JP5041787B2 - 圧着方法及び半導体装置の作製方法 - Google Patents

圧着方法及び半導体装置の作製方法 Download PDF

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Publication number
JP5041787B2
JP5041787B2 JP2006302661A JP2006302661A JP5041787B2 JP 5041787 B2 JP5041787 B2 JP 5041787B2 JP 2006302661 A JP2006302661 A JP 2006302661A JP 2006302661 A JP2006302661 A JP 2006302661A JP 5041787 B2 JP5041787 B2 JP 5041787B2
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JP
Japan
Prior art keywords
pressure
conductive film
film
substrate
element group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006302661A
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English (en)
Japanese (ja)
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JP2007158316A (ja
JP2007158316A5 (enExample
Inventor
秀和 高橋
直人 楠本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2006302661A priority Critical patent/JP5041787B2/ja
Publication of JP2007158316A publication Critical patent/JP2007158316A/ja
Publication of JP2007158316A5 publication Critical patent/JP2007158316A5/ja
Application granted granted Critical
Publication of JP5041787B2 publication Critical patent/JP5041787B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2006302661A 2005-11-11 2006-11-08 圧着方法及び半導体装置の作製方法 Expired - Fee Related JP5041787B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006302661A JP5041787B2 (ja) 2005-11-11 2006-11-08 圧着方法及び半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005328030 2005-11-11
JP2005328030 2005-11-11
JP2006302661A JP5041787B2 (ja) 2005-11-11 2006-11-08 圧着方法及び半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2007158316A JP2007158316A (ja) 2007-06-21
JP2007158316A5 JP2007158316A5 (enExample) 2009-10-22
JP5041787B2 true JP5041787B2 (ja) 2012-10-03

Family

ID=38242188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006302661A Expired - Fee Related JP5041787B2 (ja) 2005-11-11 2006-11-08 圧着方法及び半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP5041787B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2009063730A1 (ja) * 2007-11-12 2011-03-31 日本電気株式会社 スクリーン印刷マスク並びにそれを用いた半田ペースト印刷装置および半田ペースト印刷方法
MY160373A (en) * 2010-07-21 2017-03-15 Semiconductor Components Ind Llc Bonding structure and method
CN102501542B (zh) * 2011-10-20 2015-02-18 北京德鑫泉物联网科技股份有限公司 具有视觉功能的压合设备
EP4624884A1 (en) * 2022-11-21 2025-10-01 FUJIFILM Corporation Manufacturing device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10321674A (ja) * 1997-05-15 1998-12-04 Toray Eng Co Ltd チップボンディングヘッドのツール平行度測定方法及びチップボンディングヘッド
JP2980073B2 (ja) * 1997-08-29 1999-11-22 日本電気株式会社 熱圧着装置及びその制御方法
JP2001291738A (ja) * 2000-04-06 2001-10-19 Toshiba Corp テープキャリアパッケージ、及びこれを用いる平面表示装置の製造方法

Also Published As

Publication number Publication date
JP2007158316A (ja) 2007-06-21

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