JP2009239072A - Peeling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently carry out work of peeling a base material from a substrate with the sheet-like base material stuck thereto. <P>SOLUTION: In the peeling device, a winding start-side end Fs of a sheet film F peeled from a substrate and wound around a winding roller 220 is extracted and held by a sheet peeling claw 512 (Fig.14(a)), and moved to the lower side of a sheet peeling mechanism 510 (Fig.14(b)). When the winding start-side end is moved to the lowest end, a sheet guide 521 with a driven roller 522 arranged therein is lowered, the sheet end is clamped by a nipping part with a transport roller 531, and transported to a recovery box 600 along a transport path P by rotation of the transport roller 531 (Fig.14(c)). <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a peeling apparatus for peeling a sheet-like base material attached to one main surface of a substrate. The substrates to be processed include semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, FED (Field Emission Display) substrates, optical disk substrates, and magnetic disks. And a magneto-optical disk substrate.

  In recent years, with an increase in the diameter of a wafer used for manufacturing an LSI and an increase in the area of a liquid crystal panel or the like, a thin film forming method suitable for the large area has become necessary. In addition, in the field of multilayer wiring technology in LSI manufacturing technology, it is necessary to planarize the surface of the insulating film with high accuracy in order to realize multilayer wiring. In addition to increasing the area, planarizing the surface in thin film formation The demand for technology is also increasing. Accordingly, in order to satisfy these requirements, a thin film forming technique for forming a thin film on a substrate by a pressure transfer method has been proposed.

  An example of such a thin film forming apparatus is described in Patent Document 1. In this thin film forming apparatus, a pattern-formed surface (substrate surface) is faced down, that is, a substrate held in a face-down state, a thin film material coated on a sheet-like base material (sheet film) is pasted, The thin film is formed on the substrate surface by heating and pressurizing them to transfer the thin film to the substrate surface.

  Further, after the thin film on the sheet film is transferred to the substrate surface in this way, it is necessary to peel off the base material. As such a peeling device, there is one described in Patent Document 2, for example. In this peeling apparatus, the substrate surface on which the sheet film is affixed is held upward, that is, in a face-up state, and the substrate is removed from the substrate surface by winding the substrate with a take-up roller provided above the substrate. Peel off.

Japanese Patent Laid-Open No. 2003-100727 (FIG. 18) Japanese Patent Laying-Open No. 2003-224184 (FIG. 1)

  In the above-described prior art, when the process of peeling the base material from the substrate is continuously performed on a plurality of substrates, it is necessary to quickly remove the base material wound on the winding roller from the substrate. Become. However, an apparatus for removing the substrate wound around the roller has not been put to practical use until now, and the roller is taken out for each winding operation to remove the substrate, or for each roller around which the substrate is wound. The actual situation is such as exchanging. Therefore, there is a problem that the throughput of processing is low, and a series of operations from sticking of a sheet film to a substrate to peeling and recovery cannot be performed continuously and automatically, which is inefficient.

  This invention is made | formed in view of the said subject, and it aims at providing the peeling apparatus which can perform efficiently the operation | work which peels a base material from the board | substrate which affixed the sheet-like base material.

  In order to achieve the above object, a peeling apparatus according to the present invention winds up the base material peeled off from a substrate having a sheet-like base material attached to one main surface, and the base material. A base material take-out means that is disposed in the vicinity of the take-up means and takes out an end portion of the base material taken up by the take-up means, and receives the base material taken out by the base material take-out means, And a conveying unit that conveys the winding unit to a separation position along a predetermined conveying path.

  In the invention configured as described above, since there is provided a means (a base material take-out means and a transport means) for taking out the base material wound up by the take-up means and transporting it to the separated position, it is wound around the take-up means. The removed substrate can be quickly removed. Therefore, it becomes possible to use for the next peeling operation without taking out the winding means once, and the processing efficiency can be improved. In addition, when the sheet film is continuously peeled from a plurality of substrates, high throughput can be obtained. Moreover, by using this peeling apparatus, it is possible to construct a processing system that continuously and automatically peels a sheet film from a plurality of substrates.

  Here, for example, the winding means may include a winding roller that winds the base material by rotating it in a predetermined direction while gripping one end of the base material. If the sheet-like base material is taken up by the take-up roller, the base material can be reliably peeled from the substrate with a relatively simple configuration. Further, since the peeled base material is wound around the roller, subsequent handling is easy.

  In this case, the number of windings of the base material around the take-up roller is less than 1, and the base material take-out means receives the one end of the base material gripped by the take-up means. In other words, it is preferable that the transfer of the base material from the winding means to the base material taking-out means is performed through one end portion on the winding start side of the roller. Since the sheet-like base material is warped or curved at the winding end position on the winding roller, the position and shape may not be stable. On the other hand, it is relatively easy to control the shape and the like on the winding start side, and by delivering this portion, reliable and stable delivery is possible. Moreover, in order to deliver the winding start side, it is desirable that the number of windings of the base material on the winding roller is less than one.

