JP2007158154A - 静電破壊保護回路及びこれを備えた半導体集積回路装置 - Google Patents
静電破壊保護回路及びこれを備えた半導体集積回路装置 Download PDFInfo
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- JP2007158154A JP2007158154A JP2005353163A JP2005353163A JP2007158154A JP 2007158154 A JP2007158154 A JP 2007158154A JP 2005353163 A JP2005353163 A JP 2005353163A JP 2005353163 A JP2005353163 A JP 2005353163A JP 2007158154 A JP2007158154 A JP 2007158154A
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- output transistor
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- 230000015556 catabolic process Effects 0.000 title claims abstract description 55
- 239000004065 semiconductor Substances 0.000 title claims description 14
- 230000005669 field effect Effects 0.000 claims description 10
- 238000010586 diagram Methods 0.000 description 7
- 230000003071 parasitic effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0259—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using bipolar transistors as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Logic Circuits (AREA)
Abstract
【解決手段】本発明に係る保護回路は、アノードがゲート信号入力端に接続され、カソードが出力トランジスタN1のゲートに接続されたダイオードD1と;一端が前記ゲート信号入力端に接続され、他端が接地端に接続された抵抗R1と;エミッタが出力トランジスタN1のゲートに接続され、ベースが抵抗R1の一端に接続され、コレクタが接地端に接続されたpnp型バイポーラトランジスタQp1と;を有して成る構成とされている。
【選択図】図2
Description
2 プリドライバ
3 ドライバ
4 FG信号出力回路
5 レギュレータ
6 ホールコンパレータ
41 静電破壊保護回路
N1 Nチャネル型電界効果トランジスタ(出力トランジスタ)
N2〜N3 Nチャネル型電界効果トランジスタ
P1 Pチャネル型電界効果トランジスタ
D1 ダイオード
R1〜R3 抵抗
Qp1 pnp型バイポーラトランジスタ
Qn1〜Qn4 npn型バイポーラトランジスタ
CL クランプ素子
Claims (4)
- オープンドレイン形式の出力トランジスタを静電破壊から保護する保護回路であって、アノードが前記出力トランジスタへの信号入力端に接続され、カソードが前記出力トランジスタのゲートに接続されたダイオードと;一端が前記信号入力端に接続され、他端が接地端に接続された第1抵抗と;エミッタ或いはソースが前記出力トランジスタのゲートに接続され、ベース或いはゲートが第1抵抗の一端に接続され、コレクタ或いはドレインが接地端に接続されたpnp型バイポーラトランジスタ或いはPチャネル型電界効果トランジスタと;を有して成ることを特徴とする静電破壊保護回路。
- 前記出力トランジスタと並列に接続され、そのトリガ電圧が前記出力トランジスタの設計耐圧よりも低い電圧値に設定されているクランプ素子を有して成ることを特長とする請求項1に記載の静電破壊保護回路。
- 前記pnp型バイポーラトランジスタのコレクタ或いは前記Pチャネル型電界効果トランジスタのドレインと接地端との間に接続された第2抵抗と;前記出力トランジスタのゲートと接地端との間にダーリントン接続され、かつ、初段のベースが第2抵抗の一端に接続された複数段のnpn型バイポーラトランジスタと;を有して成ることを特徴とする請求項1または請求項2に記載の静電破壊保護回路。
- オープンドレイン形式の出力トランジスタと、前記出力トランジスタのゲートに信号を入力するインバータと;前記出力トランジスタを静電破壊から保護する静電破壊保護回路と、を有して成る半導体集積回路装置であって、前記静電破壊保護回路として、請求項1〜請求項3のいずれかに記載の静電破壊保護回路を備えたことを特徴とする半導体集積回路装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005353163A JP4926468B2 (ja) | 2005-12-07 | 2005-12-07 | 静電破壊保護回路及びこれを備えた半導体集積回路装置 |
CN2006800156757A CN101171680B (zh) | 2005-12-07 | 2006-12-05 | 静电击穿保护电路及半导体集成电路设备 |
US11/912,412 US7859805B2 (en) | 2005-12-07 | 2006-12-05 | Electrostatic breakdown protection circuit and semiconductor integrated circuit device therewith |
PCT/JP2006/324193 WO2007066626A1 (ja) | 2005-12-07 | 2006-12-05 | 静電破壊保護回路及びこれを備えた半導体集積回路装置 |
KR1020077026346A KR101236088B1 (ko) | 2005-12-07 | 2006-12-05 | 정전 파괴 보호 회로 및 이를 포함한 반도체 집적 회로장치 |
TW095145688A TW200746926A (en) | 2005-12-07 | 2006-12-07 | Electrostatic breakdown protection circuit and semiconductor integrated circuit device fabricated therewith |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005353163A JP4926468B2 (ja) | 2005-12-07 | 2005-12-07 | 静電破壊保護回路及びこれを備えた半導体集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007158154A true JP2007158154A (ja) | 2007-06-21 |
JP4926468B2 JP4926468B2 (ja) | 2012-05-09 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005353163A Active JP4926468B2 (ja) | 2005-12-07 | 2005-12-07 | 静電破壊保護回路及びこれを備えた半導体集積回路装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7859805B2 (ja) |
