JP2007173496A - 固体撮像素子用パッケージおよび固体撮像装置 - Google Patents
固体撮像素子用パッケージおよび固体撮像装置 Download PDFInfo
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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- H01L2924/161—Cap
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- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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Abstract
【解決手段】固体撮像素子51が固着されるベース部11と、ベース部11の周縁に立ち上がった側壁部12と、側壁部12の段差部13上に配された内部端子31とを有したパッケージ1において、段差部13の下部に、接着剤52からのブリードの内部端子31への這い上がりを阻止する複数の凹部14が互いに間隔をおいて形成される。進行の速いブリードであっても、凹部14内を経て側壁部内面12aを這い上がることは困難なので、内部端子31への付着を阻止できる。凹部14の存在で懸念されるワイヤーボンド時の強度は、凹部14間に所定の間隔で残留している残留部15によって確保できる。
【選択図】 図2
Description
上記の固体撮像素子用パッケージを用いることにより、固体撮像素子の周囲に接着剤やそのブリードが拡がった時には、側壁部の段差部の凹部内に流れ込むことになり、進行のより速いブリードであっても、凹部内の側面や天面を経てから、側壁部内面を伝って這い上がることは困難なので、内部端子への接着剤やブリードの付着を阻止することができる。凹部が存在することで懸念されるワイヤーボンド時の強度は、凹部間に所定の間隔で残留している残留部によって確保できる。
ベース部および側壁部はセラミック板を積層して形成されていてよい。またベース部および側壁部は樹脂によって形成されていてよい。
(実施形態1)
図1は本発明の実施形態1の固体撮像素子用パッケージを使用した固体撮像装置の平面図であり、図2は同固体撮像装置の図1におけるA―A’線に沿う断面図であり、図3は前記固体撮像素子用パッケージの一部拡大斜視図である。固体撮像装置も発明の一部を構成している。
(実施形態2)
図4は本発明の実施形態2のパッケージを使用した固体撮像装置の断面図であり、図5はパッケージの一部拡大斜視図である。
(実施形態3)
図6は本発明の実施形態3のパッケージを使用した固体撮像装置の断面図であり、図7は同パッケージのB−B‘断面の一部拡大図である。
(実施形態4)
図8は本発明の実施形態4のパッケージを使用した固体撮像装置の断面図であり、図9は同パッケージのC−C‘断面の一部拡大図である。
2 パッケージ
3 パッケージ
4 パッケージ
11 ベース部
12 側壁部
12a 側壁部内面
13 段差部
14 凹部
15 残留部
16 凹部
31 内部端子
32 外部端子
51 固体撮像素子
52 接着剤
53 ボンディングワイヤー
200A セラミック板
200B セラミック板
200C セラミック板
200D セラミック板
200E セラミック板
Claims (6)
- 固体撮像素子が固着されるベース部と、前記ベース部の周縁に立ち上がって固体撮像素子を収容する凹状の空間を形成している側壁部と、固体撮像素子の端子を外部に引き出すために前記側壁部の内周の段差部上に配された内部端子とを有した固体撮像素子用パッケージにおいて、
前記段差部の下部に、固体撮像素子を固着する接着剤からのブリードの前記内部端子への這い上がりを阻止する複数の凹部が互いに間隔をおいて形成された固体撮像素子用パッケージ。 - ベース部に、段差部の凹部に接続する凹部が形成されている請求項1記載の固体撮像素子用パッケージ。
- 凹部の底面の面租度が他面の面粗度よりも大きい請求項1または請求項2のいずれかに記載の固体撮像素子用パッケージ。
- ベース部および側壁部はセラミック板を積層して形成されている請求項1または請求項2のいずれかに記載の固体撮像素子用パッケージ。
- ベース部および側壁部は樹脂によって形成されている請求項1または請求項2のいずれかに記載の固体撮像素子用パッケージ。
- 請求項1記載の固体撮像素子用パッケージに固体撮像素子が固着され、ワイヤーボンドされた固体撮像装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005368915A JP2007173496A (ja) | 2005-12-22 | 2005-12-22 | 固体撮像素子用パッケージおよび固体撮像装置 |
CNB200610111183XA CN100508201C (zh) | 2005-12-22 | 2006-08-10 | 固体摄像元件用封装体及固体摄像装置 |
US11/523,588 US7646428B2 (en) | 2005-12-22 | 2006-09-20 | Package for solid image pickup element and solid image pickup device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005368915A JP2007173496A (ja) | 2005-12-22 | 2005-12-22 | 固体撮像素子用パッケージおよび固体撮像装置 |
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JP2007173496A true JP2007173496A (ja) | 2007-07-05 |
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JP2005368915A Pending JP2007173496A (ja) | 2005-12-22 | 2005-12-22 | 固体撮像素子用パッケージおよび固体撮像装置 |
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US (1) | US7646428B2 (ja) |
JP (1) | JP2007173496A (ja) |
CN (1) | CN100508201C (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007180653A (ja) * | 2005-12-27 | 2007-07-12 | Funai Electric Co Ltd | 複眼撮像装置 |
JP2011014615A (ja) * | 2009-06-30 | 2011-01-20 | Denso Corp | センサ装置およびその製造方法 |
JP2014029974A (ja) * | 2012-06-26 | 2014-02-13 | Kyocera Corp | 電子部品収納用パッケージ |
JP2020145361A (ja) * | 2019-03-08 | 2020-09-10 | 三菱マテリアル株式会社 | ヒートシンク付き絶縁回路基板及びパワーモジュール |