  The base material take-out means may include a base material gripping part that grips a part of the base material wound up by the winding means and draws it away from the winding means. By grasping and pulling out a part of the base material, the base material can be taken out from the winding means and delivered to the transport means more reliably.

  The transport means transports the base material by passing the base material through the transport path including a nip portion formed by a pair of rotating rollers, and the base material take-out means is transported from the winding means. A part of the substrate taken out may be guided to the nip portion. By doing so, the transfer of the base material from the base material take-out means to the transport means can be reliably performed with a simple configuration.

  In this case, the conveying means includes an opening / closing mechanism that opens and closes the nip portion by separating and contacting the rollers that constitute the roller pair, and the substrate that is spaced apart from the rollers that constitute the roller pair. After receiving from the base material take-out means, the base material may be transported by contacting the rollers constituting the roller pair. By opening and closing the nip portion, the transfer of the base material from the base material take-out means to the transport means can be performed more easily.

  In addition, it is more preferable to provide a storage unit that stores the base material at the rear end of the transport path. In this way, a plurality of substrates can be processed continuously without carrying out the substrate from the apparatus in the middle, and the processing throughput can be further improved. Moreover, subsequent handling becomes easy by storing the sheet | seat film after peeling collectively.

  In the present invention, the shape of the substrate is not particularly limited, but the effect is particularly great when the substrate is substantially circular. This is because, in such a base material, the end portion is curved, so that it is difficult to reliably transfer it between a plurality of mechanisms. By applying the present invention to an apparatus that handles such a base material, the peeled base material can be reliably transported and removed.

  According to the present invention, since the base (winding means and transporting means) for taking out the base material taken up by the winding means and transporting it to the separated position is provided, the base material wound around the winding means. Can be quickly removed and the winding means can be used for the next peeling operation, and the efficiency of the treatment can be improved. Moreover, the processing system which peels the sheet film from a some board | substrate continuously and automatically can be constructed | assembled by using the peeling apparatus to which this invention is applied.

  FIG. 1 is a view showing an embodiment of a peeling apparatus according to the present invention. More specifically, FIG. 1 (a) is an external top view of the peeling apparatus 1, and FIG. 1 (b) is a side view thereof. FIG. 2 is a block diagram showing a main control configuration of the peeling apparatus of FIG. The peeling apparatus 1 is an apparatus for receiving a substrate carried from the outside with a sheet film attached thereto as a workpiece, and peeling and collecting the sheet film from the substrate. The peeling apparatus 1 includes a peeling unit 10 for peeling a sheet film from a substrate, a collecting unit 50 for collecting the peeled sheet film, a control unit 70 for controlling the operation of the entire apparatus, and a frame 90 for fixing them. It has.

  The peeling unit 10 includes a suction stage block 100 for sucking and holding the substrate from above, a winding block 200 for winding and peeling the sheet film while moving below the sucked and held substrate, and a winding block 200. Is provided with a guide rail block 300 for moving the substrate in a substantially horizontal direction (X direction in FIG. 1), and a temporary stage block 400 for receiving a substrate from the outside and transferring it to the suction stage block 100. Detailed structures of the suction stage block 100 and the winding block 200 will be described later.

  The guide rail block 300 holds a guide rail 303 that serves as a guide when the winding block 200 is moved horizontally, a ball screw 302 that constitutes a ball screw mechanism that drives the winding block 200, a ball screw driving unit 304, and these. A base 301 is provided.

  In addition, the temporary placement stage block 400 includes a temporary placement stage 410 that receives and temporarily supports a workpiece including a substrate and a sheet film, which are processing targets of the present apparatus, from the outside. On the upper surface of the temporary placement stage 410, a ring support pin 411 for supporting a ring constituting a work to be described later and a substrate support pin 412 for supporting the substrate after the sheet film is peeled are provided. . Three or more ring support pins 411 and three substrate support pins 412 are provided. At the tip of each of the ring support pins 411, a tip protrusion is provided that fits into a recess provided in the lower ring of the work described later. A shaft 420 extends vertically downward at the lower portion of the temporary placement stage, and is attached to a stage lifting mechanism 430 that holds the shaft 420 and drives it in the vertical direction (Z-axis direction). That is, in the temporary placement stage block 400, the temporary placement stage 410 is held by the stage lift mechanism 430 so as to be lifted and lowered.

  Further, the recovery unit 50 recovers and stores the transported block 500 that transports the sheet film peeled from the substrate backward (rightward in FIG. 1) and the peeled sheet film transported by the transport block 500. And a box 600. The transport block 500 includes a sheet peeling mechanism 510, an upper transport mechanism 520, a lower transport mechanism 530, and the like attached to a housing 501 that is held up and down by a housing lift mechanism 540. The collection box 600 is a hollow housing capable of storing a sheet film therein, and a door 601 for taking out the stored sheet film is provided in a part of the collection box 600.

