JP2748644B2 - IC carrier and suction transfer device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to an IC suction and transfer device for transferring a completed semiconductor IC to a predetermined test device, and aims to improve productivity by easily and reliably sucking and chucking the IC. For the purpose of the present invention, an accommodating portion for accommodating an IC is provided, and a surface thereof has a region to be sucked by the suction device, and the region is covered by the suction device to form a closed space. Is provided, and the closed space is set to a negative pressure, so that the IC carrier is fixed to the suction device, and the suction pad is large enough to cover the surface of the IC carrier. The suction pad is configured to form the closed space in a state in which the suction pad is in contact with the area where the IC carrier is sucked, and the area of the suction pad corresponding to the closed space has The through hole that sucks the closed space It is intended to provide an adsorption device characterized by being provided.

[Industrial applications]

The present invention relates to a transfer device for transferring a completed semiconductor IC (hereinafter simply referred to as an IC) to a test device, and particularly, to improve productivity by easily and surely adsorbing and chucking the IC.
The present invention relates to an IC suction transfer device.

For example, in order to mount a completed IC on a test device or the like, the IC housed in a carrier for preventing bending or deformation of a lead wire is sucked and transported together with the carrier with vacuum tweezers. Since the carrier varies depending on the size and shape of the IC, the suction pad of the vacuum tweezers must also be changed.Moreover, depending on the structure of the carrier, a sufficient suction area cannot be obtained, so that the suction is not reliably performed, and thus the chuck is not performed and the suction error occurs. That is, chuck errors may occur, and the IC surface must be directly adsorbed.

[Conventional technology]

FIG. 2 is a view for explaining a conventional IC suction conveyance method.
(1) is a diagram showing an IC and a carrier, (2) is a diagram showing a state where the IC is stored in a tray as a stocker, and (3) is a diagram showing mounting on a test apparatus.

FIG. 3 is a diagram for explaining another IC suction and conveyance device.

In FIG. 2 (1), a plurality of lead wires 1a protruding outside from each periphery of a required IC 1 to be inspected,
Is bent to one side (upward in the figure), and the tip 1b is bent outward to be formed.

Usually, in such an IC, each lead wire is often deformed or adjacent lead wires come into contact with each other in many cases.

Therefore, in general, the IC is stored, transported between processes, mounted on a test device, or the like in a state where the lead is prevented from being deformed and housed in a carrier that protects the IC itself.

Figure 2 shows the above IC while preventing deformation of each lead wire 1a.
1 shows a carrier made of a resin molded product or the like that protects the IC card 1. In particular, for example, the carrier 2 having a "U" shape in a plan view has the IC 1 from one side (the upper surface in the figure) in the state shown above. A concave portion is formed following the outer shape of the IC1 so that the IC1 can be fitted without looseness when inserted, and a groove 2a in which the distal end portion 1b of each lead wire 1a of the IC1 can be positioned is formed at each distal end portion 1b. Is formed at a position corresponding to.

Note that the carrier 2 needs to have the same thickness as possible for each part in order to avoid warpage or deformation after molding caused by internal strain during molding. For this reason, a lightened area 2b is formed on the back side as shown in the figure. It is provided.

Therefore, when inserting the IC1 to the carrier 2 as indicia R _1, the tip portion 1b of the lead wires 1a of the IC1 will be located separately in a groove 2a corresponding to each, resulting in the Deformation of the lead wire and contact between adjacent lead wires can be suppressed.

Then, when the IC1 is fixed to the carrier 2 by a lock mechanism (not shown) with the IC1 inserted, the state shown in (1-a) can be obtained.

In this case, the back surface (lower side in the drawing) 1c of the IC 1 is exposed except for its periphery.

In (2), a state in which the plurality of ICs 1 are accommodated in the carrier 2 described in (1) is shown in each state of the tray 3 so that the back surface 1c is exposed to the front surface. One by one is accommodated in the partition frame.

The vacuum tweezers 4 composed of a shaft 4a having a through-hole along the central axis and a tipping funnel-shaped suction pad 4b made of conductive rubber attached to the tip of the shaft 4a
A pipe 5 connected to the other end of 4a is connected to a vacuum pump (not shown).

The vacuum tweezers 4 are held by a holder 6 for holding the vacuum tweezers 4 at the shaft 4a so as to be movable in the longitudinal direction, and inserted between the holder 6 and the suction pad 4b. The contact pressure between the suction pad 4b and the object to be sucked is buffered by the coil spring 7.

Further, reference numeral 8 shown in (3) denotes an input / output terminal section of the test apparatus 9, and in particular, a plurality of connection terminals 8a
The end portion 8b is disposed at a corresponding position in the vicinity of the above-mentioned bent portion of each lead wire 1a of the IC1, and the input / output terminal portion 8 is positioned in a state where the carrier 2 into which the IC1 is inserted and fixed is positioned. When they are joined to each other, the respective lead wires 1a of the IC 1 and the respective connection terminals 8a come into contact with each other while maintaining their correspondence.