JP (1) | JP4926468B2 (ja) |
KR (1) | KR101236088B1 (ja) |
CN (1) | CN101171680B (ja) |
TW (1) | TW200746926A (ja) |
WO (1) | WO2007066626A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008035067A (ja) * | 2006-07-27 | 2008-02-14 | Renesas Technology Corp | 負荷駆動回路 |
TWI425622B (zh) * | 2010-07-08 | 2014-02-01 | Analog Devices Inc | 用於電子電路保護之設備和方法 |
JP2015082699A (ja) * | 2013-10-21 | 2015-04-27 | アスモ株式会社 | モータ制御装置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2921773B1 (fr) * | 2007-10-02 | 2011-04-22 | Thales Sa | Circuit de protection pour mosfet |
US9520486B2 (en) | 2009-11-04 | 2016-12-13 | Analog Devices, Inc. | Electrostatic protection device |
US9508487B2 (en) | 2011-10-21 | 2016-11-29 | Qualcomm Incorporated | Systems and methods for limiting voltage in wireless power receivers |
CN103281059A (zh) * | 2013-06-14 | 2013-09-04 | 成都锐奕信息技术有限公司 | 防过热开关电路 |
US10181719B2 (en) | 2015-03-16 | 2019-01-15 | Analog Devices Global | Overvoltage blocking protection device |
CN105844898A (zh) * | 2016-04-11 | 2016-08-10 | 深圳市励创微电子有限公司 | 红外发射芯片、内部电路及其应用电路 |
TWI729538B (zh) * | 2018-11-21 | 2021-06-01 | 大陸商上海瀚薪科技有限公司 | 一種整合箝制電壓箝位電路的碳化矽半導體元件 |
CN109950885B (zh) * | 2019-03-13 | 2021-01-08 | 惠科股份有限公司 | 一种显示面板的静电防护装置、方法及显示装置 |
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JPH05327456A (ja) * | 1992-05-20 | 1993-12-10 | Fujitsu Ltd | 半導体集積回路装置 |
JPH10224201A (ja) * | 1997-02-03 | 1998-08-21 | Fujitsu Ltd | 半導体集積回路装置 |
JPH1154711A (ja) * | 1997-08-04 | 1999-02-26 | Nippon Precision Circuits Kk | 半導体装置の静電保護回路 |
JP2001358297A (ja) * | 2000-06-14 | 2001-12-26 | Nec Corp | 静電保護回路 |
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-
2005
- 2005-12-07 JP JP2005353163A patent/JP4926468B2/ja active Active
-
2006
- 2006-12-05 CN CN2006800156757A patent/CN101171680B/zh not_active Expired - Fee Related
- 2006-12-05 US US11/912,412 patent/US7859805B2/en active Active
- 2006-12-05 WO PCT/JP2006/324193 patent/WO2007066626A1/ja active Application Filing
- 2006-12-05 KR KR1020077026346A patent/KR101236088B1/ko active IP Right Grant
- 2006-12-07 TW TW095145688A patent/TW200746926A/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH05327456A (ja) * | 1992-05-20 | 1993-12-10 | Fujitsu Ltd | 半導体集積回路装置 |
JPH10224201A (ja) * | 1997-02-03 | 1998-08-21 | Fujitsu Ltd | 半導体集積回路装置 |
JPH1154711A (ja) * | 1997-08-04 | 1999-02-26 | Nippon Precision Circuits Kk | 半導体装置の静電保護回路 |
JP2001358297A (ja) * | 2000-06-14 | 2001-12-26 | Nec Corp | 静電保護回路 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008035067A (ja) * | 2006-07-27 | 2008-02-14 | Renesas Technology Corp | 負荷駆動回路 |
TWI425622B (zh) * | 2010-07-08 | 2014-02-01 | Analog Devices Inc | 用於電子電路保護之設備和方法 |
JP2015082699A (ja) * | 2013-10-21 | 2015-04-27 | アスモ株式会社 | モータ制御装置 |
Also Published As
Publication number | Publication date |
---|---|
KR101236088B1 (ko) | 2013-02-21 |
US20090080128A1 (en) | 2009-03-26 |
JP4926468B2 (ja) | 2012-05-09 |
US7859805B2 (en) | 2010-12-28 |
CN101171680B (zh) | 2010-10-13 |
CN101171680A (zh) | 2008-04-30 |
TW200746926A (en) | 2007-12-16 |
WO2007066626A1 (ja) | 2007-06-14 |
KR20080071894A (ko) | 2008-08-05 |
TWI337834B (ja) | 2011-02-21 |
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