  A region sandwiched between the upper transport mechanism 520 and the lower transport mechanism 530 is a transport path for transporting the sheet film peeled from the substrate toward the collection box 600. The upper transport mechanism 520 moves up and down the sheet guides 521 and 524 for guiding the sheet film peeled from the substrate to the transport path, a plurality of driven rollers 522 rotatably mounted on these, and the sheet guide 521. And a guide opening / closing mechanism 523 for opening and closing the conveyance path. The lower transport mechanism 530 includes a plurality of transport rollers 531 that are driven to rotate by a transport roller driving unit 532. The driven roller 522 and the transport roller 531 are in contact with each other to form a nip portion, and the transport path includes this nip portion.

  2 which will not be described so far will be described in detail later along with the operation thereof, but before that, the work handled by the peeling apparatus 1 will be described.

  FIG. 3 is a diagram showing a configuration of a workpiece which is a processing target of the peeling apparatus. In the peeling apparatus 1 of the present embodiment, as shown in FIG. 3A which is an exploded view of the workpiece and FIG. 3B which is a cross-sectional view, the sheet films F attached to the disk-shaped substrate W are respectively provided. An annular structure sandwiched between an upper ring Rup and a lower ring Rdw that is coaxial with the central axis J of the substrate W is handled as a workpiece Wk to be processed. Although not shown, the upper ring Rup and the lower ring Rdw are magnetically attracted and coupled to each other by a built-in permanent magnet. Although not shown, a recess is provided on the lower surface of the lower ring Rdw so as to be fitted with the tip protrusion of the ring support pin 411, and the displacement of the lower ring Rdw with respect to the temporary placement stage 410 is caused by the fitting. Is prevented.

  A thin film material (for example, SOG; Spin-on-Glass) is applied to the upper surface Fa of the sheet film F, and a substrate W is overlaid thereon with its surface (pattern forming surface) Wf facing downward. Therefore, the back surface Wb of the substrate faces upward in the workpiece Wk. The structure of the workpiece Wk is the same as that disclosed in Patent Document 1 (Japanese Patent Laid-Open No. 2003-100727), and the detailed structure of the work Wk and the apparatus and method for creating the same are disclosed in the same publication. The detailed description is omitted here.

  Further, as shown in FIGS. 3A and 3B, the workpiece Wk is carried into the peeling apparatus 1 in a so-called face-down state with the substrate surface Wf to which the sheet film F is attached facing downward. Shall.

  FIG. 4 is a view showing the structure of the suction stage block. More specifically, FIG. 4A is a view of the suction stage block 100 as viewed from below, and FIG. 4B is a cross-sectional view taken along the line A-A ′ of FIG. The suction stage block 100 has a structure in which a first plate (top plate) 101, a second plate 102, and a third plate 103 are overlapped. The third plate 103 has a disk shape having substantially the same diameter as the substrate W, and the lower surface thereof is an opposing flat surface 130a facing the upper surface (back surface Wb) of the substrate W. A plurality of substrate adsorbers 113 for vacuum adsorbing the substrate W by being connected to the adsorption mechanism unit 130 via the substrate adsorption control valve 123 are provided near the periphery of the third plate 103.

  The second plate 102 has a disk shape having substantially the same diameter as the outer diameter of the upper ring Rup, and is connected to the suction mechanism 130 via the ring suction control valve 121 at the periphery thereof. A plurality of ring adsorbers 111 for vacuum adsorbing the ring Rup are provided. A plurality of sheet adsorbers 112 a and 112 b for adsorbing the sheet film F are provided inside the ring adsorber 111. Further, a protrusion pin hole 114 is provided through the first and second plates 101 and 102 to protrude a protrusion pin, which will be described later, at a position adjacent to the protrusion pin hole 114 in the sheet adsorber. The two adsorbers 112a provided and the other adsorbers 112b are connected to the adsorbing mechanism unit 130 via sheet adsorbing control valves 122a and 122b that are independent of each other.

  Here, the sheet adsorbers 112 a and 112 b are provided inside the ring adsorber 111, but may be provided on the same circumference as the ring adsorber 111. In this case, a sheet adsorber is disposed between the ring adsorbers 111, and a through hole is formed at a portion of the upper ring Rup facing the sheet adsorber. And a sheet | seat adsorption device can be set as the structure which adsorb | sucks the upper surface of a sheet film through the through-hole of an upper ring.

  The suction mechanism unit 130 and the control valves 121, 122a, 122b, and 123 are controlled by the control unit 70. The control unit 70 can suck and release the substrate W, the upper ring Rup, and the sheet film F independently. it can. Further, the sheet film F can be sucked and released independently in the vicinity of the protruding pin hole 114 and in other areas.

