover 32 Engagement part 33 Tip part 35 Arm intrusion cover 36 Switch contact member 40 Stop switch 42 Wiring 44 Stop switch 46 Stop switch 51 First substrate processing chamber 52 Second substrate processing chamber 53 Third substrate processing chamber 61 Substrate loading chamber 63 First transfer robot area 64 Temporary storage shelf area 65 Second transfer robot area 67 Third Transfer robot area 70A First transfer robot 70B Second transfer robot 70C Third transfer robot 72 Arm (robot arm)
100 Temporary storage shelf 200 Substrate processing apparatus (CVD apparatus)
210 Substrate processing equipment (CVD equipment)
1000 Substrate processing equipment (CVD equipment)

Claims (6)

  1.  基板を処理する基板処理装置であって、
     基板が搬入される基板搬入室と、
     前記基板搬入室に連結された第1搬送ロボットエリアと、
     前記第1搬送ロボットエリアに連結され、前記第1搬送ロボットエリアから前記基板が導入される第1基板処理室と、
     前記第1搬送ロボットエリアに、仮置き棚エリアを介して連結された前記第2搬送ロボットエリアと、
     前記第2搬送ロボットエリアに連結され、前記第2搬送ロボットエリアから前記基板が導入される第2基板処理室と
     を備え、
     前記第1搬送ロボットエリアには、前記第1基板処理室に前記基板を搬送するアームを有する第1搬送ロボットが配置されており、
     前記第2搬送ロボットエリアには、前記第2基板処理室に前記基板を搬送するアームを有する第2搬送ロボットが配置されており、
     前記仮置き棚エリアには、前記第1搬送ロボットのアームおよび前記第2搬送ロボットのアームによって前記基板を仮置き可能な仮置き棚が配置されており、
     前記仮置き棚には、前記第2搬送ロボットエリア側の開口部を塞ぎ、前記第2搬送ロボットのアームの侵入を防止するアーム侵入カバーが配置され、しかも、前記仮置き棚には、前記アーム侵入カバーによって前記開口部を塞いだ状態において前記第2搬送ロボットの駆動を停止させる停止スイッチが設けられている、基板処理装置。
    A substrate processing apparatus for processing a substrate,
    A substrate loading chamber in which substrates are loaded;
    A first transfer robot area connected to the substrate loading chamber;
    A first substrate processing chamber connected to the first transfer robot area and into which the substrate is introduced from the first transfer robot area;
    The second transfer robot area connected to the first transfer robot area via a temporary storage shelf area;
    A second substrate processing chamber connected to the second transfer robot area and into which the substrate is introduced from the second transfer robot area;
    A first transfer robot having an arm for transferring the substrate to the first substrate processing chamber is disposed in the first transfer robot area.
    A second transfer robot having an arm for transferring the substrate to the second substrate processing chamber is disposed in the second transfer robot area,
    In the temporary storage shelf area, a temporary storage shelf capable of temporarily placing the substrate by the arm of the first transfer robot and the arm of the second transfer robot is disposed,
    The temporary storage shelf is provided with an arm entry cover that closes the opening on the second transfer robot area side and prevents the arm of the second transfer robot from entering, and the temporary storage shelf includes the arm A substrate processing apparatus, comprising: a stop switch that stops driving of the second transfer robot in a state where the opening is closed by an intrusion cover.
  2.  前記仮置き棚の上部には、前記アーム侵入カバーを支持するフックが設けられている、請求項1に記載の基板処理装置。 The substrate processing apparatus according to claim 1, wherein a hook for supporting the arm entry cover is provided on an upper portion of the temporary storage shelf.
  3.  前記仮置き棚の上部には、前記アーム侵入カバーを収納するカバー収納部が配置されており、
     前記アーム侵入カバーは、前記カバー収納部から引き出されて前記開口部を塞ぐことを特徴とする、請求項1に記載の基板処理装置。
    On the upper part of the temporary storage shelf, a cover storage portion for storing the arm entry cover is disposed,
    The substrate processing apparatus according to claim 1, wherein the arm intrusion cover is pulled out from the cover storage portion and closes the opening.
  4.  前記アーム侵入カバーは、電動によって前記カバー収納部から出し入れ可能な構造を有する、請求項3に記載の基板処理装置。 4. The substrate processing apparatus according to claim 3, wherein the arm intrusion cover has a structure that can be inserted and removed from the cover storage portion by electric power.
  5.  前記基板は、液晶パネル用マザーガラスであり、
     前記第1基板処理室および前記第2基板処理室においては、CVD処理およびドライエッチング処理の一方が実行される、請求項1から4の何れか一つに記載の基板処理装置。
    The substrate is a mother glass for a liquid crystal panel,
    5. The substrate processing apparatus according to claim 1, wherein one of a CVD process and a dry etching process is performed in the first substrate processing chamber and the second substrate processing chamber.
  6.  クリーンルーム内に設けられた第1搬送ロボットおよび第2搬送ロボットによって基板を仮置き可能な仮置き棚であって、
     前記基板を収納する棚本体部と、
     前記棚本体部に設けられ、前記第1搬送ロボットのアームが挿入される第1開口部と、
     前記棚本体部に設けられ、前記第2搬送ロボットのアームが挿入される第2開口部と
     を備え、
     第2開口部には、前記第2搬送ロボットのアームの侵入を防止するアーム侵入カバーが配置され、そして、
     前記仮置き棚には、前記アーム侵入カバーによって前記第2開口部を塞いだ状態において前記第2搬送ロボットの駆動を停止させる停止スイッチが設けられている、仮置き棚。
    A temporary storage shelf in which a substrate can be temporarily placed by a first transfer robot and a second transfer robot provided in a clean room,
    A shelf body for storing the substrate;
    A first opening provided in the shelf body and into which an arm of the first transfer robot is inserted;
    A second opening provided in the shelf main body and into which an arm of the second transfer robot is inserted;
    An arm intrusion cover for preventing the arm of the second transfer robot from entering is disposed in the second opening, and
    The temporary storage shelf is provided with a stop switch for stopping the driving of the second transfer robot in a state where the second opening is closed by the arm intrusion cover.
PCT/JP2011/060747 2010-05-27 2011-05-10 Substrate processing apparatus and temporary storage shelf WO2011148782A1 (en)

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CN110391152A (en) * 2018-04-16 2019-10-29 汉民科技股份有限公司 Epitaxial growth process system and its automatic transmitting method
CN112658014A (en) * 2020-12-23 2021-04-16 福建琰衡实业有限公司 Large-scale rubbish crushing apparatus in gardens

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JPH05299312A (en) * 1992-04-21 1993-11-12 Sumitomo Electric Ind Ltd Semiconductor manufacturing equipment
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WO1997034742A1 (en) * 1996-03-18 1997-09-25 Komatsu Ltd. Control device for a work carrying system
JP2007511104A (en) * 2003-11-10 2007-04-26 ブルーシフト テクノロジーズ インコーポレイテッド Method and system for processing a product being processed in a semiconductor processing system under vacuum

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CN110391152A (en) * 2018-04-16 2019-10-29 汉民科技股份有限公司 Epitaxial growth process system and its automatic transmitting method
CN112658014A (en) * 2020-12-23 2021-04-16 福建琰衡实业有限公司 Large-scale rubbish crushing apparatus in gardens

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