Then, as shown in (2), when the suction pad 4b of the vacuum tweezers 4 is lowered to the illustrated area A of the exposed surface 1c of the IC 1 on the tray 3 as shown by the arrow a and the vacuum pump (not shown) is operated, Vacuum tweezers 4 is an IC
Adsorb 1

Since the static electricity charged on the surface of the IC 1 is discharged by the suction pad 4b made of conductive rubber, the characteristics of the IC 1 are not impaired.

Next, the IC 1 adsorbed to the vacuum tweezers 4
Is transported together with the carrier 2 to the position shown by the dashed line c as shown by the arrow b, and the carrier 1 is set at a predetermined position of the input / output terminal portion 8 to connect the IC 1 to the test apparatus 9.

In the case of such an IC1 transfer method, the suction area by the vacuum tweezers 4 can be increased, so that there is an advantage that reliable suction, that is, chucking can be performed.

However, since the surface 1c of the IC 1 is directly attracted, there is a disadvantage that the pressing force of the vacuum tweezers 4 is directly applied to the lead wire 1a of the IC 1.

FIG. 3 shows an apparatus for avoiding such a drawback, in which a test IC 1 similar to FIG. 2 is housed in a tray 3 in a state of being inserted and fixed in the carrier 2 described in FIG.

In addition, 12 in the drawing is a set of four vacuum tweezers 11 having the same configuration as the vacuum tweezers 4 described in FIG.
Denotes a holder which is mounted so as to be movable in the longitudinal direction similarly to the vacuum tweezers 4, and 13 denotes the holder 12 and the suction pad 11 a mounted on the tip of each of the vacuum tweezers 11. The coil spring inserted between them is shown.

In particular, the position of each vacuum tweezers 11 in this case corresponds to the area B in the drawing corresponding to the four corners of the flat surface 2c formed around the IC 1 on the upper surface of the carrier 2.

The other end of each vacuum tweezer 11 is connected to a pipe 14.
Is connected to a vacuum pump (not shown).

Then, as in the case of FIG. 2, when the holder 12 is lowered and the suction pad 11a of each of the vacuum tweezers 11 is brought into contact with the area B of the carrier 2 on the tray 3, a vacuum pump (not shown) is operated. The vacuum tweezers 11 suck the carrier 2.

It is to be noted that static electricity charged on the surface of the IC 1 is discharged by the suction pad 11a made of conductive rubber in the same manner as in FIG.

In the following, the carrier 2 adsorbed by the four vacuum tweezers 11 is transported together with the IC 1 to the test apparatus shown in FIG. 2, and the IC 1 can be connected to the test apparatus in the same manner as in FIG.

Particularly in this case, since the carrier 2 is attracted, the pressing force of the vacuum tweezers 11 is not applied to the lead wire of the IC 1.

However, when the flat portion is narrow or complicated in terms of the structure or shape of the carrier, it is difficult to secure a sufficient suction area to obtain the required suction force with the circular suction pad as described above. It is necessary to prepare an appropriate suction pad, and it is necessary to accurately position each vacuum tweezer 11 in the suction area B of the carrier.

[Problems to be solved by the invention]

In a conventional IC suction and transfer device, there is a problem that the IC may be damaged when directly sucking the surface of the IC, and when suctioning a flat portion on the carrier, a suction pad suitable for the carrier may be used. There is a problem in that the vacuum tweezers must be prepared and matched with the suction area of the carrier.

[Means for solving the problem]

According to the present invention, the above problem is provided with an accommodating portion for accommodating an IC, the surface of which has a region to be sucked by the suction device, and the region is covered by the suction device and closed. An IC carrier characterized by being provided with a concave portion in which a space is formed and being fixed to the suction device by making the closed space a negative pressure, and the surface of the IC carrier is sufficient. A suction pad having a size, wherein the suction pad is configured to form the closed space in a state in which the suction pad is in contact with a suction area of the IC carrier, and corresponds to the closed space of the suction pad. The area to
The problem is solved by a suction device characterized in that a through hole for sucking the closed space is provided.

[Operation] In the present invention, a concave portion such as a lightening groove formed in a carrier is used as a suction region, and a space formed by the concave portion and the suction pad is set to a negative pressure, thereby performing suction fixing. .

In other words, the surface with irregularities is covered, and the space is set to a negative pressure so that the space is fixed by suction.

〔Example〕

FIG. 1 is a view for explaining an IC suction and transfer apparatus according to the present invention. FIG. 1 (A) is a view showing a configuration example of the apparatus, and FIG.
FIG. 3 is a diagram showing a suction conveyance state of FIG.

Note that the figure shows the main parts according to the present invention.

In FIG. 2 (A), the carrier 15 has a “U” shape in plan view similarly to FIG. 2 (1).
FIG. 2 (1) shows that a plurality of grooves 15b described in FIG. 1A are formed, and the IC 1 to be tested inserted from the surface 15a side corresponding to the grooves 15b is fixed by a lock mechanism (not shown). Same as -a).

Note that, in this case, the back surface (upper side in the drawing) 1c of the IC 1 is exposed except for the periphery thereof, as in the case of FIG.