  FIG. 5 is a cross-sectional view taken along the line B-B ′ of FIG. As shown in FIG. 5A, a protruding mechanism 140 is provided on the upper portion of the first plate 101. The ejecting mechanism 140 includes a cylinder 141 and an ejecting pin 142 provided inside the cylinder 141 so as to be movable up and down. The ejecting pin 142 moves up and down in response to a control command from the control unit 70. Since the protrusion pin hole 114 is formed through the first plate 101 and the second plate 102 immediately below the protrusion mechanism 140, the protrusion pin 142 moves downward through the protrusion pin hole 114 when the protrusion mechanism 140 is operated. Project to

  The position of the protruding pin 142 is provided on the outer side of the outer peripheral portion and on the inner side of the inner peripheral portion of the upper ring Rup when viewed from the central axis J of the substrate W. The sheet film F extending outward is brought into contact with the sheet film F and protrudes downward. Although details will be described later, in this embodiment, the suction stage block 100 is held by removing the lower ring Rdw from the work Wk, so that the peripheral edge of the projected sheet film F is shown in FIG. The part will hang down.

  FIG. 6 is a perspective view showing the configuration of the winding block. In the winding block 200, a winding roller 220 and a guide roller 214 are rotatably mounted on a substantially U-shaped frame 210 constituted by a base frame 211 and two side frames 212 and 213. The base frame 211 is provided with a slider 215 slidably fitted to the guide rail 303 provided on the guide rail block 300, and the moving direction of the winding block 200 is restricted to the X direction. Further, a ball screw nut 216 that fits with the ball screw 302 provided on the guide rail block 300 is provided, and the entire take-up block 200 is formed by a ball screw mechanism including the ball screw 302 and the ball screw nut 216. Reciprocates in the X direction.

  The take-up roller 220 has a substantially cylindrical envelope outer shape, and a notch 221 from which a portion corresponding to about ¼ of the peripheral surface is removed is provided at the center in the axial direction. The notch portion 221 includes sheet clamps 223 and 225 for gripping the peripheral portion of the sheet film F hanging downward, and motors 222 and 224 for controlling the control unit 70 to open and close them, respectively. Is provided.

  Next, the operation of the peeling apparatus configured as described above will be described. The operation of the peeling device 1 includes (1) loading a workpiece (carrying-in operation), (2) peeling the sheet film from the substrate (peeling operation), and (3) collecting the peeled sheet film (collecting operation). (4) By repeating a series of operations of unloading the substrate and the ring (unloading operation), a large number of workpieces are processed continuously. Hereinafter, the flow of processing for one workpiece Wk will be described with reference to FIGS.

  FIG. 7 is a flowchart showing an outline of the operation of the peeling apparatus. 8 and 9 are schematic diagrams for explaining the work loading operation. 10 and 11 are schematic views for explaining the peeling operation. 12 to 15 are schematic diagrams for explaining the collection operation.

  First, a loading operation (steps S101 to S104) for loading the workpiece Wk is performed. That is, as shown in FIG. 8, the housing elevating mechanism 540 is operated to move the housing 501 containing the transport block 500 downward, and the winding block 200 is retracted to the space (right side) created thereby ( Step S101). Further, the stage elevating mechanism 430 is actuated to lower the temporary placement stage 410 so that the distance from the suction stage block 100 is widened. In this state, the work Wk carried in along the direction of the arrow in FIGS. 8 and 9A is received by an external transport mechanism (not shown). The carried workpiece Wk is placed on the temporary placement stage 410 (step S102). The workpiece Wk is supported from below the lower ring Rdw by a ring support pin 411 installed on the upper surface of the temporary placement stage 410 (FIG. 9A).

  At this time, since the work can be carried in from the outside by a combination of simple horizontal movement and vertical movement, a conventionally known conveyance mechanism can be used. Further, the guide rail block 300 is substantially U-shaped with the left side of FIG. 8 opened when viewed from above, and the take-up block 200 is retracted to the right end position. There will be no hindrance.

  When the workpiece Wk is placed on the temporary placement stage 410 in this way, the temporary placement stage 410 is raised toward the suction stage block 100 by the stage lifting mechanism 430. When the workpiece Wk on the temporary placement stage 410 comes to just below the suction stage block 100, the suction mechanism unit 130 holds the workpiece Wk by suction (step S103). At this time, the ring suction device 111 sucks the upper ring Rup of the workpiece Wk. The sheet adsorbers 112a and 112b adsorb the sheet film F. The substrate adsorber 113 adsorbs the back surface Wb of the substrate W (FIG. 9B).

  Next, only the lower ring Rdw is removed from the work Wk. In this embodiment, the temporary placement stage 410 that supports the lower ring Rdw is rotated around the rotation axis J of the substrate W to disconnect the magnetic coupling with the upper ring Rup, and the temporary placement stage remains on the lower ring Rdw. By lowering 410, the lower ring Rdw is retracted downward (step S104, FIG. 9C). At this time, the fitting between the tip protrusion of the ring support pin 411 and the recess of the lower ring Rdw functions as a detent for the lower ring Rdw. Although the removed lower ring Rdw is in a state of being retracted downward together with the temporary placement stage 410, it may be carried out to the outside at this time.

