JP2007201454A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP2007201454A JP2007201454A JP2006352991A JP2006352991A JP2007201454A JP 2007201454 A JP2007201454 A JP 2007201454A JP 2006352991 A JP2006352991 A JP 2006352991A JP 2006352991 A JP2006352991 A JP 2006352991A JP 2007201454 A JP2007201454 A JP 2007201454A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 62
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 239000012535 impurity Substances 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 8
- 239000012212 insulator Substances 0.000 description 18
- 238000005530 etching Methods 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66666—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7827—Vertical transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/05—Making the transistor
- H10B12/053—Making the transistor the transistor being at least partially in a trench in the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/34—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the transistor being at least partially in a trench in the substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Memories (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Non-Volatile Memory (AREA)
Abstract
【課題】 半導体装置及びその製造方法が開示される。
【解決手段】 半導体装置は、導電性構造物、第1絶縁膜、及び第1導電膜パターンを含む。導電性構造物は、第1部分、第2部分、及び第3部分を含む。第2部分は第1部分上で第1方向に延びていて、前記第1方向と実質的に垂直である第2方向に互いに離隔している。第3部分は第2部分上で第1及び第2方向に互いに離隔している。第1絶縁膜は、第2部分の側壁を塗布する。第1導電膜パターンは、第1絶縁膜上に形成される。本発明によると、ボディに相当する第2部分が第1方向に延びている。従って、ボディはソース/ドレイン領域によって絶縁されない。又、第2部分に相対的に広い幅のチャンネルが形成されるので、半導体装置は相対的に速い動作速度を有する。
【選択図】図2
Description
11 導電性構造物
11a 第1部分
11b 第2部分
11c 第3部分
12 第1導電膜パターン
21 第1絶縁膜
Claims (10)
- 第1部分、前記第1部分上で第1方向に延びていて前記第1方向と実質的に垂直な第2方向に互いに離隔している第2部分、前記第2部分上で前記第1及び第2方向に互いに離隔している第3部分を含む導電性構造物と、
前記第2部分の側壁を覆う第1絶縁膜と、
前記第1絶縁膜上に形成される第1導電膜パターンと、
を含むことを特徴とする半導体装置。 - 前記第1部分及び前記第3部分はN型不純物を含み、
前記第2部分はP型不純物を含むことを特徴とする請求項1記載の半導体装置。 - 前記第3部分と電気的に連結された第2導電膜パターンと、
前記第2導電膜パターンを覆う第2絶縁膜と、
前記第2絶縁膜上に形成され前記第2方向に延びていて前記第1方向に互いに離隔している第3導電膜パターンと、
を更に含むことを特徴とする請求項1記載の半導体装置。 - 前記第2部分と電気的に連結される導電性部材を更に含むことを特徴とする請求項1記載の半導体装置。
- 基部及び前記基部上で第1方向に延びていて前記第1方向と実質的に垂直な第2方向に互いに離隔している突出部を含む半導体基板を形成する段階と、
前記突出部の側面上に第1絶縁膜を形成する段階と、
前記第1絶縁膜上に第1導電膜パターンを形成する段階と、
前記基部の上部に第1不純物領域を形成する段階と、
前記突出部の上部を部分的に除去して前記突出部の下部上に前記第1及び第2方向に互いに離隔している凸部を形成する段階と、
前記凸部の上部に第2不純物領域を形成する段階と、
を含むことを特徴とする半導体装置の製造方法。 - 前記第1及び第2不純物領域は、実質的に同じ不純物を含むことを特徴とする請求項5記載の半導体装置の製造方法。
- 前記不純物は、N型不純物であることを特徴とする請求項6記載の半導体装置の製造方法。
- 前記半導体基板は、P型不純物でドーピングされることを特徴とする請求項5記載の半導体装置の製造方法。
- 前記第2不純物領域と電気的に連結される第3導電膜パターンを形成する段階と、
前記第3導電膜パターンを覆う第2絶縁膜を形成する段階と、
前記第2絶縁膜上に前記第2方向に延びていて前記第1方向に互いに離隔している第3導電膜パターンを形成する段階と、を更に含むことを特徴とする請求項5記載の半導体装置の製造方法。 - 前記突出部の前記下部と電気的に連結される導電性部材を形成する段階を更に含むことを特徴とする請求項5記載の半導体装置の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060008313A KR100685659B1 (ko) | 2006-01-26 | 2006-01-26 | 반도체 장치 및 그 제조 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007201454A true JP2007201454A (ja) | 2007-08-09 |
Family
ID=38104321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006352991A Pending JP2007201454A (ja) | 2006-01-26 | 2006-12-27 | 半導体装置及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7489003B2 (ja) |
JP (1) | JP2007201454A (ja) |
KR (1) | KR100685659B1 (ja) |
CN (1) | CN101009281A (ja) |
DE (1) | DE102007005558B4 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009152585A (ja) * | 2007-12-24 | 2009-07-09 | Hynix Semiconductor Inc | 垂直チャネルトランジスタを備える半導体素子の製造方法 |
JP2010245196A (ja) * | 2009-04-02 | 2010-10-28 | Elpida Memory Inc | 半導体装置およびその製造方法 |
JP2016171221A (ja) * | 2015-03-13 | 2016-09-23 | 株式会社東芝 | 半導体記憶装置及び半導体装置の製造方法 |
JP7498821B2 (ja) | 2012-02-29 | 2024-06-12 | 株式会社半導体エネルギー研究所 | トランジスタ及び半導体装置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8643087B2 (en) * | 2006-09-20 | 2014-02-04 | Micron Technology, Inc. | Reduced leakage memory cells |
