JP2007183620A - 液晶表示装置及びその製造方法 - Google Patents
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Abstract
【解決手段】
本発明は、従来より少ないマスク工程を利用して液晶表示装置用アレイ基板を製造して工程を単純化して製造効率を向上させるだけでなく製造費用を大幅に節減する。又は、本発明による液晶表示装置用アレイ基板は、別途のアレイ基板保護膜を形成せずに、チャンネル保護膜形成時に酸化膜を形成して保護膜とすることで、不良を防止して画質を向上させるとともに、別途の装備と材料を要しないので材料費が節減される。
【選択図】図4
Description
図1及び図2に図示したところのように、液晶表示装置用アレイ基板では透明な絶縁基板110上に横方向を持つゲート配線121と、ゲート配線121で延長されたゲート電極122が形成されている。
前記ゲート配線121とゲート電極122上部にはゲート絶縁膜130が形成されていて、その上にアクティブ層141とオミックコンタクト層151,152が順次に形成されている。
そして、前記オミックコンタクト層151,152上にゲート配線121と直交するデータ配線161、データ配線161で延長されたソース電極162、ゲート電極122を中心にソース電極162と向い合っているドレイン電極163、及び、ゲート配線121と重畳するキャパシター電極165が形成されている。
ここで、前記データ配線161、ソース電極及びドレイン電極162,163、及び、キャパシター電極165は、保護層170で覆われていて、保護層170はドレイン電極163とキャパシター電極165をそれぞれ表わす第1及び第2コンタクトホール171,172を持つ。
前記ゲート配線121とデータ配線161が交差して定義される画素領域の保護層170上部には画素電極181が形成されているが、画素電極181は、第1及び第2コンタクトホール171,172を通じて、それぞれ、ドレイン電極163及びキャパシター電極165と連結されている。
図3は本発明の実施の形態による液晶表示装置を示す平面図で、図4は、図3のII−II’断面図、III−III’断面図、IV−IV’断面図である。
第1マスク工程は回折マスクまたはハーフ−トンマスク(half−tone mask)を使用するが、透明な伝導性物質とゲート金属層が順次に積層され、基板上に第1フォトレジスト膜を形成した後、回折マスクまたはハーフ−トンマスクを基板上部に整列させる。
Claims (21)
- 基板上に形成されたゲート配線、ゲート電極、ゲートパッド及び画素電極と、
前記基板上に形成されてゲート配線、画素電極を露出させるゲート絶縁膜と、
前記ゲート配線と交差するデータ配線と接続されたソース電極及び前記ソース電極とチャンネルを間に置いて対向するドレイン電極及び一終端に形成されたデータパッドと、前記画素電極とゲート配線の一部と重畳されたキャパシター電極と、
前記ソース電極及びドレイン電極の間の前記チャンネルを形成する半導体層と、
前記ゲートパッド、データパッド、キャパシター電極、ドレイン電極に形成された第1乃至第4コンタクトホールと、及び
前記第1乃至第4コンタクトホールに形成されて、前記ゲートパッド、データパッド、キャパシター電極、ドレイン電極とそれぞれサイドコンタクト(side contact)された第1乃至第4コンタクト電極
を含むことを特徴とする液晶表示装置。 - 前記ゲート配線、ゲート電極、ゲートパッドは、透明電極パターンとゲート金属層とが積層されて形成されていることを特徴とする請求項1に記載の液晶表示装置。
- 前記データ配線、ソース電極、ドレイン電極、キャパシター電極、データパッドは、半導体層とデータ金属層とが積層されて形成されていることを特徴とする請求項1に記載の液晶表示装置。
- 前記ゲートパッド上に、半導体層およびデータ金属層の積層パターンがさらに形成されていることを特徴とする請求項1に記載の液晶表示装置。
- 前記チャンネル上にシリコーン酸化膜またはシリコーン窒化膜で成り立ったチャンネル保護膜をさらに含んだことを特徴とする請求項1に記載の液晶表示装置。
- 前記ソース電極及びドレイン電極、ゲートパッド及びデータパッド、ゲート配線上には金属酸化膜がさらに形成されたことを特徴とする請求項1に記載の液晶表示装置。
- 前記第1コンタクトホール内部に形成された第1コンタクト電極によって前記ドレイン電極と前記画素電極がコンタクトされたことを特徴とする請求項1に記載の液晶表示装置。
- 前記第2コンタクトホール内部に形成された第2コンタクト電極によって前記キャパシター電極と前記画素電極がコンタクトされたことを特徴とする請求項1に記載の液晶表示装置。
- 前記第3コンタクトホール内部に形成された第3コンタクト電極は前記ゲートパッドと接触されたことを特徴とする請求項1に記載の液晶表示装置。
- 前記第4コンタクトホール内部に形成された第4コンタクト電極は前記データパッドと接触されたことを特徴とする請求項1に記載の液晶表示装置。
- 基板上に、透明電極パターンとゲート金属層とを積層して、ゲート配線、ゲート電極、ゲートパッドを形成するとともに、透明電極パターンで画素電極を形成する段階と、
前記基板上に、ゲート絶縁膜、半導体層、データ金属層を積層する段階と、
前記データ金属層上に、段差がある第1フォトレジストパターンを形成して、これをマスクにして蝕刻して、データ配線、データパッド、キャパシター電極、第1乃至第4コンタクトホールを形成する段階と、
前記第1フォトレジストパターン上にコンタクト電極層と第2フォトレジストを形成して、前記第2フォトレジストをアッシングして、前記第1乃至第4コンタクトホール内部に第2フォトレジストパターンを形成する段階と、
前記コンタクト電極層を蝕刻して第1乃至第4コンタクト電極を形成する段階と、