  Next, a peeling operation is performed. At this time, as shown in FIG. 10A, the upper ring Rup, the substrate W and the sheet film F are integrally held by suction at the lower part of the suction stage block 100, while the winding block 200 is retracted to the right. It has become a state. Therefore, as shown in FIG. 10B, the winding block 200 is moved to the left end, and the transport block 500 that has been retracted downward is returned to the original position (step S105). Further, the motors 222 and 224 are operated to open the sheet clamps 223 and 225.

  In this state, only the adsorption by the sheet adsorber 112a is canceled (step S106). Thereby, only the area | region adjacent to the protrusion pin hole 114 among the sheet | seat films F is not adsorb | sucked, but another area | region will be in the adsorbed state. Here, when the protrusion mechanism 140 is operated to protrude the protrusion pin 142 downward (step S107), a part of the peripheral edge of the sheet film F hangs downward. As shown in FIG. 10C, the protrusion mechanism 140 is provided directly above the winding block 200 positioned at the left end, and the positional relationship between the end Fs of the sheet film F that hangs on the winding roller 220 and It has become. Here, when the motors 222 and 224 are operated to close the sheet clamps 223 and 225 (step S107), as shown in FIG. 10D, the end Fs of the suspended sheet film F is clamped by the sheet clamps 223 and 225. And fixed to the take-up roller 220. Even if the end portion Fs of the sheet film F is clamped, the adsorption by the remaining sheet adsorber 112b is not canceled.

  Thus, in this embodiment, the end portion of the sheet film F that hangs down due to gravity is clamped and wound up. As in the prior art, if the substrate is placed on the lower side and the sheet film is placed on the upper side and the sheet film is peeled upward, the configuration for clamping the end of the flexible sheet film may be complicated, If it is set as the structure which arrange | positions a sheet film downward and peels it down like this embodiment, since the edge part of the sheet film F will hang down with gravity, it will become easy to clamp. Further, in this embodiment, in the sheet film F extending outward from the outer peripheral portion of the substrate W, only the vicinity of the area protruding by the protruding pin 142 is released, while the other areas are adsorbed. Thereby, the sagging location and the shape of the sheet film F can be controlled, and the clamping by the sheet clamps 223 and 225 can be easily and reliably performed.

  Subsequently, when the take-up roller 220 is moved in the X direction below the substrate W while rotating the take-up roller 220 in the direction of arrow D1 in FIG. 11A (step S108), the sheet film F is sequentially moved from the clamped end Fs side. It is peeled off from the substrate W and taken up by the take-up roller 220 (FIG. 11B). At this time, the pulling direction of the sheet film F from the substrate W is controlled to be constant by the guide roller 214 regardless of the position of the take-up roller 220, and a uniform thin film can be left on the substrate surface Wf.

  At this time, since the suction by the sheet suction unit 112b is not released, the take-up roller 220 peels off the sheet film F from the substrate W while forcibly releasing the suction. When the winding block 200 reaches an end position (position shown in FIG. 11C) described later, the suction by the sheet adsorber 112b is released. This prevents the sheet film F from sagging during the peeling operation. At this time, a needle valve (not shown) is provided in each sheet adsorber 112b in order to prevent the partial vacuum break caused by the sheet film F from being peeled off.

  When the winding block 200 passes through the lower part of the substrate and reaches a predetermined end position (the position shown in FIG. 1 and FIG. 11C) (step S110), as shown in FIG. The substrate W is completely peeled off and wound up by the winding roller 220.

  The rotation amount of the winding roller 220 during the movement of the winding block 200 is about 3/4 rotation (270 degrees). Thus, by setting the rotation amount of the winding roller 220 when winding the sheet film F to less than one rotation, the winding start position (end portion Fs) of the sheet film F is covered by the wound sheet film. It will never be. For this reason, when the sheet film F is peeled off from the take-up roller 220 in the collecting operation described below, it can be peeled off from the take-up start position (end Fs). This has a great significance for achieving the object of reliably removing the sheet film F from the take-up roller 220.

  When the substrate W and the sheet film F are thus separated, the sheet film F is collected in the collection box 600 by the collecting operation, while the substrate W is carried out by the carrying-out operation.

  First, the collecting operation (steps S121 to S124) for collecting the peeled sheet film F will be described. After the end of the peeling operation, as shown in FIG. 12A, the winding block 200 is positioned at the end position immediately adjacent to the left side of the transport block 500 with the sheet film F wound around the winding roller 220. ing. At this time, the winding start position of the sheet film F on the winding roller 220 is set to face the conveyance block 500 side (right side in the figure).

  The sheet peeling mechanism 510 provided in the transport block 500 includes a sheet peeling claw 512 that is slidably mounted in the X direction on the main body 511. At almost the same time as the sheet clamps 223 and 225 on the take-up roller 220 release the clamp, the sheet peeling claw 512 extends toward the take-up roller 220 and hooks the end portion of the sheet film F. When the sheet peeling claw 512 is moved back (FIG. 12B) and returned to its original position (FIG. 12C), the sheet peeling mechanism 510 holds the end Fs of the sheet film F. (Step S121).