KR101320517B1 (ko) * | 2007-03-13 | 2013-10-22 | 삼성전자주식회사 | 커패시터리스 디램 및 그의 제조 및 동작방법 |
KR101420773B1 (ko) * | 2009-07-15 | 2014-07-17 | 주성엔지니어링(주) | 전기광학소자 및 이의 제작 방법 |
KR101736235B1 (ko) * | 2010-10-08 | 2017-05-17 | 삼성전자주식회사 | 수직 채널 트랜지스터를 구비하는 반도체 장치 및 그 제조 방법 |
KR101723864B1 (ko) * | 2010-10-08 | 2017-04-07 | 삼성전자주식회사 | 수직 채널 트랜지스터를 구비하는 반도체 장치 및 그 제조 방법 |
US8482126B2 (en) * | 2011-09-02 | 2013-07-09 | Kabushiki Kaisha Toshiba | Semiconductor device |
KR20130047410A (ko) | 2011-10-31 | 2013-05-08 | 에스케이하이닉스 주식회사 | 반도체 소자 및 그 형성방법 |
FR3050867B1 (fr) | 2016-05-02 | 2018-05-25 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de fabrication d'un transistor a nanocouches a canal vertical |
KR102524614B1 (ko) | 2017-11-24 | 2023-04-24 | 삼성전자주식회사 | 반도체 메모리 소자 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61140170A (ja) * | 1984-12-13 | 1986-06-27 | Toshiba Corp | 半導体記憶装置 |
JP2002033402A (ja) * | 2000-06-15 | 2002-01-31 | Samsung Electronics Co Ltd | フローティングボディ効果を除去した半導体メモリ素子及びその製造方法 |
Family Cites Families (7)
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US6337497B1 (en) | 1997-05-16 | 2002-01-08 | International Business Machines Corporation | Common source transistor capacitor stack |
US5909618A (en) | 1997-07-08 | 1999-06-01 | Micron Technology, Inc. | Method of making memory cell with vertical transistor and buried word and body lines |
US6066869A (en) * | 1997-10-06 | 2000-05-23 | Micron Technology, Inc. | Circuit and method for a folded bit line memory cell with vertical transistor and trench capacitor |
US5907170A (en) * | 1997-10-06 | 1999-05-25 | Micron Technology, Inc. | Circuit and method for an open bit line memory cell with a vertical transistor and trench plate trench capacitor |
US6134175A (en) * | 1998-08-04 | 2000-10-17 | Micron Technology, Inc. | Memory address decode array with vertical transistors |
US5977579A (en) | 1998-12-03 | 1999-11-02 | Micron Technology, Inc. | Trench dram cell with vertical device and buried word lines |
US7045844B2 (en) * | 2002-06-21 | 2006-05-16 | Micron Technology, Inc. | Memory cell and method for forming the same |
-
2006
- 2006-01-26 KR KR1020060008313A patent/KR100685659B1/ko not_active IP Right Cessation
- 2006-10-18 US US11/582,750 patent/US7489003B2/en not_active Expired - Fee Related
- 2006-12-27 JP JP2006352991A patent/JP2007201454A/ja active Pending
- 2006-12-27 CN CNA2006101567861A patent/CN101009281A/zh active Pending
-
2007
- 2007-01-24 DE DE102007005558A patent/DE102007005558B4/de not_active Expired - Fee Related
-
2009
- 2009-01-06 US US12/349,370 patent/US7910435B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61140170A (ja) * | 1984-12-13 | 1986-06-27 | Toshiba Corp | 半導体記憶装置 |
JP2002033402A (ja) * | 2000-06-15 | 2002-01-31 | Samsung Electronics Co Ltd | フローティングボディ効果を除去した半導体メモリ素子及びその製造方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009152585A (ja) * | 2007-12-24 | 2009-07-09 | Hynix Semiconductor Inc | 垂直チャネルトランジスタを備える半導体素子の製造方法 |
USRE44473E1 (en) | 2007-12-24 | 2013-09-03 | Hynix Semiconductor Inc. | Method for fabricating semiconductor device with vertical channel transistor |
JP2010245196A (ja) * | 2009-04-02 | 2010-10-28 | Elpida Memory Inc | 半導体装置およびその製造方法 |
JP7498821B2 (ja) | 2012-02-29 | 2024-06-12 | 株式会社半導体エネルギー研究所 | トランジスタ及び半導体装置 |
JP2016171221A (ja) * | 2015-03-13 | 2016-09-23 | 株式会社東芝 | 半導体記憶装置及び半導体装置の製造方法 |
US10038032B2 (en) | 2015-03-13 | 2018-07-31 | Toshiba Memory Corporation | Semiconductor memory device, semiconductor device, and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
KR100685659B1 (ko) | 2007-02-26 |
US7489003B2 (en) | 2009-02-10 |
CN101009281A (zh) | 2007-08-01 |
DE102007005558B4 (de) | 2012-03-15 |
US7910435B2 (en) | 2011-03-22 |
DE102007005558A1 (de) | 2007-08-09 |
US20070173027A1 (en) | 2007-07-26 |
US20090155974A1 (en) | 2009-06-18 |
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