JP7338440B2 (ja) | 2019-12-12 | 2023-09-05 | 三菱マテリアル株式会社 | ヒートシンク付き絶縁回路基板及び電子機器 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010219489A (ja) * | 2009-02-20 | 2010-09-30 | Toshiba Corp | 半導体装置およびその製造方法 |
JP2010278667A (ja) * | 2009-05-27 | 2010-12-09 | Fujifilm Corp | 固体撮像ユニット、撮影装置、および固体撮像素子固定方法 |
JP2011101228A (ja) * | 2009-11-06 | 2011-05-19 | Toshiba Corp | セラミックパッケージおよびカメラモジュール |
CN102238319A (zh) * | 2010-04-26 | 2011-11-09 | 鸿富锦精密工业(深圳)有限公司 | 摄像装置 |
CN102508587B (zh) * | 2011-11-16 | 2015-10-21 | 浙江金徕镀膜有限公司 | 遮挡结构、使用该遮挡结构的电容式触控面板及其制作方法 |
CN102520831B (zh) * | 2011-11-16 | 2016-01-20 | 浙江金徕镀膜有限公司 | 遮挡结构及使用该遮挡结构的电容式触控面板 |
CN110767610B (zh) * | 2019-10-15 | 2021-06-25 | 四川豪威尔信息科技有限公司 | 一种集成电路及其制造方法 |
Citations (5)
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JPH0653459A (ja) * | 1992-07-27 | 1994-02-25 | Fuji Photo Optical Co Ltd | 固体撮像素子パッケージ |
JPH07335912A (ja) * | 1994-06-06 | 1995-12-22 | Fujikura Ltd | 半導体センサのパッケージ |
JPH11195723A (ja) * | 1997-12-27 | 1999-07-21 | Tdk Corp | 配線基板 |
JP2002134763A (ja) * | 2000-10-27 | 2002-05-10 | Kyocera Corp | 半導体受光素子収納用容器 |
JP2005252223A (ja) * | 2004-02-02 | 2005-09-15 | Matsushita Electric Ind Co Ltd | 光学デバイス |
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JP3173586B2 (ja) * | 1998-03-26 | 2001-06-04 | 日本電気株式会社 | 全モールド型固体撮像装置およびその製造方法 |
US6559539B2 (en) * | 2001-01-24 | 2003-05-06 | Hsiu Wen Tu | Stacked package structure of image sensor |
US20030116817A1 (en) * | 2001-12-20 | 2003-06-26 | Yeh Nai Hua | Image sensor structure |
KR100609012B1 (ko) * | 2004-02-11 | 2006-08-03 | 삼성전자주식회사 | 배선기판 및 이를 이용한 고체 촬상용 반도체 장치 |
US7378724B2 (en) * | 2005-03-24 | 2008-05-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cavity structure for semiconductor structures |
-
2005
- 2005-12-22 JP JP2005368915A patent/JP2007173496A/ja active Pending
-
2006
- 2006-08-10 CN CNB200610111183XA patent/CN100508201C/zh not_active Expired - Fee Related
- 2006-09-20 US US11/523,588 patent/US7646428B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0653459A (ja) * | 1992-07-27 | 1994-02-25 | Fuji Photo Optical Co Ltd | 固体撮像素子パッケージ |
JPH07335912A (ja) * | 1994-06-06 | 1995-12-22 | Fujikura Ltd | 半導体センサのパッケージ |
JPH11195723A (ja) * | 1997-12-27 | 1999-07-21 | Tdk Corp | 配線基板 |
JP2002134763A (ja) * | 2000-10-27 | 2002-05-10 | Kyocera Corp | 半導体受光素子収納用容器 |
JP2005252223A (ja) * | 2004-02-02 | 2005-09-15 | Matsushita Electric Ind Co Ltd | 光学デバイス |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007180653A (ja) * | 2005-12-27 | 2007-07-12 | Funai Electric Co Ltd | 複眼撮像装置 |
JP4492533B2 (ja) * | 2005-12-27 | 2010-06-30 | 船井電機株式会社 | 複眼撮像装置 |
JP2011014615A (ja) * | 2009-06-30 | 2011-01-20 | Denso Corp | センサ装置およびその製造方法 |
JP2014029974A (ja) * | 2012-06-26 | 2014-02-13 | Kyocera Corp | 電子部品収納用パッケージ |
JP2020145361A (ja) * | 2019-03-08 | 2020-09-10 | 三菱マテリアル株式会社 | ヒートシンク付き絶縁回路基板及びパワーモジュール |
JP7298201B2 (ja) | 2019-03-08 | 2023-06-27 | 三菱マテリアル株式会社 | ヒートシンク付き絶縁回路基板及びパワーモジュール |
JP7485129B2 (ja) | 2019-03-08 | 2024-05-16 | 三菱マテリアル株式会社 | ヒートシンク付き絶縁回路基板及びパワーモジュール |
JP7338440B2 (ja) | 2019-12-12 | 2023-09-05 | 三菱マテリアル株式会社 | ヒートシンク付き絶縁回路基板及び電子機器 |
Also Published As
Publication number | Publication date |
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CN100508201C (zh) | 2009-07-01 |
CN1988165A (zh) | 2007-06-27 |
US20070146532A1 (en) | 2007-06-28 |
US7646428B2 (en) | 2010-01-12 |
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