  As shown in FIG. 13A, the sheet peeling claw 512 has a structure in which a tip member 512b formed of a metal plate or a resin plate having elasticity protrudes downward from the tip of the main body 512a. . Therefore, when the sheet peeling claw 512 advances toward the take-up roller 220, the leading end member 512b is cut away from the cut-out portion 221 of the take-up roller 220 in the direction opposite to the moving direction as shown in FIG. It deforms elastically along the flat surface. When the sheet peeling claw 512 moves backward from the take-up roller 220 in the separating direction, the elastically deformed tip member 512b acts to scoop up the tip portion Fs of the sheet film F as shown in FIG. Therefore, the end portion of the sheet film F can be reliably hooked and held.

  In addition, as described above, the end portion of the sheet film F drawn out by the sheet peeling claw 512 is the winding start end portion Fs that is first wound up by the winding roller 220. When the thin sheet-like sheet film F is peeled off from the substrate W and wound up, the terminal portion may be bent or curved, or in a severe case, may be rounded into a cylindrical shape. It is extremely difficult to grip the resulting end. On the other hand, since the end portion Fs at the start of winding is pressed against the notch portion 221 of the take-up roller 220 by the sheet clamps 223 and 225, there are few such problems. Thus, by pulling out the end Fs of the sheet film F on the winding start side by the winding roller 220 by the sheet peeling claw 512, in this embodiment, the sheet from the winding roller 220 to the sheet peeling mechanism 510 is obtained. The delivery of the film F can be performed smoothly and reliably.

  When the end portion of the sheet film F is gripped by the sheet peeling mechanism 510, as shown in FIG. 14A, the guide roller 521 provided on the side closer to the winding block 200 in the upper conveying roller mechanism 520 is driven. It is raised together with the roller 522 by the guide opening / closing mechanism 522. As a result, the conveyance path P sandwiched between the upper conveyance mechanism 520 and the lower conveyance mechanism 530 opens greatly toward the take-up roller 220 side. It may be opened before the sheet film F is gripped by the sheet peeling mechanism 510.

  The sheet peeling mechanism 510 includes a skew feeding mechanism 513 that moves the main body 511 obliquely downward along the direction of the arrow D2 in FIG. 14A, and the sheet peeling mechanism main body 510 and the sheet peeling mechanism 510 are operated by the operation of the skew feeding mechanism 513. The sheet peeling claw 512 moves downward in the direction of the arrow D2 while holding the end portion Fs of the sheet film F (step S122). As a result, as shown in FIG. 14B, the sheet film wound up by the winding roller 220 is pulled and gradually peeled off.

  As shown in FIG. 14C, when the sheet peeling mechanism 510 moves to the lowermost end, the sheet guide 521 is lowered by the guide opening / closing mechanism 523 and the conveyance path is closed. For this reason, the end Fs of the sheet film F that has been lowered together with the sheet peeling mechanism 510 is clamped by the upper and lower rollers 522 and 531 (step S123, FIG. 15A). In this state, the holding of the sheet film by the sheet peeling claw 512 is released, and the conveying roller 531 is driven to rotate in the direction of arrow D3 in FIG. 15A, whereby the sheet film F is further peeled off from the take-up roller 220. Then, it is transported along the transport path P in the direction of the arrow D4 (FIG. 15B). The conveyed sheet film is finally collected in the collection box 600 (step S124, FIG. 15 (c)).

  Next, the carrying-out operation of the substrate W will be described. Prior to unloading the substrate W, a space is created so as not to interfere with the raising / lowering operation of the temporary placement stage 410 and the operation of the external transport mechanism. That is, the housing 501 in which the transfer block 500 is housed is retracted downward, and the winding block 200 is retracted to the space (right side) generated by this as in the case of the work loading (step S125).

  When the peeling operation is completed, the substrate W and the upper ring Rup after the sheet film is peeled are separated from each other and are individually sucked by the suction stage block 100. Therefore, the temporary placement stage 410 is raised to receive them (step S126). Specifically, when the lower ring Rdw that has been retracted on the temporary placement stage 410 comes close to the upper ring Rup and is coupled by a permanent magnet, the adsorption by the ring adsorber 111 is released. As a result, the ring body formed by combining the upper ring Rup and the lower ring Rdw is supported by the ring support pins 411 of the temporary placement stage 410. Further, by releasing the suction by the substrate suction unit 113, the substrate W is supported by the substrate support pins 412 of the temporary placement stage 410. In this state, the temporary placement stage 410 is lowered, and the substrate W and the ring body can be individually carried out to the outside (step S127).

  Here, the substrate W and the ring body are placed on the temporary placement stage 410 and lowered simultaneously, but the substrate W and the ring body are removed from the suction stage block 100 and carried out at different timings. It may be. Either can be accommodated by individually controlling the substrate suction unit 113 and the ring suction unit 111.

