JP5339680B2 - 表面の研磨 - Google Patents

表面の研磨 Download PDF

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Publication number
JP5339680B2
JP5339680B2 JP2007035270A JP2007035270A JP5339680B2 JP 5339680 B2 JP5339680 B2 JP 5339680B2 JP 2007035270 A JP2007035270 A JP 2007035270A JP 2007035270 A JP2007035270 A JP 2007035270A JP 5339680 B2 JP5339680 B2 JP 5339680B2
Authority
JP
Japan
Prior art keywords
polishing
sheet
window
abrasive
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007035270A
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English (en)
Japanese (ja)
Other versions
JP2007227915A (ja
JP2007227915A5 (enExample
Inventor
エー． ボナー ベンジャミン
マクレイノルズ ピーター
イー． メンク グレゴリー
ビー． プラブ ゴパラクリシュナ
エヌ． イアー アナンド
シー． リュン ガーレン
エム． ズニガ スティーヴン
エス． ロンダム エリック
エイチ． アウ ヘンリー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2007227915A publication Critical patent/JP2007227915A/ja
Publication of JP2007227915A5 publication Critical patent/JP2007227915A5/ja
Application granted granted Critical
Publication of JP5339680B2 publication Critical patent/JP5339680B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/12—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a contact wheel or roller pressing the belt against the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2007035270A 2006-02-15 2007-02-15 表面の研磨 Expired - Fee Related JP5339680B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US77395006P 2006-02-15 2006-02-15
US60/773950 2006-02-15

Publications (3)

Publication Number Publication Date
JP2007227915A JP2007227915A (ja) 2007-09-06
JP2007227915A5 JP2007227915A5 (enExample) 2010-04-02
JP5339680B2 true JP5339680B2 (ja) 2013-11-13

Family

ID=38549354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007035270A Expired - Fee Related JP5339680B2 (ja) 2006-02-15 2007-02-15 表面の研磨

Country Status (5)

Country Link
US (7) US20070197145A1 (enExample)
JP (1) JP5339680B2 (enExample)
KR (3) KR100882045B1 (enExample)
CN (2) CN101244535B (enExample)
TW (1) TWI357845B (enExample)

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CN109562506B (zh) * 2017-02-06 2021-11-12 株式会社大辉 抛光垫的凹部形成方法以及抛光垫
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11717936B2 (en) 2018-09-14 2023-08-08 Applied Materials, Inc. Methods for a web-based CMP system
TWI686857B (zh) * 2019-07-09 2020-03-01 華邦電子股份有限公司 化學機械研磨製程
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JP7341918B2 (ja) * 2020-02-06 2023-09-11 株式会社荏原製作所 基板処理装置および基板処理方法
CN111673607B (zh) * 2020-04-28 2021-11-26 北京烁科精微电子装备有限公司 一种化学机械平坦化设备
CN111805410A (zh) * 2020-06-01 2020-10-23 长江存储科技有限责任公司 研磨系统
CN114952539B (zh) * 2022-07-27 2022-10-18 新沂市鼎丽塑胶制品有限公司 一种瓶盖表面拉丝处理装置
CN115256062B (zh) * 2022-08-29 2024-10-15 中国计量大学 一种光流变-光化学-空化协同作用的抛光系统
CN116175397A (zh) * 2022-12-13 2023-05-30 西安奕斯伟材料科技有限公司 一种用于研磨硅片的设备和方法
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Also Published As

Publication number Publication date
KR20080075468A (ko) 2008-08-18
US20070197145A1 (en) 2007-08-23
US20070197134A1 (en) 2007-08-23
US20070197132A1 (en) 2007-08-23
TW200734119A (en) 2007-09-16
JP2007227915A (ja) 2007-09-06
TWI357845B (en) 2012-02-11
US7553214B2 (en) 2009-06-30
US7841925B2 (en) 2010-11-30
KR20080075470A (ko) 2008-08-18
CN101244535A (zh) 2008-08-20
KR100882045B1 (ko) 2009-02-09
CN101058169A (zh) 2007-10-24
US20090253358A1 (en) 2009-10-08
CN101244535B (zh) 2012-06-13
US20070197133A1 (en) 2007-08-23
KR20070082573A (ko) 2007-08-21
US20070197141A1 (en) 2007-08-23
US20070197147A1 (en) 2007-08-23
US7601050B2 (en) 2009-10-13

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