JPH0878501A - Handling unit for semiconductor device - Google Patents

Abstract

PURPOSE: To obtain a handling unit for semiconductor device in which positive attraction is realized with high response through a simple mechanism. CONSTITUTION: The handling unit comprises a hand 10 for attracting a semiconductor device 1, and a unit 20 for supporting the attraction hand 10 movably to transfer the attracted semiconductor device 1 to a predetermined position, wherein the attraction hand 10 comprises an electromagnet 12 having a plane 11 for attracting the semiconductor device 1. The attraction plane 11 may be formed to come into face contact with the semiconductor device 1. The attraction hand 10 may be supported detachably by the transfer unit 20 through a mounting/demounting part 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a handling device for transferring semiconductor devices used in, for example, semiconductor manufacturing equipment.

[0002]

2. Description of the Related Art Conventionally, a semiconductor device handling apparatus is generally known which includes a suction hand for suctioning a semiconductor device and a transport unit for movably supporting the suction hand. As the suction hand, the suction chamber 3 formed in a hollow state as shown in FIG.
1 and an adsorption nozzle 30 having an opening 32 at one end of the adsorption chamber 31. The suction nozzle 30 is supported by a transport unit (not shown) (for example, a scalar type handling robot). The adsorption chamber 31 is connected to a vacuum circuit (not shown) (for example, a vacuum source or an air pipe). When the semiconductor device 40 is transferred in the above configuration, the opening 32 of the suction nozzle 30 is brought into contact with the upper surface of the semiconductor device 40. Then, the vacuum circuit is operated to reduce the pressure in the adsorption chamber 31. That is, a vacuum state is created in the suction chamber 31, the semiconductor device 40 is sucked by the suction nozzle 30, and the semiconductor device 40 sucked by the transfer unit is transferred to a predetermined position.

[0003]

However, in the apparatus described above, the vacuum state in the suction chamber 31 is maintained when a leak or the like occurs in the vacuum circuit or when the suction nozzle 30 is deformed due to deterioration. Will be difficult. This causes pressure instability, which hinders the reliable adsorption of the semiconductor device 40. Further, it takes a certain period of time to reduce the pressure in order to create a vacuum state in the adsorption chamber 31.
That is, agile semiconductor device adsorption cannot be performed. Further, the provision of the vacuum circuit causes the mechanism to be complicated.
Therefore, it is an object of the present invention to solve the above problems, and to provide a semiconductor device handling device which is capable of performing reliable suction, is excellent in responsiveness, and has a simple mechanism.

[0004]

DISCLOSURE OF THE INVENTION The present invention is a handling device for a semiconductor device 1 devised to achieve the above object, and a suction hand 10 for sucking the semiconductor device 1,
A suction unit 10 is movably supported, and a carrier unit 20 for transferring the semiconductor device 1 sucked by the suction hand 10 to a predetermined position is provided. It is formed by an electromagnet 12 having an attracting surface 11 for attracting the device 1.

Further, the suction surface 11 is the semiconductor device 1
It may be formed into a shape that comes into surface contact with.

Further, the suction hand 10 may be provided with an attachment / detachment portion 13 for being detachably supported by the transport unit 20.

[0007]

In the handling device having the above structure, the suction surface of the suction hand is brought into contact with the semiconductor device, and the electromagnet is excited in this state. As a result, the semiconductor device is sucked by the suction hand. By moving the suction hand by the transport unit, the semiconductor device sucked by the suction hand is transferred to a predetermined place.

Further, when the suction surface is formed in a shape that makes surface contact with the semiconductor device, when the semiconductor device is sucked,
The suction surface makes surface contact with the suction surface of the semiconductor device. Therefore, the semiconductor device is attracted to the attraction surface in a stable posture.