  Thereby, peeling and collection | recovery of the sheet film F from the board | substrate W are completed about one workpiece | work Wk. By repeating the above series of operations for each workpiece, it is possible to continuously perform processing for a large number of workpieces. In the above embodiment, after the peeled sheet film F is collected in the collection box 600, the substrate W and the like are carried out. However, since the winding block 200 after the sheet film F is peeled back returns to the initial state and is separated from the operation of the recovery unit 50, the recovery of the sheet film by the recovery unit 50 within the range where the operation of each part does not interfere with each other. You may make it carry out simultaneously with carrying-out of the board | substrate W etc. by the peeling unit 10, and the process with respect to the following workpiece | work. By doing so, it is possible to more efficiently perform processing on a plurality of workpieces and improve processing throughput.

  The sheet film thus collected and stored in the collection box 600 can be taken out from the door 601 at a necessary timing by the operator and reused or discarded.

  As described above, in this embodiment, the substrate W on which the sheet film F is pasted is received in a state in which the pasting surface Wf faces downward, and this is sucked and held from above, and the sheet film F is peeled off from below. Yes. That is, in this embodiment, the sheet film is peeled without inverting the substrate W conveyed with the sheet film application surface facing downward. For this reason, the structure and process for inversion become unnecessary, and the peeling operation | work of the sheet film from a board | substrate can be performed by a simple apparatus structure with high throughput.

  Further, since the sheet film F is peeled downward from the state where the sheet film F is attached to the lower surface of the substrate, the end portion of the sheet film can be hung down by gravity and easily and reliably wound.

  In addition, since the substrate W to be transported is temporarily placed on the temporary placement stage 410, and the temporary placement stage 410 is lifted and transferred to the suction stage block 100, the known transport of the substrate from the outside is carried out. A mechanism can be used. In addition, regarding the unloading of the substrate, the processed substrate placed on the temporary placement stage 410 can be unloaded by a known transfer mechanism.

  In addition, the sheet film F peeled off from the substrate W is provided with a collection unit 50 that is peeled off from the take-up roller 220, conveyed backward, and collected. Can be done automatically. Further, since the sheet film F is collected and stored in the collection box 600, the processing for the next workpiece can be started without interruption for the removal of the sheet film after the processing for one workpiece is completed. Can do. For this reason, it is possible to process a plurality of workpieces continuously at a high throughput.

  In addition, by combining the peeling device of this embodiment with a sticking device or a thin film forming device that outputs the substrate to which the sheet film is stuck in a face-down state, the reversal process is not involved from the sticking to peeling of the sheet film. A continuous processing system can be constructed, and the productivity of the system can be greatly improved.

  As described above, in this embodiment, the winding block 200 including the winding roller 220 functions as the “winding unit” of the present invention. Further, the sheet peeling mechanism 510 functions as the “base material take-out means” of the present invention, and in particular, the sheet peeling claw 512 functions as the “base material gripping portion” of the present invention. Further, the upper transport mechanism 520 and the lower transport mechanism 530 function as the “transport means” of the present invention, and the transport roller 531 and the driven roller 522 constitute the “roller pair” of the present invention. Further, a guide opening / closing mechanism 523 that opens and closes the nip portion between the conveying roller 531 and the driven roller 522 functions as the “opening / closing mechanism” of the present invention. In this embodiment, the collection box 600 functions as the “accommodating portion” of the present invention. Furthermore, in this embodiment, the sheet film F corresponds to the “base material” of the present invention.

  The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, the peeling device of the above embodiment is to accept the sheet film F attached to the substrate W in a state of being sandwiched between the upper and lower rings, but the present invention is not limited only to those with the ring attached in this way, The present invention can also be applied to a peeling apparatus for processing a workpiece consisting only of a substrate and a sheet film. Also in this case, the sheet film can be peeled and collected from the substrate in the same manner as in the above embodiment by omitting the attachment / detachment of the ring.

  Moreover, although the peeling apparatus of the said embodiment makes the workpiece | work which stuck the disk-shaped sheet film F on the disk-shaped board | substrate W similarly, it is not limited to this. For example, the present invention can also be applied to an apparatus that uses a workpiece that has a rectangular shape or a sheet film having a rectangular shape attached to a disk-shaped substrate. However, when a circular sheet film is used, the configuration of the present embodiment is particularly effective because the peripheral edge of the sheet film is curved and it is not easy to securely grip the end.

  Moreover, in the workpiece | work Wk in this embodiment, it is in the state which the sheet film extended to the whole circumference | surroundings of the board | substrate W, However, The extension of a sheet film does not necessarily need to be the whole circumference | surroundings of a board | substrate.

  Moreover, in the said embodiment, although holding | maintenance of the workpiece | work is performed by vacuum suction, if the board | substrate W can be hold | maintained from upper direction, you may use another method. Further, for example, the upper ring Rup may be held by magnetic force while the substrate W is held by vacuum suction.

  Moreover, in the said embodiment, it is set as the structure which protrudes a sheet film downward by the protrusion pin 142, However, You may comprise so that a sheet film may be protruded, for example with a gas pressure.