The back (upper surface in the figure) 15c of the carrier 15 has a second
The bottomed lightening region 15d described with reference to FIG. 1 is provided in a circular shape on the inner side along the periphery. In particular, in this case, the back surface 15c of the carrier 15 has the entire portion except the lightening region 15d.
That is, in the case of the drawing, the dot area C along the periphery of the back surface 15c and the dot area D along the inside of the lightening area 15d are formed as the same suction surface.

Therefore, when a flat plate material large enough to cover at least the entire back surface (hereinafter referred to as the suction surface) 15c of the carrier 15 is brought into contact with the suction surface 15c of the carrier 15, the lightening region 15d forms a closed space. Will do.

On the other hand, the suction head 16 is provided with a flange 16a having a size large enough to cover at least the entire suction surface 15c of the carrier 15 and an elastic body such as a conductive rubber adhered to an end surface of the flange 16a by means such as adhesion. Plate-shaped suction pad 17
Vacuum tweezers 18 composed of
The vacuum tweezers 18 are held by a holder 6 described in FIG. 2 which movably holds the vacuum tweezers 18 in the longitudinal direction of the shaft 16b at a shaft 16b portion connected to the shaft 16a at right angles. Second, the contact pressure between the suction pad 17 and the object to be sucked is buffered by the coil spring 7 inserted between the shaft 16b and the concave step 16c provided on the flange 16a side of the shaft 16b. This is the same as in the case of FIG.

Of these, a stepped surface 16 which is concave from the end surface of the suction head 16 except for a peripheral region E along the periphery is left on the end surface of the flange 16a.
d is formed, and a through hole 16e is formed in the step surface 16d so as to pass through the shaft 16b in the axial direction.

The suction head 16 is connected to a vacuum pump (not shown) by a pipe 5 connected to the other end of the shaft 16b.

Further, at least a plurality of through holes 17a are formed in the suction pad 17 at positions corresponding to the lightening regions 15d of the carrier 15 described above.

Therefore, while positionally to correspond to the carrier 15 to IC1 in the tray 3 described is fixed in Figure 2, the adsorption of the carrier 15 through the adsorbing pad 17 descends to the vacuum tweezers 18 as indicia R ₂ When contacting the surface 15c, (B)
The state shown in FIG.

At this time, the lightening area 15d of the carrier 15 and the through hole 16e of the suction head 16 communicate with each other through the through hole 17a of the suction pad 17.

Accordingly, by operating a vacuum pump (not shown) in this state, the IC 1 and thus the carrier 15 can be sucked by the vacuum tweezers 18.

Then, the IC1 can be mounted on a predetermined test apparatus by transporting the vacuum tweezers 18 as described in FIG.

It is to be noted that static electricity charged on the surface of the IC 1 is discharged by the suction pad 17 made of conductive rubber as in the case of FIG.

In the case of IC suction and transfer equipment with such a configuration,
Since the IC1 is not adsorbed, the IC1 is not damaged, and the plurality of through holes 17a provided in the adsorbing pad 17 are formed corresponding to the lightening area 15d of the carrier 15, so that the IC1 can be applied to a carrier of any size and structure. There are advantages,
Since the entire lightening region 15d has an adsorption area, an adsorption area sufficient to simultaneously adsorb and transport the IC1 and the carrier 15 can be easily obtained without strictly aligning the vacuum tweezers 18 and the carrier 15. .

(Effects of the Invention) As described above, according to the present invention, it is possible to provide an IC suction and conveyance device that improves productivity by easily and reliably sucking and chucking ICs.

Note that, in the description of the present invention, the case where the lightening region provided in the carrier is formed in a continuous peripheral shape is performed, but the same applies even when the lightening region is discontinuously dispersed and arranged. It has been experimentally confirmed that the effect can be obtained.

[Brief description of the drawings]

 FIG. 1 is a view for explaining an IC suction and transfer apparatus according to the present invention, FIG. 2 is a view for explaining a conventional IC suction and transfer method, and FIG. 3 is a view for explaining another IC suction and transfer apparatus. . In the figure, 1 is a semiconductor IC, 1a is a lead wire, 1c is a back surface, 3 is a tray, 5 is a pipe, 6 is a holder, 7 is a coil spring, 15 is a carrier, 15 is a surface, 15b is a groove, and 15c is a suction surface. (Back side), 15d is a lightening area, 16 is a suction head, 16a is a flange, 16b is a shaft, 16c is a stepped portion, 16d is a stepped surface, 16e is a through hole, 17 is a suction pad, 17a is a through hole, 18 is a through hole Vacuum tweezers, respectively.

Claims (2)

(57) [Claims] 1. A storage section for storing an IC, the surface of which has a region to be sucked by a suction device, and the region is covered by the suction device to form a closed space. An IC carrier comprising a concave portion, wherein the closed space is fixed to the suction device by applying a negative pressure to the closed space. 2. An IC carrier according to claim 1, further comprising a suction pad large enough to cover a surface of the IC carrier, wherein the suction pad is in contact with an area of the IC carrier to be sucked. An attraction device configured to form a space, and a through-hole for sucking the closed space is provided in a region of the suction pad corresponding to the closed space.