前記第1フォトレジストをアッシングして前記データ配線と連結されたソース電極及びドレイン電極の間を蝕刻してチャンネルを形成する段階と、
前記第1フォトレジストパターンと第2フォトレジストパターンを除去する段階と、
を含むことを特徴とする液晶表示装置の製造方法。 - 前記第1乃至第4コンタクトホールは前記データ金属層、半導体層、ゲート絶縁膜を蝕刻して形成されて、前記第1乃至第4コンタクト電極は前記第1乃至第4コンタクトホールを通じてそれぞれ前記ゲートパッド、データパッド、キャパシター電極、ドレイン電極とサイドコンタクトされることを特徴とする請求項11に記載の液晶表示装置の製造方法。
- 前記データ配線、ソース電極、ドレイン電極、キャパシター電極、データパッドは半導体層とデータ金属層が積層されて形成されることを特徴とする請求項11に記載の液晶表示装置の製造方法。
- 前記ゲートパッド上には前記ゲート絶縁膜を間に置いて半導体層、データ金属層の積層パターンがアイルランド(island)形状で形成されることを特徴とする請求項11に記載の液晶表示装置の製造方法。
- 前記データ配線と連結されたソース電極及びドレイン電極の間を蝕刻してチャンネルを形成する段階以後に、
前記チャンネルはプラズマ処理して表面層にシリコーン酸化膜またはシリコーン窒化膜で成り立ったチャンネル保護膜を形成する段階をさらに含むことを特徴とする請求項11に記載の液晶表示装置の製造方法。 - 前記チャンネルはプラズマ処理して表面層にシリコーン酸化膜またはシリコーン窒化膜で成り立ったチャンネル保護膜を形成する段階で、
前記ソース電極及びドレイン電極、ゲートパッド及びデータパッド、ゲート配線表面上には金属酸化膜がさらに形成されることを特徴とする請求項15に記載の液晶表示装置の製造方法。 - 前記第1コンタクトホール内部に形成された第1コンタクト電極によって前記ドレイン電極と前記画素電極がコンタクトされることを特徴とする請求項11に記載の液晶表示装置の製造方法。
- 前記第2コンタクトホール内部に形成された第2コンタクト電極によって前記キャパシター電極と前記画素電極がコンタクトされることを特徴とする請求項11に記載の液晶表示装置の製造方法。
- 前記第3コンタクトホール内部に形成された第3コンタクト電極は前記ゲートパッドと接触されることを特徴とする請求項11に記載の液晶表示装置の製造方法。
- 前記第4コンタクトホール内部に形成された第4コンタクト電極は前記データパッドと接触されることを特徴とする請求項11に記載の液晶表示装置の製造方法。
- 前記コンタクト電極層は透明導電性物質または不透明導電性物質で形成されることを特徴とする請求項11に記載の液晶表示装置の製造方法。
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JP2019207416A (ja) * | 2008-09-19 | 2019-12-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP2016218477A (ja) * | 2010-09-13 | 2016-12-22 | 株式会社半導体エネルギー研究所 | 表示装置 |
US9917112B2 (en) | 2010-09-13 | 2018-03-13 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method for manufacturing the same |
US10522572B2 (en) | 2010-09-13 | 2019-12-31 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method for manufacturing the same |
US11024655B2 (en) | 2010-09-13 | 2021-06-01 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method for manufacturing the same |
US11417688B2 (en) | 2010-09-13 | 2022-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method for manufacturing the same |
US11682678B2 (en) | 2010-09-13 | 2023-06-20 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method for manufacturing the same |
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US20100308336A1 (en) | 2010-12-09 |
TW200725913A (en) | 2007-07-01 |
KR20070070382A (ko) | 2007-07-04 |
DE102006061869A9 (de) | 2007-10-31 |
CN1991470A (zh) | 2007-07-04 |
US20070166859A1 (en) | 2007-07-19 |
US7973896B2 (en) | 2011-07-05 |
DE102006061869B4 (de) | 2010-05-12 |
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JP4490962B2 (ja) | 2010-06-30 |
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