  Further, in the above embodiment, the lower ring Rdw removed from the work is retracted downward while being placed on the temporary placement stage 410, and after the peeling operation is completed, it is coupled with the upper ring Rup and then carried out. However, it may be carried out immediately after being removed from the workpiece. In this case, after the peeling operation is completed, the lower ring Rdw may be put back again and carried out together with the upper ring Rup, or only the upper ring Rup may be carried out alone.

  Further, the collection unit 50 of the above embodiment conveys the sheet film by the rotation of the conveying roller 531, but in addition to this, for example, the sheet film is conveyed by rotating a belt or winding the roller around the roller. May be.

  Moreover, it is not essential to combine the peeling unit 10 and the collection | recovery unit 50 in the said embodiment, Each can be used independently. Therefore, each unit may be used in combination with another processing unit. In particular, with respect to the peeling unit 10, it is possible to construct a processing system capable of efficient processing by combining with a processing unit for attaching a sheet film to a substrate. Further, the recovery unit 50 can be used in combination with an apparatus for peeling a sheet film from a substrate in a face-up state as described in Patent Document 2, for example.

  The present invention relates to a semiconductor wafer, a glass substrate for photomask, a glass substrate for liquid crystal display, a glass substrate for plasma display, a substrate for FED (Field Emission Display), a substrate for optical disk, a substrate for magnetic disk, a substrate for magneto-optical disk, etc. The present invention can be applied to a peeling apparatus that peels off a sheet-like base material that is a target of processing for all substrates including the substrate. In particular, when a substrate with a sheet-like base material attached to the surface thereof is combined with a processing unit that outputs in a face-down state, a processing system with a simple apparatus configuration and high throughput can be constructed.

It is a figure which shows one Embodiment of the peeling apparatus concerning this invention. It is a block diagram which shows the main control structures of the peeling apparatus of FIG. It is a figure which shows the structure of the workpiece | work which is a process target of this peeling apparatus. It is a figure which shows the structure of an adsorption | suction stage block. FIG. 5 is a cross-sectional view taken along line B-B ′ of FIG. It is a perspective view which shows the structure of a winding block. It is a flowchart which shows the outline of operation | movement of this peeling apparatus. It is a 1st schematic diagram for demonstrating the carrying-in operation | movement of a workpiece | work. It is a 2nd schematic diagram for demonstrating the carrying-in operation | movement of a workpiece | work. It is a 1st schematic diagram for demonstrating peeling operation | movement. It is a 2nd schematic diagram for demonstrating peeling operation | movement. It is a 1st schematic diagram for demonstrating collection | recovery operation | movement. It is a 2nd schematic diagram for demonstrating collection | recovery operation | movement. It is a 3rd schematic diagram for demonstrating collection | recovery operation | movement. It is a 4th schematic diagram for demonstrating collection | recovery operation | movement.

Explanation of symbols

200: Winding block (winding means)
220 ... take-up roller 510 ... sheet peeling mechanism (base material take-out means)
512 ... Sheet peeling nail (base material gripping part)
520 ... Upper transport mechanism (transport means)
522 .. Followed roller (roller constituting roller pair)
523 ... Guide opening / closing mechanism (opening / closing mechanism)
530 ... Lower transport mechanism (transport means)
531: Conveying roller (roller constituting a roller pair)
600 ... Collection box (container)
F ... Sheet film (base material)
W ... Substrate Wf ... Substrate surface Wk ... Workpiece

Claims (8)

On the other hand, a winding means for winding the base material peeled from the substrate having a sheet-like base material attached to the main surface;
A base material take-out means that is disposed in the vicinity of the take-up means that has wound up the base material and takes out an end of the base material wound up by the take-up means;
A peeling apparatus comprising: a transport unit that receives the base material taken out by the base material take-out unit and transports the base material from the winding unit to a separation position along a predetermined transport path.   The peeling apparatus according to claim 1, wherein the winding unit includes a winding roller that winds the base material by rotating in a predetermined direction while gripping one end portion of the base material.   The peeling according to claim 2, wherein the number of windings of the base material around the winding roller is less than one, and the base material take-out means receives the one end of the base material gripped by the winding means. apparatus.   The said base material taking-out means is equipped with the base-material holding part which grips a part of said base material wound up by the said winding-up means, and pulls out in the direction separated from the said winding-up means. The peeling apparatus as described in.   The transport means transports the base material by passing the base material through the transport path including a nip portion formed by a pair of rotating rollers, and the base material take-out means is taken out from the take-up means. The peeling apparatus according to any one of claims 1 to 4, wherein a part of the base material is guided to the nip portion.   The conveying means includes an opening / closing mechanism that opens and closes the nip portion by separating and contacting rollers constituting the roller pair, and the base material is placed in the state where the rollers constituting the roller pair are separated from each other. 6. The peeling apparatus according to claim 5, wherein after receiving from the take-out means, the substrate constituting the roller pair is brought into contact with the substrate to convey the substrate.   The peeling apparatus according to any one of claims 1 to 6, wherein an accommodation portion for accommodating the base material is provided at a rear end of the conveyance path.   The peeling apparatus according to any one of claims 1 to 7, wherein the substrate is substantially circular.

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