JP2007158316A5 - - Google Patents
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- Publication number
- JP2007158316A5 JP2007158316A5 JP2006302661A JP2006302661A JP2007158316A5 JP 2007158316 A5 JP2007158316 A5 JP 2007158316A5 JP 2006302661 A JP2006302661 A JP 2006302661A JP 2006302661 A JP2006302661 A JP 2006302661A JP 2007158316 A5 JP2007158316 A5 JP 2007158316A5
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- conductive film
- film
- element group
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 31
- 238000000034 method Methods 0.000 claims 20
- 238000001514 detection method Methods 0.000 claims 19
- 238000009826 distribution Methods 0.000 claims 19
- 238000002788 crimping Methods 0.000 claims 18
- 239000000463 material Substances 0.000 claims 12
- 239000004065 semiconductor Substances 0.000 claims 12
- 238000004519 manufacturing process Methods 0.000 claims 11
- 238000003825 pressing Methods 0.000 claims 6
- 238000003384 imaging method Methods 0.000 claims 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 230000001681 protective effect Effects 0.000 claims 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006302661A JP5041787B2 (ja) | 2005-11-11 | 2006-11-08 | 圧着方法及び半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005328030 | 2005-11-11 | ||
| JP2005328030 | 2005-11-11 | ||
| JP2006302661A JP5041787B2 (ja) | 2005-11-11 | 2006-11-08 | 圧着方法及び半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007158316A JP2007158316A (ja) | 2007-06-21 |
| JP2007158316A5 true JP2007158316A5 (enExample) | 2009-10-22 |
| JP5041787B2 JP5041787B2 (ja) | 2012-10-03 |
Family
ID=38242188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006302661A Expired - Fee Related JP5041787B2 (ja) | 2005-11-11 | 2006-11-08 | 圧着方法及び半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5041787B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2009063730A1 (ja) * | 2007-11-12 | 2011-03-31 | 日本電気株式会社 | スクリーン印刷マスク並びにそれを用いた半田ペースト印刷装置および半田ペースト印刷方法 |
| MY160373A (en) * | 2010-07-21 | 2017-03-15 | Semiconductor Components Ind Llc | Bonding structure and method |
| CN102501542B (zh) * | 2011-10-20 | 2015-02-18 | 北京德鑫泉物联网科技股份有限公司 | 具有视觉功能的压合设备 |
| EP4624884A1 (en) * | 2022-11-21 | 2025-10-01 | FUJIFILM Corporation | Manufacturing device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10321674A (ja) * | 1997-05-15 | 1998-12-04 | Toray Eng Co Ltd | チップボンディングヘッドのツール平行度測定方法及びチップボンディングヘッド |
| JP2980073B2 (ja) * | 1997-08-29 | 1999-11-22 | 日本電気株式会社 | 熱圧着装置及びその制御方法 |
| JP2001291738A (ja) * | 2000-04-06 | 2001-10-19 | Toshiba Corp | テープキャリアパッケージ、及びこれを用いる平面表示装置の製造方法 |
-
2006
- 2006-11-08 JP JP2006302661A patent/JP5041787B2/ja not_active Expired - Fee Related
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