JP2007227915A5 - - Google Patents

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Publication number
JP2007227915A5
JP2007227915A5 JP2007035270A JP2007035270A JP2007227915A5 JP 2007227915 A5 JP2007227915 A5 JP 2007227915A5 JP 2007035270 A JP2007035270 A JP 2007035270A JP 2007035270 A JP2007035270 A JP 2007035270A JP 2007227915 A5 JP2007227915 A5 JP 2007227915A5
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JP
Japan
Prior art keywords
polishing
sheet
linear
abrasive
edge
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007035270A
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English (en)
Japanese (ja)
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JP2007227915A (ja
JP5339680B2 (ja
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Publication of JP2007227915A publication Critical patent/JP2007227915A/ja
Publication of JP2007227915A5 publication Critical patent/JP2007227915A5/ja
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Publication of JP5339680B2 publication Critical patent/JP5339680B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007035270A 2006-02-15 2007-02-15 表面の研磨 Expired - Fee Related JP5339680B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US77395006P 2006-02-15 2006-02-15
US60/773950 2006-02-15

Publications (3)

Publication Number Publication Date
JP2007227915A JP2007227915A (ja) 2007-09-06
JP2007227915A5 true JP2007227915A5 (enExample) 2010-04-02
JP5339680B2 JP5339680B2 (ja) 2013-11-13

Family

ID=38549354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007035270A Expired - Fee Related JP5339680B2 (ja) 2006-02-15 2007-02-15 表面の研磨

Country Status (5)

Country Link
US (7) US20070197145A1 (enExample)
JP (1) JP5339680B2 (enExample)
KR (3) KR100882045B1 (enExample)
CN (2) CN101244535B (enExample)
TW (1) TWI357845B (enExample)

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US11717936B2 (en) 2018-09-14 2023-08-08 Applied Materials, Inc. Methods for a web-based CMP system
TWI686857B (zh) * 2019-07-09 2020-03-01 華邦電子股份有限公司 化學機械研磨製程
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
JP7341918B2 (ja) * 2020-02-06 2023-09-11 株式会社荏原製作所 基板処理装置および基板処理方法
CN111673607B (zh) * 2020-04-28 2021-11-26 北京烁科精微电子装备有限公司 一种化学机械平坦化设备
CN111805410A (zh) * 2020-06-01 2020-10-23 长江存储科技有限责任公司 研磨系统
CN114952539B (zh) * 2022-07-27 2022-10-18 新沂市鼎丽塑胶制品有限公司 一种瓶盖表面拉丝处理装置
CN115256062B (zh) * 2022-08-29 2024-10-15 中国计量大学 一种光流变-光化学-空化协同作用的抛光系统
CN116175397A (zh) * 2022-12-13 2023-05-30 西安奕斯伟材料科技有限公司 一种用于研磨硅片的设备和方法
JP2024094565A (ja) * 2022-12-28 2024-07-10 株式会社荏原製作所 処理装置

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