Further, when the suction hand is provided with a detachable portion, the suction hand is detachably supported by the transport unit. That is, by exchanging the suction hand, the suction unit having the suction surface corresponding to the semiconductor device to be sucked is supported by the transport unit.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor device handling apparatus according to the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing an example of the device. As shown in the figure,
A suction hand 10 for suctioning the semiconductor device 1, and a transport unit 20 for movably supporting the suction hand 10 and for transferring the semiconductor device 1 sucked by the suction hand 10 to a predetermined position. It is equipped with.

The adsorption hand 10 is provided with an electromagnet 12 which is densely wound with an insulated electric wire around an iron core and generates a magnetic field by applying a current to the electric wire. The electromagnet 12 has an attraction surface 11 having a shape that makes surface contact with the semiconductor device 1 to be attracted. At this time, when the semiconductor device 1 sucked by the suction hand 10 is, for example, a resin-sealed package, the sucked surface of the semiconductor device 1 may be the upper surface or the lower surface of the resin-sealed portion. Therefore, in this case, the suction surface 11 is formed in a flat shape so as to come into surface contact with the upper surface or the lower surface of the resin sealing portion. Also, the suction surface 11
Are formed in the same shape as the outer shape of the resin sealing portion of the semiconductor device 1 to be adsorbed. However, this can be carried out even in an arbitrary shape smaller than the outer shape (for example, a circle or a rectangle).

On the other hand, above the suction hand 10, there is provided an attachment / detachment portion 13 which is detachably supported by the transport unit 20. The attaching / detaching portion 13 is formed so as to engage with the fixing portion 21 provided on the transport unit 20.
The attachment / detachment section 13 has a connector (not shown) that is electrically connected to the transport unit device 20 in order to apply a current to the electromagnet 12. The suction hand 10 is detachably supported by the transport unit 20 by the engagement of the attaching / detaching portion 13 and the fixing portion 21. That is, the suction hand 10 can be replaced according to the outer shape of the semiconductor device 1 to be sucked.

The transport unit 20 supporting the suction hand 10 is formed so as to be movable in the multi-axis direction.
For example, it can be configured by a scalar type handling robot or the like. The transport unit 20 is formed so as to give a current for exciting the electromagnet 12 of the suction hand 10.

When the semiconductor device 1 is transferred in the handling device having the above structure, first, the suction hand 10 is moved to the upper surface of the semiconductor device 1 by the transport unit 20, and the suction surface 11 is brought into surface contact. Next, the suction surface 11
The electromagnet 12 is excited in a state where the surface contact with the semiconductor device 1 is made. As a result, a magnetic field is generated from the attracting surface 11, and the lead frame 1a of the semiconductor device 1 reacts to this magnetic field,
Adsorbed by the suction hand 10. That is, the transport unit 20
When the electromagnet 12 is excited more, the semiconductor device 1 is attracted to the attraction hand 10. However, in the semiconductor device 1 to be attracted, the lead frame 1a is made of a magnetic material (for example, Fe-Ni).
It is limited to those made of alloy, etc.). Then, by moving the transport unit 20 in this state, the semiconductor device 1 sucked by the suction hand 10 can be transferred to a predetermined place. The semiconductor device 1 after transfer is the electromagnet 1
It is placed in a predetermined place by releasing the excitation of 2.

At this time, the suction surface 11 of the suction hand 10 is
Since the semiconductor device 1 is formed in a flat shape so as to come into surface contact with the semiconductor device 1, the semiconductor device 1 is sucked by the suction hand 10 in a stable posture. Further, the suction surface 11 is the semiconductor device 1
Since it is formed in the same shape as the outer shape of the portion to be sucked, even if a plurality of semiconductor devices 1 are adjacently stored on the tray, the suction hand 10 sucks only a desired one. can do. Even if the outer shape of the semiconductor device 1 to be sucked is changed, by exchanging the suction hand 10, it is possible to ensure that only the desired semiconductor device 1 is sucked. In other words, the suction hand 10 is capable of sucking only what should be sucked in a stable posture, and can realize reliable suction and transfer operations. Although the semiconductor device 1 is described as a resin-sealed package here, the suction hand 1 reacts to the magnetic field generated from the suction surface 11.
If 0 can be adsorbed, for example, a ceramic package or a can package can be used.

FIG. 2 is a block diagram showing an example of another embodiment. The apparatus of the illustrated example is a transport unit 20, and a grip portion 22 for manually transferring the semiconductor device 1
Is formed, and the suction hand 10 is supported by the grip portion 22. The grip portion 22 is formed so that the attachment / detachment portion 13 engages in order to detachably support the suction hand 10. Further, the grip portion 22 is used for the suction hand 10.
A connector (not shown) is provided for electrical connection with the. The grip portion 22 is formed in a shape that can be gripped by a human hand or something similar thereto.
Further, the handle portion 22 is provided with a switch 23 for exciting the electromagnet 12 of the suction hand 10, and a battery 24 is provided inside the handle portion 22 and the battery 24 is turned on by turning on the switch 23.
It is formed so that a current flows further to the electromagnet 12.

When the semiconductor device 1 is transferred in the apparatus having the above-described structure, the grip portion 22 is gripped by hand or something similar thereto, and the grip portion 22 is moved to move the suction surface of the suction hand 10. 11 is brought into surface contact with the semiconductor device 1. When the switch 23 is turned on in this state, a current flows from the battery 24 to the electromagnet 12, a magnetic field is generated from the suction surface 11, and the semiconductor device 1 reacts to this magnetic field and is attracted to the suction hand 10. This is effective when, for example, the semiconductor device 1 is manually taken out from a tray containing a plurality of semiconductor devices 1. If such work is manually performed, the semiconductor device 1
The lead frame 1a may be bent or damaged. However, when the device is used, the semiconductor device 1 is sucked by the suction hand 10 supported by the grip portion 22, so that the semiconductor device 1 can be surely sucked and taken out without causing the above problems. it can.

[0018]

As described above, according to the present invention, since the semiconductor device is attracted by the electromagnet, the magnetic device having a magnetic substance can be surely attracted. Further, the suction hand is capable of sucking only what should be sucked in a stable posture. Even if the shape of the semiconductor device is changed, this can be easily dealt with by selecting the suction hand according to the semiconductor device and supporting it.
That is, the reliability and reliability of the suction and transfer operations of the semiconductor device are improved. Also, because the semiconductor device is attached to and detached from the suction hand by intermittently supplying the electric current to the electromagnet, agile attachment / detachment is possible and excellent responsiveness is realized. Further, since the semiconductor device is attracted by exciting the electromagnet, a vacuum circuit and a complicated mechanical mechanism are not required. That is, the semiconductor device can be attracted by a simple mechanism. That is, in the present invention, it is possible to surely adsorb and excellent responsiveness,
It is possible to provide a semiconductor device handling device having a simple mechanism.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an example of a semiconductor device handling apparatus according to the present invention.

FIG. 2 is a configuration diagram illustrating an example of another embodiment.

FIG. 3 is a configuration diagram illustrating an example of a conventional suction hand.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 10 Adsorption hand 11 Adsorption surface 12 Electromagnet 13 Attachment / detachment unit 20 Transport unit

Claims (3)

[Claims] 1. A suction unit for sucking a semiconductor device, and a transfer unit for movably supporting the suction hand and transferring the semiconductor device sucked by the suction hand to a predetermined position. In the handling device provided with, the said adsorption | suction hand is formed by the electromagnet which has an adsorption | suction surface for adsorb | sucking the said semiconductor device, The handling device of the semiconductor device characterized by the above-mentioned. 2. The semiconductor device handling apparatus according to claim 1, wherein the suction surface is formed in a shape that makes surface contact with the semiconductor device. 3. The semiconductor device handling apparatus according to claim 1, wherein the suction hand is provided with an attachment / detachment portion that is detachably supported by the transport unit.